JP3855459B2 - Multi-layer board cutting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for cutting a multilayer board used for manufacturing a printed wiring board.
[0002]
[Prior art]
Multilayer boards are used in the production of printed wiring boards used in electrical and electronic equipment. In this multilayer board, adhesive sheets made by impregnating a base material with a thermosetting resin composition called a prepreg are stacked on the front and back of an inner layer substrate on which conductor circuits are formed, and metal foils are formed on both outer sides thereof. After being arranged and stacked to form a bonded body, the bonded body is sandwiched between flat plates, further sandwiched between molding presses, and heated and pressurized to be integrated.
[0003]
Note that the prepreg has a considerably large amount of resin compared to the amount of resin generally required so that irregularities between conductor circuits of various shapes ranging from those having a high area ratio of conductor circuits to those having a low area can be filled. Things are used. Therefore, a portion where the resin has flowed out and hardened is formed around the multilayer board obtained by heating and pressurizing and integrating. In addition, since this part becomes a hindrance in the manufacturing process of the printed wiring board, the multilayer board is cut so as to have a size substantially corresponding to the substrate for the inner layer by cutting off the part where the resin flows out and hardened. Used in the manufacturing process of printed wiring boards.
[0004]
As a method for cutting off the cured portion of the resin formed around the multilayer board, for example, as described in JP-A-2-14695, two cutting guide marks are previously formed on the inner layer substrate. After providing the X-ray through the cutting guide mark of the multi-layer board, the multi-layer board is moved according to the see-through information to position the multi-layer board with respect to the fixed cutting device. The method of cutting is done.
[0005]
In order to improve productivity, as shown in FIG. 6 (a), several inner layer substrates 10a are interposed between prepregs 12 that are several times larger than the inner layer substrates 10a, 10b,. , 10b,... Are arranged in a horizontal direction and stacked, and a metal foil 14 of a size that covers the entire prepreg 12 is placed on both sides of the metal foil 14 and stacked, and then a size corresponding to the size of the metal foil 14 Further, a method of obtaining a large number of multilayer plates at a time by sandwiching between pressing plates 18 of a molding press having a size corresponding to the size of the flat plate 16 and heating and pressurizing them is also performed. .
[0006]
When a multi-layer board is manufactured by sandwiching a plurality of inner layer substrates 10a, 10b,... Between the prepregs 12 in the horizontal direction, the inner layer substrates 10a, 10a, when the resin of the prepreg 12 flows by heating and pressing .. 10b also moved, and as shown in FIG. 6B, there was a case where a deviation occurred between the inner layer substrates 10a, 10b. When this deviation occurs, only the two cutting guide marks G are seen through the multilayer board 20 as described in JP-A-2-14695, and the individual inner layer substrates 10a, 10b,. In the method of cutting so as to correspond to the above, there is a problem that the yield of the obtained multilayer board is low because the cutting is performed at an incorrect position.
[0007]
Therefore, as described in JP-A-4-260393, two cutting guide marks G are provided in advance on each inner layer substrate 10a, 10b,..., And each inner layer substrate 10a, The two cutting guide marks G provided on 10b... Are each seen through X-rays for each inner layer substrate 10a, 10b..., And then the multilayer board 20 is loaded and held on the rotary table and then seen through. The rotation angle of the rotary table is controlled according to the position of the two cutting guide marks G for each of the inner layer substrates 10a, 10b,..., And the multilayer board 20 is provided for each portion corresponding to each inner layer substrate 10a, 10b,. , The multi-layer board 20 is positioned with respect to a fixed cutting device, and a method of cutting so as to correspond to the individual inner layer substrates 10a, 10b,. .
[0008]
However, even in the method of cutting by controlling the rotation angle of the rotary table for each portion corresponding to each of the inner layer substrates, the cutting position may shift, There is a need for a method of cutting a multilayer board with excellent cutting position accuracy.
[0009]
[Problems to be solved by the invention]
The present invention has been made in order to improve the above-mentioned problems. The object of the present invention is to provide a plurality of cutting guide marks provided between a prepreg comprising a thermosetting resin composition and a substrate. The inner layer substrates are sandwiched side by side in the horizontal direction, and the multilayer plate obtained by heating and pressurizing the metal foil is placed on both surface layers of the sandwiched substrate, and the cutting guide marks are X-rayed. Is a method for cutting a multilayer board that is cut by a cutting device for each portion corresponding to an individual inner layer substrate by providing a cutting method with excellent cutting position accuracy.
