CN109623541B

CN109623541B - Solder ball removing equipment and method for BGA packaging device

Info

Publication number: CN109623541B
Application number: CN201811203889.8A
Authority: CN
Inventors: 尧彬; 赖灿雄; 肖庆中; 林晓玲
Original assignee: China Electronic Product Reliability and Environmental Testing Research Institute
Current assignee: China Electronic Product Reliability and Environmental Testing Research Institute
Priority date: 2018-10-16
Filing date: 2018-10-16
Publication date: 2020-07-17
Anticipated expiration: 2038-10-16
Also published as: CN109623541A

Abstract

The invention relates to a BGA packaging device solder ball removing device and a method thereof, wherein the BGA packaging device solder ball removing device comprises a processing device, a transmission device, a grinding machine for grinding solder balls of the BGA packaging device, a pressure sensor for sensing the pressure of the BGA packaging device and a clamp for fixing the BGA packaging device; the transmission equipment is connected with the clamp; the solder ball surface of the BGA package device faces the grinder; the processing equipment is respectively connected with the transmission equipment, the pressure sensor and the grinding machine; the processing equipment drives the transmission equipment to drive the clamp to move towards the direction of the grinding machine; the pressure sensor transmits the sensed pressure of the BGA packaging device to the processing equipment; the processing equipment starts the grinder when the pressure is equal to the preset pressure, so that the grinder grinds the solder balls of the BGA packaging device. The embodiment of the invention can remove the solder balls of the BGA packaging device, prevent the substrate of the BGA packaging device from being damaged mechanically and optimize the removal effect of the solder balls of the BGA packaging device.

Description

Solder ball removing equipment and method for BGA packaging device

Technical Field

The invention relates to the technical field of package thermal deformation detection, in particular to a BGA package device solder ball removing device and a method thereof.

Background

Due to the fact that the integrated circuit package has a thermal mismatch phenomenon among different package materials, thermal warping deformation can occur in the high-temperature reflow soldering process, package deformation can cause defects of cold solder joint, empty solder joint, bridging and the like of a package leading-out end in reflow soldering assembly, and electrical open circuit or short circuit failure can be caused. Ball Grid Array (BGA) packages are one form of integrated circuit packages, which are more susceptible to thermal deformation. At present, the ball pitch and the size of the solder balls of the BGA are smaller and smaller, but the size of a package body is continuously increased, so that the probability of welding defects caused by thermal deformation of the BGA package is greatly increased. And with the conversion from the lead welding process to the lead-free welding process, the reflow soldering peak temperature is greatly increased, so that the thermal deformation of the BGA package causes greater hidden troubles to the quality and reliability of the assembly process, and the yield of board-level components is easy to decrease. The BGA thermal deformation detection is carried out, and the method has important significance for improving the quality of the BGA welding process and improving the assembling reliability of the BGA device. When detecting the thermal deformation of the BGA, the deformation of the whole plane area where the solder ball is located needs to be detected from the substrate surface. Since the BGA solder balls on the substrate surface cause light scattering and result in test errors, the solder balls on the substrate surface need to be processed before the test to ensure the accuracy of thermal deformation test of the BGA.

In the implementation process, the inventor finds that at least the following problems exist in the conventional technology: the traditional BGA packaging device has poor solder ball removing effect and is easy to cause device damage.

Disclosure of Invention

Therefore, it is necessary to provide a BGA package device solder ball removing apparatus and method thereof, aiming at the problems of the conventional BGA package device that the solder ball removing effect is poor and the device is easily damaged.

In order to achieve the above object, an embodiment of the present invention provides a ball removing apparatus for a BGA package device, including a processing apparatus, a driving apparatus, a grinder for grinding a ball of the BGA package device, a pressure sensor for sensing a pressure of the BGA package device, and a jig for fixing the BGA package device; the transmission equipment is connected with the clamp; the solder ball surface of the BGA package device faces the grinder;

the processing equipment is respectively connected with the transmission equipment, the pressure sensor and the grinding machine;

the processing equipment drives the transmission equipment to drive the clamp to move towards the direction of the grinding machine; the pressure sensor transmits the sensed pressure of the BGA packaging device to the processing equipment; the processing equipment starts the grinder when the pressure is equal to the preset pressure, so that the grinder grinds the solder balls of the BGA packaging device.

