CN211332748U - Fixture device for monocrystalline silicon wafer polishing machine - Google Patents
Fixture device for monocrystalline silicon wafer polishing machine Download PDFInfo
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- CN211332748U CN211332748U CN201921776847.3U CN201921776847U CN211332748U CN 211332748 U CN211332748 U CN 211332748U CN 201921776847 U CN201921776847 U CN 201921776847U CN 211332748 U CN211332748 U CN 211332748U
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Abstract
The utility model discloses a clamp device for a monocrystalline silicon wafer polishing machine, which comprises a base plate, wherein a left vertical plate and a right vertical plate are arranged on the base plate side by side, a clamping assembly is arranged between the left vertical plate and the right vertical plate, and the clamping assembly is used for clamping a monocrystalline silicon wafer; a power assembly for driving the clamping assembly to rotate is arranged on one side of the left vertical plate on the base plate; the clamping device is simple in structure, convenient to operate and capable of clamping a plurality of monocrystalline silicon wafers at one time.
Description
Technical Field
The utility model belongs to the technical field of monocrystalline silicon piece polishing, especially, relate to a clamping device for monocrystalline silicon piece polishing machine.
Background
A single crystal silicon wafer is a crystal having a substantially complete lattice structure. Different directions have different properties and are good semiconducting materials. After the single crystal silicon wafer is manufactured, the surface of the single crystal silicon wafer is usually required to be polished due to the rough surface. In order to facilitate grinding and polishing, the monocrystalline silicon wafer needs to be fixed, the conventional fixing mode is similar to the clamping mode of a bench vice, and the monocrystalline silicon wafer is clamped by driving a clamping block through a screw rod. The fixing mode can only fix one monocrystalline silicon piece at a time, so that the grinding and polishing efficiency of the monocrystalline silicon piece is seriously influenced.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model aims at providing a single crystal silicon wafer is fixture device for burnishing machine, its simple structure not only, convenient operation moreover, a plurality of single crystal silicon wafers's centre gripping is realized to one time performance.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a clamp device for a monocrystalline silicon wafer polishing machine comprises a substrate, wherein a left vertical plate and a right vertical plate are arranged on the substrate side by side, a clamping assembly is arranged between the left vertical plate and the right vertical plate, and the clamping assembly is used for clamping a monocrystalline silicon wafer; a power assembly for driving the clamping assembly to rotate is arranged on one side of the left vertical plate on the base plate; the clamping assembly comprises a rotating shaft which is rotatably connected between the left vertical plate and the right vertical plate, a clamping block body with a square cross section is fixedly installed on the rotating shaft, and clamping grooves with openings at left ends are formed in four side surfaces around the clamping block body; the rotating shaft is connected with a pressing plate in a sliding manner, and the pressing plate is positioned between the clamping block body and the left vertical plate; and a compression spring is sleeved on the rotating shaft and is positioned between the compression plate and the left vertical plate and used for forcing the compression plate to be pressed towards the clamping block body.
Through the technical scheme, when the clamp device for the monocrystalline silicon wafer polishing machine works, the pressing plate is moved towards the left vertical plate direction and compresses the pressing spring, then the four monocrystalline silicon wafers are placed into the four clamping grooves, then the pressing plate is loosened, and the pressing plate presses the four monocrystalline silicon wafers in the clamping grooves under the action of the pressing spring; then, the power assembly drives the rotating shaft to rotate, so that one of the monocrystalline silicon wafers is in a horizontal position, and the monocrystalline silicon wafers are conveniently polished by a polishing machine; after one of the monocrystalline silicon wafers is processed, the power assembly controls the rotating shaft to continuously rotate so as to drive the other monocrystalline silicon wafer to be in a horizontal position, then the polishing machine is convenient to polish and polish the monocrystalline silicon wafers, and the power assembly controls the rotating shaft to rotate in sequence until all the monocrystalline silicon wafers on the clamping block body are processed; when the monocrystalline silicon wafer needs to be taken out, the pressing plate is moved towards the left vertical plate again and the pressing spring is compressed, so that the monocrystalline silicon wafer can be taken out from the clamping groove; the clamping device is simple in structure, convenient to operate and capable of clamping a plurality of monocrystalline silicon wafers at one time.
In a further technical scheme, power component includes worm wheel, worm, runner, worm wheel fixed mounting is in the pivot and stretches out the one end of the vertical board in a left side, respectively be equipped with a backup pad in the both sides of worm wheel along vertical direction on the base plate, the worm rotates to be connected between two backup pads, and with the worm wheel meshing.
Through the technical scheme, when the power assembly works, the worm is driven to rotate through the rotating wheel, the worm rotates to drive the worm wheel to rotate, the rotating shaft is driven to rotate, and the rotating shaft can be prevented from rotating when the monocrystalline silicon piece is polished by the worm wheel and the worm.
In a further technical scheme, a positioning rod is arranged at one end, close to a left vertical plate, of the clamping block body, and a positioning hole matched with the positioning rod is formed in the pressing plate; the pressing plate and the rotating shaft can be prevented from rotating relatively through the matching of the positioning rod and the positioning hole.
