JPH11340638A - Method for cutting multilayer board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting method superior in cutting position accuracy in the cutting method of a multilayer board for cutting each part corresponding to an individual interlayer substrate, by viewing cutting guide marks G by X-rays and positioning a multilayer board manufactured by means of arranging the inner layer substrates. SOLUTION: Two cutting guide marks G installed in inner layer substrates 10a and 10b are viewed for the respective inner layer substrates 10a and 10b by X-rays 36. The end side of the side of a direction A, where the inner layer substrates 10a and 10b are arranged, is cut by a cutting device 30, while the cutting angles of the cutting device 30 are adjusted for the respective inner layer substrates 10a and 10b, in accordance with an angle difference between a direction connecting the two viewed cutting guide marks G for respective inner layer substrates 10a and 10b and a prescribed direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a multilayer board used for manufacturing a printed wiring board.

[0002]

2. Description of the Related Art Multilayer boards are used for manufacturing printed wiring boards used for electric and electronic equipment. This multilayer board is formed by stacking an adhesive sheet in the form of a sheet by impregnating a base material with a thermosetting resin composition called a prepreg on the front and back of an inner layer substrate on which a conductive circuit is formed, and further applying metal foil on both outer sides thereof. After arranging and stacking to form a body to be pressed, the body to be pressed is sandwiched between flat plates, further sandwiched between forming presses, and heated and pressed to be integrated to be manufactured.

[0003] The prepreg has a considerably large amount of resin compared to a generally required amount of resin so that irregularities between conductor circuits of various shapes, from high to low, can be filled. Large quantities are used. For this reason, a portion where the resin flows out and is hardened is formed around the multilayer board obtained by heating and pressurizing to be integrated. In addition, since this part becomes an obstacle in the manufacturing process of the printed wiring board, the multilayer board is cut so as to have a size substantially corresponding to the substrate for the inner layer by cutting off the hardened part where the resin has flowed out, It is used in the manufacturing process of printed wiring boards.

[0004] As a method of cutting off the hardened portion of the resin formed around the multilayer board by flowing out, for example, as described in Japanese Patent Application Laid-Open No. 2-146795, two cuttings are previously formed on an inner layer substrate. A guide mark is provided, and after the guide mark for cutting the multilayer board is seen through X-rays, the multilayer board is moved according to the information that has been seen through, so that the multilayer board can be moved to a fixedly provided cutting device. Positioning and cutting methods have been used.

In order to improve the productivity, as shown in FIG. 6 (a), a plurality of inner layer substrates 10a, 10b,... Are arranged side by side in the horizontal direction,
A metal foil 14 having a size such that the entire prepreg 12 is covered is disposed on both outer sides of the metal foil 14, and the metal foil 14 is sandwiched between flat plates 16 having a size corresponding to the size of the metal foil 14. Plate 1 of forming press of size corresponding to
There is also a method in which a large number of multilayer boards are obtained at one time by heating and pressurizing the multilayer board between the sheets.

When a multilayer board is manufactured by sandwiching a plurality of inner layer substrates 10a, 10b,... In a horizontal direction between the prepregs 12, when the resin of the prepreg 12 flows by heating and pressing, The substrates 10a, 10b,... Also move, and as shown in FIG.
In some cases, a shift occurred between b. When this displacement occurs, only two cutting guide marks G are seen through the entire multi-layer board 20 as described in the above-mentioned Japanese Patent Application Laid-Open No. 2-146795, and the individual inner layer substrates 10a and 10
In the method of cutting corresponding to b .., there is a problem that cutting is performed at an incorrect position, and the yield of the obtained multilayer board is low.

Therefore, as described in JP-A-4-260393, each of the inner layer substrates 10
a, 10b... are provided with two cutting guide marks G, and the two cutting guide marks G provided on each inner layer substrate 10a, 10b. , 10b,..., Respectively, the multilayer board 20 is mounted and held on a rotary table, and then rotated according to the positions of the two cutting guide marks G for each of the see-through inner layer substrates 10a, 10b,. By controlling the rotation angle of the table and moving the multilayer board 20 for each portion corresponding to each of the inner layer substrates 10a, 10b,..., The multilayer board 20 is positioned with respect to the fixedly provided cutting device. , A method of cutting to correspond to the individual inner layer substrates 10a, 10b,.

