CN109616466A - Fingerprint encapsulation module, packaging method, display module - Google Patents
Fingerprint encapsulation module, packaging method, display module Download PDFInfo
- Publication number
- CN109616466A CN109616466A CN201811109821.3A CN201811109821A CN109616466A CN 109616466 A CN109616466 A CN 109616466A CN 201811109821 A CN201811109821 A CN 201811109821A CN 109616466 A CN109616466 A CN 109616466A
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- module
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- fingerprint
- passivation layer
- fingerprint encapsulation
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 115
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 20
- 230000006698 induction Effects 0.000 claims abstract description 68
- 239000004033 plastic Substances 0.000 claims abstract description 53
- 239000004020 conductor Substances 0.000 claims abstract description 41
- 238000003466 welding Methods 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 205
- 238000002161 passivation Methods 0.000 claims description 94
- 239000011799 hole material Substances 0.000 claims description 70
- 229910052751 metal Inorganic materials 0.000 claims description 58
- 239000002184 metal Substances 0.000 claims description 58
- 239000000463 material Substances 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- BWCDLEQTELFBAW-UHFFFAOYSA-N 3h-dioxazole Chemical compound N1OOC=C1 BWCDLEQTELFBAW-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000002322 conducting polymer Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 Cu (copper) Chemical class 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The present invention provides a kind of fingerprint encapsulation modules, packaging method, display module, fingerprint encapsulation module includes: the drive module being spaced apart and induction module, drive module includes driving chip and Passive components, driving chip and Passive components are spaced apart, induction module includes sensitive surface and the back side that is oppositely arranged with sensitive surface, driving chip includes welding surface, is provided with pad on sensitive surface and welding surface；Plastic packaging layer, plastic packaging layer fill the gap between driving chip, Passive components and induction module, and plastic packaging layer includes first surface and the second surface that is oppositely arranged with first surface, and first surface and welding surface are located at the same side；Multiple through-holes are filled with conductive material in through-hole；First structure is electrically interconnected with drive module and induction module respectively by pad, and the conductive material in first structure and through-hole is electrically connected；And second structure, the conductive material in the second structure and through-hole is electrically connected, the thickness of fingerprint encapsulation module is thinned.
Description
Technical field
The present invention relates to fingerprint encapsulation technology field, in particular to a kind of fingerprint encapsulation module, packaging method, display mould
Group.
Background technique
Commonly used with smart phone, the requirement that people are light to mobile phone, thin is higher and higher, so that each component of mobile phone is all
It needs highly integrated.Fingerprint encapsulation module is integrated with drive module and identification of fingerprint device as handset switch, so that driving
Dynamic chip, the component heights such as Passive components and identification of fingerprint chip are concentrated.
However, the packaging method of fingerprint encapsulation module commonly used in the prior art is COB (Chip On Board, core on plate
Piece) encapsulation is by driving chip, Passive components and identification of fingerprint chip etc. are attached to mutual symbasis with conductive or non-conductive adhesive
On plate (generalling use pcb board), then carries out wire bonding and realize its electric connection, it later can be in the induction of identification of fingerprint chip
For example, by one protection glass of the encapsulation adhesives such as epoxy resin covering, (for example, infrared glass has infrared ray on face
The glass of filtering function), to protect the sensitive surface of identification of fingerprint chip.Exist by the fingerprint encapsulation module that the above method is formed
Following problems: on the one hand, since above-mentioned component is superimposed upon on interconnection substrate, lead to the thickness for being formed by fingerprint encapsulation module
It is larger；On the other hand, it is formed on interconnection substrate by way of routing due to metal lead wire, since technique limits, fingerprint envelope
The spacing between each device in die-filling group is typically larger than 100 microns, thus limits the further of fingerprint encapsulation module area
It reduces, both sides reason will cause limitation of the fingerprint encapsulation module in subsequent composition display module in size.
Summary of the invention
The purpose of the present invention is to provide a kind of fingerprint encapsulation modules, packaging method, the thickness of fingerprint encapsulation module is thinned
Degree.
