JP4069488B2 - Alignment transfer device - Google Patents

Alignment transfer device Download PDF

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Publication number
JP4069488B2
JP4069488B2 JP07751398A JP7751398A JP4069488B2 JP 4069488 B2 JP4069488 B2 JP 4069488B2 JP 07751398 A JP07751398 A JP 07751398A JP 7751398 A JP7751398 A JP 7751398A JP 4069488 B2 JP4069488 B2 JP 4069488B2
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Japan
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mark
inner layer
layer circuit
drilling
ray
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JP07751398A
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JPH11277495A (en
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宏幸 石黒
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は、X線穴あけ装置の所定の位置に内層回路入り積層板を搬送する、位置合わせ搬送装置に関するものである。
【0002】
【従来の技術】
電気・電子機器等に、多層のプリント配線板が使用されている。この多層のプリント配線板は、導体パターンを形成した内層用基板と、熱硬化性樹脂組成物をガラスクロスに含浸したプリプレグとを積み重ね、更にそのプリプレグの最外層に金属箔を配して積層した後、この積層物を加熱・加圧することにより成形して内層回路入り積層板を作製する。
【0003】
次いで、この内層回路入り積層板に、以後の工程で基準となる基準穴を形成した後、この基準穴を用いてドリルマシンにセットして穴あけを行い、次いで、このドリルマシンであけたドリル穴に、内層の導体パターンと外層の金属箔を導通するスルホールメッキ皮膜を形成すると共に、外層の金属箔をエッチングして外層回路を形成する方法により多層のプリント配線板は製造されている。
【0004】
なお、内層用基板の基準穴を形成しようとする位置には、あらかじめ基準マークを形成しておき、成形後、基準マークの位置に基準穴をあけることにより、内層の導体パターンとドリル穴の位置を位置合わせすることが行われている。また、内層回路入り積層板の表裏や左右を間違えないように、図3(a)や(c)に示すように、基準マーク2,2に加えて、内層用基板に方向マーク3をも形成しておき、成形後、方向マーク3の位置に方向穴をあけることにより、穴を非対称にして間違いを防止することが行われている。
【0005】
これらの基準穴や方向穴を形成する方法としては、基準マークや方向マークをX線により透視して穴あけすることが行われており、例えば、特開平5−138503号や特開平7−185999号に記載されたような、所定の位置に内層回路入り積層板を載置した後、内層回路入り積層板に形成された基準マークや方向マークをX線により透視し、次いでこれらの透視した位置と所定の基準位置とのずれを求めた後、この求めたずれに応じて内層回路入り積層板の位置やドリルマシンのドリル位置を調整して、基準マークや方向マークの中心に穴あけする、一般にX線穴あけ装置と呼ばれる装置が用いられている。
【0006】
また、上記のような内層回路入り積層板の位置やドリルマシンのドリル位置を調整するために必要な時間を短縮してX線穴あけ装置の生産性を向上させるために、X線穴あけ装置の所定の位置に内層回路入り積層板を位置合わせしながら搬送し載置する位置合わせ搬送装置を、X線穴あけ装置と組み合わせることも検討されており、例えば、基準マーク2ヶ所をX線により透視した後、この透視した基準マーク2ヶ所の位置と所定の基準位置とのずれに応じて調整することにより、内層回路入り積層板を位置合わせしながらX線穴あけ装置の所定の位置に搬送する位置合わせ搬送装置が用いられている。
【0007】
しかし、上記のような位置合わせ搬送装置を用いた場合であっても、X線穴あけ装置で穴あけが完了するまでにかかる時間は依然として長く、更に生産性が優れた穴あけが可能な穴あけ方法が望まれている。
【0008】
【発明が解決しようとする課題】
本発明は、上記問題点を改善するために成されたもので、その目的とするところは、X線穴あけ装置の所定の位置に、内層回路入り積層板を位置合わせしながら搬送する位置合わせ搬送装置であって、X線穴あけ装置と組み合わせた場合に、X線穴あけ装置で生産性が優れた穴あけが可能となる位置合わせ搬送装置を提供することにある。
【0009】
【課題を解決するための手段】
本発明の請求項1に係る位置合わせ搬送装置は、基準マーク及び方向マークを内層に有する内層回路入り積層板の、方向マークのいずれか1つをX線により透視した後、移動して、基準マークのいずれか1つをX線により透視し、次いで、これらの透視した基準マーク及び方向マークのそれぞれの位置と所定の基準位置とのずれを求める位置ずれ検出手段と、位置ずれ検出手段で求めた方向マークの位置と所定の基準位置とのずれに応じて調整することにより、方向マークの位置に方向穴を穴あけする方向穴あけ手段と、位置ずれ検出手段で求めた基準マーク及び方向マークのそれぞれの位置と所定の基準位置とのずれに応じて調整することにより、内層回路入り積層板を所定の位置に位置合わせしながら搬送する搬送手段と、を備え、基準マークをX線により透視して基準マークの位置に基準穴を穴あけするX線穴あけ装置の、所定の位置に内層回路入り積層板を搬送可能に形成していることを特徴とする。