However, even in the case of cutting by controlling the rotation angle of the turntable for each portion corresponding to each inner layer substrate, the cutting position may be shifted. In addition, there is a need for a method of cutting a multilayer board having an excellent cutting position accuracy.

[0009]

DISCLOSURE OF THE INVENTION The present invention has been made to improve the above problems, and an object of the present invention is to provide a prepreg comprising a thermosetting resin composition and a base material. A multi-layer board obtained by heating and pressing after sandwiching a plurality of inner layer substrates provided with cutting guide marks in a horizontal direction and stacking them so that metal foil is disposed on both surface layers of the sandwiched ones Is a cutting method of a multilayer board, in which the cutting guide mark is positioned by seeing through X-rays, and cut by a cutting device for each portion corresponding to an individual inner layer substrate. It is to provide a method.

[0010]

According to a first aspect of the present invention, there is provided a method of cutting a multilayer board, comprising a plurality of cutting guide marks provided between a prepreg comprising a thermosetting resin composition and a base material. The substrates for the inner layer are horizontally arranged and sandwiched, and the sandwiched ones are stacked so that the metal foil is arranged on both surface layers. In the method of cutting a multilayer board, which is cut by a cutting device for each portion corresponding to an individual inner layer substrate by positioning through see-through, the multilayer board is cut by a cutting device for each portion corresponding to an individual inner layer substrate. The method is such that, while advancing the multilayer board in a direction in which the inner layer substrates are arranged, two cutting guide marks provided on each inner layer substrate are respectively seen through each inner layer substrate by X-rays, and then each of the seen through marks is seen. 2 per substrate for inner layer Adjusting the cutting angle of the first cutting device for each inner layer substrate according to the angle difference between the direction connecting the cutting guide marks and the predetermined direction, and moving the multilayer board in the direction in which the inner layer substrates are arranged. A method of cutting an end in the direction in which the inner-layer substrates are arranged for each inner-layer substrate with a first cutting device, and then cutting the remaining end to cut each part corresponding to an individual inner-layer substrate. It is characterized by being.

According to a second aspect of the present invention, there is provided a method of cutting a multilayer board according to the first aspect of the present invention, wherein the method of cutting the remaining edge is such that the multilayer board is stacked and held on a rotary table. After that, by controlling the rotation angle of the rotary table according to the size of the cutting angle adjusted by the first cutting device to move the multilayer plate, the multilayer plate remains with respect to the fixedly provided second cutting device. The method is characterized in that the edge is positioned, then the multilayer board is advanced in the direction in which the inner layer substrates are arranged, and the remaining edge is cut by the second cutting device.

According to a third aspect of the present invention, in the method for cutting a multilayer board according to the second aspect, the method for advancing the multilayer board in the direction in which the substrates for the inner layers are arranged includes: On the imaginary line that passes through the center of rotation and extends in the direction in which the inner layer substrates that advance the multilayer board are arranged, the midpoint of the line connecting the two cutting guide marks for each of the inner layer substrates as seen through is arranged. The method is characterized in that, while adjusting the position of the multilayer board in a direction orthogonal to the direction in which the inner layer substrates are arranged, the multilayer board is advanced in the direction in which the inner layer substrates are arranged.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for cutting a multilayer board according to the present invention will be described with reference to the drawings. FIG. 1 is a plan view for explaining one embodiment of a method for cutting a multilayer board according to the present invention, and FIG.
FIG. 3 is a perspective view illustrating an embodiment of the method for cutting a multilayer board according to the present invention, and FIG. 3 is a plan view illustrating main parts of the embodiment of the method for cutting a multilayer board according to the present invention. is there. FIG. 4 is a plan view illustrating another embodiment of the method for cutting a multilayer board according to the present invention. FIG. 5 is a plan view illustrating still another embodiment of the method for cutting a multilayer board according to the present invention. It is a principal part top view explaining. 6A and 6B are views for explaining the multilayer board according to the present invention, wherein FIG. 6A is a cross-sectional view and FIG. 6B is a plan view.