To solve the above-mentioned problems, on the one hand, the present invention provides a kind of fingerprint encapsulation modules, comprising:
The drive module and induction module being spaced apart, the drive module include driving chip and Passive components, institute
It states driving chip and Passive components is spaced apart, the induction module includes sensitive surface and is oppositely arranged with the sensitive surface
The back side, the driving chip includes welding surface, is provided with pad on the sensitive surface and welding surface；Plastic packaging layer, the plastic packaging
Layer fills the gap between the driving chip, Passive components and induction module, is used to fix the driving chip, passive
Component and induction module are also used to electrically isolate the driving chip, Passive components and induction module, the plastic packaging layer packet
The second surface for including first surface and being oppositely arranged with the first surface, the first surface, the sensitive surface and welding surface
It is respectively positioned on the same side of the fingerprint encapsulation module；Multiple through-holes, the multiple through-hole are passed through along the thickness direction of the plastic packaging layer
The plastic packaging layer is worn, is filled with conductive material in the through-hole；First structure, the first structure are arranged in the first surface
On, it is electrically interconnected with the drive module and induction module respectively by the pad, and the first structure and the through-hole
In conductive material be electrically connected；And second structure, second structure setting is on the second surface, second knot
Conductive material in structure and the through-hole is electrically connected.
Optionally, the first structure includes the first passivation layer, the first metal layer and the second passivation layer, and described first is blunt
Change the layer covering first surface, the sensitive surface and welding surface, the first metal layer and is located at the portion of first passivation layer
On subregion, second passivation layer covers first passivation layer and the first metal layer, first passivation layer and the
Two passivation layers are for being isolated the first metal layer, and first passivation layer and the second passivation layer exposure sensitive surface are used
In the region of identification of fingerprint.
Optionally, be provided with the first connecting hole and the second connecting hole in first passivation layer, first connecting hole and
Conductive material, the one end point for the conductive material filled in first connecting hole and the second connecting hole are filled in second connecting hole
It is not electrically connected with the first metal layer, on the conductive material filled in the other end and the through-hole, the driving chip
Pad, the pad on the Passive components or the pad on the induction module are electrically connected, to realize the fingerprint encapsulation
The electric connection of mould group on the first surface.
Optionally, the sensitive surface for identification of fingerprint region area be the sensitive surface the gross area 20%~
80%.
Optionally, second structure includes third passivation layer, second metal layer and the 4th passivation layer, second gold medal
Belonging to layer includes multiple weld pads, and the third passivation layer covers the second surface, and it is blunt that the second metal layer is located at the third
On the partial region for changing layer, the 4th passivation layer covers the third passivation layer and the second metal layer, the third are blunt
Change layer and the 4th passivation layer for the second metal layer, and the multiple weld pad of the 4th passivation layer exposure to be isolated.
Optionally, it is provided with third connecting hole in the third passivation layer, is filled with conduction material in the third connecting hole
Material, the one end for the conductive material filled in the third connecting hole and the third metal layer are electrically connected, the other end with it is described
The conductive material filled in through-hole is electrically connected, to realize the electric connection of the fingerprint encapsulation module.
Optionally, the gap in the driving chip, Passive components and induction module between arbitrary neighborhood two is greater than
Equal to 100 microns, and the ruler at the edge of the driving chip, Passive components and induction module apart from the fingerprint encapsulation module
It is very little to be all larger than or equal to 300 microns.
Optionally, the thickness of the plastic packaging layer is greater than or equal in the driving chip, Passive components and induction module
Thickness most thick one, further, the thickness of the plastic packaging layer are equal to thick in the driving chip, Passive components and induction module
Spend the thickness of most thick one.
Optionally, the thickness of the fingerprint encapsulation module meets following formula:
H=a+b；
Wherein, h is the thickness of the fingerprint encapsulation module, and a is the thickness of the plastic packaging layer, and b is constant, wherein b is greater than
Or it is equal to 50 microns.
Optionally, the induction module includes optical finger print identification sensor or ultrasonic wave identifier, the ultrasonic wave
Identifier includes ultrasonic transmitter and ultrasonic receiver.
On the other hand, the present invention also provides a kind of display modules, including above-mentioned fingerprint encapsulation module.
It optionally, further include display, the fingerprint encapsulation module is located at the positive lower part of the display, alternatively, institute
Fingerprint encapsulation module is stated to be located on the back side of the display.