[0010]
[Means for Solving the Problems]
In the method for cutting a multilayer board according to claim 1 of the present invention, a plurality of inner layer substrates provided with cutting guide marks are horizontally arranged between prepregs comprising a thermosetting resin composition and a base material. In addition, after stacking so that the metal foil is arranged on both surface layers of the sandwiched thing, the multilayer board obtained by heating and pressurizing is positioned individually by seeing through the cutting guide marks with X-rays. In the method of cutting a multilayer board that cuts the portion corresponding to the inner layer substrate with a cutting device, the method of cutting the multilayer plate with the cutting device for each portion corresponding to the individual inner layer substrate arranged the inner layer substrates The two cutting guide marks provided on each inner layer substrate are seen through each inner layer substrate by X-rays while the multilayer board is advanced in the direction, and then the two cutting guides for each inner layer substrate seen through the X-ray are cut. Connecting guide marks The cutting angle of the first cutting device is adjusted for each inner layer substrate in accordance with the angle difference between the direction and the predetermined direction, and the multilayer plate is advanced in the direction in which the inner layer substrates are arranged, so that the inner layer for each inner layer substrate. It is a method of cutting edge portions on the direction side in which the substrates are arranged with a first cutting device and then cutting the remaining edge portions into portions corresponding to the individual inner layer substrates. .
[0011]
The multilayer board cutting method according to claim 2 of the present invention is the multilayer board cutting method according to claim 1, wherein the remaining edge is cut after the multilayer board is loaded and held on the rotary table. By moving the multilayer board by controlling the rotation angle of the rotary table according to the magnitude of the cutting angle adjusted by the one cutting device, the remaining edge of the multilayer board can be moved with respect to the fixed second cutting apparatus. The method is characterized in that the positioning is performed, and then the multilayer board is advanced in the direction in which the inner layer substrates are arranged, and the remaining edge is cut by the second cutting device.
[0012]
The method for cutting a multilayer board according to claim 3 of the present invention is the method for cutting a multilayer board according to claim 2, wherein the method for advancing the multilayer board in the direction in which the substrates for the inner layers are arranged is based on the rotation center of the rotary table. The multilayer board so that the midpoint of the line connecting the two cutting guide marks for each of the inner layer substrates seen through is arranged on a virtual line extending in the direction in which the inner layer substrates that pass through and advance the multilayer board are arranged. The multilayer board is advanced in the direction in which the inner layer substrates are arranged while adjusting the position in the direction perpendicular to the direction in which the inner layer substrates are arranged.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
A method for cutting a multilayer board according to the present invention will be described with reference to the drawings. FIG. 1 is a plan view for explaining an embodiment of a method for cutting a multilayer board according to the present invention. FIG. 2 is a perspective view for explaining an embodiment of a method for cutting a multilayer board according to the present invention. FIG. 3 is a plan view for explaining the main part of one embodiment of the method for cutting a multilayer board according to the present invention. 4 is a plan view for explaining another embodiment of the method for cutting a multilayer board according to the present invention, and FIG. 5 shows still another embodiment for the method for cutting a multilayer board according to the present invention. It is a principal part top view to explain. FIG. 6 is a view for explaining a multilayer board according to the present invention, wherein (a) is a sectional view and (b) is a plan view.
[0014]
As shown in FIG. 6 (a), one embodiment of the method for cutting a multilayer board according to the present invention includes three inner-layer substrates 10a, 10b, 10 provided with cutting guide marks G between prepregs 12. Are sandwiched between the flat plates 16 and then pressed between the pressure plates 18 of the forming press, and heated. In this embodiment, the multilayer board obtained by pressurizing and bonding the inner substrate 10a, 10b,..., The prepreg 12 and the metal foil 14 is cut using the cutting guide mark G. As shown in FIG. 6 (b), when the obtained multilayer board 20 is heated and pressurized and the resin of the prepreg 12 flows, the inner layer substrates 10a, 10b,. There may be a deviation between 10b.
[0015]
The prepreg 12 used in the present invention is composed of a thermosetting resin composition and a substrate. For example, after adjusting the viscosity by adding a solvent to the thermosetting resin composition, the substrate is immersed in the liquid. Impregnated and then heated to dry the solvent and semi-cure the thermosetting resin composition, or a base material in a state where the solid thermosetting resin composition is heated and melted at room temperature It is obtained by applying to and impregnating. The thermosetting resin composition in the prepreg 12 is limited to a semi-cured (B stage) state.
[0016]
As the substrate, inorganic fibers such as glass, organic fibers such as polyester, polyamide, polyacryl, and polyimide, and natural fibers such as cotton, woven fabric, nonwoven fabric, and paper can be used. In addition, when the woven fabric (glass cloth) made from glass fiber is used, the multilayer board 20 excellent in heat resistance and moisture resistance is obtained, and it is preferable. In addition, as a thickness of a base material, a 0.04-0.30mm thing is generally used.