【0011】
本発明の請求項に係る位置合わせ搬送装置は、請求項記載の位置合わせ搬送装置において、位置ずれ検出手段で基準マーク及び方向マークの位置を求める方法が、透視して得られた基準マーク及び方向マークに対応する画像の、それぞれの重心位置を求める方法であることを特徴とする。
【0012】
本発明に係る位置合わせ搬送装置をX線穴あけ装置と組み合わせると、X線穴あけ装置では、方向マークが形成された部分のX線による透視や方向穴の穴あけが不要となるため、従来の方向穴をも穴あけするX線穴あけ装置の場合と比較して、処理時間を短縮することが可能になる。また、位置合わせ搬送装置では、マーク2ヶ所をX線により透視すると位置合わせしながら搬送することが可能になっているため、X線穴あけ装置で処理するサイクルと略同じサイクルで内層回路入り積層板を供給可能になっており、X線穴あけ装置で処理する時間を短縮させた効果を妨げにくく、生産性が優れた穴あけが可能となる。
【0013】
【発明の実施の形態】
本発明に係る位置合わせ搬送装置を図面に基づいて説明する。図1は本発明に係る位置合わせ搬送装置の一実施の形態を説明する図であり、(a)は平面図、(b)は一部を破断して示した正面図である。図2は本発明に係る位置合わせ搬送装置の一実施の形態の、X線穴あけ装置と組み合わせた状態を説明する平面図である。図3は本発明に係る内層回路入り積層板を説明する図であり、(a)は水平方向に破断して示した平面図、(b)は(a)の鉛直方向に破断して示した正面図、(c)は(a)の変形例である。
【0014】
本発明に係る位置合わせ搬送装置の一実施の形態は、図2に示すような、X線により基準マーク2等を透視する位置ずれ検出手段10と、方向穴8を穴あけする方向穴あけ手段20と、X線穴あけ装置80に内層回路入り積層板1を搬送する搬送手段30と、複数の内層回路入り積層板1・・が積載された積層板準備手段40と、積層板準備手段40に積載された内層回路入り積層板1を1枚ずつ搬送する準備搬送手段50と、を備え、X線穴あけ装置80の所定の位置に、方向穴8を形成した内層回路入り積層板1を、搬送可能に形成している位置合わせ搬送装置である。
【0015】
この位置合わせ搬送装置で搬送する内層回路入り積層板1は、図3(a)及び(b)や、図3(c)に示すように、導体パターン4や基準マーク2,2に加えて、方向マーク3をも有しており、基準マーク2,2の位置に基準穴をあけると共に、方向マーク3の位置に方向穴をあけた場合には、穴が非対称になり、内層回路入り積層板1の表裏や左右を間違えないようになっている。なお基準穴は、以後のプリント配線板の加工工程で基準となる穴であり、例えば、この基準穴を用いてドリルマシンにセットして穴あけを行われる穴であり、一般的には、基準穴間を結んだ線が、内層回路入り積層板1の一辺と平行になるように設けられている。
【0016】
この内層回路入り積層板1は、基準マーク2及び方向マーク3を内層に有するものであれば特に限定するものではなく、例えば、熱硬化性樹脂組成物を硬化させた板や、基材を熱硬化性樹脂組成物で接着した板等の表面に、銅箔等の金属箔を接着した金属箔張り板を用い、その表面の金属箔をエッチングして基準マーク2等を形成したものを内層用基板とし、この内層用基板の片面又は両面に、熱硬化性樹脂組成物を基材に含浸したプリプレグ又は液状の熱硬化性樹脂組成物等を介して銅箔等の金属箔を接着したものである。なお、上記熱硬化性樹脂組成物としては、エポキシ樹脂系、フェノール樹脂系、ポリイミド樹脂系、不飽和ポリエステル樹脂系、ポリフェニレンエーテル樹脂系等の熱硬化性樹脂や、これらの熱硬化性樹脂に無機充填材等を配合したものが挙げられる。また、基材としては、ガラス等の無機質繊維や、ポリエステル、ポリアミド、セルロース等の有機質繊維を用いた、クロス、ペーパー等が挙げられる。
【0017】
なお、図2に示すように、位置合わせ搬送装置と組み合わせるX線穴あけ装置80は、内層回路入り積層板1の内層に形成された基準マーク2をX線により透視して基準マーク2の位置に基準穴を穴あけする装置であり、X線穴あけ装置位置ずれ検出手段82で、2つの基準マーク2,2を順にX線により透視した後、これらの透視した位置と所定の基準位置とのずれを求め、次いで、この求めたずれに応じてX線穴あけ装置基準穴あけ手段84のドリル位置や、内層回路入り積層板1の位置を調整して、基準マーク2,2の中心に穴あけする装置である。なお、予め所定の基準マーク2,2間寸法を設定しておき、X線で透視して求めた基準マーク2,2間寸法が、予め設定された寸法と異なる場合には、この差に応じて基準マーク2,2の中心からずらして穴あけすることにより、基準穴間寸法を予め設定された寸法と一致させるようになっていても良い。
【0018】
位置合わせ搬送装置の積層板準備手段40には、複数の内層回路入り積層板1・・が積載されており、準備搬送手段50は、この積層板準備手段40に積載された内層回路入り積層板1を吸着して、位置ずれ検出手段10が設けられた位置に1枚ずつ搬送するようになっている。
【0019】
この位置ずれ検出手段10は、図1(a)又は(b)に示すように、X線照射部12とX線受光部14と画像処理演算部16とを有しており、X線照射部12からX線を照射すると共に、内層回路入り積層板1内を透過したX線をX線受光部14で受光することにより、内層回路入り積層板1をX線により透視することが可能になっている。
【0020】