In one embodiment, the transmission device comprises a stepping motor, a screw rod and a fixing sleeve;

one end of the screw rod is connected with the stepping motor, and the other end of the screw rod is connected with a sleeve opening of the fixed sleeve; the other opening of the fixing sleeve is connected with the clamp.

In one embodiment, the pressure sensor is disposed at an end of the clamp proximate the lead screw.

In one embodiment, the chuck is a vacuum chuck.

In one embodiment, the vacuum suction device further comprises a vacuum pump for pumping air in the vacuum suction clamp;

the vacuum pump is connected with the vacuum adsorption clamp.

In one embodiment, the device further comprises a support frame;

one end of the supporting frame is connected with the transmission equipment.

On the other hand, the embodiment of the invention also provides a method for removing the solder balls of the BGA packaging device, which comprises the following steps:

fixing the BGA packaging device on a clamp, and enabling a welding surface of the BGA packaging device to face a grinding machine;

driving a transmission device for driving the clamp to move, and moving the transmission device for a preset distance from the initial position so that the grinding machine grinds the welding balls of the BGA packaging device; the starting position is the position of the transmission equipment recorded when the transmission equipment is driven to drive the clamp to move until the pressure of the BGA packaging device is equal to the preset pressure; the preset distance is the height of the solder ball of the BGA package device.

In one embodiment, the step of driving the driving device for driving the clamp to move from the initial position by a preset distance so that the grinding machine grinds the solder balls of the BGA package device comprises:

starting a grinder for placing rough grinding abrasive paper, driving a transmission device to move a first grinding distance from a starting position so that the grinder grinds and removes the solder balls at the first grinding distance, and recording the position of the transmission device as a first middle position; dividing the height of the solder ball into a first grinding distance, a second grinding distance and a third grinding distance;

starting the grinder for placing the fine abrasive paper, driving the transmission device to move a second grinding distance from the first middle position, so that the grinder grinds and removes the solder balls at the second grinding distance, and recording the position of the transmission device as a second middle position;

and starting the grinder for placing the polishing cloth, and driving the transmission device to move for a third grinding distance from the second middle position so that the grinder grinds and removes the solder balls at the third grinding distance.

In one embodiment, the method further comprises the following steps:

and measuring the distance between the lower surface of the substrate of the BGA packaging device and the upper surface of the metal flat plate fixed together with the solder ball surface of the BGA packaging device to obtain the height of the solder ball.

In one embodiment, the step of securing the BGA package device to the jig includes:

and starting a vacuum pump for pumping air in the clamp so as to enable the clamp to adsorb and fix the BGA packaging device.

One of the above technical solutions has the following advantages and beneficial effects:

respectively connecting the transmission equipment, the pressure sensor and the grinding machine based on the processing equipment; the transmission device is connected with the clamp. The processing equipment drives the transmission equipment to drive the clamp to move towards the direction of the grinding machine; the pressure sensor transmits the sensed pressure of the BGA (Ball grid array package) packaging device to the processing equipment; the processing equipment starts the grinder when the pressure is equal to the preset pressure, so that the grinder grinds the solder balls of the BGA packaging device. The embodiment of the invention can realize the removal of the solder balls of the BGA packaging device, can ensure the consistency of the removal effect, can prevent the mechanical damage to the substrate of the BGA packaging device, and optimizes the removal effect of the solder balls of the BGA packaging device.