[0017]
In addition, as the thermosetting resin composition, an epoxy resin type, a phenol resin type, a polyimide resin type, an unsaturated polyester resin type, a polyphenylene ether resin type or the like alone, a modified product, a mixture, a thermosetting resin, etc. The entire composition can be used. In addition, when a thermosetting resin composition is an epoxy resin type | system | group, the balance of an electrical property and adhesiveness is favorable and preferable. The thermosetting resin composition contains a thermosetting resin as an essential component, and can contain a curing agent, a curing accelerator, an inorganic filler, a solvent, and the like of the thermosetting resin as necessary. .
[0018]
The amount of the thermosetting resin composition in the prepreg 12 is preferably 40 to 70 parts by weight with respect to 100 parts by weight of the total weight of the thermosetting resin composition and the substrate. If the amount is less than 40 parts by weight, bubbles may remain in the resulting multilayer board 20 and the electrical characteristics may deteriorate, and if it exceeds 70 parts by weight, the thickness of the resulting multilayer board 20 may vary. May be larger.
[0019]
Further, the inner layer substrates 10a, 10b,... Used in the present invention are not particularly limited as long as the cutting guide marks G and the conductor circuit are formed on the board. For example, an epoxy resin system, a phenol resin system, Thermosetting resins such as polyimide resin, unsaturated polyester resin, polyphenylene ether resin, etc. and plates made by blending these thermosetting resins with inorganic fillers, inorganic fibers such as glass, polyester, polyamide, cotton For example, a material in which a cutting guide mark G and a conductor circuit are formed on a plate obtained by bonding a base material such as a cloth of organic fibers such as paper or paper with the thermosetting resin or the like. The cutting guide mark G and the conductor circuit are not limited to those exposed on the surface of the inner layer substrates 10a, 10b,... But may be formed inside.
[0020]
Moreover, as metal foil 14 used for this invention, if it is metal foil, it will not specifically limit, Single, alloy, and composite foil, such as copper, aluminum, brass, nickel, can be used. As thickness of this metal foil 14, 5-70 micrometers is common.
[0021]
Moreover, as the flat plate 16 used for this invention, the thing which insulated the surface of metal plates, such as iron and stainless steel, or these metal plates is mentioned. Instead of using the flat plate 16, it may be directly heated and pressurized between the pressurizing plates 18. Further, between the flat plate 16 and the pressure plate 18, a cushioning material such as cellulose paper or aramid fiber paper, a heat conduction adjusting material, or the like may be sandwiched between the flat plate 16 and the pressure plate 18 as necessary.
[0022]
In addition, as a method of heating and pressurizing the object to be pressed between the pressurizing plates 18, a method of heating the pressurizing plate 18 and heating by heat transfer from the pressurizing plate 18, or supplying power to the metal foil 14 and resistance The method of heating by heating is mentioned. This resistance heating is a method in which power is supplied to a conductor having electrical resistance and heated by heat generated by the Joule effect. What is necessary is just to adjust suitably as conditions for these heating so that it may become the temperature which the thermosetting resin composition in the prepreg 12 hardens | cures.
[0023]
When the multilayer board 20 is cut into portions corresponding to the individual inner layer substrates 10a, 10b,..., The multilayer board 20 is cut with an apparatus as shown in FIG. In this apparatus, an input section 40 for stacking a plurality of multilayer boards 20 to be cut, an X-ray confirmation section 42 for seeing through the cutting guide marks G with X-rays, and inner-layer substrates 10a, 10b,. The first cutting part 44 for cutting the edge on the direction A side, the second cutting part 46 for cutting the remaining edge, and the multilayer board 20 cut so as to correspond to the individual inner layer substrates 10a, 10b,. A receiving unit 48 to be loaded is provided, the X-ray confirmation unit 42 has an X-ray camera 36, and the rear end of the first cutting unit 44 has a first cutting device 30 that can change the cutting angle, and a second cutting. A second cutting device 32 having a fixed cutting angle is provided at the rear end of the portion 46.
[0024]
The X-ray confirmation unit 42 is arranged in a direction A in which the inner-layer substrates 10a, 10b,... Are arranged in a state where the X-ray confirmation unit 42 is adsorbed and held on the lower surface of the multilayer board 20 conveyed one by one from the input unit 40. The multi-layer board 20 is conveyed, and two cutting guide marks G provided for each of the inner-layer substrates 10a, 10b,. The portion 36 is seen through from the top inner layer substrate 10a by X-rays in order. Note that when the cutting guide mark G is seen through with X-rays, the multilayer board 20 may be temporarily stopped or seen through in a moving state. Alternatively, one X-ray camera 36 may move so that the two cutting guide marks G can be seen through.