そして、このX線照射部12とX線受光部14で、内層回路入り積層板1の内層に形成された方向マーク3のうち、いずれか1つが形成された部分をX線により透視する。次いで、基準マーク2のうち、いずれか1つが形成された部分にX線照射部12とX線受光部14が移動して、その基準マーク2をX線により透視する。次いで、画像処理演算部16で、これらの透視した基準マーク2及び方向マーク3のそれぞれの位置と所定の基準位置とのずれを求めるようになっている。なお、X線により透視する基準マーク2が、方向マーク3に近い位置の方向マーク3の場合、X線照射部12やX線受光部14が移動する時間が短くなるため、処理サイクルが短くなり、また、方向マーク3から遠い位置の方向マーク3の場合、内層回路入り積層板1のずれを検出する精度が向上する。なお、内層回路入り積層板1に方向マーク3が1つしか形成されていない場合には、その1つをX線により透視する。
【0021】
画像処理演算部16で、基準マーク2及び方向マーク3の位置を求める方法としては、透視して得られた基準マーク2及び方向マーク3に対応する画像の、それぞれの重心位置を求める方法や、透視して得られた基準マーク2及び方向マーク3に対応する画像の、それぞれの輪郭を検出してその中心を求める方法等が挙げられる。なお、重心位置を求める方法の場合、基準マーク2や方向マーク3を形成するときに欠け等が生じて多少形状が変形していても、その変形の影響を小さく抑えることが可能なため、求める位置の精度が優れ好ましい。
【0022】
なお、基準マーク2や方向マーク3をX線により透視した場合、内層に金属箔の有る部分は金属箔の無い部分と比較してX線が透過しにくくなるため、これらの間の画像に濃淡が生じ、画像処理演算部16でこの濃淡を画像処理することにより、基準マーク2や方向マーク3の中心位置を求めることが可能になっている。
【0023】
また、方向穴あけ手段20は、縦方向、横方向自在に移動することが可能に形成されており、内層回路入り積層板1の方向マーク3が形成された部分を位置ずれ検出手段10が透視するときには、方向マーク3が形成された部分からずれた位置に待機している。そして、画像処理演算部16で方向マーク3の位置と所定の基準位置とのずれを求めた後、この求めたずれの大きさや方向等に応じて調整しながら移動して、方向マーク3の中心に方向穴を穴あけするようになっている。
【0024】
また、搬送手段30には、内層回路入り積層板1を吸着可能な回転部32と、この回転部32を支持する軸部34を有しており、軸部34が縦方向及び横方向に自在に移動することが可能に形成されていると共に、回転部32が軸部34に対して回転自在に形成されている。そのため、内層回路入り積層板1を、縦方向、横方向、回転方向自在に動かしながら、搬送することが可能に形成されている。
【0025】
そして、この搬送手段30は、内層回路入り積層板1の方向マーク3や基準マーク2が形成された部分を位置ずれ検出手段10が透視するときには、方向マーク3や基準マーク2が形成された部分からずれた位置に待機しており、画像処理演算部16で、方向マーク3や基準マーク2の位置と所定の基準位置とのずれを求めると共に、この両者のずれを演算して方向マーク3側と基準マーク2側にずれを振り分けた後、この振り分けたずれの大きさや角度等に応じて移動距離や方向を調整することにより、内層回路入り積層板1をX線穴あけ装置80の所定の位置に位置合わせしながら搬送するようになっている。
【0027】
発明に係る位置合わせ搬送装置をX線穴あけ装置と組み合わせると、X線穴あけ装置では、方向マーク3が形成された部分のX線による透視や方向穴の穴あけが不要となるため、従来の方向穴をも穴あけするX線穴あけ装置の場合と比較して、1枚の内層回路入り積層板1を処理する時間を短縮することが可能になる。なお、2つの基準穴を穴あけする場合のように、処理時間が短い基準穴数の場合には、位置合わせ搬送装置からX線穴あけ装置に内層回路入り積層板1を供給するサイクルが律速となる場合があるが、位置合わせ搬送装置では、マーク2ヶ所をX線により透視すると位置合わせしながら搬送することが可能なため、X線穴あけ装置で処理するサイクルと略同じサイクルで供給可能になっており、X線穴あけ装置で処理する時間を短縮させた効果を妨げにくく、生産性が優れた穴あけが可能となる。
【0028】
なお、方向穴あけ手段20で方向マーク3の位置に方向穴を穴あけするタイミングは、位置ずれ検出手段10で方向マーク3をX線により透視してから、基準マーク2及び方向マーク3のそれぞれの位置と所定の基準位置とのずれを求めるまでの間に限定するものではなく、基準マーク2及び方向マーク3のそれぞれの位置と所定の基準位置とのずれを求めた時点から多少遅れても、X線穴あけ装置では、方向マーク3が形成された部分のX線による透視が不要となるため、生産性が優れた穴あけが可能となる。なお、上記間のタイミングで穴あけすると、特にX線穴あけ装置で生産性が優れた穴あけが可能となり好ましい。
【0029】
【発明の効果】
本発明に係る位置合わせ搬送装置をX線穴あけ装置と組み合わせると、X線穴あけ装置では方向マークが形成された部分のX線による透視が不要となるため、X線穴あけ装置で生産性が優れた穴あけが可能となる。
【図面の簡単な説明】
【図1】本発明に係る位置合わせ搬送装置の一実施の形態を説明する図であり、(a)は平面図、(b)は一部を破断して示した正面図である。
【図2】本発明に係る位置合わせ搬送装置の一実施の形態の、X線穴あけ装置と組み合わせた状態を説明する平面図である。
【図3】本発明に係る内層回路入り積層板を説明する図であり、(a)は水平方向に破断して示した平面図、(b)は(a)の鉛直方向に破断して示した正面図、(c)は(a)の変形例である。
【符号の説明】
1 内層回路入り積層板
2 基準マーク
3 方向マーク
4 導体パターン
8 方向穴
10 位置ずれ検出手段
12 X線照射部
14 X線受光部
16 画像処理演算部
20 方向穴あけ手段
30 搬送手段
32 回転部
34 軸部
40 積層板準備手段
50 準備搬送手段
80 X線穴あけ装置
82 X線穴あけ装置位置ずれ検出手段
84 X線穴あけ装置基準穴あけ手段
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an alignment transport device that transports a laminated board with an inner layer circuit to a predetermined position of an X-ray drilling device.
