CN109600908B - Pcb board targeting system and targeting method - Google Patents
Pcb board targeting system and targeting method Download PDFInfo
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- CN109600908B CN109600908B CN201710923616.XA CN201710923616A CN109600908B CN 109600908 B CN109600908 B CN 109600908B CN 201710923616 A CN201710923616 A CN 201710923616A CN 109600908 B CN109600908 B CN 109600908B
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- positioning
- targeting
- copper foil
- conveying belt
- substrate
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- 230000008685 targeting Effects 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000011889 copper foil Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 238000005553 drilling Methods 0.000 claims abstract description 34
- 238000007731 hot pressing Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Abstract
The invention relates to a pcb board targeting system which is characterized by comprising a control module, a drilling machine, a first manipulator, a conveying mechanism, a positioning device, a second manipulator and a targeting machine, wherein the drilling machine, the first manipulator, the conveying mechanism, the positioning device, the second manipulator and the targeting machine are electrically connected with the control module and are sequentially arranged, a hot press is arranged above the positioning device, the drilling machine comprises a first drilling machine, a second drilling machine and a third drilling machine, the conveying machine is used for conveying a pcb board to the positioning device, the pcb board comprises a substrate, an insulating layer and a copper foil layer, the conveying mechanism comprises a first conveying belt, a second conveying belt and a third conveying belt, the third conveying belt is positioned above the second conveying belt, the second conveying belt is positioned above the first conveying belt, and the first conveying belt, the second conveying belt and the third conveying belt are respectively used for conveying the substrate, the insulating layer and the copper foil layer. The invention omits a manual feeding link and improves the production efficiency.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a pcb targeting system.
Background
The existing pcb shooting machine needs a manhole to control and move the plate needing to be punched when shooting, the plate is manually placed under a camera of the pcb shooting machine, the pcb shooting machine is used for aligning, and the plate needing to be punched is manually prevented from being punched again after the shooting is finished, so that the shooting efficiency of the pcb shooting machine is greatly reduced due to feeding, and the market efficiency of enterprises is reduced.
The existing targeting method is that the pressed plate is sent to a targeting machine, and the targeting machine recognizes a target to perform targeting holes. The precondition of the operation is that the light source of the target shooting machine can penetrate pcb, and along with the development of multifunction, miniaturization and light weight of electronic products, pcb is required to be high-density, high-integration, miniaturization and multilayering, and for a multilayer pcb board with thick copper foil, the light source of the target shooting machine cannot normally penetrate thick copper foil due to certain thickness of the thick copper foil, when the target shooting is carried out, the board material which is shielded by the thick barrel foil displays the image on the display screen to be light-transmitting and fuzzy, and the target shooting machine cannot accurately capture and position, so that the target shooting cannot be carried out.
Disclosure of Invention
Based on the above, a first object of the present invention is to provide a pcb board targeting system, which is characterized by comprising a control module, and a drilling machine, a first manipulator, a transporting mechanism, a positioning device, a second manipulator and a targeting machine which are electrically connected with the control module and are sequentially arranged, wherein a hot press is arranged above the positioning device, the drilling machine comprises a first drilling machine, a second drilling machine and a third drilling machine, the transporting machine is used for transporting the pcb board to the positioning device, the pcb board comprises a substrate, an insulating layer and a copper foil layer, the transporting mechanism comprises a first conveyor belt, a second conveyor belt and a third conveyor belt, the third conveyor belt is positioned above the second conveyor belt, the second conveyor belt is positioned above the first conveyor belt, and the first conveyor belt, the second conveyor belt and the third conveyor belt are respectively used for conveying the substrate, the insulating layer and the copper foil layer.
According to the invention, the first positioning hole, the second positioning hole and the third positioning hole are drilled on the substrate, the insulating layer and the copper foil layer respectively by using the first drilling machine, the second drilling machine and the third drilling machine, wherein the diameters of the first positioning hole and the second positioning hole are consistent; in addition, the first conveying belt, the second conveying belt and the third conveying belt with different heights can ensure that the substrate, the insulating layer and the copper foil layer are overlapped according to the sequence of the substrate, the insulating layer and the copper foil layer from bottom to top, so that the automatic carrying and overlapping of the substrate, the insulating layer and the copper foil layer are realized, and the production efficiency is improved compared with manual carrying.
