CN109616034B - Method for efficiently detecting small-spacing COB display module pixel dead pixel - Google Patents
Method for efficiently detecting small-spacing COB display module pixel dead pixel Download PDFInfo
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Abstract
The invention discloses a method for efficiently detecting small-spacing COB display module pixel dead pixels, which comprises the following steps: reserving independent detection circuits of three RGB chips on a COB display module substrate; carrying out die bonding and wire bonding on the RGB chip; detecting and determining the row of the dead pixel on the whole circuit of the R circuit, the G circuit or the B circuit; bisection positioning is carried out to efficiently position the dead pixel; replacing and repairing the dead pixel; re-detecting until the circuit is fully lightened; repeating the steps to position and repair the dead pixel of the remaining two color chips; silica gel packaging COB display module; cutting off a reserved circuit of the COB display module; according to the method, before the module is packaged, the reserved circuit is used for simply and quickly carrying out overall detection, the dead pixel is quickly positioned and repaired by using the bisection method, the reserved circuit is disconnected after the module is packaged, the practical application of the display module is not influenced, the hidden quality trouble is eliminated for the next control circuit installation, and the method has important practical significance in the small-distance display field.
Description
Technical Field
The invention relates to the technical field of display screens, in particular to a method for efficiently detecting small-spacing COB display module pixel dead pixels.
Background
The small-distance display technology, namely the Light Emitting Diode (LED) micro-scale and matrixing technology, refers to the integration of high-density and micro-size LED arrays on a single display module, namely, the LED structural design is thinned, miniaturized and arrayed, so that each pixel of the LED display screen can be addressed and independently driven to be lightened, can be regarded as the micro-scale version of the current LED, and the pixel point distance is reduced from centimeter level to millimeter level. Little interval COB display module assembly advantage mainly does: the reliability is good, and the characteristics of long service life, high reliability, high efficiency and the like of the conventional LED are inherited; the high definition resolution can be easily realized at 8K based on the advantage that the small distance reaches millimeter level or even micron level; the response speed is ultra fast, and due to the small size of the pixels, the small-pitch LED array can work at microsecond switching speed (low RC time constant); low power consumption, which is about 10% of that of the LCD at the same brightness; the ultra-high brightness and the small size enable the number of LED chips carried on the display module to be large, and the requirement of high brightness can be easily met.
The most significant characteristic of the small-spacing COB display module is that the number of LED chips is large, for example, 400 LED chips are borne on a P2.5 small-spacing display module unit of 5cm x 5cm, 100 such unit display modules are spliced into a display screen of 50cm x 50cm, and the number of the LED chips on the screen can reach as many as forty thousand. This constitutes its high resolution advantage, but at the same time it also causes another disadvantage: pixel dead pixels are easily generated. The display quality of the COB display module with the small spacing can be seriously influenced by the generation of the pixel dead pixel, and the probability that the adjacent pixel points break down is easily increased. Therefore, how to detect the dead pixel in the industrialization process and repair the damaged pixel dead pixel in time is a constantly pursued target in industry. Firstly, before the LED chips are fixed on a display module substrate and packaged, the lighting test is carried out on all the chips one by one, so that pixel dead spots are eliminated, the problem of package damage caused by quality problems after packaging is avoided, the time cost is high, the workload is large, and the production cost is increased; secondly, after the packaging is finished and the control circuit is installed, the circuit is used for controlling the whole lighting test and the individual test of the pixel points of the display screen. Therefore, how to quickly detect the pixel dead pixel of the small-pitch COB display module and adapt to the production process requirement is one of the difficult problems to be overcome in the LED display industry.
Disclosure of Invention
In view of the above, to solve the problems in the prior art, the present invention provides a method for efficiently detecting a small-pitch COB display module pixel dead pixel, before module packaging, a circuit reserved on a module substrate is used for simply and quickly performing overall detection, a bisection method is further used for quickly positioning and repairing the dead pixel, and the reserved circuit is disconnected after the module packaging without affecting the practical application of the display module, so that the quality hidden trouble is eliminated for the next control circuit installation.
In order to achieve the above object, the technical solution of the present invention is as follows.