[0002]
[Prior art]
Multilayer printed wiring boards are used in electrical and electronic equipment. This multilayer printed wiring board is formed by stacking an inner layer substrate on which a conductor pattern is formed and a prepreg impregnated with a glass cloth with a thermosetting resin composition, and further arranging a metal foil on the outermost layer of the prepreg. Thereafter, this laminate is heated and pressed to form a laminate containing an inner layer circuit.
[0003]
Next, after forming a reference hole to be a reference in the subsequent process on the laminated board with the inner layer circuit, it is set in a drill machine using this reference hole, and then drilled. In addition, a multilayer printed wiring board is manufactured by a method of forming a through-hole plating film for conducting an inner layer conductor pattern and an outer layer metal foil, and etching the outer layer metal foil to form an outer layer circuit.
[0004]
In addition, by forming a reference mark in advance at the position where the reference hole of the inner layer substrate is to be formed, and forming a reference hole at the position of the reference mark after molding, the position of the inner layer conductor pattern and the drill hole The alignment is done. In addition to the reference marks 2 and 2, the direction mark 3 is also formed on the inner layer substrate as shown in FIGS. 3A and 3C so that the front, back, left and right sides of the laminated board with the inner layer circuit are not mistaken. In addition, after forming, by making a direction hole at the position of the direction mark 3, the hole is made asymmetric to prevent mistakes.
[0005]
As a method of forming these reference holes and direction holes, drilling is performed by seeing through the reference marks and direction marks with X-rays. For example, Japanese Patent Laid-Open Nos. 5-138503 and 7-185999 are disclosed. After placing the laminated board with the inner layer circuit at a predetermined position as described in the above, the reference mark and the direction mark formed on the laminated board with the inner layer circuit are fluoroscopically seen through X-rays, and then these fluoroscopic positions and After obtaining the deviation from the predetermined reference position, adjust the position of the laminated board with the inner layer circuit and the drill position of the drill machine according to the obtained deviation, and drill a hole at the center of the reference mark or direction mark. A device called a wire drilling device is used.