In a further technical scheme, a convex block extending towards the clamping groove is arranged on the surface of the pressing plate facing the clamping block body, a pressing inclined surface is arranged on the convex block, and a clamping inclined surface is arranged on the side surface, far away from the convex block, in the clamping groove; this setting can further compress tightly the monocrystalline silicon piece in the centre gripping inslot through the cooperation that compresses tightly inclined plane and joint inclined plane.
In a further technical scheme, a pointer extending towards the circle center direction of a worm wheel is fixedly mounted on the side face of one of the support plates, and an indication scale mark is arranged on the end face of the worm wheel far away from the left vertical plate; according to the arrangement, the precise horizontal positioning of the monocrystalline silicon wafer can be realized through the matching of the pointer and the indication scale marks.
(III) advantageous effects
Compared with the prior art, the technical scheme of the utility model have following advantage:
when the clamp device for the monocrystalline silicon wafer polishing machine works, the pressing plate is moved towards the left vertical plate direction and compresses the pressing spring, then the four monocrystalline silicon wafers are placed into the four clamping grooves, then the pressing plate is loosened, and the pressing plate presses the four monocrystalline silicon wafers in the clamping grooves under the action of the pressing spring; then, the power assembly drives the rotating shaft to rotate, so that one of the monocrystalline silicon wafers is in a horizontal position, and the monocrystalline silicon wafers are conveniently polished by a polishing machine; after one of the monocrystalline silicon wafers is processed, the power assembly controls the rotating shaft to continuously rotate so as to drive the other monocrystalline silicon wafer to be in a horizontal position, then the polishing machine is convenient to polish and polish the monocrystalline silicon wafers, and the power assembly controls the rotating shaft to rotate in sequence until all the monocrystalline silicon wafers on the clamping block body are processed; when the monocrystalline silicon wafer needs to be taken out, the pressing plate is moved towards the left vertical plate again and the pressing spring is compressed, so that the monocrystalline silicon wafer can be taken out from the clamping groove; the clamping device is simple in structure, convenient to operate and capable of clamping a plurality of monocrystalline silicon wafers at one time.
Drawings
FIG. 1 is a schematic perspective view of a polishing machine in an embodiment;
FIG. 2 is a front view of the polishing machine in the embodiment;
FIG. 3 is a left side view of the polishing machine in the embodiment;
FIG. 4 is a cross-sectional view taken at B-B of FIG. 3;
FIG. 5 is an enlarged view of the structure at A in FIG. 4;
FIG. 6 is a perspective view of a clamping block according to the embodiment;
fig. 7 is a perspective view of the pressing plate in the embodiment.
Detailed Description
Referring to fig. 1-7, a clamping device for a monocrystalline silicon wafer polishing machine comprises a substrate 1, wherein a left vertical plate 2a and a right vertical plate 2b are arranged on the substrate 1 side by side, and a clamping assembly is arranged between the left vertical plate 2a and the right vertical plate 2b and used for clamping a monocrystalline silicon wafer; a power assembly for driving the clamping assembly to rotate is arranged on one side of the left vertical plate 2a on the base plate 1; the clamping assembly comprises a rotating shaft 13 rotatably connected between the left vertical plate 2a and the right vertical plate 2b, a clamping block body 14 with a square cross section is fixedly mounted on the rotating shaft 13, and clamping grooves 1401 with openings at left ends are formed in four side surfaces around the clamping block body 14; the rotating shaft 13 is connected with a pressing plate 15 in a sliding manner, and the pressing plate 15 is positioned between the clamping block body 14 and the left vertical plate 2 a; a pressing spring 16 is sleeved on the rotating shaft 13, and the pressing spring 16 is positioned between the pressing plate 15 and the left vertical plate 2a and used for forcing the pressing plate 15 to press the clamping block body 14.
The power component comprises a worm wheel 17, a worm 18 and a rotating wheel 19, wherein the worm wheel 17 is fixedly arranged at one end of the rotating shaft 13 extending out of the left vertical plate 2a, supporting plates 20 are respectively arranged on two sides of the worm wheel 17 on the substrate 1 along the vertical direction, and the worm 18 is rotatably connected between the two supporting plates 20 and meshed with the worm wheel 17.
The clamping block body 14 is provided with a positioning rod 21 at one end close to the left vertical plate 2a, the pressing plate 15 is provided with a positioning hole 1501 matched with the positioning rod 21, and the pressing plate 15 and the rotating shaft 13 can be prevented from rotating relatively through the matching of the positioning rod 21 and the positioning hole 1501. The pressing plate 15 is provided with a bump 1502 extending into the clamping groove 1401 on the surface facing the clamping block 14, the bump 1502 is provided with a pressing inclined surface 1503, the clamping groove 1401 is provided with a clamping inclined surface 1402 on the side surface far away from the bump 1502, and the pressing inclined surface 1503 is matched with the clamping inclined surface 1402, so that the monocrystalline silicon piece can be further pressed in the clamping groove 1401. And a pointer 22 extending towards the circle center direction of the worm wheel 17 is fixedly arranged on the side surface of one of the support plates 20, an indication scale line 1701 is arranged on the end surface of the worm wheel 17 far away from the left vertical plate 2a, and the accurate horizontal positioning of the monocrystalline silicon wafer can be realized through the matching of the pointer 22 and the indication scale line 1701.