The method for efficiently detecting the pixel dead pixel of the small-spacing COB display module comprises the following steps:
step 1, preparing a COB display module substrate, and reserving detection circuits of pixel points on the substrate, wherein the detection circuits comprise independent detection circuits of a red light chip, a green light chip and a blue light chip;
step 2, carrying out die bonding and wire bonding on the red light chip, the green light chip and the blue light chip respectively;
step 3, detecting an integral circuit where an undetected chip in the red light chip, the green light chip and the blue light chip is located, if no pixel dead pixel chip is detected, executing step 7, if a pixel dead pixel chip is detected, determining a row where the pixel dead pixel chip is located, and executing step 4;
step 4, accurately positioning the position of the pixel dead pixel chip by a bisection method;
step 5, taking down the pixel dead pixel chip and using the same color light chip to perform die bonding and wire bonding again;
step 6, the whole circuit where the color light chip is located is detected again, if the pixel dead pixel chip is still found, the steps 3 to 5 are repeated until the circuit is completely lightened;
step 7, if the whole circuit where the undetected corresponding color light chip is located exists, returning to execute the step 3, and if the red light chip, the green light chip and the blue light chip have no pixel dead pixel, executing the step 8;
and 9, cutting off the reserved circuit of the COB display module.
Further, the independent detection circuits of the red light chips, the green light chips and the blue light chips on the substrate of the COB display module in the step 1 are row-row series-column parallel circuits, the row-row series circuits in the row-row series-column parallel circuits comprise N rows, each row comprises M colored light chips (N is greater than or equal to 1, 100 is greater than or equal to M is greater than or equal to 10), the bonding pads of the M colored light chips are connected in series, and the lighting voltage of the colored light chips is 2.5-3V; the column parallel circuit is formed by connecting M colored light chips in series and then connecting N rows of chips in parallel; one end of the column parallel circuit is respectively led out a blue light chip cathode welding spot, a green light chip cathode welding spot and a red light chip cathode welding spot to be used as a negative electrode connecting point, and the other end of the column parallel circuit is provided with a common anode welding spot to be used as a positive electrode connecting point.
Further, the step 3 comprises the following steps:
31, preparing a 25-300V direct current power supply;
step 32, connecting a direct current power supply with a cathode welding spot of a blue light chip or a cathode welding spot of a green light chip or a cathode welding spot of a red light chip and a common anode welding spot respectively, detecting, executing step 7 if all rows are successfully lightened, and executing step 33 if one or more rows cannot be lightened;
and step 33, the row which cannot be lightened is the row where the pixel dead pixel chip is located.
Further, in the step 4, determining the location of the defective pixel chip by using a dichotomy, connecting one end of a direct current power supply to a cathode welding spot of the color light chip, and connecting the other end of the direct current power supply to a wire between two adjacent color light chips in the middle of a row where the pixel defective pixel chip is located, performing a lighting test, wherein the non-lighting end is the end where the pixel defective pixel chip is located, and repeatedly using the dichotomy for the end where the pixel defective pixel chip is located until the location of the pixel defective pixel chip is determined; the first time division DC power supply voltage is 1/2-2/3 of detection voltage, the second time division DC power supply voltage is 1/4-4/9 of detection voltage, the nth time division DC power supply voltage is (1/2) of detection voltagen～(2/3)n。
Further, a high-speed die bonder is used for die bonding in the step 5, the die bonding resolution is 0.5-30 um, the XY axis feeding precision is 0.1-2 um, a gold ball bonding machine is used for bonding wires, the image recognition precision is 0.1-2 um, and the pin positioning precision is 1-30 um.
Further, the light transmittance of the silica gel packaged in the silica gel in the step 8 is 65-99%, and the packaging temperature is 80-250 ℃.
Further, the cutting depth of the cutting in the step 9 is 0.2-5 mm, the cutting method comprises high-speed cutting machine cutter cutting, high-pressure water cutting or laser cutting, the cutting stepping precision is 1-10 um, and the feeding speed is 0.1-500 mm/s.
Furthermore, the method is applicable to COB display module with a distance of P0.5-P5.0, the COB display module substrate is square, rectangular or hexagonal, and the length and the width are 5-25 cm.
Compared with the prior art, the invention has the following advantages and beneficial effects:
compared with the common method for detecting the quality of the display module chip, the method has the advantages that the possibility that the original encapsulation consistency is damaged by detecting after the control circuit is installed is avoided, and the detection workload is greatly reduced, for example, 400 LED chips are loaded on the display module unit with the distance of P2.5 and the distance of 5cm multiplied by 5 cm. The pixel dead pixel can be found only by carrying out the test for 1 pixel dead pixel chip for 400 times at most before the package, the method can be used for finding the pixel dead pixel 6 times at most, the efficiency is high, the workload is greatly reduced, the time and the production cost are saved, the pixel dead pixels on all display modules are completely repaired in advance, the reserved circuit is disconnected after the package, the practical application of the display modules is not influenced, and the method has important significance for the assembly of the control circuit in the next step, so the method has wide application prospect in the field of small-spacing display.
Drawings
FIG. 1 is a schematic diagram of a small-pitch display module according to an embodiment of the present invention.
FIG. 2 is a schematic diagram of a small-pitch display module chip die-bonding and wire-bonding in an embodiment of the invention.
FIG. 3 is a schematic diagram of the whole line detection of a single-color chip of a small-pitch display module according to an embodiment of the present invention.
FIG. 4 is a schematic diagram of a binary test of a single-color chip of a small-pitch display module according to an embodiment of the present invention.
Fig. 5 is a schematic diagram illustrating a dichotomy positioning of the small-pitch display module in embodiment 1 of the invention to a dead pixel.
FIG. 6 is a schematic diagram of the overall detection of the small-gap display module according to the embodiment of the present invention after repairing the defective pixel.
FIG. 7 is a schematic diagram of a small-pitch display module integrally breaking a reserved row series circuit according to an embodiment of the present invention.
Fig. 8 is a schematic diagram of a dead pixel detected by the small-pitch display module in the dichotomy positioning in embodiment 2 of the invention.
Fig. 9 is a schematic diagram of a dead pixel detected by the two-step method for the small-pitch display module in embodiment 3 of the present invention.
Included in fig. 1 to 9 are: 11 blue light chip (B) cathode welding spot, 12 green light chip (G) cathode welding spot, 13 red light chip (R) cathode welding spot, 14 chip welding spots, 15COB display module group base plate, 17 common anode welding spot, 18 blue light chip (B), 19 green light chip (G), 20 red light chip (R), 21 test qualified chip, 22 DC power supply, 23 pixel dead pixel chip and 24 to-be-confirmed chip.
Detailed Description
The following description will further explain embodiments of the present invention by referring to the figures and the specific embodiments. It should be noted that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work based on the embodiments of the present invention belong to the protection scope of the present invention.
The method for efficiently detecting the pixel dead pixel of the small-spacing COB display module comprises the following steps:
step 1, preparing a COB display module substrate, and reserving detection circuits of pixel points on the substrate, wherein the detection circuits comprise independent detection circuits of a red light chip, a green light chip and a blue light chip;
step 2, carrying out die bonding and wire bonding on the red light chip, the green light chip and the blue light chip respectively;
step 3, detecting an integral circuit where an undetected chip in the red light chip, the green light chip and the blue light chip is located, if no pixel dead pixel chip is detected, executing step 7, if a pixel dead pixel chip is detected, determining a row where the pixel dead pixel chip is located, and executing step 4;
step 4, accurately positioning the position of the pixel dead pixel chip by a bisection method;
step 5, taking down the pixel dead pixel chip and using the same color light chip to perform die bonding and wire bonding again;
step 6, the whole circuit where the color light chip is located is detected again, if the pixel dead pixel chip is still found, the steps 3 to 5 are repeated until the circuit is completely lightened;
step 7, if the whole circuit where the undetected corresponding color light chip is located exists, returning to execute the step 3, and if the red light chip, the green light chip and the blue light chip have no pixel dead pixel, executing the step 8;
and 9, cutting off the reserved circuit of the COB display module.
Example 1
Taking a 5cm multiplied by 5cm COB display module unit with P5.0 small spacing as an example, the small-spacing COB display module substrate 15 is square, in order to conveniently and clearly express the method for efficiently detecting the pixel dead pixel of the small-spacing COB display module, the reserved detection circuit preferably reserves an independent line series-column parallel circuit for RGB three chips, all the figures only draw part of the chips as schematic representation, and only draw a single color chip as schematic representation in the line detection and dichotomy stage.
The method comprises the following steps:
(1) as shown in fig. 1, a row-to-row parallel circuit is reserved in advance in a small-pitch COB display module substrate 15, and the row-to-row parallel circuit means that electrodes of color light chip pads 14 in each row are connected in series, that is, the anode of each pad is connected with the cathode of the previous pad, the cathode of each pad is connected with the anode of the next pad, and two pins are led out from the pads at the two sides to form a row-to-row parallel circuit; the column parallel connection means that each row is connected in series and then connected in parallel to form a column parallel circuit, namely pins at two sides of each row are respectively connected by a vertical circuit, so that the parallel connection relationship between the rows is achieved.
(2) After the columns are connected in parallel, a cathode welding point 11 of a blue light chip (B), a cathode welding point 12 of a green light chip (G), a cathode welding point 13 of a red light chip (R) are respectively led out to be used as a negative connecting point of the integral detection, and a common anode welding point 17 is used as a positive connecting point.
(3) As shown in fig. 2, the undetected RGB chips are bonded to the chip pads 14 of the small-pitch COB display module substrate 15 by a die bonding and wire bonding process to form a rectangular pixel distribution array with rows and columns distributed vertically and horizontally.
(4) As shown in fig. 3, the entire green chip (G) circuit is tested first; and the external direct current power supply 22 is connected with the cathode welding spot 12 and the common anode welding spot 17 of the green chip (G) and is electrified to carry out the integral lighting test. The voltage of the external direct current power supply 22 is in direct proportion to the number of the row series chips of the small-distance display module, the lighting voltage of a single small-distance display color light chip is 3V, the number of the row series chips is 10, and the voltage of the external direct current power supply is 30V; only the middle row is found to be unlit, indicating that the pixel dead pixel chip 23 is in the middle row.
(5) As shown in fig. 4, on the basis of determining the row of the pixel dead pixel chips 23 of the green chip (G)19, a lighting test is performed by connecting a bisection electrode directly to the pad and directly to the middle wire of the row, and the first bisection dc power voltage is 1/2, that is, 15V, of the overall row detection voltage, and it is found that the right end is not lit; and (4) continuing repeating the steps on the right end to perform bisection until the pixel dead pixel chip 23 is found, detecting for 4 times to find that the middle point is the pixel dead pixel chip 23, and successfully positioning, as shown in fig. 5.
(6) On the basis of positioning to the dead pixel, repairing the pixel dead pixel chip 23, namely taking down the dead pixel chip and carrying out die bonding and wire bonding again by using the same chip; the die bonding is carried out by adopting a high-speed die bonding machine, the die bonding resolution is 2um and the XY axis feeding precision is 1um in cooperation with the small-space display requirement. The bonding wire adopts gold ball bonding machine to go on, and image recognition precision is 0.5um, and pin positioning accuracy is 3 um.
(7) As shown in fig. 6, after the defective pixel is repaired, the green chip (G)19 needs to be subjected to a whole circuit test again, that is, the external dc power supply 22 is connected to two pads led out after the columns are connected in parallel to perform a lighting test. All the chips were found to be lit up, indicating that all the chips were good chips 21.
(8) After the G circuit is detected and repaired, the remaining blue chip (B)18 and red chip (R)20 chips need to be detected by repeating the line detection and bisection positioning method until the blue chip (B)18, green chip (G)19 and red chip (R)20 chips can be successfully lit up in the line test.
(9) On the basis that three kinds of RGB chips all passed through the detection, carry out the silica gel encapsulation to the booth apart from COB display module assembly, the luminousness of the silica gel of adoption is 90%. The curing temperature was 160 ℃.
(10) As shown in fig. 7, on the basis that all the RGB three-color chips pass the detection, the reserved-line series circuit is cut and divided as a whole, so that the qualified chip 21 becomes an independent light-emitting pixel. The cutting depth on the small-spacing COB display module substrate 15 is 2mm, and the reserved row series circuit is completely cut off to be in an open circuit state. The cutting method is cutting by a high-speed cutting machine tool, the cutting stepping precision is 5um, and the feeding speed is 50 mm/s.
Example 2
Taking a 5cm multiplied by 5cm COB display module unit with P5.0 small spacing as an example, the small-spacing COB display module substrate 15 is square, in order to conveniently and clearly express the method for efficiently detecting the pixel dead pixel of the small-spacing COB display module, the reserved detection circuit preferably reserves an independent line series-column parallel circuit for RGB three chips, all the figures only draw part of the chips as schematic representation, and only draw a single color chip as schematic representation in the line detection and dichotomy stage.
The detection steps are substantially the same as those of embodiment 1, except that the lighting test of the whole row of the green chips (G)19 in this embodiment finds that there are two rows of non-lighting, which indicates that there are pixel dead pixel chips 23 of the green chips (G)19 in the two rows, which is the case where there are pixel dead pixels in two or even more rows (n rows), and then the two rows are respectively detected, and at most 4n times of dichotomy detection can find out two green chips (G) dead pixels thereof, as shown in fig. 9.
Example 3
Taking a 5cm multiplied by 5cm COB display module unit with P5.0 small spacing as an example, the small-spacing COB display module substrate 15 is square, in order to conveniently and clearly express the method for efficiently detecting the pixel dead pixel of the small-spacing COB display module, the reserved detection circuit preferably reserves an independent line series-column parallel circuit for RGB three chips, all the figures only draw part of the chips as schematic representation, and only draw a single color chip as schematic representation in the line detection and dichotomy stage.
The detection steps are substantially the same as those of embodiment 1, except that in this embodiment, when the green chip (G)19 is tested by the dichotomy, both ends are not lighted, which indicates that there are pixel dead pixel chips 23 of the green chip (G)19 at both ends, and it is necessary to further dichotomy process and detect the undetected chips at both ends until all the pixel dead pixel chips 23 of the green chip (G)19 are found. This is the case for a single row of multiple bad pixels, as shown in FIG. 8.
In summary, the method for efficiently detecting the small-pitch COB display module pixel dead pixel provided by the invention provides a solution for efficiently positioning the pixel dead pixel aiming at the difficulty in detecting a large number of small-pitch COB display module chips, the circuit reserved on the module substrate is used for simply and rapidly carrying out overall detection before module packaging, then the dead pixel is rapidly positioned and repaired by using a bisection method, the reserved circuit is disconnected after the module packaging, the actual application of the display module is not influenced, the quality hidden trouble is eliminated for the next control circuit installation, the method realizes the function of efficiently and rapidly positioning the pixel dead pixel, has incomparable advantages for the small-pitch COB display module, and has important practical significance in the small-pitch display field.
Claims (8)
1. The utility model provides a method of high-efficient detection booth COB display module group pixel bad point which characterized in that includes following step:
step 1, preparing a COB display module substrate, and reserving detection circuits of pixel points on the substrate, wherein the detection circuits comprise independent detection circuits of a red light chip, a green light chip and a blue light chip;
step 2, carrying out die bonding and wire bonding on the red light chip, the green light chip and the blue light chip respectively;
step 3, detecting an integral circuit where an undetected chip in the red light chip, the green light chip and the blue light chip is located, if no pixel dead pixel chip is detected, executing step 7, if a pixel dead pixel chip is detected, determining a row where the pixel dead pixel chip is located, and executing step 4;
step 4, accurately positioning the position of the pixel dead pixel chip by a bisection method;
step 5, taking down the pixel dead pixel chip and using the same color light chip to perform die bonding and wire bonding again;
step 6, the whole circuit where the color light chip is located is detected again, if the pixel dead pixel chip is still found, the steps 3 to 5 are repeated until the circuit is completely lightened;
step 7, if the whole circuit where the undetected corresponding color light chip is located exists, returning to execute the step 3, and if the red light chip, the green light chip and the blue light chip have no pixel dead pixel, executing the step 8;
step 8, performing silica gel packaging on the COB display module;
and 9, cutting off the reserved circuit of the COB display module.
2. The method for efficiently detecting the pixel dead pixel of the small-pitch COB display module according to claim 1, wherein the method comprises the following steps: the independent detection circuits of the red light chip, the green light chip and the blue light chip on the COB display module substrate in the step 1 are row series-column parallel circuits, the row series circuits in the row series-column parallel circuits comprise N rows, each row comprises M colored light chips, N is not less than 1, M is not less than 100 and not less than 10, bonding pads of the M colored light chips are connected in series, and the lighting voltage of the colored light chips is 2.5-3V; the column parallel circuit is formed by connecting M colored light chips in series and then connecting N rows of chips in parallel; one end of the column parallel circuit is respectively led out a blue light chip cathode welding spot, a green light chip cathode welding spot and a red light chip cathode welding spot to be used as a negative electrode connecting point, and the other end of the column parallel circuit is provided with a common anode welding spot to be used as a positive electrode connecting point.
3. The method for efficiently detecting the bad pixels of the COB display module with small pitch according to claim 1, wherein the step 3 comprises the following steps:
31, preparing a 25-300V direct current power supply;
step 32, connecting a direct current power supply with a cathode welding spot of a blue light chip or a cathode welding spot of a green light chip or a cathode welding spot of a red light chip and a common anode welding spot respectively, detecting, executing step 7 if all rows are successfully lightened, and executing step 33 if one or more rows cannot be lightened;
and step 33, the row which cannot be lightened is the row where the pixel dead pixel chip is located.
4. The method for efficiently detecting the bad pixels of the COB display module with the small pitch as claimed in claim 1, wherein in the step 4, a dichotomy is used to determine the position of the bad pixel chip, one end of a direct current power supply is connected to a cathode welding point of the color light chip, the other end of the direct current power supply is connected to a wire between two adjacent color light chips in the middle of a row of the bad pixel chip, a lighting test is performed, the non-lighting end is the position of the bad pixel chip, and the dichotomy is repeatedly used for the position of the bad pixel chip until the position of the bad pixel chip is determined; the first time dichotomous DC power supply voltage is 1/2-2/3 of the whole line detection voltage, the second time dichotomous DC power supply voltage is 1/4-4/9 of the whole line detection voltage, and the nth time dichotomous DC power supply voltage is (1/2) of the whole line detection voltagen～(2/3)n。
5. The method for efficiently detecting the pixel dead pixel of the small-pitch COB display module according to claim 1, wherein the method comprises the following steps: and (3) fixing the crystal in the step (5) by using a high-speed crystal fixing machine, wherein the crystal fixing resolution is 0.5-30 um, the XY axis feeding precision is 0.1-2 um, the bonding wire uses a gold ball bonding machine, the image recognition precision is 0.1-2 um, and the pin positioning precision is 1-30 um.
6. The method for efficiently detecting the pixel dead pixel of the small-pitch COB display module according to claim 1, wherein the method comprises the following steps: the light transmittance of the silica gel packaged by the silica gel in the step 8 is 65-99%, and the packaging temperature is 80-250 ℃.
7. The method for efficiently detecting the pixel dead pixel of the small-pitch COB display module according to claim 1, wherein the method comprises the following steps: the cutting depth of the cutting in the step 9 is 0.2-5 mm, the cutting method comprises high-speed cutting machine cutter cutting, high-pressure water cutting or laser cutting, the cutting stepping precision is 1-10 um, and the feeding speed is 0.1-500 mm/s.
8. The method for efficiently detecting the pixel defect of the COB display module with small spacing according to any one of claims 1 to 7, wherein: the method is applicable to COB display modules, the distance between the COB display modules is P0.5-P5.0, the COB display module substrate is square, rectangular or hexagonal, and the length and the width of the COB display module substrate are 5-25 cm.
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