[0006]
Further, in order to shorten the time required for adjusting the position of the laminated board with the inner layer circuit as described above and the drill position of the drill machine and improve the productivity of the X-ray drilling apparatus, a predetermined X-ray drilling apparatus is used. It is also being considered to combine an alignment transport device that transports and places the laminated board with the inner layer circuit at the position of X2 with an X-ray drilling device. For example, after seeing two reference marks through X-rays Alignment conveyance that conveys the laminated board with the inner layer circuit to a predetermined position while aligning the laminated board with the inner layer circuit by adjusting according to the deviation between the position of the two transparent reference marks and the predetermined reference position. The device is used.
[0007]
However, even when using the above-mentioned alignment transport device, it still takes a long time to complete the drilling with the X-ray drilling device, and a drilling method capable of drilling with higher productivity is desired. It is rare.
[0008]
[Problems to be solved by the invention]
The present invention has been made to remedy the above problems, and its purpose is to align and convey the laminated board containing the inner layer circuit to a predetermined position of the X-ray drilling device. It is an apparatus, and it is an object of the present invention to provide an alignment transport device that can perform drilling with excellent productivity when used in combination with an X-ray drilling device.
[0009]
[Means for Solving the Problems]
The alignment conveying apparatus according to claim 1 of the present invention moves after seeing through any one of the direction marks of the laminated board with the inner layer circuit having the reference mark and the direction mark in the inner layer by X-ray, Any one of the marks is seen through with X-rays, and then the position deviation detecting means for obtaining the deviation between the position of each of the seen reference marks and direction marks and the predetermined reference position, and the position deviation detecting means. By adjusting according to the deviation between the position of the direction mark and the predetermined reference position, each of the direction mark making means for making a direction hole at the position of the direction mark, and the reference mark and the direction mark obtained by the position deviation detection means And a conveying means for conveying the laminated board with the inner layer circuit while aligning it at a predetermined position by adjusting according to the deviation between the position of the inner layer and the predetermined reference position. X-ray drilling apparatus for drilling a reference hole of over click the position of the reference mark by fluoroscopy by X-ray, characterized in that it is transportable form an inner layer circuit containing laminate in place.
[0011]
According to a second aspect of the present invention, there is provided the alignment conveying device according to the first aspect , wherein the method of obtaining the position of the reference mark and the direction mark by the misalignment detecting means is obtained by seeing through. And, it is a method for obtaining respective gravity center positions of images corresponding to the direction marks.
[0012]
When the alignment transport device according to the present invention is combined with an X-ray drilling device, the X-ray drilling device eliminates the need for X-ray fluoroscopy and direction hole drilling of the portion where the direction mark is formed. Compared to the case of an X-ray drilling apparatus that also drills a hole, the processing time can be shortened. Moreover, in the alignment transport device, if the two marks are seen through with X-rays, it can be transported while being aligned. Therefore, the laminated board with an inner layer circuit in substantially the same cycle as that processed by the X-ray drilling device. Can be supplied, and it is difficult to hinder the effect of shortening the processing time by the X-ray drilling apparatus, and drilling with excellent productivity becomes possible.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
An alignment conveyance device according to the present invention will be described with reference to the drawings. 1A and 1B are diagrams for explaining an embodiment of an alignment conveyance device according to the present invention, in which FIG. 1A is a plan view and FIG. FIG. 2 is a plan view for explaining a state in which the alignment conveying apparatus according to an embodiment of the present invention is combined with an X-ray drilling apparatus. FIGS. 3A and 3B are diagrams for explaining a laminated board with an inner layer circuit according to the present invention, in which FIG. 3A is a plan view broken in the horizontal direction, and FIG. 3B is broken in the vertical direction of FIG. Front view, (c) is a variation of (a).
[0014]
As shown in FIG. 2, an embodiment of the alignment transport device according to the present invention includes a misregistration detection means 10 for seeing through the reference mark 2 and the like by X-rays, and a direction punching means 20 for punching the direction hole 8. , A conveying means 30 for conveying the laminated board 1 with the inner layer circuit to the X-ray punching device 80, a laminated board preparing means 40 on which a plurality of laminated boards 1 with inner circuit are stacked, and a laminated board preparing means 40. Preparation means 50 for conveying the laminated board 1 with the inner layer circuit one by one so that the laminated board 1 with the inner layer circuit in which the directional hole 8 is formed at a predetermined position of the X-ray drilling device 80 can be conveyed. It is the alignment conveyance apparatus currently formed.