In another aspect, the present invention also provides a kind of fingerprint packaging methods, comprising the following steps:
A support plate is provided, the support plate is formed with an adhesive layer on one side；By multiple fingerprint encapsulation modules to be packaged
It is spaced apart on the adhesive layer, the fingerprint encapsulation module to be packaged includes driving chip, Passive components and sense
Module is answered, the driving chip, Passive components and induction module are spaced apart, and the sensitive surface of the induction module is described in
Adhesive layer, the welding surface of the driving chip towards the adhesive layer, the multiple fingerprint encapsulation module to be packaged
Direction is identical；Between the multiple fingerprint encapsulation module to be packaged and the driving chip, Passive components and induction
Capsulation material is filled between module, and solidifies the capsulation material to form plastic packaging layer；Remove the support plate；In the plastic packaging layer
Middle to form multiple through-holes, the through-hole runs through the plastic packaging layer along the modeling seal coat thickness direction, and fills in the through hole
Conductive material, the plastic packaging layer include first surface and the second surface that is oppositely arranged with the first surface；Described first
Forming first structure on surface, the first structure includes the first passivation layer, the first metal layer and the second passivation layer, and described the
One metal layer is used to be electrically connected pad, Passive components and the induction of the driving chip of the fingerprint encapsulation module to be packaged
The pad of module, while being electrically connected with the conductive material filled in the through-hole；The second knot is formed on the second surface
Structure, second structure include third passivation layer, second metal layer and the 4th passivation layer, and the second metal layer includes multiple
Weld pad, the 4th passivation layer cover the second metal layer, and the multiple weld pad of exposure, the second metal layer with it is described
It fills conductive material in through-hole to be electrically connected, to form multiple fingerprint encapsulating structures；And the separation fingerprint encapsulating structure.
Optionally, the thickness of the fingerprint encapsulation module meets following formula:
H=a+b；
Wherein, h is the thickness of the fingerprint encapsulation module, and a is the thickness of the plastic packaging layer, and b is constant, wherein b is greater than
Or it is equal to 50 microns.
Compared with prior art, a kind of fingerprint encapsulation module provided by the present invention, packaging method, the fingerprint Encapsulation Moulds
Group is by passing through the fixation and first structure and second of plastic packaging layer for each building block of fingerprint encapsulation module to be packaged
The conductive material filled in through-hole in structure and plastic packaging layer is real by the circuit on the circuit and second surface on first surface
It is now electrically connected, without using PCB construction, is conducive to the thickness that fingerprint encapsulation module is thinned, can also reduce cost.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the fingerprint encapsulation module of one embodiment of the invention；
Fig. 2 is the flow diagram of the fingerprint packaging method of one embodiment of the invention.
Description of symbols:
110- induction module；110a- sensitive surface；The back side of 110b- induction module；
120- drive module；
121- driving chip；121a- welding surface；The opposite back side of 121b- welding surface；122- Passive components；
130- pad；
200- plastic packaging layer；200a- first surface；200b- second surface；210- through-hole；
300- first structure；The first passivation layer of 310-；320- the first metal layer；The second passivation layer of 330-；
The second structure of 400-；410- third passivation layer；420- second metal layer；The 4th passivation layer of 430-；
The edge of 500- fingerprint encapsulation module.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to fingerprint encapsulation module of the invention, packaging method, display module make into
One step is described in detail.According to following description and drawings, advantages and features of the invention will be become apparent from, however, it should be noted that,
The design of technical solution of the present invention can be implemented in many different forms, it is not limited to specific embodiment set forth herein.
Attached drawing is all made of very simplified form and using non-accurate ratio, only to convenient, lucidly aid illustration is of the invention
The purpose of embodiment.
Fig. 1 is the schematic diagram of the section structure of the fingerprint encapsulation module of the present embodiment.As shown in Figure 1, present embodiments providing
A kind of fingerprint encapsulation module, the fingerprint encapsulation module include: the drive module 120 being spaced apart and induction module 110, described
Drive module 120 includes driving chip 121 and Passive components 122 (such as capacitor), the driving chip 121 and passively first device
Part 122 is spaced apart, and the induction module 110 is, for example, that optical finger print recognizes sensor or ultrasonic wave identifier, described super
Sound wave identifier includes ultrasonic transmitter and ultrasonic receiver.The driving chip 121, Passive components 122 and induction
Gap in module 110 between arbitrary neighborhood two is more than or equal to 100 microns, and the driving chip 121, Passive components
122 and the size at edge 500 of the induction module 110 apart from the fingerprint encapsulation module be all larger than or be equal to 300 microns.