Drawings

FIG. 1 is a schematic view of a first structure of a ball removing apparatus for a BGA package device in one embodiment;

FIG. 2 is a schematic diagram showing a second structure of the solder ball removing apparatus for a BGA package device in accordance with one embodiment;

FIG. 3 is a schematic view showing a third structure of a solder ball removing apparatus for a BGA package device in accordance with one embodiment;

FIG. 4 is a diagram illustrating a fourth exemplary structure of a ball removing apparatus for a BGA package device in accordance with one embodiment;

FIG. 5 is a schematic illustration of solder ball height measurement in one embodiment;

FIG. 6 is a schematic diagram of a first process for removing solder balls from a BGA package device in one embodiment;

FIG. 7 is a schematic flow chart showing the solder ball grinding step of the BGA package device in one embodiment;

fig. 8 is a schematic diagram of a second flow chart of a method for removing solder balls from a BGA packaged device in accordance with one embodiment.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The conventional way of removing the solder balls of the BGA package device is generally: 1. the mode of removing the solder balls by heating and refluxing is required, but the solder balls are required to be removed at high temperature, and the thermal deformation result of the BGA packaging device is influenced after the BGA packaging device is subjected to high temperature; 2. the metal scraper is adopted to directly and manually scrape the solder balls, but the method has different removal effects on the solder balls according to different people, is lack of consistency, and easily causes mechanical damage to the substrate, thereby influencing the detection result.

In each embodiment of the invention, the welding balls of the BGA packaging device can be removed by mechanical automation, and the transmission equipment is driven by the processing equipment to drive the clamp to move towards the direction of the grinding machine; the pressure sensor transmits the sensed pressure of the BGA packaging device to the processing equipment; the processing equipment starts the grinder when the pressure is equal to the preset pressure, so that the grinder grinds the solder balls of the BGA packaging device. The consistency of the removal effect can be ensured, the BGA packaging substrate can be prevented from being damaged mechanically, and the technical requirement of thermal deformation detection can be met.

In one embodiment, as shown in fig. 1, there is provided a ball removing apparatus for a BGA packaged device, including a processing apparatus 110, a driving apparatus 120, a grinder 130 for grinding balls of the BGA packaged device, a pressure sensor 140 for sensing a pressure of the BGA packaged device, and a jig 150 for fixing the BGA packaged device; the driving device 120 is connected to the jig 150; the solder balls of the BGA packaged device face the grinder 130. The processing device 110 is connected to the transmission device 120, the pressure sensor 140 and the grinder 130, respectively.

The processing device 110 drives the transmission device 120 to drive the clamp 150 to move towards the grinding machine; the pressure sensor 140 transmits the sensed pressure of the BGA package device to the processing device 110; the processing apparatus 110 activates the grinder 130 when the pressure is equal to the preset pressure, so that the grinder 130 grinds the solder balls of the BGA package device.

The processing device 110 refers to a device having functions of signal processing, signal transmission, and the like; alternatively, the processing device 110 may be a personal computer, a notebook computer, or an industrial personal computer, and the driving device 120 refers to a device capable of performing motion through driving control. The grinder 130 refers to a device for grinding the surface of a workpiece by a grinder coated with or embedded with an abrasive material, and the grinder 130 may be used to grind the solder balls of the BGA package device. The pressure sensor 140 may be used to sense the pressure to which the BGA packaged device is subjected when it comes into contact with a grinder. Alternatively, the pressure sensor 140 may be a piezoresistive pressure sensor or a piezoelectric pressure sensor. The jig 150 refers to a device for fixing a processing object to take a correct position to receive a construction or inspection, and the jig 150 may be used to fix a BGA package device.

Specifically, the driving device 120, the pressure sensor 150, and the grinder 130 are electrically connected based on the processing device 110, respectively; one end of the jig 150 is mechanically connected to the driving device 120, and the other end of the jig 150 is mechanically connected to the BGA package device with the solder ball surface of the BGA package device facing the grinding surface of the grinder 130. The handling device 110 drives the transmission device 120 to move, and the transmission device 120 moves to drive the clamp 150 to move, so that the transmission device 120 drives the clamp 150 to move toward the grinder 130. The pressure sensor 140 senses the pressure of the BGA packaged device, and the pressure sensor 140 transmits the sensed pressure of the BGA packaged device to the processing device 110. When the pressure is equal to the preset pressure, that is, the soldering surface of the BGA package device contacts the grinding surface of the grinder 130, the grinder 130 is started, and the solder balls of the BGA package device are ground by the grinding function of the grinder 130, so as to remove the solder balls of the BGA package device.