[0025]
Next, in the first cutting unit 44, the center of the cutting guide mark G obtained by performing image processing on an image seen through with the X-ray camera 36 while being sucked and held on the lower surface of the multilayer board 20 seen through with X-rays. As shown in FIG. 3, the direction of connecting two cutting guide marks G on the inner layer substrate 10a on the first cutting device 30 side among the inner layer substrates 10a, 10b,. An angle difference α1 between B and a predetermined direction C set in advance for machine operation reference is obtained. And according to the calculated angle difference α1, the angle β1 from the predetermined direction D preset for the operation reference of the first cutting device 30 is adjusted, so that the cutting angle of the first cutting device 30 is set. After the adjustment, the multilayer board 20 is advanced in the arrangement direction A, and the first cutting apparatus 30 sets the edge of the inner layer substrate 10a on the first cutting apparatus 30 side on the leading side in the arrangement direction A and then on the rear side in the arrangement direction A. Disconnect with.
[0026]
Next, using the information seen through the X-ray camera 36 of the next inner layer substrate 10b, the direction B connecting the two cutting guide marks G of the inner layer substrate 10b and the machine operation reference are set in advance. The angle difference α2 with respect to the predetermined direction C is obtained. And according to the calculated angle difference α2, the cutting angle of the first cutting device 30 is adjusted by adjusting the angle β2 from the predetermined direction D preset for the operation reference of the first cutting device 30. After the adjustment, the multilayer board 20 is advanced in the arrangement direction A, and the first cutting device 30 cuts the edges of the inner layer substrate 10b on the front side in the arrangement direction A and the rear side in the arrangement direction A. Such cutting is repeated a number of times in which the inner layer substrates 10a, 10b,.
[0027]
In the case of the method of cutting by controlling and positioning the rotation angle of the rotary table as described in the conventional Japanese Patent Laid-Open No. 4-260393, the angle adjusted when the first inner layer substrate portion is cut is set. Even if an attempt is made to return the portion of the next inner layer substrate when cutting, the position of the multilayer board 20 may be slightly shifted because the position of the multilayer board 20 is moved, and the position of cutting the next inner layer substrate may be shifted. When the cutting angle of the first cutting device 30 is adjusted for each of the inner layer substrates 10a, 10b,... And the end side on the arrangement direction A side of the inner layer substrates 10a, 10b,. Since the influence of the movement of the position of the plate 20 does not occur, it is possible to accurately adjust to the obtained angle, and it is possible to perform cutting with excellent cutting position accuracy.
[0028]
Next, as shown in FIG. 1, the remaining edge is cut by the second cutting device 32, and the multilayer board 20 is cut into portions corresponding to the individual inner layer substrates 10a, 10b,. In addition, a rotary table 34 is provided at the center of the second cutting portion 46, and after the multilayer plate 20 cut at two sides is loaded on the rotary table 34, it is sucked and held on the lower surface of the multilayer plate 20. Then, the multi-layer board 20 is fixed by moving the multi-layer board 20 by controlling the rotation angle of the rotary table 34 according to the magnitude of the cutting angle adjusted when the first cutting device 30 cuts the portion of the multi-layer board 20. The remaining edge of the multilayer plate 20 is positioned with respect to the second cutting device 32 provided in the position. After the positioning, the multilayer plate 20 is advanced in the arrangement direction A, and the second cutting device 32 The remaining edges are cut. When the multilayer board 20 is multi-faceted, the multilayer board 20 may be cut into small pieces at this time.
[0029]
Note that the method of cutting the remaining edge is not limited to the method using the rotary table 34 as described above. For example, as shown in FIG. 4, in the direction substantially perpendicular to the cutting direction of the first cutting device 30. A third cutting device 38 that can be cut and whose cutting angle can be changed is provided, and the cutting angle of the third cutting device 38 is set according to the size of the cutting angle adjusted by the first cutting device 30. By adjusting and moving, the third cutting device 38 is positioned with respect to the multilayer plate 20, and then the multilayer plate 20 is advanced in a direction orthogonal to the arrangement direction A, and the remaining edge is cut by the third cutting device 38. Although not shown, the side cut by the first cutting device 30 is abutted against the fixed surface to adjust the angle of the multilayer board 20, and then the remaining edge is fixed by the fourth cutting device that is fixedly provided. A method of cutting may be used. In the case of the method using the rotary table 34, since the cutting portions are arranged in a line, the multilayer board 20 can be easily conveyed, which is preferable.