[0015]
As shown in FIGS. 3 (a) and 3 (b) and FIG. 3 (c), in addition to the conductor pattern 4 and the reference marks 2 and 2, the laminated board 1 with the inner layer circuit transported by this alignment transport device, It also has a direction mark 3, and when a reference hole is made at the position of the reference mark 2, 2 and a direction hole is made at the position of the direction mark 3, the hole becomes asymmetrical, and the laminated board with the inner layer circuit The front and back of 1 and the right and left are not mistaken. The reference hole is a hole to be used as a reference in the subsequent processing process of the printed wiring board. For example, the reference hole is a hole that is set in a drill machine using the reference hole, and is generally a reference hole. A line connecting them is provided so as to be parallel to one side of the laminated board 1 with the inner layer circuit.
[0016]
The laminated board 1 with the inner layer circuit is not particularly limited as long as it has the reference mark 2 and the direction mark 3 in the inner layer. For example, a board obtained by curing a thermosetting resin composition or a substrate is heated. For the inner layer, a metal foil-clad plate in which a metal foil such as a copper foil is bonded to the surface of a plate or the like bonded with a curable resin composition is used, and the reference mark 2 or the like is formed by etching the metal foil on the surface. A substrate and a metal foil such as a copper foil adhered to one or both sides of the inner layer substrate via a prepreg impregnated with a thermosetting resin composition or a liquid thermosetting resin composition. is there. In addition, as said thermosetting resin composition, an epoxy resin type, a phenol resin type, a polyimide resin type, an unsaturated polyester resin type, a polyphenylene ether resin type, etc., and these thermosetting resins are inorganic. The thing which mix | blended the filler etc. is mentioned. Moreover, as a base material, cloth, paper, etc. using inorganic fibers, such as glass, and organic fibers, such as polyester, polyamide, and cellulose, are mentioned.
[0017]
As shown in FIG. 2, the X-ray drilling device 80 combined with the alignment conveying device is made to pass through the reference mark 2 formed on the inner layer of the laminated board 1 with the inner layer circuit through the X-ray, and to the position of the reference mark 2. This is a device for drilling a reference hole. After the two reference marks 2 and 2 are sequentially seen through X-rays by the X-ray drilling device position deviation detecting means 82, the deviation between the see-through position and a predetermined reference position is detected. Then, according to the obtained deviation, the drill position of the X-ray drilling apparatus reference drilling means 84 and the position of the laminated board 1 with the inner layer circuit are adjusted to drill the center of the reference marks 2 and 2. . It should be noted that a predetermined dimension between the reference marks 2 and 2 is set in advance, and if the dimension between the reference marks 2 and 2 obtained through fluoroscopy is different from a predetermined dimension, the difference is determined. Thus, by drilling the holes by shifting from the center of the reference marks 2 and 2, the dimension between the reference holes may be made to coincide with a preset dimension.
[0018]
The laminated plate preparing means 40 of the alignment conveying device is loaded with a plurality of laminated plates 1 with inner layer circuits, and the prepared conveying means 50 is a laminated plate with inner layer circuits loaded on the laminated plate preparing means 40. 1 is sucked and conveyed one by one to the position where the position deviation detecting means 10 is provided.
[0019]
As shown in FIG. 1 (a) or (b), the misregistration detection means 10 includes an X-ray irradiation unit 12, an X-ray light receiving unit 14, and an image processing calculation unit 16, and the X-ray irradiation unit. 12, and X-rays that have passed through the inner layer circuit-containing laminate 1 are received by the X-ray light receiving unit 14, so that the inner layer circuit-containing laminate 1 can be seen through with X-rays. ing.
[0020]
Then, the X-ray irradiation unit 12 and the X-ray light-receiving unit 14 see through the portion where any one of the direction marks 3 formed on the inner layer of the laminated board 1 with the inner layer circuit is formed by X-rays. Next, the X-ray irradiation unit 12 and the X-ray light receiving unit 14 move to a portion where any one of the reference marks 2 is formed, and the reference mark 2 is seen through with X-rays. Next, the image processing calculation unit 16 obtains a deviation between the position of each of the see-through reference mark 2 and the direction mark 3 and a predetermined reference position. In addition, when the reference mark 2 seen through with the X-ray is the direction mark 3 at a position close to the direction mark 3, the time required for the X-ray irradiation unit 12 and the X-ray light receiving unit 14 to move is shortened, so the processing cycle is shortened. In the case of the direction mark 3 at a position far from the direction mark 3, the accuracy of detecting the displacement of the laminated board 1 with the inner layer circuit is improved. In addition, when only one direction mark 3 is formed on the laminated board 1 with the inner layer circuit, one of them is seen through with X-rays.