Further, the solder ball height of the BGA packaged device is obtained when the solder of the BGA packaged device contacts the grinding surface of the grinder 130. When the pressure applied to the BGA package device is equal to the preset pressure, the processing device 110 starts the grinder 130 to grind the solder balls of the BGA package device through the grinding function of the grinder 130; and drives the BGA package device through the jig 150 by driving the driving device 120 to move the solder ball height toward the grinder 130. It should be noted that the processing device 110 can drive the transmission device to move at a constant speed, so as to drive the BGA package device to move towards the grinder 130 at a constant speed, thereby achieving accurate removal of the solder balls of the BGA package device.

According to the embodiment, the transmission device, the pressure sensor and the grinding machine are respectively connected through the processing device; the transmission device is connected with the clamp. The processing equipment drives the transmission equipment to drive the clamp to move towards the direction of the grinding machine; the pressure sensor transmits the sensed pressure of the BGA packaging device to the processing equipment; the processing equipment starts the grinder when the pressure is equal to the preset pressure, so that the grinder grinds the solder balls of the BGA packaging device. The embodiment of the invention can realize the removal of the solder balls of the BGA packaging device, can ensure the consistency of the removal effect, can prevent the mechanical damage to the substrate of the BGA packaging device, and optimizes the removal effect of the solder balls of the BGA packaging device.

In one embodiment, as shown in fig. 2, there is provided a ball removing apparatus for a BGA packaged device, including a processing apparatus 210, an actuator apparatus 220, a grinder 230, a pressure sensor 240, and a jig 250. Wherein the transmission device 220 includes a stepping motor 220, a lead screw 224 and a fixing kit 226.

One end of the screw rod 224 is connected with the stepping motor 222, and the other end is connected with a sleeve opening of the fixing sleeve 226; the other cuff of the retaining sleeve 226 is connected to a clamp 250.

Optionally, the stepping motor 222 may be a reaction type stepping motor, a permanent magnet type stepping motor, or a hybrid type stepping motor. The lead screw 224 refers to an element capable of converting a rotational motion into a linear motion. The securing kit 226 refers to a device that can be equipped to assemble or secure other components. One sleeve opening of the fixing sleeve 226 can be connected with the screw rod 224 through matching threads, and the other sleeve opening of the fixing sleeve 226 can be sleeved with the clamp 250.

Specifically, one end of the screw rod 224 is connected to the stepping motor 222, and the other end of the screw rod 224 is connected to a socket of the fixing sleeve 226; the other cuff of the retaining sleeve 226 is connected to a clamp 250. The processing device 210 drives the stepping motor 222 to work, and the stepping motor 222 pushes the screw rod 224 to drive the fixing sleeve 226 and the clamp 250 to move. The BGA package device is moved by the movement of the clamp 250.

Further, when the pressure of the BGA package device is equal to the preset pressure, the processing device 210 starts the grinder 230 to grind the solder balls of the BGA package device through the grinding function of the grinder 230; the screw rod 224 is pushed to drive the fixing sleeve 226 and the clamp 250 to move by driving the stepping motor 222; the jig 250 drives the BGA package device to move the height of the solder balls towards the direction of the grinding machine, so that the solder balls of the BGA package device can be accurately removed.

Further, a pressure sensor 240 is provided at an end of the clamp 250 adjacent to the lead screw 224.