The sensitive surface 110a of the induction module 110 including induction module and the back side being oppositely arranged with the sensitive surface
110b.The driving chip 121 includes the welding surface 121a and back side 121b being oppositely arranged with welding surface 121a.The induction
Pad 130 is provided on face 110a and welding surface 121a.The welding surface 121a and the sensitive surface 110a same direction (i.e.
Positioned at the same side of the fingerprint encapsulation module).Preferably, the thickness direction of the Passive components 122 and the driving core
The thickness direction of piece 121 is identical.
The fingerprint encapsulation module further includes plastic packaging layer 200, and the plastic packaging layer 200 fills the driving chip 121, passive
Gap between component 122 and induction module 110 is used to fix the driving chip 121, Passive components 122 and sense
Module 110 is answered, is also used to electrically isolate the driving chip 121, Passive components 122 and induction module 110.The plastic packaging layer
200 include with the first surface 200a of the sensitive surface 110a same direction and with the back side phase Tongfang of the induction module 110
To second surface 200b, that is, the sensitive surface 110a and first surface 200a is located at the same of the fingerprint encapsulation module
Side, and the back side of the induction module 110 and the second surface 200b are located at the other side of the fingerprint encapsulation module.Institute
State the sensitive surface 110a of the first surface 200a exposure induction module 110 and the pad 130 of the driving chip 121.Institute
State the thickness of plastic packaging layer 200 most more than or equal to thickness in the driving chip 121, Passive components 122 and induction module 110
Thick one, that is, the distance between the first surface 200a and the second surface 200b be more than or equal to the driving chip 121,
The distance between the front with its back side of thickness most thick one in Passive components 122 and induction module 110.Preferably, the modeling
Thickness of the thickness of sealing 200 equal to thickness most thick one in the driving chip 121, Passive components 122 and induction module 110
Degree.
In the present embodiment, the thickness of the fingerprint encapsulation module meets following formula:
H=a+b；
Wherein, h is the thickness of the fingerprint encapsulation module, and a is the thickness of the plastic packaging layer 200, and b is constant, wherein b
More than or equal to 50 microns.
From the foregoing, it will be observed that compared to existing fingerprint encapsulation module, without mutual in the fingerprint encapsulation module in the present embodiment
The thickness of symbasis plate, is effectively thinned the thickness of fingerprint encapsulation module, and then is thinned and has used the aobvious of the fingerprint encapsulation module
Show the thickness of mould group, meanwhile, it reduces costs.
Further, the drive module 120 being thinned and induction module 110 are directlyed adopt；Or the plastic packaging layer is thinned
200, so that the thickness of fingerprint encapsulation module is equal to the sum of the thickness of Passive components such as capacitor and 50 microns.
The fingerprint encapsulation module further includes the multiple through-holes 210 being arranged in the plastic packaging layer 200, the multiple through-hole
210 run through the plastic packaging layer 200 along the thickness direction of the plastic packaging layer 200, and conductive material is filled in the through-hole 210.Institute
State the conductive material filled in through-hole 210 be used for by with the circuit and the second surface 200b on the first surface 200a
Circuit electric connection, specifically, by the pad 130, Passive components 122 and induction module of the driving chip 121
It is electrically connected between 110 pad 130, then conductive material and the second surface 200b by being filled in the through-hole 210
Upper realization is electrically connected, so that the driving chip 121 in the fingerprint encapsulation module can select have identical function according to demand
The different manufacturers of energy or the chip of model are specifically designed chip needs without the demand to be integrated on chip,
Selectivity is more, to reduce costs.
The conductive material be, for example, the conductive metals such as Cu (copper), W (tungsten), Ag (silver) or Au (gold), electrical conductivity alloy or
Conducting resinl.
Be provided with first structure 300 on the first surface 200a, by the pad 130 respectively with the driving mould
Block and induction module electrically interconnect, and the conductive material in the first structure 300 and the through-hole 210 is electrically connected.It is described
First structure 300 includes the first passivation layer 310, the first metal layer 320 and the second passivation layer 330, first passivation layer 310
The first surface 200a, the sensitive surface 110a and welding surface 121a are covered, the first metal layer 320 is located at described first
On the partial region of passivation layer 310, second passivation layer 330 covers first passivation layer 310 and the first metal layer 320.