When the clamping device for the monocrystalline silicon wafer polishing machine works, the pressing plate 15 is firstly moved towards the left vertical plate 2a and the pressing spring 16 is compressed, then four monocrystalline silicon wafers are placed in the four clamping grooves 1401, then the pressing plate 15 is loosened, and the four monocrystalline silicon wafers are pressed in the clamping grooves 1401 by the pressing plate 15 under the action of the pressing spring 16 through the bumps 1502 and the pressing inclined planes 1503 on the bumps 1502. Then the worm 18 is driven to rotate through the rotating wheel 19, the worm 18 drives the worm wheel 17 to rotate when rotating, and further drives the rotating shaft 13 to rotate, when the pointer 22 is aligned with the indication scale line 1701, the rotating wheel 19 stops rotating, and the monocrystalline silicon wafer in one of the clamping grooves 1401 is in a horizontal position, so that the grinding and polishing of the monocrystalline silicon wafer by the polishing machine are facilitated.
After one of the monocrystalline silicon wafers is processed, the worm 18 is driven to rotate through the rotating wheel 19 again, the worm 18 drives the worm wheel 17 to rotate when rotating, further drives the rotating shaft 13 to rotate, when the pointer 22 is aligned with the next indication scale line 1701, the rotating wheel 19 stops rotating, and at the moment, the other monocrystalline silicon wafer in the other clamping groove 1401 is in a horizontal position; and then, grinding and polishing the monocrystalline silicon wafer by using the polishing machine again, and sequentially operating until all the monocrystalline silicon wafers on the clamping block body 14 are completely processed. When the single crystal silicon wafer is to be taken out, the single crystal silicon wafer can be taken out from the holding groove 1401 by moving the pressing plate 15 toward the left vertical plate 2a and compressing the pressing spring 16.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the technical principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (5)
1. The clamp device for the monocrystalline silicon wafer polishing machine comprises a substrate and is characterized in that a left vertical plate and a right vertical plate are arranged on the substrate side by side, a clamping assembly is arranged between the left vertical plate and the right vertical plate, and the clamping assembly is used for clamping a monocrystalline silicon wafer; a power assembly for driving the clamping assembly to rotate is arranged on one side of the left vertical plate on the base plate; the clamping assembly comprises a rotating shaft which is rotatably connected between the left vertical plate and the right vertical plate, a clamping block body with a square cross section is fixedly installed on the rotating shaft, and clamping grooves with openings at left ends are formed in four side surfaces around the clamping block body; the rotating shaft is connected with a pressing plate in a sliding manner, and the pressing plate is positioned between the clamping block body and the left vertical plate; and a compression spring is sleeved on the rotating shaft and is positioned between the compression plate and the left vertical plate and used for forcing the compression plate to be pressed towards the clamping block body.
2. The clamping device for the monocrystalline silicon wafer polishing machine as claimed in claim 1, wherein the power assembly comprises a worm wheel, a worm and a rotating wheel, the worm wheel is fixedly arranged at one end of the rotating shaft extending out of the left vertical plate, a supporting plate is respectively arranged on the two sides of the worm wheel on the base plate along the vertical direction, and the worm is rotatably connected between the two supporting plates and meshed with the worm wheel.
3. The jig device for a single crystal silicon wafer polishing machine as claimed in claim 1, wherein the grip block body is provided with a positioning rod at an end thereof adjacent to the left vertical plate, and the pressing plate is provided with a positioning hole to be fitted with the positioning rod.
4. The clamping device for the monocrystalline silicon wafer polishing machine as claimed in claim 1, wherein the pressing plate is provided with a projection extending into the clamping groove on a surface facing the clamping block body, the projection is provided with a pressing inclined surface, and a clamping inclined surface is provided on a side surface far away from the projection in the clamping groove.
5. The clamping device for the monocrystalline silicon wafer polishing machine as claimed in claim 2, wherein a pointer extending towards the center of the worm wheel is fixedly mounted on the side surface of one of the supporting plates, and the worm wheel is provided with an indicating scale mark on the end surface far away from the left vertical plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921776847.3U CN211332748U (en) | 2019-10-22 | 2019-10-22 | Fixture device for monocrystalline silicon wafer polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921776847.3U CN211332748U (en) | 2019-10-22 | 2019-10-22 | Fixture device for monocrystalline silicon wafer polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211332748U true CN211332748U (en) | 2020-08-25 |
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ID=72098821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921776847.3U Active CN211332748U (en) | 2019-10-22 | 2019-10-22 | Fixture device for monocrystalline silicon wafer polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211332748U (en) |
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2019
- 2019-10-22 CN CN201921776847.3U patent/CN211332748U/en active Active
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