[0021]
As a method for obtaining the positions of the reference mark 2 and the direction mark 3 in the image processing calculation unit 16, a method for obtaining the respective gravity center positions of the images corresponding to the reference mark 2 and the direction mark 3 obtained through fluoroscopy, For example, a method of detecting the respective contours of the images corresponding to the reference mark 2 and the direction mark 3 obtained by fluoroscopy and obtaining the center thereof may be used. In the case of the method for obtaining the position of the center of gravity, even if the reference mark 2 or the direction mark 3 is formed, even if a chip or the like is generated and the shape is somewhat deformed, the influence of the deformation can be suppressed to a small value. The position accuracy is excellent and preferable.
[0022]
In addition, when the reference mark 2 and the direction mark 3 are seen through with X-rays, the portion with the metal foil in the inner layer is less likely to transmit X-rays compared with the portion without the metal foil. Thus, the image processing calculation unit 16 performs image processing on the shading, whereby the center positions of the reference mark 2 and the direction mark 3 can be obtained.
[0023]
Further, the direction punching means 20 is formed so as to be movable in the vertical direction and the horizontal direction, and the misalignment detection means 10 sees through the portion where the direction mark 3 of the laminated board 1 with the inner layer circuit is formed. Sometimes, it stands by at a position shifted from the portion where the direction mark 3 is formed. Then, after obtaining the deviation between the position of the direction mark 3 and the predetermined reference position by the image processing calculation unit 16, it moves while adjusting according to the magnitude and direction of the obtained deviation and the center of the direction mark 3. It is designed to make a directional hole.
[0024]
Further, the conveying means 30 has a rotating part 32 capable of attracting the laminated board 1 with the inner layer circuit and a shaft part 34 for supporting the rotating part 32, and the shaft part 34 is freely movable in the vertical direction and the horizontal direction. The rotary part 32 is formed so as to be rotatable with respect to the shaft part 34. Therefore, the laminated board 1 with the inner layer circuit is formed so as to be able to be conveyed while moving freely in the vertical direction, the horizontal direction, and the rotation direction.
[0025]
And this conveyance means 30 is the part in which the direction mark 3 or the reference mark 2 is formed when the position deviation detection means 10 sees through the part in which the direction mark 3 or the reference mark 2 of the laminated board 1 with the inner layer circuit is formed. The image processing calculation unit 16 obtains a shift between the position of the direction mark 3 or the reference mark 2 and a predetermined reference position, and calculates the shift between the two to calculate the direction mark 3 side. And the reference mark 2 side, and by adjusting the moving distance and direction according to the size and angle of the distributed deviation, the laminated circuit board 1 with the inner layer circuit is placed at a predetermined position of the X-ray drilling device 80. It is designed to be transported while being aligned with.
[0027]
When the alignment conveyance device according to the present invention is combined with an X-ray drilling device, the X-ray drilling device does not require X-ray fluoroscopy or direction hole drilling of the portion where the direction mark 3 is formed. as compared with the case of X-ray drilling apparatus for drilling well a hole, it is possible to shorten the time to process one of the inner layer circuit containing laminate 1. In the case where the number of reference holes is short, such as when two reference holes are drilled, the cycle of supplying the laminated board 1 with the inner layer circuit from the alignment conveying device to the X-ray drilling device is rate-limiting. In some cases, the alignment transport device can be transported while aligning when the two marks are seen through X-rays, so that it can be supplied in substantially the same cycle as the cycle processed by the X-ray drilling device. Therefore, it is difficult to hinder the effect of shortening the processing time with the X-ray drilling apparatus, and drilling with excellent productivity becomes possible.
[0028]
In addition, the timing of making the direction hole at the position of the direction mark 3 by the direction hole punching means 20 is the position of each of the reference mark 2 and the direction mark 3 after the direction mark 3 is seen through X-rays by the position deviation detection means 10. Is not limited to the time until the deviation between the reference mark 2 and the predetermined reference position is obtained, and even if there is a slight delay from the time when the deviation between the respective positions of the reference mark 2 and the direction mark 3 and the predetermined reference position is obtained, In the line drilling device, the X-ray fluoroscopy of the portion where the direction mark 3 is formed becomes unnecessary, so that it is possible to perform drilling with excellent productivity. In addition, it is preferable to perform drilling at the timing between the above, because it is possible to perform drilling with excellent productivity, particularly with an X-ray drilling apparatus.
[0029]
【The invention's effect】
When the alignment conveyance device according to the present invention is combined with an X-ray drilling device, the X-ray drilling device eliminates the need for X-ray fluoroscopy of the portion where the direction mark is formed. Drilling is possible.
[Brief description of the drawings]
1A and 1B are diagrams for explaining an embodiment of an alignment conveyance device according to the present invention, in which FIG. 1A is a plan view and FIG.
FIG. 2 is a plan view for explaining a state in which the alignment conveying apparatus according to an embodiment of the present invention is combined with an X-ray drilling apparatus.
