CN219716888U - Anti-train-lighting full-color lamp bead - Google Patents
Anti-train-lighting full-color lamp bead Download PDFInfo
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- CN219716888U CN219716888U CN202320470977.4U CN202320470977U CN219716888U CN 219716888 U CN219716888 U CN 219716888U CN 202320470977 U CN202320470977 U CN 202320470977U CN 219716888 U CN219716888 U CN 219716888U
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- 239000011324 bead Substances 0.000 title claims abstract description 87
- 238000003466 welding Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 15
- 238000013508 migration Methods 0.000 description 15
- 230000005012 migration Effects 0.000 description 15
- 238000012423 maintenance Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses an anti-train-lighting full-color lamp bead, which comprises a lamp bead base and a full-color light-emitting unit matched with the lamp bead base, wherein the lamp bead base is provided with a lamp bead cover; the red LED wafer, the green LED wafer and the blue LED wafer of the full-color light-emitting unit are respectively fixed on the front surface of the red light die bonding pad, the front surface of the green light die bonding pad and the blue light die bonding pad; the anodes of the red LED wafer, the green LED wafer and the blue LED wafer are respectively connected and conducted with the common electrode bonding pad through conductive wires, and the cathodes of the red LED wafer, the green LED wafer and the blue LED wafer are respectively connected with the red die bonding pad, the green die bonding pad and the blue die bonding pad. The utility model can effectively prevent the LED display screen from displaying bright display columns.
Description
Technical Field
The utility model relates to the field of LEDs, in particular to an anti-train-lighting full-color lamp bead.
Background
As shown in fig. 1, many of the existing LED display panels employ common-anode full-color beads, and red LED chips 21', green LED chips 22', and blue LED chips 23' of full-color light emitting units B ' of the common-anode full-color beads are disposed on a bead base a ' by adopting a common-anode connection method; specifically, the positive and negative electrodes of the red LED chip 21 'are respectively positioned on the front and back surfaces of the red LED chip 21'; the positive and negative electrodes of the green LED wafer 22 'and the blue LED wafer 23' are arranged on the front surface of the wafer; in a full-color light emitting unit B ', the negative electrode of the red LED chip 21' and the negative electrode of the green LED chip 22' and the back surface of the blue LED chip 23' are both fixed on the red negative electrode pad 12', the negative electrode of the green LED chip 22' is connected with the green negative electrode pad 13' through the conductive wire 3', the negative electrode of the blue LED chip 23' is connected with the blue negative electrode pad 14' through the conductive wire 3', the positive electrode of the red LED chip 21', the positive electrode of the green LED chip 22' and the positive electrode of the blue LED chip 23' are respectively connected with the common positive electrode pad 11' through the conductive wire 3', and the common positive electrode pad 11', the red negative electrode pad 12', the green negative electrode pad 13' and the blue negative electrode pad 14' are all formed on the lamp bead base a '.
When the conventional common-positive full-color lamp beads are applied to an LED display screen and driven in a scanning mode, a problem is easy to occur. That is, when metal migration occurs, the green LED chip 22' or the blue LED chip 23' of the full-color light emitting unit B ' of a certain common positive full-color lamp bead can make the negative electrode of the green LED chip 22' or the blue LED chip 23' directly conduct with the red negative electrode pad 12', which can lead to the conduction of the red negative electrode pad 12' with the green negative electrode pad 13' and/or the conduction of the red negative electrode pad 12' with the blue negative electrode pad 14', that is, the full-color light emitting unit B ' of the common positive full-color lamp bead has negative-negative short circuit, and at this time, the conduction voltage of the red LED chip 21' is lower than the conduction voltage of the green LED chip 22' and the blue LED chip 23', which can lead to the damaged full-color light emitting unit B ' to display red light only; meanwhile, as the connection mode between all the full-color light emitting units B ' on each column of the LED display screen is parallel, when the full-color light emitting units B ' of a certain common positive full-color lamp bead have a negative-negative short circuit phenomenon, the column where the damaged full-color light emitting unit B ' is located can only display red, and the phenomenon is generally called as a ' hair worm phenomenon ' (namely, the ' display column brightness ' phenomenon of the LED display screen) in the industry, so that the display effect of the LED display screen is greatly influenced.