Preferably, the fixing device comprises a positioning groove and a positioning column arranged in the positioning groove, the positioning column is perpendicular to the bottom surface of the positioning groove, and the size of the positioning groove is matched with the size of the pcb.
The substrate, the insulating layer and the copper foil layer are conveyed into the positioning grooves with the sizes matched with the substrate, the insulating layer and the copper foil layer, so that the alignment of edges of the substrate, the insulating layer and the copper foil layer can be ensured when the substrate, the insulating layer and the copper foil layer are overlapped, and in addition, the substrate, the insulating layer and the copper foil layer can be placed into the positioning grooves only when the positioning columns are inserted into the positioning holes, so that the substrate, the insulating layer and the copper foil layer are prevented from being placed reversely, and the subsequent procedures are influenced.
Further, the positioning column comprises an upper column and a lower column, the central line of the upper column and the central line of the lower column are positioned on the same straight line, the diameter of the upper column is smaller than that of the lower column, the height of the lower column is equal to the sum of the heights of the base plate and the insulating layer, and the height of the upper column is equal to the height of the copper foil layer.
The diameter of the lower cylinder is consistent with that of the first positioning hole, the diameter of the upper cylinder is consistent with that of the third positioning hole, and after the first positioning hole, the second positioning hole and the third positioning hole are sleeved on the positioning column in sequence from bottom to top, the positions of the substrate, the insulating layer and the copper foil layer can be further positioned, so that the edges of the substrate, the insulating layer and the copper foil layer are overlapped.
Further, the positioning device further comprises a vibration mechanism, wherein the vibration mechanism is arranged below the positioning groove and is fixedly connected with the positioning groove, and the vibration mechanism is electrically connected with the control module.
The vibration mechanism can enable the positioning groove to vibrate, so that the substrate, the insulating layer and the copper foil layer which are overlapped are in close contact, and hot pressing and pressing of the hot press are facilitated.
Another object of the present invention is to provide a targeting method of a pcb targeting system, comprising the steps of: .
S1, a first drilling machine, a second drilling machine and a third drilling machine drill a first positioning hole, a second positioning hole and a third positioning hole on a substrate, an insulating layer and a copper foil layer respectively, wherein the diameters of the first positioning hole and the second positioning hole are consistent with the diameter of the lower cylinder, the diameter of the third positioning hole is consistent with the diameter of the upper cylinder, and if the edges of the substrate, the insulating layer and the copper foil layer are aligned and overlapped, the centers of the first positioning hole, the second positioning hole and the third positioning hole on the substrate, the insulating layer and the copper foil layer are positioned on the same vertical straight line;
S2, a first manipulator conveys the substrate, the insulating layer and the copper foil layer to a first conveying belt, a second conveying belt and a third conveying belt respectively;
s3, conveying the substrate, the insulating layer and the copper foil layer into a positioning groove by the first conveying belt, the second conveying belt and the third conveying belt respectively, and superposing the substrate, the insulating layer and the copper foil layer in sequence from bottom to top;
s4, hot-pressing and laminating the superimposed substrate, insulating layer and copper foil layer by using a hot press;
S5, conveying the pcb board subjected to hot pressing to a targeting machine by a second manipulator;
S6, performing targeting by a targeting machine.
Among them, the hot pressing process of the hot press and the targeting process of the targeting machine are conventional means, and thus are not described in detail in the specification.
Preferably, the diameters of the first positioning hole and the second positioning hole are 5mm, and the diameter of the third positioning hole is 2mm.
The principle and effect of the present invention are further described below with reference to the above technical schemes:
according to the invention, the substrate, the insulating layer and the copper foil layer which are drilled with the locating holes by the drilling machine are transported to the locating device through the first conveying device, the second conveying device and the third conveying device respectively, and the substrate, the insulating layer and the copper foil layer are laminated in sequence from bottom to top, so that the step of manual operation is omitted, the production efficiency is improved, and in addition, the locating holes are drilled on the substrate, the insulating layer and the copper foil layer, so that targets behind the copper foil layer are not blocked by the copper foil layer, and the board is accurately located.