FIGS. 3A and 3B are diagrams illustrating a laminated board with an inner layer circuit according to the present invention, in which FIG. 3A is a plan view broken away in the horizontal direction, and FIG. 3B is broken away in the vertical direction of FIG. (C) is a modified example of (a).
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Laminate board with inner layer circuit 2 Reference mark 3 Direction mark 4 Conductor pattern 8 Direction hole 10 Position shift detection means 12 X-ray irradiation part 14 X-ray light reception part 16 Image processing calculation part 20 Direction punching means 30 Conveyance means 32 Rotation part 34 Axis Unit 40 Laminate plate preparation means 50 Preparation conveyance means 80 X-ray drilling device 82 X-ray drilling device position deviation detection means 84 X-ray drilling device reference drilling means

Claims (2)

基準マーク及び方向マークを内層に有する内層回路入り積層板の、方向マークのいずれか1つをX線により透視した後、移動して、基準マークのいずれか1つをX線により透視し、次いで、これらの透視した基準マーク及び方向マークのそれぞれの位置と所定の基準位置とのずれを求める位置ずれ検出手段と、位置ずれ検出手段で求めた方向マークの位置と所定の基準位置とのずれに応じて調整することにより、方向マークの位置に方向穴を穴あけする方向穴あけ手段と、位置ずれ検出手段で求めた基準マーク及び方向マークのそれぞれの位置と所定の基準位置とのずれに応じて調整することにより、内層回路入り積層板を所定の位置に位置合わせしながら搬送する搬送手段と、を備え、基準マークをX線により透視して基準マークの位置に基準穴を穴あけするX線穴あけ装置の、所定の位置に内層回路入り積層板を搬送可能に形成していることを特徴とする内層回路入り積層板の位置合わせ搬送装置。  The laminated board with the inner layer circuit having the reference mark and the direction mark in the inner layer, after seeing through any one of the direction marks with X-rays, moving, see through any one of the reference marks with X-rays, The positional deviation detection means for obtaining the deviation between the respective positions of the fluoroscopic reference mark and the direction mark and the predetermined reference position, and the deviation between the position of the direction mark obtained by the positional deviation detection means and the predetermined reference position. Adjust according to the deviation between the predetermined reference position and the direction hole drilling means for drilling the direction hole at the position of the direction mark, and the reference mark and the direction mark obtained by the position deviation detection means. And a conveying means for conveying the laminated board with the inner layer circuit while aligning it at a predetermined position. X-ray drilling apparatus for drilling a quasi hole, registration transport device of the inner layer circuit containing laminate characterized in that it is transportable form an inner layer circuit containing laminate in place. 位置ずれ検出手段で基準マーク及び方向マークの位置を求める方法が、透視して得られた基準マーク及び方向マークに対応する画像の、それぞれの重心位置を求める方法であることを特徴とする請求項記載の位置合わせ搬送装置。The method of obtaining the positions of the reference mark and the direction mark by the misalignment detection means is a method of obtaining respective gravity center positions of images corresponding to the reference mark and the direction mark obtained through fluoroscopy. 1. The alignment conveyance device according to 1 .
JP07751398A 1998-03-25 1998-03-25 Alignment transfer device Expired - Fee Related JP4069488B2 (en)

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US7677602B2 (en) 2001-02-06 2010-03-16 Swagelok Company Tube fitting
US7695027B2 (en) 2004-04-22 2010-04-13 Swagelok Company Fitting for tube and pipe
US7762592B2 (en) 2001-02-06 2010-07-27 Swagelok Company Tube fitting for stainless steel tubing
US7815226B2 (en) 2001-02-06 2010-10-19 Swagelok Company Fitting for metal pipe and tubing
US8038180B2 (en) 2004-04-22 2011-10-18 Swagelok Company Fitting with taper and single ferrule
US10215315B2 (en) 2008-09-05 2019-02-26 Parker-Hannifin Corporation Tube compression fitting and flared fitting used with connection body and method of making same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7677602B2 (en) 2001-02-06 2010-03-16 Swagelok Company Tube fitting
US7740283B2 (en) 2001-02-06 2010-06-22 Swagelok Company Tube fitting with separable tube gripping device
US7762592B2 (en) 2001-02-06 2010-07-27 Swagelok Company Tube fitting for stainless steel tubing
US7815226B2 (en) 2001-02-06 2010-10-19 Swagelok Company Fitting for metal pipe and tubing
US7695027B2 (en) 2004-04-22 2010-04-13 Swagelok Company Fitting for tube and pipe
US8038180B2 (en) 2004-04-22 2011-10-18 Swagelok Company Fitting with taper and single ferrule
US10215315B2 (en) 2008-09-05 2019-02-26 Parker-Hannifin Corporation Tube compression fitting and flared fitting used with connection body and method of making same

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