As shown in FIG. 6 (a), one embodiment of the method for cutting a multilayer board according to the present invention comprises three inner layer substrates 1 provided with cutting guide marks G between prepregs 12.
.. Are arranged side by side in the horizontal direction, and the object to be crimped so that the metal foil 14 is arranged on both surface layers of the sandwiched object is sandwiched between the flat plates 16 and then sandwiched between the pressing plates 18 of the forming press. , And heated and pressurized to form the inner layer substrate 10
In this embodiment, a multilayer board obtained by bonding a, 10b,..., a prepreg 12, and a metal foil 14 is cut using a cutting guide mark G. As shown in FIG. 6B, when the resin of the prepreg 12 is heated and pressurized and the resin of the prepreg 12 flows, the obtained multilayer board 20 is used as the inner layer substrates 10a and 10b.
May also move, and a shift may occur between the inner layer substrates 10a, 10b.

The prepreg 12 used in the present invention comprises a thermosetting resin composition and a base material. For example, after adding a solvent to the thermosetting resin composition to adjust the viscosity,
The base material is immersed in the liquid to be impregnated, and then heated to dry the solvent to obtain a semi-cured thermosetting resin composition, or to heat a solid thermosetting resin composition at room temperature. It is obtained by applying and impregnating a substrate in a molten state. In addition, the thermosetting resin composition in the prepreg 12 is limited to a semi-cured (B stage) state.

As the substrate, woven fabric, non-woven fabric, paper and the like of inorganic fibers such as glass, organic fibers such as polyester, polyamide, polyacryl and polyimide, and natural fibers such as cotton can be used. In addition, it is preferable to use a woven fabric (glass cloth) made of glass fiber because a multilayer board 20 having excellent heat resistance and moisture resistance can be obtained. The thickness of the base material is generally from 0.04 to 0.30 mm.

Further, the thermosetting resin composition includes:
The entire thermosetting resin composition can be used, such as an epoxy resin-based, phenolic resin-based, polyimide resin-based, unsaturated polyester resin-based, polyphenylene ether resin-based alone, modified product, or mixture. In addition, when a thermosetting resin composition is an epoxy resin type | system | group, the balance of an electrical property and adhesiveness is favorable and it is preferable. The thermosetting resin composition contains a thermosetting resin as an essential component, and may contain a curing agent for the thermosetting resin, a curing accelerator, an inorganic filler, a solvent, and the like as necessary. .

The amount of the thermosetting resin composition in the prepreg 12 is preferably 40 to 70 parts by weight based on 100 parts by weight of the total weight of the thermosetting resin composition and the base material. 40
If the amount is less than 10 parts by weight, air bubbles may remain inside the obtained multilayer board 20 and electrical characteristics may be reduced. If the amount is more than 70 parts by weight, the thickness of the obtained multilayer board 20 varies greatly. May be.

The inner layer substrate 10 used in the present invention
are not particularly limited as long as they have the cutting guide mark G and the conductive circuit formed thereon. For example, epoxy resin, phenol resin, polyimide resin, unsaturated polyester resin, Thermosetting resins such as polyphenylene ether resin, and boards made of those thermosetting resins mixed with inorganic fillers, etc., inorganic fibers such as glass, cloth of organic fibers such as polyester, polyamide, cotton, paper, etc. One in which a guide mark G for cutting and a conductor circuit are formed on a plate in which a base material is bonded with the above-mentioned thermosetting resin or the like. The cutting guide mark G and the conductor circuit are provided on the inner layer substrates 10a and 10a.
It is not limited to those exposed on the surface of b .., but may be formed inside.

The metal foil 14 used in the present invention is not particularly limited as long as it is a metal foil.
A single, alloy, or composite foil of copper, aluminum, brass, nickel, or the like can be used. The thickness of the metal foil 14 is generally 5 to 70 μm.