Drawings
FIG. 1 is a schematic diagram of a targeting system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a targeting system according to an embodiment of the present invention;
FIG. 3 is an enlarged schematic view of a positioning column according to an embodiment of the present invention;
reference numerals illustrate:
the first drilling machine 11, the second drilling machine 12, the third drilling machine 13, the first manipulator 2, the first conveying belt 31, the second conveying belt 32, the third conveying belt 33, the lower cylinder 411, the upper cylinder 412, the positioning groove 42, the vibration mechanism 43, the hot press 5, the second manipulator 6 and the target machine 7.
Detailed Description
For the convenience of understanding by those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and examples:
1-3, a pcb board targeting system, characterized by comprising a control module and a drilling machine, a first manipulator 2, a conveying mechanism, a positioning device, a second manipulator 6 and a targeting machine 7 which are electrically connected with the control module and sequentially arranged, wherein a hot press 5 is arranged above the positioning device, the drilling machine comprises a first drilling machine 11, a second drilling machine 12 and a third drilling machine 13, the conveying machine is used for conveying pcb boards to the positioning device, the pcb boards comprise a substrate, an insulating layer and a copper foil layer, the conveying mechanism comprises a first conveying belt 31, a second conveying belt 32 and a third conveying belt 33, the third conveying belt 33 is positioned above the second conveying belt 32, the second conveying belt 32 is positioned above the first conveying belt 31, and the first conveying belt 31, the second conveying belt 32 and the third conveying belt 33 are respectively used for conveying the substrate, the insulating layer and the copper foil layer.
In one embodiment, the fixing device includes a positioning slot 42 and a positioning column disposed in the positioning slot 42, the positioning column is perpendicular to the bottom surface of the positioning slot 42, and the size of the positioning slot 42 matches with the size of the pcb.
In one embodiment, the positioning column includes an upper cylinder 412 and a lower cylinder 411, the upper cylinder 412 and the center line of the lower cylinder 411 are located on the same straight line, the diameter of the upper cylinder 412 is smaller than that of the lower cylinder 411, the height of the lower cylinder 411 is equal to the sum of the heights of the substrate and the insulating layer, and the height of the upper cylinder 412 is equal to the height of the copper foil layer.
In one embodiment, the positioning device further includes a vibration mechanism 43, where the vibration mechanism 43 is disposed below the positioning slot 42 and is fixedly connected to the positioning slot 42, and the vibration mechanism 43 is electrically connected to the control module.
Another object of the present invention is to provide a targeting method of a pcb targeting system, comprising the steps of: .
S1, a first drilling machine 11, a second drilling machine 12 and a third drilling machine 13 drill a first positioning hole, a second positioning hole and a third positioning hole on a substrate, an insulating layer and a copper foil layer respectively, wherein the diameters of the first positioning hole and the second positioning hole are consistent with the diameter of the lower cylinder 411, the diameter of the third positioning hole is consistent with the diameter of the upper cylinder 412, and if the edges of the substrate, the insulating layer and the copper foil layer are aligned and overlapped, the centers of the first positioning hole, the second positioning hole and the third positioning hole on the substrate, the insulating layer and the copper foil layer are positioned on the same vertical straight line;
s2, the first manipulator 2 conveys the substrate, the insulating layer and the copper foil layer to a first conveying belt 31, a second conveying belt 32 and a third conveying belt 33 respectively;
s3, conveying the substrate, the insulating layer and the copper foil layer into a positioning groove 42 by a first conveying belt 31, a second conveying belt 32 and a third conveying belt 33 respectively, and superposing the substrate, the insulating layer and the copper foil layer in sequence from bottom to top;
S4, hot pressing and laminating the superimposed substrate, insulating layer and copper foil layer by using a hot press 5;
S5, conveying the pcb board subjected to hot pressing to a targeting machine 7 by a second manipulator 6;
S6, performing targeting by using a targeting machine 7.
