CN218567426U - PCB board - Google Patents

Abstract

The utility model discloses a PCB board, which comprises an integrated circuit layer, a pad layer, a pixel array, a first lead, a second lead, a first test needle position through hole and a second test needle position through hole, wherein the pixel array is arranged on the pad layer; the integrated circuit layer is positioned on one side of the pad layer; the negative electrode of a pixel unit on the pixel array is connected with the first lead, one end of the first testing needle position through hole is positioned at a position corresponding to the first lead, and the other end of the first testing needle position through hole penetrates through the integrated circuit layer; the positive electrode of the pixel unit with the same color light on the pixel array is connected with the second lead, one end of the second testing needle position through hole is located at a position corresponding to the second lead, and the other end of the second testing needle position through hole penetrates through the integrated circuit layer, so that the number of testing needle positions on the PCB is greatly reduced, the number of thimbles on the corresponding testing jig is effectively reduced, the manufacturing difficulty of the testing jig is further reduced, and the accuracy of PCB testing is improved.

Description

PCB board

Technical Field

The utility model relates to a circuit board technical field especially relates to a PCB board.

Background

The existing PCB board usually reserves testing needle positions at pins of an IC (integrated circuit), provides a lighting program on a drive pad, has more testing needle positions, leads to too many points of the adaptive testing jig needing needle testing, is easy to report by mistake in batch testing, and in addition, when the size of a PCB unit plate is further enlarged, the testing needle positions are also increased, leads to too large number of thimbles on the required testing jig and can not manufacture the testing jig.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the PCB board can effectively reduce the number of the thimbles on the corresponding test fixture.

In order to solve the technical problem, the utility model discloses a technical scheme be:

a PCB board comprises an integrated circuit layer, a pad layer, a pixel array, a first lead, a second lead, a first test needle through hole and a second test needle through hole, wherein the pixel array is arranged on the pad layer;

the integrated circuit layer is positioned on one side of the pad layer;

the negative electrode of a pixel unit on the pixel array is connected with the first lead, one end of the first testing needle position through hole is positioned at a position corresponding to the first lead, and the other end of the first testing needle position through hole penetrates through the integrated circuit layer;

and the positive electrode of the pixel unit with the same color light on the pixel array is connected with the second lead, one end of the second testing needle position through hole is positioned at a position corresponding to the second lead, and the other end of the second testing needle position through hole penetrates through the integrated circuit layer.

Further, the pixel unit comprises a first color light LED chip, a second color light LED chip and a third color light LED chip;

the second lead comprises a first color light lead, a second color light lead and a third color light lead;

the second testing needle position through hole comprises a first chromatic light testing needle position through hole, a second chromatic light testing needle position through hole and a third chromatic light testing needle position through hole;

the positive electrode of the first color light LED chip on the same pixel row on the pixel array is connected with the first color light lead, the positive electrode of the second color light LED chip on the same pixel row is connected with the second color light lead, and the positive electrode of the third color light LED chip on the same pixel row is connected with the third color light lead;

one end of the first color light test needle position through hole is positioned at a position corresponding to the first color light lead, and the other end of the first color light test needle position through hole penetrates through the integrated circuit layer;

one end of the second color light testing needle position through hole is positioned at a position corresponding to the second color light lead, and the other end of the second color light testing needle position through hole penetrates through the integrated circuit layer;

one end of the third color light testing needle position through hole is located at a position corresponding to the third color light lead, and the other end of the third color light testing needle position through hole penetrates through the integrated circuit layer.

Further, the negative electrode of the pixel unit of the same pixel column on the pixel array is connected with the first lead.

Further, the circuit also comprises a first circuit layer and a second circuit layer;

the first circuit layer is arranged on one side, close to the integrated circuit layer, of the bonding pad layer, and the second circuit layer is arranged on one side, far away from the bonding pad layer, of the first circuit layer;

one end of the first test needle position through hole is located at a position corresponding to the first lead, and the other end of the first test needle position through hole penetrates through the first circuit layer, the second circuit layer and the integrated circuit layer in sequence.