The flat plate 16 used in the present invention may be a metal plate such as iron or stainless steel, or a plate obtained by insulating the surface of these metal plates. The heating and pressurizing may be directly performed between the pressurizing plates 18 without using the flat plate 16. Heating and pressing may be performed between the flat plate 16 and the pressing plate 18 with a cushioning material such as cellulose paper or aramid fiber paper, a heat conduction adjusting material, or the like interposed therebetween, if necessary.

As the method of heating and pressurizing the object to be pressed between the pressurizing plates 18, a method of heating the pressurizing plate 18 and heating by heat transfer from the pressurizing plate 18, a method of heating the metal foil 14.
And heating by resistance heating.
The resistance heating is a method of supplying power to a conductor having electric resistance and heating the conductor by heat generated by the Joule effect. These heating conditions may be appropriately adjusted so that the thermosetting resin composition in the prepreg 12 is cured.

Then, the multilayer board 20 is connected to the individual inner layer substrates 1.
When cutting is performed for each portion corresponding to 0a, 10b,..., The cutting is performed by an apparatus as shown in FIG. 1 or FIG. In this apparatus, an input section 40 on which a plurality of multilayer boards 20 to be cut are stacked, an X-ray confirming section 42 for seeing through a cutting guide mark G with X-rays, and inner layer substrates 10a, 10b,. A first cutting portion 44 for cutting the edge on the direction A side, a second cutting portion 46 for cutting the remaining edge, and the multilayer board 2 cut to correspond to the individual inner layer substrates 10a, 10b,.
0 is provided, the X-ray confirmation unit 42 has an X-ray camera 36, and the rear end of the first cutting unit 44 has a first cutting device 30 capable of changing the cutting angle. A second cutting device 32 having a fixed cutting angle is provided at the rear end of the two cutting portions 46.

The X-ray confirmation unit 42 is arranged in the direction A (hereinafter, referred to as the inner substrate 10a, 10b,...) While adsorbing and holding the lower surface of the multi-layer board 20 conveyed one by one from the input unit 40. The multi-layer board 20 is transported in the arrangement direction A), and two cutting guide marks G provided for each of the inner layer substrates 10a, 10b,. At the X-ray camera 36, X-rays are used to see through sequentially from the leading inner layer substrate 10a. When the cutting guide mark G is viewed through X-rays, the multilayer board 20 may be temporarily stopped.
You may see through the moving state. Alternatively, one X-ray camera 36 may move to see through the two cutting guide marks G.

Next, in the first cutting section 44, a cutting guide mark obtained by performing image processing on an image seen through the X-ray camera 36 in a state of being held by suction on the lower surface of the multilayer board 20 seen through X-rays. By inputting information such as the central coordinates of G, as shown in FIG. 3, among the inner layer substrates 10a, 10b,.
An angle difference α1 between a direction B connecting the two cutting guide marks G of the inner layer substrate 10a on the first cutting device 30 side and a predetermined direction C set in advance for the operation reference of the machine is determined. Then, the cutting angle of the first cutting device 30 is adjusted by adjusting the angle β1 from the predetermined direction D preset for the operation reference of the first cutting device 30 according to the obtained angle difference α1. After the adjustment, the multilayer board 20 is advanced in the arranging direction A, and the edge of the inner layer substrate 10a on the side of the first cutting device 30 on the leading side in the arranging direction A and then on the rear side in the arranging direction A is cut by the first cutting device 30. Disconnect with

Next, using the information of the next inner layer substrate 10b seen through the X-ray camera 36, the inner layer substrate 10b is used.
The angle difference α2 between the direction B connecting the two cutting guide marks G and the predetermined direction C set in advance for the operation reference of the machine is obtained. Then, the obtained angle difference α2
After adjusting the cutting angle of the first cutting device 30 by adjusting the angle β2 from the predetermined direction D set in advance for the operation reference of the first cutting device 30 in the The multilayer board 20 is advanced, and the first side of the inner layer substrate 10b on the leading side and the trailing side in the arranging direction A is cut by the first cutting device 30. Note that such cutting is repeated a number of times in which the inner-layer substrates 10a, 10b,.