First passivation layer 310 and the second passivation layer 330 to avoid its short circuit, and are covered for the first metal layer 320 to be isolated
Other regions on first surface 200a in addition to the part sensitive surface for identification of fingerprint are covered, that is, first passivation layer
310 and second passivation layer only exposed on first surface 200a the induction module 110 sensitive surface 110a for fingerprint
The region of identification, the region of the sensitive surface 110a exposed are, for example, the 20%~80% of sensitive surface 110a area.
Preferably, first passivation layer 310 and the second passivation layer 330 are insulating materials, e.g. high molecular material,
Further, e.g. polyimides (polyimides), benzocyclobutene (BCB) or poly- in dioxazole benzene (PBO)
One or several kinds of combinations.The material of first passivation layer 310 and the second passivation layer 330 may be the same or different.
In the present embodiment, first passivation layer 310 is identical with the material of the second passivation layer 330, such as is polyamides
Imines.
The first metal layer 320 can be the metal materials such as Cu, Ag, W or Au, electrical conductivity alloy, conductive oxide (such as
The inorganic material such as ITO), alternatively, it is also possible to conductive organic material, such as conducting polymer.The first metal layer 320
About 3~10 microns, preferably 3~5 microns of thickness on 310 surface of the first passivation layer.
Can be set the first connecting hole and the second connecting hole in first passivation layer 310, first connecting hole and
Conductive material, the one end point for the conductive material filled in first connecting hole and the second connecting hole are filled in second connecting hole
It is not connect with the first metal layer 320, the weldering of the conductive material, the driving chip 121 filled in the other end and through-hole 210
The pad 130 of disk 130, the pad 130 of Passive components 122 or induction module 110 is electrically connected, to realize the fingerprint encapsulation
Electric connection of the mould group on first surface 200a.
The second structure 400, second structure 400 and leading in the through-hole are provided on the second surface 200b
Electric material is electrically connected.Second structure 400 includes third passivation layer 410, second metal layer 420 and the 4th passivation layer
430, the metal layer includes multiple weld pads, and the third passivation layer 410 covers the second surface 200b, second metal
Layer 420 is located on the partial region of the third passivation layer 410, and the 4th passivation layer 430 covers the third passivation layer 410
With the second metal layer 420, the third passivation layer 410 and the 4th passivation layer 430 are for being isolated the second metal layer
420, to avoid its short circuit, and the 4th passivation layer 430 exposes the multiple weld pad.
Preferably, the third passivation layer 410 and the 4th passivation layer 430 are insulating materials, e.g. high molecular material,
Further, e.g. polyimides (polyimides), benzocyclobutene (BCB) or poly- in dioxazole benzene (PBO)
One or several kinds of combinations.First passivation layer 310, the second passivation layer 330, third passivation layer 410 and the 4th passivation layer
430 material can identical or part it is identical, can also be entirely different.
In the present embodiment, the third passivation layer 410 is identical with the material of the 4th passivation layer 430, such as is polyamides
Imines.
The second metal layer 420 can be the metal materials such as Cu, Ag, W or Au, electrical conductivity alloy, conductive oxide (such as
The inorganic material such as ITO), alternatively, it is also possible to conductive organic material, such as conducting polymer.The second metal layer 420
About 3~10 microns, preferably 3~5 microns of thickness on 410 surface of third passivation layer.
Third connecting hole can be set in the third passivation layer 410, be filled with conduction material in the third connecting hole
Material, the one end for the conductive material filled in the third connecting hole and the third metal layer 420 are electrically connected, the other end and logical
The conductive material filled in hole 210 is electrically connected, to realize circuit on the fingerprint encapsulation module first surface 200a and the
The electric connection of circuit on two surface 200b, that is, realize the electric connection of the fingerprint encapsulation module.