Specifically, by disposing the pressure sensor 240 at one end of the clamp 250 close to the lead screw 224, and then the processing device 210 drives the stepping motor 222 to push the lead screw 224 to move toward the grinder 230, one end of the lead screw 224 can contact and press the pressure sensor 240. The pressure applied to the pressure sensor 240 by the lead screw 224 is the pressure applied to the BGA package device

Based on the embodiment, the processing equipment drives the stepping motor to drive the clamp to move towards the direction of the grinding machine through the screw rod; the pressure sensor transmits the sensed pressure of the BGA packaging device to the processing equipment; the processing equipment starts the grinder when the pressure is equal to the preset pressure, so that the grinder grinds the solder balls of the BGA packaging device. The embodiment of the invention can realize the removal of the solder balls of the BGA packaging device, can ensure the consistency of the removal effect, can prevent the mechanical damage to the substrate of the BGA packaging device, and optimizes the removal effect of the solder balls of the BGA packaging device.

In one embodiment, as shown in fig. 3, there is provided a ball removing apparatus for a BGA packaged device, including a processing apparatus 310, an actuator 320, a grinder 330, a pressure sensor 340, and a jig. Wherein the clamp is a vacuum adsorption clamp 350.

The vacuum chuck 350 is a chuck in which a workpiece is fixed at a chuck end by external atmospheric pressure during vacuum clamping; the vacuum suction jig 350 may generate a suction force by a difference between an air pressure inside the jig and an air pressure outside the jig, thereby fixing the BGA package device.

Specifically, the driving device 320, the pressure sensor 340 and the grinder 330 are electrically connected based on the processing device 310, respectively; one end of the vacuum adsorption clamp 350 is mechanically connected with the transmission device 320, the other end of the vacuum adsorption clamp 350 is mechanically connected with the BGA package device, and the BGA package device is fixed at the other end of the vacuum adsorption clamp 350 through the air pressure difference principle. The processing device 310 drives the transmission device 320 to move, and the transmission device 320 moves to drive the vacuum chuck 350 to move, so that the transmission device 320 drives the vacuum chuck 350 to move toward the grinder 330. The compression of the BGA packaged device is sensed by the pressure sensor 340. When the pressure applied to the BGA package device by the processing device 310 is equal to the preset pressure, that is, the solder surface of the BGA package device contacts the grinding surface of the grinder 330, the grinder 330 is started, and the solder balls of the BGA package device are ground by the grinding function of the grinder 330, so that the solder balls of the BGA package device are removed.

In a specific embodiment, as shown in fig. 3, the BGA package device solder ball removal apparatus further includes a vacuum pump 360 for pumping air inside the vacuum suction jig 350; the vacuum pump 360 is connected to the vacuum suction jig 350.

The vacuum pump 360 is a device or apparatus for obtaining a vacuum by pumping a pumped container by a mechanical, physical, chemical or physicochemical method.

Specifically, when the BGA package device needs to be fixed to the vacuum chuck 350, air in the vacuum chuck may be pumped by the vacuum pump 360, so that an air pressure difference is generated between the inside and the outside of the vacuum chuck. When the air pressure difference reaches a certain value, the BGA package device can be fixed to the vacuum chuck 350. When the BGA package device needs to be taken out from the vacuum adsorption clamp 350, the vacuum pump 360 can be closed, and the valve of the vacuum adsorption clamp 350 is opened, so that the air pressure inside and outside the vacuum adsorption clamp 350 is the same, the BGA package device can be taken out from the vacuum adsorption clamp 350, and the automation degree of removing the solder balls of the BGA package device is improved.

In one embodiment, as shown in fig. 3, the BGA package device ball removing apparatus further includes a support frame 370; one end of the support bracket 370 is connected to the transmission device 320.

Specifically, the supporting frame 370 may be used to fix one end of the driving device 320, so that the driving device 320 may accurately drive the BGA package device to move through the fixture.

Based on this embodiment, can accurate control transmission equipment grind the BGA solder ball and get rid of, can guarantee to get rid of the uniformity of effect, prevent to cause mechanical damage to BGA package substrate to can satisfy the technical requirement that thermal deformation detected.