In the case of the method of cutting by controlling the rotation angle of the rotary table and positioning as described in the conventional Japanese Patent Application Laid-Open No. 4-260393, adjustment is made when the first inner layer substrate portion is cut. The angle is returned when cutting the next portion of the inner layer substrate.
However, there is a case where the position of the first cutting device 30 is shifted as described in the present invention, although the position of the first cutting device 30 is shifted slightly, so that the position for cutting the next inner layer substrate is shifted.
a, 10b... adjusted for each of the inner layer substrates 10a, 10b.
In the case of cutting the end side in the arrangement direction A of b .., because the influence of the movement of the position of the multilayer board 20 does not occur, the cutting angle can be accurately adjusted to the obtained angle, and the cutting position accuracy is excellent. Becomes possible.

Then, as shown in FIG. 1, the remaining edge is cut by the second cutting device 32, and the multilayer board 20 is cut into portions corresponding to the individual inner layer substrates 10a, 10b,.
The rotary table 34 is located at the center of the second cutting section 46.
Is provided, and after the multilayer board 20 cut on two sides is stacked on the turntable 34, the multilayer board 20 is sucked and held on the lower surface of the multilayer board 20. Then, the portion of the multilayer board 20 is cut by the first cutting device 30. The rotation angle of the turntable 34 is controlled in accordance with the size of the cutting angle adjusted when cutting, and the multilayer board 20 is controlled.
Is moved to position the remaining edge of the multilayer board 20 with respect to the second cutting device 32 fixedly provided. After the positioning, the multilayer board 2 is positioned in the arranging direction A.
0 is advanced, and the remaining edge is cut by the second cutting device 32. If the multilayer board 20 is multi-faced, the multilayer board 20 may be cut at this time.

The method of cutting the remaining edge is not limited to the method using the rotary table 34 as described above. For example, as shown in FIG. 4, the cutting direction of the first cutting device 30 is substantially orthogonal. Can be cut in the direction of
A third cutting device 38 capable of changing the cutting angle is provided,
The cutting angle of the third cutting device 38 is
The third cutting device 38 is positioned with respect to the multilayer board 20 by adjusting and moving the multilayer board 20 in accordance with the magnitude of the cutting angle adjusted in the above step.
May be advanced, and the remaining edge may be cut by the third cutting device 38. Although not shown, the side cut by the first cutting device 30 is brought into contact with a fixed surface to adjust the angle of the multilayer board 20. Alternatively, a method of cutting the remaining edge with a fourth cutting device fixedly provided may be used. In addition, in the case of the method using the rotary table 34, since the cut portions are arranged in a line, the transport of the multilayer board 20 is facilitated, which is preferable.

The embodiment shown in FIG.
In this embodiment, 0 is not moved in the direction orthogonal to the arrangement direction A (excluding rotation on the rotary table 34), but is moved only in the arrangement direction A. Without limitation, for example, FIG.
As shown in the figure, 2 for each inner layer substrate 10a, 10b.
If the midpoint g of the line connecting the two cutting guide marks G is displaced from the imaginary line L passing through the rotation center of the turntable 34 and extending in the arrangement direction A, the multilayer board 20 is advanced in the arrangement direction A. At this time, it is also moved in a direction perpendicular to the arrangement direction A so that the middle point g of the line connecting the cutting guide marks G is arranged on the virtual line L as shown in FIG. After the adjustment, it may be loaded on the turntable 34 as shown in FIG. In this case, FIG.
As shown in (d), when the direction of the multilayer board 20 is changed by rotating the turntable 34, the center point g of the line connecting the rotation center of the turntable 34 and the cutting guide mark G substantially coincides. However, the influence of this difference is less likely to occur, and the direction can be changed almost exactly to the predetermined direction, and cutting with particularly excellent cutting position accuracy can be performed.

In the above embodiment, the embodiment in which the edge on the side in the arrangement direction A is cut and then the remaining edge is cut is described. May be operated in parallel so as to cut the remaining edge of the leading inner layer substrate 10a at the same time when the edge is cut. Further, in the above-described embodiment, the embodiment in which the direction connecting the two cutting guide marks G is a direction substantially orthogonal to the arrangement direction A has been described, but the present invention is not particularly limited, and the cutting guide marks G Can be provided at any position, but is preferably provided as far away as possible.