In the present embodiment, by putting the driving chip 121, Passive components 122 and induction module 110 interval
It sets, the welding surface 121a and the sensitive surface 110a are in the same side, in driving chip 121, Passive components 122 and induction mould
Plastic packaging layer 200 is filled in interval between block 110, is formed in the plastic packaging layer 200 and is filled with the through-hole 210 of conductive material,
First structure 300 is formed on the first surface 200a of the plastic packaging layer 200, and the inside of fingerprint encapsulation module is realized electrically
Connection, forms the second structure 400, by fingerprint encapsulation module in the first table on the second surface 200b of the plastic packaging layer 200
Circuit on the 200a of face is electrically connected by circuit on multiple through-holes and first surface 200a, is effectively thinned fingerprint Encapsulation Moulds
The thickness of group, reduces costs simultaneously.
Fig. 2 is the flow diagram of the fingerprint packaging method of the present embodiment.As shown in Fig. 2, simultaneously, please continue to refer to Fig. 1,
The present embodiment additionally provides a kind of packaging method of fingerprint encapsulation module, and the packaging method of the present embodiment refers to will be to be packaged
Each building block (that is, driving chip 121, Passive components 122 and induction module 110) encapsulation of fingerprint encapsulation module, which is formed, to be referred to
The method of line encapsulation module.
S1: providing a support plate, and the support plate is formed with an adhesive layer on one side, wherein the shape of the support plate is for example
It is round or rectangular；
S2: multiple fingerprint encapsulation modules to be packaged are spaced apart on the adhesive layer, the finger to be packaged
Line encapsulation module includes driving chip 121, Passive components 122 and induction module 110, the driving chip 121, passive first device
Part 122 and induction module 110 are spaced apart, and the sensitive surface 110a of the induction module 110 is towards the adhesive layer, the drive
For the welding surface 121a of dynamic chip 121 towards the adhesive layer, the direction of the multiple fingerprint encapsulation module to be packaged is identical；
S3: between the multiple fingerprint encapsulation module to be packaged and the driving chip 121, Passive components
Capsulation material is filled between 122 and induction module 110, and solidifies the capsulation material to form plastic packaging layer 200；
S4: the support plate is removed；
S5: forming multiple through-holes 210 in the plastic packaging layer 200, and the through-hole 210 is passed through along the modeling seal coat thickness direction
Wear the plastic packaging layer 200, and fill conductive material in the through-hole 210, the plastic packaging layer 200 include first surface 200a and
The second surface 200b being oppositely arranged with the first surface 200a；
S6: forming first structure 300 on the first surface 200a, and the first structure 300 includes the first passivation layer
310, the first metal layer 320 and the second passivation layer 330, the first metal layer 320 are described to be packaged for being electrically connected
The pad 130 of the pad 130 of the driving chip 121 of fingerprint encapsulation module, Passive components 122 and induction module 110, while with
The conductive material filled in the through-hole is electrically connected；And
S7: forming the second structure 400 on the second surface 200b, and second structure 400 includes third passivation layer
410, second metal layer 420 and the 4th passivation layer 430, the second metal layer 420 include multiple weld pads, the 4th passivation
The 430 covering second metal layer 420 of layer, and the multiple weld pad of exposure, the second metal layer 420 and the through-hole 210
Middle filling conductive material is electrically connected, and to form multiple fingerprint encapsulating structures, the thickness of the fingerprint encapsulation module meets following
Formula:
H=a+b；
Wherein, h is the thickness of the plastic packaging layer 200, and a is the thickness of the plastic packaging layer 200, and b is constant, wherein b is greater than
Or it is equal to 50 microns；And
S8: separating the fingerprint encapsulating structure, to obtain fingerprint encapsulation module.
The present embodiment additionally provides a kind of display module, includes fingerprint encapsulation module as shown in Figure 1.
The display module includes that display is, for example, mobile phone display screen and fingerprint encapsulation module.
In the present embodiment, the fingerprint encapsulation module can be located at the positive lower part of the display, the Encapsulation Moulds
Group exposes its induction zone for being used for identification of fingerprint.
In other embodiments, the fingerprint encapsulation module may be located on the back side of the display.
From the foregoing, it will be observed that since display module includes the encapsulation module after being thinned, so that the thickness of display module is also corresponding
Be thinned.
Certainly, fingerprint encapsulation module can also be located on the side wall of display module or other any positions.