In one embodiment, as shown in fig. 4, there is provided a ball removing apparatus for a BGA packaged device, including a computer 410, a stepping motor 420, a lead screw 430, a fixing kit 440, a pressure sensor 450, a jig 460, a vacuum pump 470, and a grinder 480; the computer 410 is electrically connected to the stepper motor 420, the pressure sensor 450, and the grinder 480, respectively. Wherein, the computer 410 is used for further program control of the stepping motor 420 and the pressure sensor 450; the screw rod 430 is connected with the fixed sleeve 440 through matched threads; the stepping motor 420 drives the fixing sleeve 440 and the clamp 460 to move by pushing the screw rod 430; the clamp 460 is used for picking up and fixing the BGA package device and driving the BGA package device to move; the vacuum pump 470 is used to draw air in the jig to fix the BGA package device by the principle of pressure difference; the pressure sensor 450 is used to position the BGA packaged device in contact with the grinder 480; the grinder 480 is used for grinding removal of the solder balls of the BGA device.

Specifically, the specific working process for removing the solder balls of the BGA package device is as follows:

1. the BGA package device is held together with the metal plate (e.g., with a rubber band or metal clip) so that the substrate of the BGA package device is parallel to the metal plate.

2. Measuring the distance between the lower surface of the substrate of the BGA device and the upper surface of the metal plate by using a measuring device such as a vernier caliper or a tool microscope (as shown in fig. 5, measuring each side of the BGA package device, wherein each side includes at least 3 different positions); and averaging all the test data, and taking the processing result as the solder ball height of the BGA packaging device.

3. Placing the BGA packaging device at the lower end of the clamp, wherein the solder ball surface of the BGA packaging device faces downwards; and starting a vacuum pump, extracting air in the clamp, and fixing the BGA packaging device by the pressure difference principle.

4. The stepping motor is driven by the computer, the clamp and the BGA packaging device are driven by the lead screw to move downwards towards the grinding machine, when the testing pressure of the pressure sensor is greater than or equal to the preset pressure (for example, the preset pressure is 0.5kg), the movement is stopped, and the position is recorded as the starting position.

5. The grinder places coarse grinding sandpaper, starts the grinder (speed adjustable), controls the stepper motor to drive the fixture and the BGA package device to move downward from the initial position at a constant speed (speed adjustable) by a first height (e.g., the height of the solder ball is 70% of the height of the first height), i.e., removes the solder ball at the first height by coarse grinding, and records the position as the first grinding position.

6. After the grinder is turned off and the fine grinding abrasive paper is replaced, the grinder (with adjustable speed) is started, the stepper motor is controlled to drive the clamp and the BGA packaging device to move downwards from the first grinding position at a constant speed (with the speed being set) for a second height (the second height is 25% of the height of the solder balls), namely, the solder balls at the second height are removed through fine grinding, and the position is recorded as a second grinding position.

7. After the grinding machine is turned off and the polishing cloth (polishing solution) is replaced, the grinding machine (with adjustable speed) is started, and the stepping motor is controlled to drive the clamp and the BGA packaging device to move downwards from the second high grinding position at a constant speed (with the speed being set) by a third height (the third height is 5% of the height of the solder ball), namely, the whole solder ball is removed by polishing. Wherein the sum of the first height, the second height, and the third height is equal to the solder ball height.

8. And turning off the vacuum pump, and taking down the BGA packaging device after the solder balls are removed to finish the removal of the solder balls of the BGA packaging device.

In one embodiment, as shown in fig. 6, there is provided a ball removing method for a BGA packaged device, comprising the steps of:

step S610, the BGA package device is fixed on the jig with the bonding surface of the BGA package device facing the grinder.

Step S620, driving a transmission device for driving the clamp to move, and moving the transmission device for a preset distance from the initial position so that the grinding machine grinds the solder balls of the BGA packaging device; the starting position is the position of the transmission equipment recorded when the transmission equipment is driven to drive the clamp to move until the pressure of the BGA packaging device is equal to the preset pressure; the preset distance is the height of the solder ball of the BGA package device.