[0032]

According to the method for cutting a multilayer board according to the present invention, after one cutting guide mark G provided on each inner layer substrate is seen through each inner layer substrate by X-rays, each of the seen inner layer substrates is cut. An edge in the direction side in which the inner layer substrates are arranged while adjusting the cutting angle of the first cutting device for each inner layer substrate according to the angle difference between the direction connecting the two cutting guide marks and the predetermined direction. Is cut by the first cutting device, so that cutting with excellent cutting position accuracy can be performed.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating one embodiment of a method for cutting a multilayer board according to the present invention.

FIG. 2 is a perspective view illustrating one embodiment of a method for cutting a multilayer board according to the present invention.

FIG. 3 is a plan view illustrating a main part of an embodiment of the method for cutting a multilayer board according to the present invention.

FIG. 4 is a plan view illustrating another embodiment of the method for cutting a multilayer board according to the present invention.

FIG. 5 is a plan view of an essential part for explaining still another embodiment of the method for cutting a multilayer board according to the present invention.

FIG. 6 is a view for explaining a multilayer board according to the present invention;
(A) is a sectional view, and (b) is a plan view.

[Explanation of symbols]

 10a, 10b Inner-layer substrate 12 Pre-preg 14 Metal foil 20 Multi-layer board 30 First cutting device 32 Second cutting device 34 Rotary table 36 X-ray camera 38 Third cutting device 40 Input unit 42 X-ray confirmation unit 44 First cutting unit 46 Second cutting portion 48 Receiving portion A Arrangement direction (direction in which inner layer substrates are arranged) B Direction connecting two cutting guide marks C, D Predetermined direction set for operation reference G Cutting guide mark

Claims (3)

[Claims] 1. A plurality of inner layer substrates provided with cutting guide marks are horizontally arranged and sandwiched between a prepreg composed of a thermosetting resin composition and a base material, and metal is provided on both surface layers of the sandwiched substrates. After stacking so that the foils are arranged, the multi-layer board obtained by heating and pressing is positioned by seeing the cutting guide mark with X-rays, so that each part corresponding to the individual inner layer substrate In the method of cutting a multilayer board to be cut by a cutting device, a method of cutting the multilayer board by a cutting device for each part corresponding to an individual inner layer substrate is performed while advancing the multilayer board in a direction in which the inner layer substrates are arranged. The two cutting guide marks provided on the inner layer substrate are respectively seen through by X-ray for each inner layer substrate, and then the direction connecting the two seeing cutting guide marks of each inner layer substrate and a predetermined direction are determined. According to the angle difference First, the cutting angle of the first cutting device is adjusted for each substrate for the inner layer, and the multilayer board is advanced in the direction in which the substrates for the inner layer are arranged. And then cutting the remaining edges to cut each portion corresponding to an individual inner layer substrate. 2. A method of cutting the remaining edge, comprising stacking and holding a multilayer board on a rotary table, and then controlling the rotation angle of the rotary table according to the magnitude of the cutting angle adjusted by the first cutting device. By moving the multilayer board, the remaining edge of the multilayer board is positioned with respect to the second cutting device fixedly provided, and then the multilayer board is advanced in the direction in which the inner layer substrates are arranged, and the second cutting is performed. 2. The method for cutting a multilayer board according to claim 1, wherein the method is a method for cutting the remaining edges with an apparatus. 3. A method of advancing a multilayer board in a direction in which inner-layer substrates are arranged, wherein a perspective view is drawn on an imaginary line that passes through the rotation center of the rotary table and extends in a direction in which the inner-layer boards that advance the multilayer board are arranged. While adjusting the position of the multilayer board in a direction orthogonal to the direction in which the inner layer substrates are arranged, the inner layer substrate is adjusted so that the midpoint of the line connecting the two cutting guide marks for each inner layer substrate is arranged. 3. The method for cutting a multilayer board according to claim 2, wherein the method is a method of advancing the multilayer board in a direction in which the pieces are arranged.