In summary, a kind of fingerprint encapsulation module of the invention, packaging method, display module, the fingerprint encapsulation module
By the way that each building block of fingerprint encapsulation module to be packaged is passed through the fixation of plastic packaging layer and first structure and the second knot
Circuit on first surface is transferred on second surface by the conductive material filled in the through-hole in structure and plastic packaging layer, entire mistake
Journey is thinned the thickness of fingerprint encapsulation module without existing PCB construction, while also reducing cost.
It should be noted that unless stated otherwise or point out, the otherwise term " first " in specification, " second ", "
Three " etc. description is used only for distinguishing various components, element, the step etc. in specification, without be intended to indicate that various components,
Logical relation or ordinal relation between element, step etc..
It is understood that although the present invention has been disclosed in the preferred embodiments as above, above-described embodiment not to
Limit the present invention.For any person skilled in the art, without departing from the scope of the technical proposal of the invention,
Many possible changes and modifications all are made to technical solution of the present invention using the technology contents of the disclosure above, or are revised as
With the equivalent embodiment of variation.Therefore, anything that does not depart from the technical scheme of the invention are right according to the technical essence of the invention
Any simple modifications, equivalents, and modifications made for any of the above embodiments still fall within the range of technical solution of the present invention protection
It is interior.
Claims (16)
1. a kind of fingerprint encapsulation module characterized by comprising
The drive module and induction module being spaced apart, the drive module include driving chip and Passive components, the drive
Dynamic chip and Passive components are spaced apart, and the induction module includes sensitive surface and the back that is oppositely arranged with the sensitive surface
Face, the driving chip include welding surface, are provided with pad on the sensitive surface and welding surface；
Plastic packaging layer, the plastic packaging layer fill the gap between the driving chip, Passive components and induction module, are used for solid
The fixed driving chip, Passive components and induction module, are also used to electrically isolate the driving chip, Passive components and sense
Answer module, the plastic packaging layer includes first surface and the second surface that is oppositely arranged with the first surface, the first surface,
The sensitive surface and welding surface are respectively positioned on the same side of the fingerprint encapsulation module；
Multiple through-holes, the multiple through-hole run through the plastic packaging layer along the thickness direction of the plastic packaging layer, fill in the through-hole
There is conductive material；
First structure, first structure setting on the first surface, by the pad respectively with the drive module
It is electrically interconnected with induction module, and the conductive material in the first structure and the through-hole is electrically connected；And
Second structure, conduction of second structure setting on the second surface, in second structure and the through-hole
Material is electrically connected.
2. fingerprint encapsulation module as described in claim 1, which is characterized in that the first structure includes the first passivation layer, the
One metal layer and the second passivation layer, first passivation layer covers the first surface, the sensitive surface and welding surface, described
The first metal layer is located on the partial region of first passivation layer, and second passivation layer covers first passivation layer and institute
State the first metal layer, first passivation layer and the second passivation layer are and described first blunt for being isolated the first metal layer
Change layer and the second passivation layer exposure sensitive surface is used for the region of identification of fingerprint.
3. fingerprint encapsulation module as claimed in claim 2, which is characterized in that be provided with the first connection in first passivation layer
Hole and the second connecting hole, are filled with conductive material in first connecting hole and the second connecting hole, first connecting hole and the
The one end for the conductive material filled in two connecting holes is electrically connected with the first metal layer respectively, in the other end and the through-hole
On the conductive material of filling, the pad on the driving chip, the pad on the Passive components or the induction module
Pad is electrically connected, to realize the electric connection of the fingerprint encapsulation module on the first surface.
4. fingerprint encapsulation module as claimed in claim 2, which is characterized in that the sensitive surface is used for the region of identification of fingerprint
Area is the 20%~80% of the gross area of the sensitive surface.
5. fingerprint encapsulation module as described in claim 1, which is characterized in that second structure includes third passivation layer,
Two metal layers and the 4th passivation layer, the second metal layer include multiple weld pads, the third passivation layer covering described second
Surface, the second metal layer are located on the partial region of the third passivation layer, and the 4th passivation layer covers the third
Passivation layer and the second metal layer, the third passivation layer and the 4th passivation layer are used to that the second metal layer to be isolated, and
The multiple weld pad of the 4th passivation layer exposure.
6. fingerprint encapsulation module as claimed in claim 5, which is characterized in that be provided with third connection in the third passivation layer
Hole, is filled with conductive material in the third connecting hole, the one end for the conductive material filled in the third connecting hole with it is described
Third metal layer is electrically connected, and the conductive material filled in the other end and the through-hole is electrically connected, to realize the fingerprint envelope
Die-filling group of electric connection.
7. fingerprint encapsulation module as described in claim 1, which is characterized in that the driving chip, Passive components and induction
Gap in module between arbitrary neighborhood two is more than or equal to 100 microns, and the driving chip, Passive components and induction mould
The size at edge of the block apart from the fingerprint encapsulation module is all larger than or is equal to 300 microns.
8. fingerprint encapsulation module as described in claim 1, which is characterized in that the thickness of the plastic packaging layer is greater than or equal to described
Thickness most thick one in driving chip, Passive components and induction module.
9. fingerprint encapsulation module as claimed in claim 8, which is characterized in that the thickness of the plastic packaging layer is equal to the driving core
The thickness of thickness most thick one in piece, Passive components and induction module.
10. fingerprint encapsulation module as described in claim 1, which is characterized in that the thickness of the fingerprint encapsulation module meet with
Lower formula:
H=a+b；
Wherein, h is the thickness of the fingerprint encapsulation module, and a is the thickness of the plastic packaging layer, and b is constant, wherein b is greater than or waits
In 50 microns.
11. fingerprint encapsulation module as described in claim 1, which is characterized in that the induction module includes optical finger print identification
Sensor or ultrasonic wave identifier.
12. fingerprint encapsulation module as described in claim 1, which is characterized in that the ultrasonic wave identifier includes ultrasonic wave hair
Emitter and ultrasonic receiver.
13. a kind of display module, which is characterized in that including fingerprint encapsulation module such as of any of claims 1-12.
14. display module as claimed in claim 13, which is characterized in that it further include display, fingerprint encapsulation module position
In the positive lower part of the display, alternatively, the fingerprint encapsulation module is located on the back side of the display.
15. a kind of packaging method of fingerprint encapsulation module, which comprises the following steps:
A support plate is provided, the support plate is formed with an adhesive layer on one side；
Multiple fingerprint encapsulation modules to be packaged are spaced apart on the adhesive layer, the fingerprint Encapsulation Moulds to be packaged
Group includes driving chip, Passive components and induction module, and the driving chip, Passive components and induction module interval are put
Set, the sensitive surface of the induction module towards the adhesive layer, the welding surface of the driving chip towards the adhesive layer,
The direction of the multiple fingerprint encapsulation module to be packaged is identical；
Between the multiple fingerprint encapsulation module to be packaged and the driving chip, Passive components and induction module
Between fill capsulation material, and solidify the capsulation material to form plastic packaging layer；
Remove the support plate；
Multiple through-holes are formed in the plastic packaging layer, the through-hole runs through the plastic packaging layer along the modeling seal coat thickness direction, and
Fill conductive material in the through hole, the plastic packaging layer include first surface and be oppositely arranged with the first surface second
Surface；
Form first structure on the first surface, the first structure includes the first passivation layer, the first metal layer and the
Two passivation layers, the pad of driving chip of the first metal layer for being electrically connected the fingerprint encapsulation module to be packaged,
The pad of Passive components and induction module, while being electrically connected with the conductive material filled in the through-hole；
The second structure is formed on the second surface, second structure includes third passivation layer, second metal layer and
Four passivation layers, the second metal layer include multiple weld pads, and the 4th passivation layer covers the second metal layer, and exposure institute
Multiple weld pads are stated, filling conductive material is electrically connected in the second metal layer and the through-hole, to form multiple fingerprint encapsulation
Structure；And
Separate the fingerprint encapsulating structure.
16. packaging method as claimed in claim 15, which is characterized in that the thickness of the fingerprint encapsulation module meets following public
Formula:
H=a+b；
Wherein, h is the thickness of the fingerprint encapsulation module, and a is the thickness of the plastic packaging layer, and b is constant, wherein b is greater than or waits
In 50 microns.
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| CN201811109821.3A CN109616466A (en) | 2018-09-21 | 2018-09-21 | Fingerprint encapsulation module, packaging method, display module |
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|---|---|---|---|
| CN201811109821.3A CN109616466A (en) | 2018-09-21 | 2018-09-21 | Fingerprint encapsulation module, packaging method, display module |
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Application publication date: 20190412 |