Specifically, the BGA package device is fixed on a jig with the solder face of the BGA package device facing a grinder, and the solder ball height of the BGA package device is measured. When the pressure that processing equipment received BGA encapsulation device equals to predetermineeing pressure, the current position of record BGA encapsulation device is the home position to start the machine of grinding, through the grinding function of grinding the machine, grind the solder ball of BGA encapsulation device, processing equipment drive transmission equipment passes through anchor clamps and drives BGA encapsulation device and move the distance of predetermineeing (being the distance of solder ball height) towards the direction of grinding the machine from the home position. It should be noted that the processing equipment drives the transmission equipment to move at a constant speed, and then drives the BGA package device to move towards the grinding machine at a constant speed, and then realizes accurate removal of the solder balls of the BGA package device.

In a specific embodiment, the method further comprises the steps of:

Specifically, when the solder ball surface of the BGA package device is fixed to the metal plate, the processing device measures the distance between the lower surface of the substrate of the BGA package device and the upper surface of the metal plate, so as to obtain the solder ball height of the BGA package device.

Based on this embodiment, the processing equipment can drive the transmission equipment to drive the clamp to move towards the direction of the grinding machine, and when the pressure applied to the BGA package device is equal to the preset pressure, the grinding machine is started so that the grinding machine can grind the solder balls of the BGA package device. The solder ball removing device can remove solder balls of the BGA packaging device, can ensure the consistency of the removing effect, can prevent mechanical damage to a substrate of the BGA packaging device, and optimizes the solder ball removing effect of the BGA packaging device.

In one embodiment, a method for removing solder balls from a BGA package device is provided, wherein, as shown in fig. 7, a schematic flow chart of a solder ball grinding step of a BGA package device includes the following steps:

step S710, starting a grinder for placing rough grinding abrasive paper, driving a transmission device to move a first grinding distance from an initial position so that the grinder grinds and removes the solder balls at the first grinding distance, and recording the position of the transmission device as a first middle position; dividing the height of the solder ball into a first grinding distance, a second grinding distance and a third grinding distance;

step S720, starting a grinder for placing fine abrasive paper, driving the transmission equipment to move a second grinding distance from the first middle position so that the grinder grinds and removes the solder balls at the second grinding distance, and recording the position of the transmission equipment as a second middle position;

and step S730, starting the grinder for placing the polishing cloth, and driving the transmission device to move for a third grinding distance from the second middle position so that the grinder grinds and removes the solder balls at the third grinding distance.

Specifically, processing equipment starts the machine that grinds of placing coarse grinding abrasive paper, placing fine grinding abrasive paper and placing polishing cloth respectively, and then makes the machine that grinds remove whole solder ball, realizes accurate getting rid of BGA encapsulation device solder ball, has optimized BGA encapsulation device solder ball and has got rid of the effect.

In one embodiment, as shown in fig. 8, there is provided a ball removing method for a BGA packaged device, comprising the steps of:

step S810, starting a vacuum pump for pumping air in the jig so that the jig adsorbs and fixes the BGA package device.

Step S820, the BGA packaged device is fixed on the jig with the bonding surface of the BGA packaged device facing the grinder.

Step S830, driving a transmission device for driving the clamp to move, and moving the transmission device for a preset distance from an initial position so that the grinding machine grinds the solder balls of the BGA packaging device; the starting position is the position of the transmission equipment recorded when the transmission equipment is driven to drive the clamp to move until the pressure of the BGA packaging device is equal to the preset pressure; the preset distance is the height of the solder ball of the BGA package device.

The specific content process of step S820 and step S830 may refer to the above content, and is not described herein again.

Specifically, the processing equipment starts a vacuum pump for pumping air in the clamp, so that the clamp adsorbs and fixes the BGA packaging device; the processing equipment drives the transmission equipment to drive the clamp to move towards the direction of the grinding machine; when the pressure applied to the BGA package device is equal to the preset pressure, the processing equipment starts the grinder so that the grinder grinds the solder balls of the BGA package device. And then the removal of the solder balls of the BGA packaging device is realized.