In one embodiment, the diameters of the first positioning hole and the second positioning hole are 5mm, and the diameter of the third positioning hole is 2mm.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (3)
1. The pcb board targeting system is characterized by comprising a control module, a drilling machine, a first manipulator, a conveying mechanism, a positioning device, a second manipulator and a targeting machine, wherein the drilling machine, the first manipulator, the conveying mechanism, the positioning device, the second manipulator and the targeting machine are electrically connected with the control module and are sequentially arranged;
the positioning device comprises a positioning groove and a positioning column arranged in the positioning groove, the positioning column is perpendicular to the bottom surface of the positioning groove, and the size of the positioning groove is matched with the size of the pcb;
The positioning column comprises an upper column and a lower column, the central lines of the upper column and the lower column are positioned on the same straight line, the diameter of the upper column is smaller than that of the lower column, the height of the lower column is equal to the sum of the heights of the substrate and the insulating layer, and the height of the upper column is equal to the height of the copper foil layer;
The positioning device further comprises a vibration mechanism, wherein the vibration mechanism is arranged below the positioning groove and is fixedly connected with the positioning groove, and the vibration mechanism is electrically connected with the control module.
2. A targeting method of a pcb targeting system as claimed in claim 1, comprising the steps of:
s1, a first drilling machine, a second drilling machine and a third drilling machine drill a first positioning hole, a second positioning hole and a third positioning hole on a substrate, an insulating layer and a copper foil layer respectively, wherein the diameters of the first positioning hole and the second positioning hole are consistent with the diameter of the lower cylinder, the diameter of the third positioning hole is consistent with the diameter of the upper cylinder, and if the edges of the substrate, the insulating layer and the copper foil layer are aligned and overlapped, the centers of the first positioning hole, the second positioning hole and the third positioning hole on the substrate, the insulating layer and the copper foil layer are positioned on the same vertical straight line;
S2, a first manipulator conveys the substrate, the insulating layer and the copper foil layer to a first conveying belt, a second conveying belt and a third conveying belt respectively;
s3, conveying the substrate, the insulating layer and the copper foil layer into a positioning groove by the first conveying belt, the second conveying belt and the third conveying belt respectively, and superposing the substrate, the insulating layer and the copper foil layer in sequence from bottom to top;
s4, hot-pressing and laminating the superimposed substrate, insulating layer and copper foil layer by using a hot press;
S5, conveying the pcb board subjected to hot pressing to a targeting machine by a second manipulator;
S6, performing targeting by a targeting machine.
3. The method of targeting of claim 2, wherein the first and second locating holes have a diameter of 5mm and the third locating hole has a diameter of 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710923616.XA CN109600908B (en) | 2017-09-30 | Pcb board targeting system and targeting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710923616.XA CN109600908B (en) | 2017-09-30 | Pcb board targeting system and targeting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109600908A CN109600908A (en) | 2019-04-09 |
| CN109600908B true CN109600908B (en) | 2024-06-28 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101649A (en) * | 2015-08-17 | 2015-11-25 | 景旺电子科技(龙川)有限公司 | Multi-layer PCB (Printed Circuit Board) shooting method |
| CN106413290A (en) * | 2016-04-15 | 2017-02-15 | 江阴科利达电子有限公司 | Production technology of high-precision long-life circuit board |
| CN106604551A (en) * | 2016-12-19 | 2017-04-26 | 深圳崇达多层线路板有限公司 | Circuit board production method through automatic pressing and profiling |
| CN207652754U (en) * | 2017-09-30 | 2018-07-24 | 惠州威健电路板实业有限公司 | Pcb plate targeting systems |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101649A (en) * | 2015-08-17 | 2015-11-25 | 景旺电子科技(龙川)有限公司 | Multi-layer PCB (Printed Circuit Board) shooting method |
| CN106413290A (en) * | 2016-04-15 | 2017-02-15 | 江阴科利达电子有限公司 | Production technology of high-precision long-life circuit board |
| CN106604551A (en) * | 2016-12-19 | 2017-04-26 | 深圳崇达多层线路板有限公司 | Circuit board production method through automatic pressing and profiling |
| CN207652754U (en) * | 2017-09-30 | 2018-07-24 | 惠州威健电路板实业有限公司 | Pcb plate targeting systems |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: No. 18, Shihua Avenue West, Xiangshuihe Industrial Park, Daya Bay, Huizhou, Guangdong 516083 Applicant after: Weijian Technology (Huizhou) Co.,Ltd. Address before: No. 18, Shihua Avenue West, Xiangshuihe Industrial Park, Daya Bay, Huizhou, Guangdong 516083 Applicant before: HUIZHOU WEIJIAN CIRCUIT BOARD INDUSTRIAL CO.,LTD. Country or region before: China |
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| GR01 | Patent grant |