When the LED display screen has the phenomenon of 'displaying column brightness', the control system of the LED display screen can not adjust the voltage through the column driving wafer so as to solve the problem, and the damaged common-positive full-color lamp beads can be screened out only by checking all the common-positive full-color lamp beads in the column where the 'displaying column brightness' phenomenon exists one by one during maintenance, so that the maintenance efficiency is low; in addition, the disassembly and reinstallation of the common-positive full-color lamp beads have certain influence on the service life of the full-color lamp beads, so that the maintenance effect is poor, and the maintenance labor and time cost is high.
Therefore, the problem that the LED display screen displays bright display is a pain point and a difficulty in the industry, and the problem needs to be solved urgently.
Disclosure of Invention
The utility model aims to provide an anti-row-lighting full-color lamp bead which can effectively prevent an LED display screen from displaying row lighting.
In order to achieve the above object, the solution of the present utility model is:
an anti-train-lighting full-color lamp bead comprises a lamp bead base and a full-color light-emitting unit matched with the lamp bead base; the full-color light-emitting unit comprises a bonding pad group and a wafer group matched with the bonding pad group; the bonding pad group comprises a public electrode bonding pad, a red light die bonding pad, a green light die bonding pad and a blue light die bonding pad which are fixed on the lamp bead base and are mutually separated; the wafer group comprises a red LED wafer, a green LED wafer and a blue LED wafer; the red LED wafer, the green LED wafer and the blue LED wafer are respectively fixed on the front surface of the red die bonding pad, the front surface of the green die bonding pad and the front surface of the blue die bonding pad, and the red LED wafer, the green LED wafer and the blue LED wafer are positioned on the same straight line; the positive electrode of the red LED wafer, the positive electrode of the green LED wafer and the positive electrode of the blue LED wafer are respectively connected and conducted with the common electrode bonding pad through conductive wires, the negative electrode of the red LED wafer is conducted with the red die bonding pad, the negative electrode of the green LED wafer is conducted with the green die bonding pad, and the negative electrode of the blue LED wafer is conducted with the blue die bonding pad.
The positive electrode and the negative electrode of the red LED wafer are respectively positioned on the front surface and the back surface of the red LED wafer, and the negative electrode of the red LED wafer is welded and connected with the red light die bonding pad or bonded through conductive adhesive.
And the negative electrode of the green LED wafer is connected and conducted with the green die bonding pad through a conductive wire.
And the negative electrode of the blue light LED wafer is connected and conducted with the blue light die bonding pad through a conductive wire.
The adjacent parts of the common electrode bonding pad, the red light die bonding pad, the green light die bonding pad and the blue light die bonding pad of the bonding pad group of the full-color light emitting unit are separated by an insulating lamp bead dam.
And the lamp bead dam protrudes upwards out of the public electrode bonding pad, the red light die bonding pad, the green light die bonding pad and the blue light die bonding pad of the bonding pad group.
The lamp bead dam and the lamp bead base are integrally formed or are separately arranged and then are fixed into a whole.
And the lamp bead base is combined with the common electrode bonding pad, the red light die bonding pad, the green light die bonding pad and the blue light die bonding pad of the bonding pad group in an encapsulation mode.
The public electrode bonding pad, the red light die bonding pad, the green light die bonding pad and the blue light die bonding pad of the bonding pad group are respectively bent to form a public electrode welding leg, a red light negative electrode welding leg, a green light negative electrode welding leg and a blue light negative electrode welding leg.
The lamp bead base forms a light-passing hole, the wafer group of the full-color light-emitting unit is positioned in the light-passing hole, and the light-passing hole is filled with a light-transmitting protective body for covering the wafer group.
After the scheme is adopted, the red LED wafer, the green LED wafer and the blue LED wafer are respectively fixed on the red die bonding pad, the green die bonding pad and the blue die bonding pad, the anode of the red LED wafer, the anode of the green LED wafer and the anode of the blue LED wafer are respectively connected and conducted with the public electrode pad through conductive wires, the cathode of the red LED wafer is conducted with the red die bonding pad, the cathode of the green LED wafer is conducted with the green die bonding pad, and the cathode of the blue LED wafer is conducted with the blue die bonding pad; according to the utility model, the red LED wafer, the green LED wafer and the blue LED wafer are mutually independent, so that the negative electrode of the green LED wafer is prevented from being conducted with the negative electrode of the red die bonding pad and the negative electrode of the red LED wafer when metal migration occurs, the negative electrode of the blue LED wafer is prevented from being conducted with the negative electrode of the red die bonding pad and the negative electrode of the red LED wafer when metal migration occurs, and the negative electrode short circuit phenomenon is avoided; in the second aspect, when metal migration occurs, the green LED chip and the blue LED chip only cause the phenomenon of 'positive and negative electrode short circuit' of the full-color light emitting unit B, so that the anti-train-lighting full-color lamp beads cannot be lighted; in the third aspect, heat generated during the operation of the red LED wafer, the green LED wafer and the blue LED wafer is respectively conducted to the red die bonding pad, the green die bonding pad and the blue die bonding pad, so that the heat generated during the operation of the red LED wafer, the green LED wafer and the blue LED wafer can be rapidly dissipated and cannot be concentrated together, and the anti-train-lighting full-color lamp bead has good heat dissipation effect.
When the anti-train-lighting full-color lamp beads are applied to an LED display screen driven in a scanning mode, and the problem of metal migration occurs to a green LED wafer and/or a blue LED wafer of a full-color light emitting unit of a certain anti-train-lighting full-color lamp bead, the anti-train-lighting full-color lamp beads with the problem of metal migration cannot occur a negative-negative short circuit phenomenon, so that the anti-train-lighting full-color lamp beads with the problem of metal migration can be prevented from displaying red only in the train, the phenomenon of displaying train lighting of the LED display screen is avoided, the influence on the display effect of the LED display screen is further reduced, and the product quality is improved; meanwhile, when the positive and negative electrode short circuit phenomenon occurs to the anti-train-lighting full-color lamp beads due to the metal migration problem of the green light LED wafer and/or the blue light LED wafer of the full-color light emitting unit of a certain anti-train-lighting full-color lamp bead, the anti-train-lighting full-color lamp bead with the positive and negative electrode short circuit phenomenon cannot be lightened when the LED display screen works, so that maintenance personnel can quickly find the anti-train-lighting full-color lamp bead with the positive and negative electrode short circuit phenomenon to replace, and the maintenance efficiency is high.
Drawings
FIG. 1 is a schematic diagram of a conventional common-anode full-color lamp bead;
FIG. 2 is a schematic diagram of a first embodiment of the present utility model;
FIG. 3 is a second schematic diagram of the structure of the present utility model;
FIG. 4 is a schematic view of a partial structure of the present utility model;
FIG. 5 is an exploded view of the structure of the present utility model;
description of the reference numerals:
the background technology is as follows: a lamp bead base a ', a full-color light emitting unit B', a common positive electrode pad 11', a red negative electrode pad 12', a green negative electrode pad 13', a blue negative electrode pad 14', a red LED chip 21', a green LED chip 22', a blue LED chip 23', and a conductive wire 3';
the specific embodiment is as follows: the LED lamp comprises a lamp bead base A, a light passing hole A1, a full-color light emitting unit B, a bonding pad group 1, a common electrode bonding pad 11, a common electrode bonding pad 111, a red light die bonding pad 12, a red light negative electrode bonding pad 121, a green light die bonding pad 13, a green light negative electrode bonding pad 131, a blue light die bonding pad 14, a blue light negative electrode bonding pad 141, a wafer group 2, a red light LED wafer 21, a green light LED wafer 22, a blue light LED wafer 23, a conductive wire 3, a light transmission protective body C and a lamp bead dam D.
Description of the embodiments
In order to further explain the technical scheme of the utility model, the utility model is explained in detail by specific examples.
As shown in fig. 2 to 5, the present utility model discloses an anti-row-lighting full-color lamp bead, which comprises a lamp bead base a and a full-color light emitting unit B matched with the lamp bead base a; the full-color light emitting unit B comprises a bonding pad group 1 and a wafer group 2 matched with the bonding pad group 1; the bonding pad group 1 comprises a common electrode bonding pad 11, a red light die bonding pad 12, a green light die bonding pad 13 and a blue light die bonding pad 14 which are fixed on a lamp bead base A and are mutually separated; the wafer group 2 includes a red LED wafer 21, a green LED wafer 22, and a blue LED wafer 23; the red LED wafer 21, the green LED wafer 22 and the blue LED wafer 23 are respectively fixed on the front surface of the red die bond pad 12, the front surface of the green die bond pad 13 and the front surface of the blue die bond pad 14, and the red LED wafer 21, the green LED wafer 22 and the blue LED wafer 23 are on the same straight line; the positive electrode of the red LED wafer 21, the positive electrode of the green LED wafer 22 and the positive electrode of the blue LED wafer 23 are respectively connected and conducted with the public electrode bonding pad 11 through the conductive wires 3, the negative electrode of the red LED wafer 21 is conducted with the red die bonding pad 12, the negative electrode of the green LED wafer 22 is conducted with the green die bonding pad 13, and the negative electrode of the blue LED wafer 23 is conducted with the blue die bonding pad 14.
In the utility model, a red LED wafer 21, a green LED wafer 22 and a blue LED wafer 23 are respectively fixed on a red die bonding pad 12, a green die bonding pad 13 and a blue die bonding pad 14, the positive electrode of the red LED wafer 21, the positive electrode of the green LED wafer 22 and the positive electrode of the blue LED wafer 23 are respectively connected and conducted with a public electrode pad 11 through a conductive wire 3, the negative electrode of the red LED wafer 21 is conducted with the red die bonding pad 12, the negative electrode of the green LED wafer 22 is conducted with the green die bonding pad 13, and the negative electrode of the blue LED wafer 23 is conducted with the blue die bonding pad 14; the utility model is arranged in such a way, in the first aspect, the red LED wafer 21, the green LED wafer 22 and the blue LED wafer 23 can be mutually independent, so that the negative electrode of the green LED wafer 22 is prevented from being conducted with the negative electrodes of the red die bonding pad 12 and the red LED wafer 21 when metal migration occurs in the green LED wafer 22, and the negative electrode of the blue LED wafer 23 is prevented from being conducted with the negative electrodes of the red die bonding pad 12 and the red LED wafer 21 when metal migration occurs in the blue LED wafer 23, and the negative-electrode short circuit phenomenon can be avoided; in the second aspect, the green LED chip 22 and the blue LED chip 23 also only cause the full-color light emitting unit B to have a "positive and negative electrode short circuit" phenomenon when metal migration occurs, so that the anti-train-lighting full-color lamp beads cannot be lighted; in the third aspect, heat generated during the operation of the red LED chip 21, the green LED chip 22 and the blue LED chip 23 is respectively conducted to the red die bonding pad 12, the green die bonding pad 13 and the blue die bonding pad 14, so that heat generated during the operation of the red LED chip 21, the green LED chip 22 and the blue LED chip 23 can be rapidly dissipated and not concentrated, and the anti-train-lighting full-color lamp bead has good heat dissipation effect.
When the anti-row-lighting full-color lamp beads are applied to an LED display screen driven in a scanning mode, and the problem of metal migration occurs in the green LED wafer 22 and/or the blue LED wafer 23 of the full-color light emitting unit B of a certain anti-row-lighting full-color lamp bead, the anti-row-lighting full-color lamp beads with the problem of metal migration cannot occur a negative-negative short circuit phenomenon, so that the row where the anti-row-lighting full-color lamp beads with the problem of metal migration is can be prevented from displaying red only, the phenomenon of displaying row lighting of the LED display screen is avoided, the influence on the display effect of the LED display screen is further reduced, and the product quality is improved; meanwhile, when the phenomenon of 'positive and negative electrode short circuit' occurs to the anti-train-lighting full-color lamp beads due to the metal migration problem of the green LED wafer 22 and/or the blue LED wafer 23 of the full-color light emitting unit B of a certain anti-train-lighting full-color lamp bead, the anti-train-lighting full-color lamp bead with the phenomenon of 'positive and negative electrode short circuit' cannot be lightened when the LED display screen works, so that maintenance personnel can quickly find out the anti-train-lighting full-color lamp bead with the phenomenon of 'positive and negative electrode short circuit' to replace, and the maintenance efficiency is high.
In the embodiment of the utility model, the lamp bead base A is a plastic part, and is combined with the common electrode bonding pad 11, the red light bonding pad 12, the green light bonding pad 13 and the blue light bonding pad 14 of the bonding pad group 1 in an encapsulation manner, so that the production can be facilitated. The lamp bead base A can form a light-transmitting hole A1, the wafer group 2 of the full-color light-emitting unit B is positioned in the light-transmitting hole A1, and the light-transmitting hole A1 is filled with a light-transmitting protective body C for covering the wafer group 2; the light-transmitting hole A1 can perform a light-gathering function to improve the light-emitting effect of the anti-train-lighting full-color lamp bead, and the light-transmitting protective body C can protect the wafer group 2.
In the embodiment of the utility model, the common electrode pad 11, the red light die bonding pad 12, the green light die bonding pad 13 and the blue light die bonding pad 14 of the pad group 1 are respectively bent to form a common electrode pad 111, a red light negative electrode pad 121, a green light negative electrode pad 131 and a blue light negative electrode pad 141, and the common electrode pad 111, the red light negative electrode pad 121, the green light negative electrode pad 131 and the blue light negative electrode pad 141 are used for being connected with a substrate of an LED display screen; the common electrode pad 111, the red light negative electrode pad 121, the green light negative electrode pad 131 and the blue light negative electrode pad 141 are formed by bending a common electrode pad 11, a red light die bond pad 12, a green light die bond pad 13 and a blue light die bond pad 14, so that the size of the anti-train-lighting full-color lamp bead is smaller.
In the embodiment of the utility model, the positive electrode and the negative electrode of the red LED chip 21 are respectively positioned on the front surface and the back surface of the red LED chip 21, and the negative electrode of the red LED chip 21 is welded and connected with the red die bonding pad 12 or bonded by conductive adhesive, so that the red LED chip 21 is fixed on the front surface of the red die bonding pad 12 and the negative electrode of the red LED chip 21 is conducted with the red die bonding pad 12 simultaneously.
In the embodiment of the present utility model, the positive electrode and the negative electrode of the green LED chip 22 may be both on the front surface of the green LED chip 22, and the negative electrode of the green LED chip 22 may be connected and conducted to the green die bonding pad 13 through the conductive wire 3.
In the embodiment of the present utility model, the positive electrode and the negative electrode of the blue LED chip 23 may be both on the front surface of the blue LED chip 23, and the negative electrode of the blue LED chip 23 may be connected and conducted with the blue die bonding pad 14 through the conductive wire 3.
In the embodiment of the utility model, the adjacent parts of the common electrode pad 1, the red light die bonding pad 12, the green light die bonding pad 13 and the blue light die bonding pad 14 of the pad group 1 of the full-color light emitting unit B can be separated by an insulating lamp bead dam D, and the lamp bead dam D can play a role in isolation and protection, so that the common electrode pad 1, the red light die bonding pad 12, the green light die bonding pad 13 and the blue light die bonding pad 14 are prevented from being conducted due to flash when the red light LED wafer 21, the green light LED wafer 22 and the blue light LED wafer 23 are installed. The lamp bead dam D can be protruded upwards from the common electrode bonding pad 11, the red light die bonding pad 12, the green light die bonding pad 13 and the blue light die bonding pad 14 of the bonding pad group so as to play a good role in isolation and protection. The lamp bead dam D and the lamp bead base A can be integrally formed or are arranged in a split mode and then are fixed into a whole.
The above examples and drawings are not intended to limit the form or form of the present utility model, and any suitable variations or modifications thereof by those skilled in the art should be construed as not departing from the scope of the present utility model.
Claims (10)
1. An anti-train-lighting full-color lamp bead is characterized in that: the full-color light-emitting unit comprises a lamp bead base and a full-color light-emitting unit matched with the lamp bead base;
the full-color light-emitting unit comprises a bonding pad group and a wafer group matched with the bonding pad group;
the bonding pad group comprises a public electrode bonding pad, a red light die bonding pad, a green light die bonding pad and a blue light die bonding pad which are fixed on the lamp bead base and are mutually separated;
the wafer group comprises a red LED wafer, a green LED wafer and a blue LED wafer; the red LED wafer, the green LED wafer and the blue LED wafer are respectively fixed on the front surface of the red die bonding pad, the front surface of the green die bonding pad and the front surface of the blue die bonding pad, and the red LED wafer, the green LED wafer and the blue LED wafer are positioned on the same straight line; the positive electrode of the red LED wafer, the positive electrode of the green LED wafer and the positive electrode of the blue LED wafer are respectively connected and conducted with the common electrode bonding pad through conductive wires, the negative electrode of the red LED wafer is conducted with the red die bonding pad, the negative electrode of the green LED wafer is conducted with the green die bonding pad, and the negative electrode of the blue LED wafer is conducted with the blue die bonding pad.
2. The anti-train-lighting full-color lamp bead according to claim 1, wherein: the positive electrode and the negative electrode of the red LED wafer are respectively positioned on the front surface and the back surface of the red LED wafer, and the negative electrode of the red LED wafer is welded and connected with the red light die bonding pad or bonded through conductive adhesive.
3. The anti-train-lighting full-color lamp bead according to claim 1, wherein: and the negative electrode of the green LED wafer is connected and conducted with the green die bonding pad through a conductive wire.
4. The anti-train-lighting full-color lamp bead according to claim 1, wherein: and the negative electrode of the blue light LED wafer is connected and conducted with the blue light die bonding pad through a conductive wire.
5. The anti-train-lighting full-color lamp bead according to claim 1, wherein: the adjacent parts of the common electrode bonding pad, the red light die bonding pad, the green light die bonding pad and the blue light die bonding pad of the bonding pad group of the full-color light emitting unit are separated by an insulating lamp bead dam.
6. The anti-train-lighting full-color lamp bead according to claim 5, wherein: and the lamp bead dam protrudes upwards out of the public electrode bonding pad, the red light die bonding pad, the green light die bonding pad and the blue light die bonding pad of the bonding pad group.
7. An anti-train-lighting full-color lamp bead according to claim 5 or 6, wherein: the lamp bead dam and the lamp bead base are integrally formed or are separately arranged and then are fixed into a whole.
8. The anti-train-lighting full-color lamp bead according to claim 1, wherein: and the lamp bead base is combined with the common electrode bonding pad, the red light die bonding pad, the green light die bonding pad and the blue light die bonding pad of the bonding pad group in an encapsulation mode.
9. An anti-train-lighting full-color lamp bead according to claim 1 or 8, wherein: the public electrode bonding pad, the red light die bonding pad, the green light die bonding pad and the blue light die bonding pad of the bonding pad group are respectively bent to form a public electrode welding leg, a red light negative electrode welding leg, a green light negative electrode welding leg and a blue light negative electrode welding leg.
10. An anti-train-lighting full-color lamp bead according to claim 1 or 8, wherein: the lamp bead base forms a light-passing hole, the wafer group of the full-color light-emitting unit is positioned in the light-passing hole, and the light-passing hole is filled with a light-transmitting protective body for covering the wafer group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320470977.4U CN219716888U (en) | 2023-03-13 | 2023-03-13 | Anti-train-lighting full-color lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320470977.4U CN219716888U (en) | 2023-03-13 | 2023-03-13 | Anti-train-lighting full-color lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219716888U true CN219716888U (en) | 2023-09-19 |
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ID=87980899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320470977.4U Active CN219716888U (en) | 2023-03-13 | 2023-03-13 | Anti-train-lighting full-color lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219716888U (en) |
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2023
- 2023-03-13 CN CN202320470977.4U patent/CN219716888U/en active Active
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