Further, laser perforation is also included;

the second lead is arranged on the first circuit layer;

one end of the laser hole is located at a position corresponding to the anode of the pixel unit, and the other end of the laser hole is located at a position corresponding to the second lead.

Further, the first color light is red light, the second color light is green light, and the third color light is blue light.

The beneficial effects of the utility model reside in that: the integrated circuit layer is located on one side of the pad layer, the negative electrode of the pixel unit on the pixel array is connected with the first lead, one end of the first testing needle position through hole is located at a position corresponding to the first lead, the other end of the first testing needle position through hole penetrates through the integrated circuit layer, the positive electrode of the pixel unit with the same color light on the pixel array is connected with the second lead, one end of the second testing needle position through hole is located at a position corresponding to the second lead, the other end of the second testing needle position through hole penetrates through the integrated circuit layer, the negative electrode of the pixel unit shares one testing needle position, and the positive electrode of the pixel unit with the same color light shares one testing needle position, so that the number of the testing needle positions on the PCB is greatly reduced, the number of thimbles on the corresponding testing jig is effectively reduced, the manufacturing difficulty of the testing jig is reduced, and the accuracy of the PCB testing is improved.

Drawings

Fig. 1 is a top view of a PCB according to an embodiment of the present invention;

fig. 2 is a top view of a first circuit layer of a PCB board according to an embodiment of the present invention;

fig. 3 is a side view of a first testing pin through hole of a PCB according to an embodiment of the present invention;

fig. 4 is a side view of a second testing pin through hole of a PCB according to an embodiment of the present invention;

description of the reference symbols:

1. an Integrated Circuit (IC) layer; 2. a pad layer; 3. an array of pixels; 31. a first color light LED chip; 32. a second color light LED chip; 33. a third color light LED chip; 4. a first lead; 5. a second lead; 51. a first color light lead; 52. a second color light lead; 53. a third color light lead; 6. a first test needle location through hole; 7. a second test needle position through hole; 71. a first colorimetric test needle through hole; 72. testing the needle position through hole by using second colored light; 73. testing the needle position through hole by using third color light; 8. a first circuit layer; 9. a second circuit layer; 10. laser perforation; 11. a first test needle position; 12. and a second test needle position.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 to 4, a PCB includes an integrated circuit layer 1, a pad layer 2, a pixel array 3 disposed on the pad layer, a first lead 4, a second lead 5, a first test pin through hole 6, and a second test pin through hole 7;

the integrated circuit layer 1 is positioned at one side of the pad layer 2;

the negative electrode of the pixel unit on the pixel array 3 is connected with the first lead 4, one end of the first test needle position through hole 6 is positioned at the position corresponding to the first lead 4, and the other end of the first test needle position through hole penetrates through the integrated circuit layer 1;

the positive electrode of the pixel unit with the same color light on the pixel array 3 is connected with the second lead 5, one end of the second testing needle position through hole 7 is located at a position corresponding to the second lead 5, and the other end of the second testing needle position through hole penetrates through the integrated circuit layer 1.

From the above description, the beneficial effects of the present invention are: the integrated circuit layer 1 is positioned on one side of the pad layer 2, the negative electrodes of the pixel units on the pixel array 3 are connected with the first lead 4, one end of the first testing needle position through hole 6 is positioned at a position corresponding to the first lead 4, the other end of the first testing needle position through hole penetrates through the integrated circuit layer 1, the positive electrodes of the pixel units with the same color light on the pixel array 3 are connected with the second lead 5, one end of the second testing needle position through hole 7 is positioned at a position corresponding to the second lead 5, the other end of the second testing needle position through hole penetrates through the integrated circuit layer 1, the negative electrodes of the pixel units share one testing needle position, the positive electrodes of the pixel units with the same color light share one testing needle position, therefore, the number of testing needle positions on the PCB is greatly reduced, the number of thimbles on the corresponding testing jig is effectively reduced, the manufacturing difficulty of the testing jig is reduced, and the accuracy of the PCB is improved.