It should be understood that, although the respective steps in the flowcharts of fig. 6 to 8 are sequentially shown as indicated by arrows, the steps are not necessarily sequentially performed in the order indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Also, at least some of the steps in fig. 6-8 may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

It will be understood by those of ordinary skill in the art that all or a portion of the processes of the methods of the embodiments described above may be implemented by instructions associated with hardware via a computer program that may be stored on a non-volatile computer-readable storage medium, which when executed, may include processes such as those of the embodiments of the methods of division.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A BGA packaging device solder ball removing device is characterized in that the BGA packaging device solder ball removing device is applied to BGA thermal deformation detection; the BGA packaging device solder ball removing device comprises a processing device, a transmission device, a grinder for grinding solder balls of the BGA packaging device, a pressure sensor for sensing the pressure of the BGA packaging device, and a clamp for fixing the BGA packaging device; the transmission equipment is connected with the clamp; the solder balls of the BGA package device face the grinder;

the processing equipment drives the transmission equipment to drive the clamp to move towards the grinding machine; the pressure sensor transmits the sensed pressure of the BGA packaging device to the processing equipment; when the pressure is equal to a preset pressure, the processing equipment starts the grinding machine and drives the transmission equipment to move for a preset distance, so that the grinding machine grinds the welding balls of the BGA packaging device;

the preset distance is the height of a solder ball of the BGA packaging device; the height of the solder ball is obtained by measuring the distance between the lower surface of the substrate of the BGA package device and the upper surface of the metal flat plate fixed together with the solder ball surface of the BGA package device.

2. The BGA package device ball removing apparatus of claim 1, wherein said transmission apparatus includes a stepping motor, a lead screw and a fixing kit;

one end of the screw rod is connected with the stepping motor, and the other end of the screw rod is connected with a sleeve opening of the fixed sleeve; and the other looping of the fixing suite is connected with the clamp.

3. The BGA package device ball removal apparatus of claim 2, wherein the pressure sensor is disposed at one end of the jig near the lead screw.

4. The BGA package device solder ball removal apparatus of claim 1, wherein the jig is a vacuum suction jig.

5. The BGA package device solder ball removal apparatus of claim 4, further comprising a vacuum pump for pumping air inside the vacuum suction jig;

the vacuum pump is connected with the vacuum adsorption clamp.

6. The BGA package device solder ball removing apparatus of any one of claims 1 to 5, further comprising a support frame;

one end of the support frame is connected with the transmission equipment.

7. The BGA package device solder ball removal apparatus of any one of claims 1 to 5, wherein the pressure sensor is a piezoresistive pressure sensor or a piezoelectric pressure sensor.

8. A method for removing a solder ball of a BGA packaging device is characterized by being applied to BGA thermal deformation detection; the method comprises the following steps:

driving a transmission device for driving the clamp to move, and moving the transmission device from the initial position by a preset distance so that the grinding machine grinds the welding balls of the BGA packaging device; the starting position is the position of the transmission equipment recorded when the transmission equipment is driven to drive the clamp to move until the pressure of the BGA packaging device is equal to the preset pressure; the preset distance is the height of a solder ball of the BGA packaging device;

further comprising the steps of:

9. The method of claim 8, wherein the step of moving the driving means for moving the jig from the initial position by a predetermined distance to allow the grinding machine to grind the solder balls of the BGA package device comprises:

starting the grinder for placing rough grinding abrasive paper, driving the transmission device to move a first grinding distance from a starting position, so that the grinder grinds and removes the solder balls at the first grinding distance, and recording the position of the transmission device as a first intermediate position; the height of the solder ball is divided into the first grinding distance, the second grinding distance and the third grinding distance;

starting the grinder for placing fine grinding abrasive paper, driving the transmission device to move from the first middle position by a second grinding distance, so that the grinder grinds and removes the solder balls at the second grinding distance, and recording the position of the transmission device as a second middle position;

10. The method of claim 9, wherein the step of fixing the BGA package device to the jig comprises: