CN106686888A - Printed circuit board element for forming enhancement mode biosensing module and fabrication method for printed circuit board element - Google Patents
Printed circuit board element for forming enhancement mode biosensing module and fabrication method for printed circuit board element Download PDFInfo
- Publication number
- CN106686888A CN106686888A CN201510765469.9A CN201510765469A CN106686888A CN 106686888 A CN106686888 A CN 106686888A CN 201510765469 A CN201510765469 A CN 201510765469A CN 106686888 A CN106686888 A CN 106686888A
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- Prior art keywords
- circuit board
- printed circuit
- bio
- board component
- sensing chip
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The invention provides a printed circuit board element for forming an enhancement mode biosensing module and a fabrication method for the printed circuit board element. The printed circuit board element comprises a printed circuit board, a biosensing chip and a protection layer, wherein the printed circuit board comprises an insulating layer and a conductive layer; the conductive layer forms a working circuit, an excitation circuit, multiple first connecting point welding pads and multiple second connecting point welding pads on a part of the upper surface of the insulating layer, wherein the second connecting point welding pads are connected to the excitation circuit; the biosensing chip is assembled on the printed circuit board; the biosensing chip comprises a sensing region, an excitation signal source, multiple combination welding pads and multiple conductive elements; each combination welding pad is electrically connected to the corresponding first connecting point welding pad; the excitation signal source is connected to the excitation circuit through the combination welding pads and used for providing an excitation signal; each conductive element is assembled on the corresponding second connecting point welding pad; and the protection layer is formed on and covers the printed circuit board, the biosensing chip and the conductive elements. According to the printed circuit board element, cracking of the protection layer can be avoided by virtue of the light and thin dimensions of the conductive elements.
Description
Technical field
The present invention relates to printed-board technology field, particularly designs a kind of formation enhancement mode bio-sensing mould
The printed circuit board component and its manufacture method of block.
Background technology
Perhaps eurypalynous biometric feature can be used as individual and distinguish a kind of form with access control, and other
Biometric feature, such as heartbeat, blood oxygen saturation etc. can be used for monitoring the body physical of people
State.In the method for obtaining biometric feature, impedance, the resistance of some parts comprising human body are measured
And electric capacity, it is common method in some examples.Some bio-sensing modules, such as fingerprint sensing module,
Can design to measure the resistance or capacitance difference that are distributed on sensing surface, to obtain bio-identification data.It is biological
The extra excitation signal source of close sensing unit can be used to improve the property of the bio-sensing module in sensing module
Energy.For example, in U.S. Patent No. 8,736,001, it is proposed that a kind of bezel, cluster knot for being couple to circuit
Structure, is used as driving electrodes to provide the excitation signal to the finger of user.In fact, such as apple
The iPhone6 of Company, piece of metal ring is formed at around home keys, and is wherein embedded in a fingerprint core
Piece.The becket is such as the bezel, cluster structure in U.S. Patent No. 8,736,001.However, such technology meeting
There are two problems.First, the bezel, cluster structure exposed or becket of directly contact human body (is hereafter referred to as transmitted
Number structure) it is likely to result in fingerprint failure of chip.More particularly, the size of human body has become a picture
As antenna, equipment that radiation signal can be extracted, these radiation signals may interfere with the function of fingerprint sensing.
Secondly, signalling structure increased the gross thickness of a running gear equipped with the bio-sensing module, and
The upper surface for also resulting in this action device is uneven.This is not compact, the modern times that people are seeking
Brief design.
Therefore, a kind of trend is to enter to encapsulate level by the signalling structural integrity, i.e. printed circuit board (PCB) level
In.That is, this will form a part of the signalling structure for printed circuit board component.With a finger
As an example illustrating, printed circuit board component as shown in Figure 1 can solve aforesaid asking to line sensing module
Topic.However, because fingerprint sensing module by made by different materials (sensing unit is probably integrated circuit,
Excitation signal source possibly kind of selected metal, and protective layer is probably a kind of thermosetting resin), some are not
Expectable problem, such as structural deformation are damaged, and will be occurred in manufacturing process.
Referring to Fig. 1.Fig. 1 is the profile of the fingerprint sensing module 1 formed by said method.In order to bright
Really understand the structure of fingerprint sensing module 1, the ratio in vertical direction is greater compared with horizontal direction.Namely
Say, much thinner than the fingerprint sensing module 1 in Fig. 1 of real fingerprint sensing module.Fingerprint sensing module 1
Substantially it is made up of printed circuit board (PCB) 2, fingerprint sensing chip 3, electrode 4 and protective layer 5.Printed circuit board (PCB)
2 function is, as a plate base, to carry all electronic components that must be used for fingerprint sensing module 1, including
Fingerprint sensing chip 3 and electrode 4.Electrode 4 is installed on printed circuit board (PCB) 2 and closely fingerprint sensing core
Piece 3.In fact, electrode 4 can be two separate metal derbies, or in a complete metal loop type,
And the becket is cut on section and is made two parts.Protective layer 5 can be made up of mold compound, extension distribution
On the part surface of fingerprint sensing chip 3, electrode 4, other electronic components and printed circuit board (PCB) 2.Protection
Layer 5 is used for protecting the original paper under it.Whole fingerprint sensing module 1 can partly be assembled in safety means or intelligence
In energy mobile phone.
It is obvious that electrode 4 and protective layer 5 are by made by different materials.Electrode 4 can by special metal or
Alloy, such as aluminium, make.Protective layer mainly includes epoxy resin.When the material of protective layer 5 is applied,
Before protective layer 5 is formed, a program curing must carry out heating fingerprint sensing module 1 to epoxy resin
Curable temperature.The thermal coefficient of expansion of electrode 4 is much bigger compared with the thermal coefficient of expansion of epoxy resin.Work as heating
When, the direction of arrow as shown in Figure 1 of electrode 4 expands towards all directions, and epoxy resin is losing flowing
Property and solidification.Therefore, when fingerprint sensing module 1 is cooled to normal temperature, there is crack self-electrode 4 in protective layer 5
Produce.Additionally, fingerprint sensing module 1 may be applied in Reflow Soldering to be combined with other electronic equipments,
These cracks may result in the mechanical weakness of module and/or malformation.
The content of the invention
Based on this, it is necessary to there is a problem of crack for the protective layer of traditional finger print detecting module, there is provided
A kind of printed circuit board component of the formation enhancement mode bio-sensing module for being prevented from protective layer cracking, while
Additionally provide a kind of method for manufacturing above-mentioned printed circuit board component.
Above-mentioned purpose is achieved through the following technical solutions：
A kind of printed circuit board component for forming enhancement mode bio-sensing module, including：
Printed circuit board (PCB), including insulating barrier and conductive layer, the conductive layer formed operating circuit, energizing circuit,
Multiple first contact weld pads with multiple second contact weld pads in a part for the upper surface of the insulating barrier, its
Described in the second contact weld pad be connected to the energizing circuit；
Bio-sensing chip, is installed on the printed circuit board (PCB)；The bio-sensing chip include sensing area,
Excitation signal source, multiple bond pads and multiple conducting elements, each bond pad is electrically connected to correspondence
The first contact weld pad；The excitation signal source is connected to the energizing circuit via the bond pad,
For providing excitation signal；Each conducting element is installed on the second contact weld pad, for providing
The excitation signal is in close object；And
Protective layer, forms and is covered in the printed circuit board (PCB), the bio-sensing chip and the conductive element
On part, the protective layer has flat upper surface.
Wherein in one embodiment, the energizing circuit has signal enhancing unit, described sharp for strengthening
Signal.
Wherein in one embodiment, the bio-sensing chip is fingerprint sensing chip.
Wherein in one embodiment, the protective layer is made up of mold composite materials.
Wherein in one embodiment, the mold composite materials are epoxy resin.
Wherein in one embodiment, after the printed circuit board component is formed, each conducting element
Height of the height of upper surface more than or equal to the bio-sensing chip.
Wherein in one embodiment, the energizing circuit is surrounded or the neighbouring bio-sensing chip is laid.
Wherein in one embodiment, the conducting element is that surface adhesion components, conductive chip or metal are long
Cube.
Wherein in one embodiment, the size of the conducting element is consistent with surface adhesion components size.
Wherein in one embodiment, the printed circuit board component is also included by oleophobic property and hydrophobic material
Made by hard conating, the hard conating is covered on the protective layer.
A kind of method of the printed circuit board component for manufacture as described in above-mentioned technical characteristic is further related to, including
Following steps：
Printed circuit board (PCB), bio-sensing chip and multiple conducting elements are provided；
Each bond pad is electrically connected into corresponding first contact weld pad, install the bio-sensing chip in
On the printed circuit board (PCB)；
Multiple conducting elements are installed respectively to multiple second contact weld pads, part second contact is welded
Pad and electrically connected with the conducting element of installing；And
Form protective layer.
A kind of method of the printed circuit board component for manufacture as described in above-mentioned technical characteristic is further related to, including
Following steps：
Printed circuit board (PCB), bio-sensing chip and multiple conducting elements are provided；
Each bond pad is electrically connected into corresponding first contact weld pad, install the bio-sensing chip in
On the printed circuit board (PCB)；
Multiple conducting elements are installed respectively to multiple second contact weld pads, part second contact is welded
Pad and electrically connected with the conducting element of installing；
Form protective layer；And
The hard conating by made by oleophobic property and hydrophobic material is formed, the hard conating is overlying on the protective layer.
The invention has the beneficial effects as follows：
The printed circuit board component and its manufacture method of the formation enhancement mode bio-sensing module of the present invention, structure
Design advantages of simple, using the frivolous size of conducting element, such as surface adhesion components, it is to avoid protective layer is opened
Split.Meanwhile, the present invention has the advantages that conducting element used below：1) manufacturing process is glutinous using standard surface
Technology processing procedure, the processing procedure has been ripe technology；2) cost of conducting element is far below becket, metal
The cost of frame or bonding jumper；3) the additional mold cost for making becket, metal frame or bonding jumper can be exempted.
Description of the drawings
Fig. 1 is the sectional view of conventional fingerprint sensing module；
Fig. 2 bows for the printed circuit board component of the formation enhancement mode bio-sensing module of one embodiment of the invention
View；
Fig. 3 is the sectional view of the AA ' lines along Fig. 2；
Fig. 4 is the sectional view of the BB ' lines along Fig. 2；
Fig. 5 is the top view for removing surface adhesion components on printed circuit board component；
Fig. 6 is the flow chart for forming the method for printed circuit board component；
Fig. 7 is the printed circuit board component of the formation enhancement mode bio-sensing module of another embodiment of the present invention
Top view；
Wherein：
1- finger print detecting modules；
2- printed circuit board (PCB)s；
3- fingerprint sensing chips；
4- electrodes；
5- protective layers；
10- printed circuit board components；
100- printed circuit board (PCB)s；
102- insulating barriers；
104- conductive layers；
1042- operating circuits；
1044- energizing circuits；
1046- the first contact weld pads；
1048- the second contact weld pads；
106- soldering-resistance layers；
200- bio-sensing chips；
202- sensing areas；
204- bond pads；
206- excitation signals source；
300- conducting elements；
400- protective layers；
500- hard conatings；
600- metal frames.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, by the following examples,
And accompanying drawing is combined, the printed circuit board component and its manufacture to the formation enhancement mode bio-sensing module of the present invention
Method is further elaborated.It should be appreciated that specific embodiment described herein is only to explain this
Invention, is not intended to limit the present invention.
In one embodiment of this invention, referring to Fig. 2 to Fig. 5, printed circuit board component 10 forms enhancement mode
Bio-sensing module.Please referring also to Fig. 2 to Fig. 4.Fig. 2 is the top view of printed circuit board component 10,
Fig. 3 is the sectional view of the AA ' lines along Fig. 2 of printed circuit board component 10, and Fig. 4 is printed circuit board component
10 along BB ' lines sectional view.Printed circuit board component 10 includes printed circuit board (PCB) 100, bio-sensing core
Piece 200, multiple conducting elements 300, protective layer 400 and hard conating 500.The function and composition of all elements
To be discussed in detail in lower section.
Printed circuit board (PCB) 100 substantially should be comprising insulating barrier 102 and conductive layer 104.Multiple opening (not shown)
During soldering-resistance layer 106 can be formed at, to expose contact weld pad.Soldering-resistance layer 106 is typically incorporated within printed circuit board (PCB) 100
On, for protecting opposing oxidation and preventing Xi Qiao to be formed between close weld pad.Certainly, the present invention may be used also
To have other insulating barriers and conductive layer, insulating barrier is provided with conductive layer based on printed circuit board component 100
Additional functionality is present.Insulating barrier described herein 102 performs operation bio-sensing chip 200 with conductive layer 104
And the major function of connection bio-sensing chip 200 and other elements.Insulating barrier 102 is sufficiently solid, it
It is the major part of printed circuit board component 100, to support other to be attached to the element on insulating barrier 102,
And opposing is applied to the positive force on bio-sensing chip 200.
Conductive layer 104 forms operating circuit 1042, energizing circuit 1044, multiple first contact weld pads 1046
And multiple second contact weld pads 1048 are on the upper surface of a part for insulating barrier 102.Meanwhile, in order to clear and definite
Understand the framework of printed circuit board component 10, the ratio in vertical direction is much greater compared with horizontal direction.Also
It is to say, actual printed circuit board component is than thin more shown in Fig. 3.Fig. 3 shows energizing circuit 1044
With the layout of contact weld pad 1048.In fact, operating circuit 1042, energizing circuit 1044, the first contact
The contact weld pad 1048 of weld pad 1046 and second is made by identical processing procedure.First contact weld pad 1046 with
Second contact weld pad 1048 is made by opening is formed in soldering-resistance layer 106, and routing is combined and element weldering knot exists
On multiple first contact weld pads 1046 and multiple second contact weld pads 1048.Second contact weld pad 1048 with swash
Power Generation Road 1044 be used in it is different functionally.However, the second contact weld pad 1048 should make and be excited to connect
The somewhere of circuit 1044, although the second contact weld pad 1048 is with energizing circuit 1044 on this section
Separate.(section of energizing circuit 1044 is with oblique line filling, the second contact weld pad 1048 for different display effects
Section be hatching solid) can be used for visually distinguish the two.Second contact weld pad 1048 show compared with
Energizing circuit 1044 is slightly higher.In fact, they are in a thickness direction almost high, the height being higher by is used
To illustrate that the second contact weld pad 1048 exposes multiple openings and is welded to element thereon.Energizing circuit 1044
Will not directly contact solder because having soldering-resistance layer 106 therebetween.Second contact weld pad 1048 with excite electricity
Road 1044 is formed around the position of the design of bio-sensing chip 200.
The layout of the contact weld pad 1046 of operating circuit 1042 and first is shown in Fig. 4.Preferably, work electricity
The contact weld pad 1046 of road 1042 and first should be located remotely from bio-sensing chip 200 but close bio-sensing core
The I/O ports of piece 200.Similarly, (section of operating circuit 1042 is with oblique line for different display effects
Filling, the section of the first contact weld pad 1046 is hatching solid) can be used for visually distinguishing the two.The
The relatively operating circuit 1042 that one contact weld pad 1046 shows is slightly higher, only for illustrating the first contact weld pad 1046
Expose multiple openings and electrically connect with the I/O weld pads of bio-sensing chip 200.Herein, the method for connection is to beat
Line connects, but it is also possible to using the reliable method of other formation electrical connections.
The function of operating circuit 1042 mainly connects printed circuit board component 10 and printed circuit board component 10
The miscellaneous equipment of installing.Certainly, any assistance design to the normal operation of printed circuit board component 10 can go out
Now in operating circuit 1042, such as electrostatic discharge (ESD) protection (Electrostatic Discharge, ESD).Swash
Power Generation Road 1044 is substantially a circuit, for transmitting excitation signal, is transmitted from bio-sensing chip 200
To human body, with the performance of enhanced bio-sensing chip 200.The efficiency of excitation signal is directly excited electricity
Impedance influences between road 1044 and object (such as finger).Reduce between energizing circuit 1044 and the object
Distance will reduce the impedance for existing therebetween, further improve the efficiency of excitation signal.Bio-sensing chip 200
Opposite conductive layer 104 is thick.Compared to the distance between bio-sensing chip 200 and the object, electricity is excited
Larger distance will significantly reduce the efficiency of excitation signal between road 1044 and the object.Therefore, it is necessary to have
Other conductive structures are covered on energizing circuit 1044, for reducing between energizing circuit 1044 and the object
Impedance, and provide the excitation signal on the height more than or equal to the upper surface of bio-sensing chip 200.Thing
In reality, the physical form of energizing circuit 1044 may change, for example, holding wire, annulus, circular arc, square
Shape ring or multirow shape etc..First contact weld pad 1046 is used for connecting the I/O welderings of bio-sensing chip 200
Pad.Second contact weld pad 1048 is formed in energizing circuit 1044, for connecting conducting element 300.
Bio-sensing chip 200 is installed on printed circuit board (PCB) 100, and it includes three kinds of critical pieces：Sensing
Area 202, multiple bond pads 204 and excitation signal source 206.Bio-sensing chip 200 can be when outside
When voltage applies, for detecting any chip that human-body biological recognizes feature, before sensing area 202 is used for carrying out
Work.In the present embodiment, bio-sensing chip 200 is fingerprint sensing chip.Each bond pad 204
It is electrically connected to corresponding first contact weld pad 1046.Bond pad 204 is the I/O of bio-sensing chip 200
Port.Excitation signal source 206 is electrically connected to energizing circuit 1044 via bond pad 204, is swashed with providing this
Signal.Excitation signal is a kind of capacity coupled excitation signal, from bio-sensing chip 200 via conduction
Element 300 is sent to and is detected object.Additionally, capacity coupled excitation signal can reduce low frequency (about 60Hz)
Signal is disturbed, and further reduces the news of making an uproar of the output signal of bio-sensing chip 200, and prevents bio-sensing core
The failure of piece 200.Additionally, the excitation signal can be a series of voltage jump change, it does not have conventional
Cycle.For ideally, bio-sensing chip 200 should provide enough voltage to produce the excitation signal.
However, when more elements occur in excitation signal source 206 and are detected between object, the work(of excitation signal
Rate may decay.Preferably, energizing circuit 1044 can have signal enhancing unit (not shown), such as put
Big device, for strengthening excitation signal to certain degree, so that the voltage of excitation signal can cause bio-sensing core
Operation needed for piece 200.
According to the present invention, conducting element is small conductive element 300 or miniature conductive element, small-sized conduction
Element 300 is a kind of innovation and application for bio-sensing chip.The size and table of small conductive element 300
The size of face adhesion components is consistent, that is to say, that small conductive element 300 has close to surface mount
The size of element, simply can be attached on printed circuit board (PCB) 100 using surface mount technology.Preferably, it is little
The inherently a kind of surface adhesion components of type conducting element 300 (surface mount resistance is preferable).If it can,
Could be used that conductive chip or metal cuboid.Each small conductive element 300 is attached to the second contact weld pad
On 1048, it can transmit excitation signal to close object.Small conductive element 300 must be by conductive material system
Make.The layout of small conductive element 300 is used for replacing traditional signal to discharge structure, such as becket, metal
Frame or bonding jumper.When energizing circuit 1044 is surrounded or is laid adjacent to bio-sensing chip 200, traditionally make
Method, the energizing circuit 1044 should thereon combine metal frame.But on the contrary, according to the present invention, small-sized conduction
Element 300 is connected to energizing circuit 1044 with substituted metal frame via the second contact weld pad 1048.Ask for an interview Fig. 5
Middle traditional structure and the comparison of the present invention, are labeled as the metal frame 600 of black positioned in energizing circuit 1044
Top.Compare with metal frame 600, multiple small conductive elements 300 have close entire area, to
Discharge the excitation signal.However, being scattered between small conductive element 300.If as described above, used
Metal frame 600, because thermal expansion and/or contraction, overall encapsulation may ftracture.In order to more accurately,
This is because volume change causes the substantial amounts of internal stress of protective layer 400 very much greatly.When metal frame 600 is by little
During type 300 replacement of conducting element, the strain of small conductive element 300 is relatively small.Protective layer 400 will not
Can be produced crack and be split by too high stress.Meanwhile, the function of metal frame 600 can be switched to small-sized conduction
On element 300.Additionally, there is several use surface adhesion components：1) manufacturing process utilizes standard scale
Face mount technology processing procedure, the processing procedure has been ripe technology；2) cost of surface adhesion components is far below metal
The cost of ring, metal frame or bonding jumper；3) the extra mould for making becket, metal frame or bonding jumper can be exempted
Tool cost.
It should be noted that small conductive element 300 has it to limit.Refer to Fig. 3.In printed circuit board component
After 10 form, the height of the upper surface of each small conductive element 300 should be greater than being equal to bio-sensing chip 200
Height.At least, the height of the upper surface of small conductive element 300 cannot be below bio-sensing chip 200
Height.If the height of the upper surface of small conductive element 300 is less than the height of bio-sensing chip 200,
The efficiency of small conductive element 300 will be reduced.
Protective layer 400 is formed and is covered in printed circuit board (PCB) 100, bio-sensing chip 200 and small conductive element
On 300.It has a flat upper surface.Protective layer 400 is generally made up of mold composite materials.Most
Good, mold composite materials are epoxy resin.Protective layer 400 provides basic for printed circuit board component 10
Protection.Extra hard conating 500 may need the surface characteristic for being used for improving encapsulation, such as resistance to impact and
Mechanical wear resistance etc..Because the upper surface of printed circuit board component 10 would generally suffer from environmental pollution,
Such as water stain and oil stain, and these pollutions may reduce the efficiency of bio-sensing chip 200, hard conating 500
Can be made up of oleophobic property and hydrophobic material, protective mulch 400.
In another embodiment of the present invention, there is provided a kind of method for manufacturing aforesaid printed circuit board component 10.
Fig. 6 is referred to, the program of the method is as described below.First, there is provided printed circuit board (PCB) 100, bio-sensing core
Piece 200 and small conductive element 300 (S01).Then, each bond pad 204 is electrically connected to corresponding
First contact weld pad 1046, installing bio-sensing chip 200 to (S02) on printed circuit board (PCB) 100.Then,
Multiple small conductive elements 300 are installed respectively on multiple second contact weld pads 1048, the contact of part second is welded
Pad 1048 is electrically connected (S03) with the small conductive element 300 of installing.In this stage, the protective layer 400 is formed
(S04).Finally, the hard conating 500 by made by oleophobic property and hydrophobic material is formed, is covered in protective layer
On 400 (S05).In fact, considering cost, hard conating 500 can be unwanted, and manufacturing step is parked in
Step S04.In implementation, step S02 can be exchanged with the order of S03.Printed circuit board component 10 its
Its element can be installed in step S02 or S03, and this is not limited by the present invention.
In one embodiment of this invention, small conductive element 300 has the size of close surface adhesion components.
, it is clear that the under band of small conductive element 300 is such as surface adhesion components model 0201.This means little
Type conducting element 300 is 0.6mm × 0.3mm from the point of view of top view.In fact, according to the present invention, other are big
The small conductive element of size can also be used, for example, (the 1.0mm of surface adhesion components model 0402
× 0.5mm) or 0603 (1.6mm × 0.8mm).Refer to Fig. 7.In the figure 7, surface adhesion components
The size of the small conductive element 300 of model 0201 can be by the replacement of 0603 surface adhesion components of model 302.
Because the size of each surface adhesion components 302 is larger, the arrangement of surface adhesion components 302 should change.
For example, the surface adhesion components 302 in Fig. 7 are rotated by the direction of the middle-size and small-size conducting elements 300 of Fig. 2
90°.It should be noted that the arrangement of larger small conductive element, enough skies between neighbouring small conductive element
Between should reserve, in case because straining the crack caused greatly.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, can also make it is some deformation and
Improve, these belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is defined.
Claims (12)
1. a kind of printed circuit board component for forming enhancement mode bio-sensing module, it is characterised in that bag
Include：
Printed circuit board (PCB), including insulating barrier and conductive layer, the conductive layer formed operating circuit, energizing circuit,
Multiple first contact weld pads with multiple second contact weld pads in a part for the upper surface of the insulating barrier, its
Described in the second contact weld pad be connected to the energizing circuit；
Bio-sensing chip, is installed on the printed circuit board (PCB)；The bio-sensing chip include sensing area,
Excitation signal source, multiple bond pads and multiple conducting elements, each bond pad is electrically connected to correspondence
The first contact weld pad；The excitation signal source is connected to the energizing circuit via the bond pad,
For providing excitation signal；Each conducting element is installed on the second contact weld pad, for providing
The excitation signal is in close object；And
Protective layer, forms and is covered in the printed circuit board (PCB), the bio-sensing chip and the conductive element
On part, the protective layer has flat upper surface.
2. printed circuit board component according to claim 1, it is characterised in that the energizing circuit tool
There is signal enhancing unit, for strengthening the excitation signal.
3. printed circuit board component according to claim 1, it is characterised in that the bio-sensing core
Piece is fingerprint sensing chip.
4. printed circuit board component according to claim 1, it is characterised in that the protective layer is by casting
Mould composite materials are made.
5. printed circuit board component according to claim 4, it is characterised in that the mold compound
Material is epoxy resin.
6. printed circuit board component according to claim 1, it is characterised in that the printed circuit board (PCB)
After element is formed, the height of the upper surface of each conducting element is more than or equal to the bio-sensing chip
Highly.
7. printed circuit board component according to claim 1, it is characterised in that the energizing circuit encloses
Around or the neighbouring bio-sensing chip lay.
8. printed circuit board component according to claim 1, it is characterised in that the conducting element is
Surface adhesion components, conductive chip or metal cuboid.
9. printed circuit board component according to claim 1, it is characterised in that the conducting element
Size is consistent with surface adhesion components size.
10. printed circuit board component according to claim 1, it is characterised in that also include by oleophobic
Property and hard conating made by hydrophobic material, the hard conating is covered on the protective layer.
A kind of 11. methods for manufacturing printed circuit board component as claimed in claim 1, its feature exists
In comprising the steps：
Printed circuit board (PCB), bio-sensing chip and multiple conducting elements are provided；
Each bond pad is electrically connected into corresponding first contact weld pad, install the bio-sensing chip in
On the printed circuit board (PCB)；
Multiple conducting elements are installed respectively to multiple second contact weld pads, part second contact is welded
Pad and electrically connected with the conducting element of installing；And
Form protective layer.
A kind of 12. methods for manufacturing printed circuit board component as claimed in claim 10, its feature exists
In comprising the steps：
Printed circuit board (PCB), bio-sensing chip and multiple conducting elements are provided；
Each bond pad is electrically connected into corresponding first contact weld pad, install the bio-sensing chip in
On the printed circuit board (PCB)；
Multiple conducting elements are installed respectively to multiple second contact weld pads, part second contact is welded
Pad and electrically connected with the conducting element of installing；
Form protective layer；And
The hard conating by made by oleophobic property and hydrophobic material is formed, the hard conating is overlying on the protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510765469.9A CN106686888A (en) | 2015-11-11 | 2015-11-11 | Printed circuit board element for forming enhancement mode biosensing module and fabrication method for printed circuit board element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510765469.9A CN106686888A (en) | 2015-11-11 | 2015-11-11 | Printed circuit board element for forming enhancement mode biosensing module and fabrication method for printed circuit board element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106686888A true CN106686888A (en) | 2017-05-17 |
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ID=58865651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510765469.9A Pending CN106686888A (en) | 2015-11-11 | 2015-11-11 | Printed circuit board element for forming enhancement mode biosensing module and fabrication method for printed circuit board element |
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| CN109616466A (en) * | 2018-09-21 | 2019-04-12 | 芯光科技新加坡有限公司 | Fingerprint encapsulation module, packaging method, display module |
| CN107247939B (en) * | 2017-06-16 | 2020-10-23 | 业泓科技(成都)有限公司 | Acoustic wave type fingerprint identification device and electronic device |
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| CN109616466A (en) * | 2018-09-21 | 2019-04-12 | 芯光科技新加坡有限公司 | Fingerprint encapsulation module, packaging method, display module |
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