Further, the pixel unit includes a first color light LED chip 31, a second color light LED chip 32, and a third color light LED chip 33;

the second lead 5 includes a first color light lead 51, a second color light lead 52, and a third color light lead 53;

the second testing needle position through hole 7 comprises a first color light testing needle position through hole 71, a second color light testing needle position through hole 72 and a third color light testing needle position through hole 73;

the positive electrode of the first color LED chip 31 on the same pixel row of the pixel array 3 is connected to the first color lead 51, the positive electrode of the second color LED chip 32 on the same pixel row is connected to the second color lead 52, and the positive electrode of the third color LED chip 33 on the same pixel row is connected to the third color lead 53;

one end of the first color light test needle position through hole 71 is located at a position corresponding to the first color light lead 51, and the other end penetrates through the integrated circuit layer 1;

one end of the second color light testing needle position through hole 72 is located at a position corresponding to the second color light lead 52, and the other end penetrates through the integrated circuit layer 1;

one end of the third color light testing needle position through hole 73 is located at a position corresponding to the third color light lead 53, and the other end penetrates through the integrated circuit layer 1.

As can be seen from the above description, only one testing needle position is needed for the anode of the LED chip with the same color light on each pixel row, so that the number of the testing needle positions is greatly reduced.

Further, the negative electrode of the pixel unit of the same pixel column on the pixel array 3 is connected to the first lead 4.

As can be seen from the above description, only one test needle position is needed for the cathodes of the pixel units in the same pixel column, so that the number of test needle positions is greatly reduced.

Further, a first circuit layer 8 and a second circuit layer 9 are also included;

the first circuit layer 8 is arranged on one side of the pad layer close to the integrated circuit layer 1, and the second circuit layer 9 is arranged on one side of the first circuit layer 8 far away from the pad layer 2;

one end of the first test needle position through hole 6 is located at a position corresponding to the first lead 4, and the other end of the first test needle position through hole penetrates through the first circuit layer 8, the second circuit layer 9 and the integrated circuit layer 1 in sequence.

As can be seen from the above description, one end of the first testing needle through hole 6 is located at a position corresponding to the first lead 4, and the other end thereof sequentially penetrates through the first circuit layer 8, the second circuit layer 9 and the integrated circuit layer 1, so as to form the positive testing needle of the pixel unit.

Further, the device also comprises a laser hole 10;

the second lead 5 is arranged on the first circuit layer 8;

one end of the laser hole 10 is located at a position corresponding to the anode of the pixel unit, and the other end of the laser hole is located at a position corresponding to the second lead 5.

As can be seen from the above description, one end of the laser hole 10 is located at a position corresponding to the anode of the pixel unit, and the other end is located at a position corresponding to the second lead 5, so that the anode of the pixel unit is connected laterally through the laser hole 10.

Further, the first color light is red light, the second color light is green light, and the third color light is blue light.

The utility model discloses foretell PCB Board can be applicable to and need carry out COB (Chip On Board, directly pastes the high light efficiency integrated surface light source technique On the mirror surface metal substrate of high reflectance with the LED Chip) PCB Board of lighting test, explains through embodiment mode below:

example one

Referring to fig. 1 to 4, a PCB of the present embodiment includes an Integrated Circuit (IC) layer 1, a pad layer 2, a pixel array 3 disposed on the pad layer 2, a first lead 4, a second lead 5, a first test pin through hole 6, and a second test pin through hole 7;

the integrated circuit layer 1 is positioned at one side of the pad layer 2;

the negative electrode of the pixel unit on the pixel array 3 is connected with the first lead 4, one end of the first test needle position through hole 6 is positioned at the position corresponding to the first lead 4, and the other end of the first test needle position through hole penetrates through the integrated circuit layer 1;

the positive electrode of the pixel unit with the same color light on the pixel array 3 is connected with the second lead 5, one end of the second testing needle position through hole 7 is positioned at the position corresponding to the second lead 5, and the other end of the second testing needle position through hole penetrates through the integrated circuit layer 1, so that a first testing needle position 11 is formed at the first testing needle position through hole 6, and a second testing needle position 12 is formed at the second testing needle position through hole 7;

specifically, as shown in fig. 1 to 3, the pixel unit includes a first color light LED chip 31, a second color light LED chip 32, and a third color light LED chip 33;

the second lead 5 includes a first color light lead 51, a second color light lead 52, and a third color light lead 53;

the second testing needle position through hole 7 comprises a first color light testing needle position through hole 71, a second color light testing needle position through hole 72 and a third color light testing needle position through hole 73;

the positive electrode of the first color LED chip 31 on the same pixel row of the pixel array 3 is connected to the first color lead 51, the positive electrode of the second color LED chip 32 on the same pixel row is connected to the second color lead 52, and the positive electrode of the third color LED chip 33 on the same pixel row is connected to the third color lead 53;

one end of the first color light test needle position through hole 71 is located at a position corresponding to the first color light lead 51, and the other end penetrates through the integrated circuit layer 1;

one end of the second color light testing needle position through hole 72 is located at a position corresponding to the second color light lead 52, and the other end penetrates through the integrated circuit layer 1;

one end of the third color light testing needle position through hole 73 is located at a position corresponding to the third color light lead 53, and the other end penetrates through the integrated circuit layer 1;

specifically, the negative electrode of the pixel unit in the same pixel column on the pixel array 3 is connected to the first lead 4;

specifically, as shown in fig. 3 to 4, the printed circuit board further includes a first circuit layer 8 and a second circuit layer 9;

the first circuit layer 8 is arranged on one side of the pad layer 2 close to the integrated circuit layer 1, and the second circuit layer 9 is arranged on one side of the first circuit layer 8 far away from the pad layer 2;

one end of the first test needle position through hole 6 is located at a position corresponding to the first lead 4, and the other end of the first test needle position through hole penetrates through the first circuit layer 8, the second circuit layer 9 and the integrated circuit layer 1 in sequence;

specifically, as shown in fig. 4, the device further comprises a laser hole 10;

the second lead 5 is arranged on the first circuit layer 8;

one end of the laser hole 10 is located at a position corresponding to the anode of the pixel unit, and the other end of the laser hole is located at a position corresponding to the second lead 5;

specifically, the first color light is red light, the second color light is green light, and the third color light is blue light;

the working principle is as follows:

the method comprises the steps of connecting the cathodes of pixel units belonging to the same pixel row on a pixel array 3 by using a lead, arranging a first test needle position through hole 6 at a position corresponding to the lead, enabling the first test needle position through hole 6 to penetrate through an integrated circuit layer 1, forming a first test needle position 11 on the integrated circuit layer 1, arranging a conductive spring thimble at the first test needle position 11 for conducting the cathodes, connecting the anodes of LED chips belonging to the same pixel row and the same color light on the pixel array 3 by using a lead, arranging a second test needle position through hole 7 at a position corresponding to the lead, enabling the second test needle position through hole 7 to penetrate through the integrated circuit layer 1, forming a second test needle position 12 on the integrated circuit layer 1, arranging a conductive spring thimble at the second test needle position 12 for conducting the anodes, and therefore, assuming that four rows and three rows of pixel arrays 3 exist, only four first test needle positions 11 and nine second test needle positions 12 are needed, so that the number of test needles on the pixel array is greatly reduced, the test needles on the PCB is further, the effective test efficiency is reduced, and the test efficiency of the PCB is improved.

In summary, the present invention provides a PCB, including an integrated circuit layer, a pad layer, a pixel array disposed on the pad layer, a first lead, a second lead, a first testing needle through hole and a second testing needle through hole; the integrated circuit layer is positioned on one side of the pad layer; the negative electrode of a pixel unit on the pixel array is connected with the first lead, one end of the first testing needle position through hole is positioned at a position corresponding to the first lead, and the other end of the first testing needle position through hole penetrates through the integrated circuit layer; the positive pole of the pixel unit of the same chromatic light on the pixel array is connected with the second lead, one end of the second testing needle position through hole is located at the position corresponding to the second lead, the other end of the second testing needle position through hole penetrates through the integrated circuit layer, specifically, the negative pole of the pixel unit of the same pixel row on the pixel array is connected with the first lead, the negative poles of the pixel units share one testing needle position, and the positive pole of the pixel unit of the same chromatic light shares one testing needle position, so that the quantity of the testing needle positions on the PCB is greatly reduced, the quantity of the thimbles on the corresponding testing jig is effectively reduced, the manufacturing difficulty of the testing jig is reduced, and the accuracy of the PCB testing is improved.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims (6)

1. A PCB board is characterized by comprising an integrated circuit layer, a pad layer, a pixel array, a first lead, a second lead, a first test needle through hole and a second test needle through hole, wherein the pixel array is arranged on the pad layer;

the integrated circuit layer is positioned on one side of the pad layer;

the negative electrode of a pixel unit on the pixel array is connected with the first lead, one end of the first testing needle position through hole is positioned at a position corresponding to the first lead, and the other end of the first testing needle position through hole penetrates through the integrated circuit layer;

and the positive electrode of the pixel unit with the same color light on the pixel array is connected with the second lead, one end of the second testing needle position through hole is positioned at a position corresponding to the second lead, and the other end of the second testing needle position through hole penetrates through the integrated circuit layer.

2. The PCB board of claim 1, wherein the pixel unit comprises a first color light LED chip, a second color light LED chip and a third color light LED chip;

the second lead comprises a first color light lead, a second color light lead and a third color light lead;

the second testing needle position through hole comprises a first chromatic light testing needle position through hole, a second chromatic light testing needle position through hole and a third chromatic light testing needle position through hole;

the positive electrode of the first color light LED chip on the same pixel row on the pixel array is connected with the first color light lead, the positive electrode of the second color light LED chip on the same pixel row is connected with the second color light lead, and the positive electrode of the third color light LED chip on the same pixel row is connected with the third color light lead;

one end of the first color light test needle position through hole is positioned at a position corresponding to the first color light lead, and the other end of the first color light test needle position through hole penetrates through the integrated circuit layer;

one end of the second color light testing needle position through hole is positioned at a position corresponding to the second color light lead, and the other end of the second color light testing needle position through hole penetrates through the integrated circuit layer;

one end of the third color light testing needle position through hole is located at a position corresponding to the third color light lead, and the other end of the third color light testing needle position through hole penetrates through the integrated circuit layer.

3. The PCB board of claim 1, wherein the negative electrodes of the pixel units of the same pixel column on the pixel array are connected to the first lead.

4. The PCB of claim 1, further comprising a first circuit layer and a second circuit layer;

the first circuit layer is arranged on one side, close to the integrated circuit layer, of the bonding pad layer, and the second circuit layer is arranged on one side, far away from the bonding pad layer, of the first circuit layer;

one end of the first test needle position through hole is located at a position corresponding to the first lead, and the other end of the first test needle position through hole penetrates through the first circuit layer, the second circuit layer and the integrated circuit layer in sequence.

5. The PCB board of claim 4, further comprising laser holes;

the second lead is arranged on the first circuit layer;

one end of the laser hole is located at a position corresponding to the anode of the pixel unit, and the other end of the laser hole is located at a position corresponding to the second lead.

6. The PCB board of claim 2, wherein the first color light is red light, the second color light is green light, and the third color light is blue light.

Images