[0030]
The embodiment shown in FIG. 1 is an embodiment in which the multilayer board 20 is moved only in the arrangement direction A without moving the multilayer board 20 in the direction orthogonal to the arrangement direction A (excluding rotation on the rotary table 34). For example, as shown in FIG. 5A, two cutting guide marks G for each inner layer substrate 10a, 10b,... Are connected. When the midpoint g of the line deviates from the virtual line L that passes through the rotation center of the turntable 34 and extends in the arrangement direction A, when the multilayer board 20 is advanced in the arrangement direction A, As shown in FIG. 5 (b), it is also moved in the orthogonal direction, and adjusted so that the midpoint g of the line connecting the cutting guide marks G is arranged on the imaginary line L. As shown in FIG. Good. In this case, as shown in FIG. 5 (d), when the turntable 34 is rotated to change the direction of the multilayer board 20, the midpoint g of the line connecting the rotation center of the turntable 34 and the cutting guide mark G is obtained. Therefore, the influence of this difference is less likely to occur, and the direction can be changed almost exactly to the planned direction, and cutting with particularly excellent cutting position accuracy is possible.
[0031]
In addition, although said embodiment demonstrated embodiment which cut | disconnects the remaining edge after cut | disconnecting the edge by the side of arrangement direction A, for example, the edge by the side of arrangement A of center inner substrate 10b May be operated in parallel so as to simultaneously cut the remaining edge of the leading inner layer substrate 10a. In the above-described embodiment, the embodiment in which the direction in which the two cutting guide marks G are connected is substantially perpendicular to the arrangement direction A is not particularly limited, and the cutting guide marks G are not particularly limited. Can be provided at an arbitrary position, but is preferably provided as far away as possible.
[0032]
【The invention's effect】
In the method for cutting a multilayer board according to the present invention, two cutting guide marks G provided on each inner layer substrate are seen through each of the inner layer substrates by X-rays, and then cut through each of the seen inner layer substrates. Adjusting the cutting angle of the first cutting device for each inner layer substrate in accordance with the angle difference between the direction for connecting the guide marks for a predetermined direction and the first cutting device. In this case, since the influence of the movement of the position of the multilayer board does not occur , it is possible to accurately adjust to the obtained angle, and it is possible to perform cutting with excellent cutting position accuracy.
[Brief description of the drawings]
FIG. 1 is a plan view for explaining an embodiment of a multilayer board cutting method according to the present invention.
FIG. 2 is a perspective view for explaining an embodiment of a multilayer board cutting method according to the present invention.
FIG. 3 is a plan view for explaining a main part of an embodiment of the method for cutting a multilayer board according to the present invention.
FIG. 4 is a plan view for explaining another embodiment of the multilayer board cutting method according to the present invention.
FIG. 5 is a plan view of an essential part for explaining still another embodiment of the multilayer board cutting method according to the present invention.
6A and 6B are diagrams illustrating a multilayer board according to the present invention, in which FIG. 6A is a cross-sectional view, and FIG. 6B is a plan view.
[Explanation of symbols]
10a, 10b Inner layer substrate 12 Prepreg 14 Metal foil 20 Multi-layer board 30 First cutting device 32 Second cutting device 34 Rotary table 36 X-ray camera 38 Third cutting device 40 Input unit 42 X-ray confirmation unit 44 First cutting unit 46 Second cutting portion 48 Receiving portion A Arrangement direction (direction in which inner layer substrates are arranged)
B Direction for connecting two cutting guide marks C, D Predetermined direction set for operation reference G Cutting guide mark

Claims (3)

A plurality of inner layer substrates provided with cutting guide marks are horizontally arranged between a thermosetting resin composition and a prepreg made of a base material, and metal foils are arranged on both surface layers of the sandwiched material. After stacking, the multilayer board obtained by heating and pressurizing is cut by a cutting device for each portion corresponding to the individual inner layer substrate by positioning the cutting guide mark through X-rays. In the cutting method of the multilayer board,
A method of cutting a multilayer board with a cutting device for each part corresponding to an individual inner layer substrate,
While advancing the multilayer board in the direction in which the inner layer substrates are arranged, two cutting guide marks provided on each inner layer substrate are seen through each of the inner layer substrates by X-rays, and then each of the seen inner layer substrates is seen through. The cutting angle of the first cutting device is adjusted for each inner layer substrate in accordance with the angle difference between the direction in which the two cutting guide marks are connected to each other and the predetermined direction, and the multilayer board is arranged in the direction in which the inner layer substrates are arranged. Proceed and cut the edge on the direction side where the inner layer substrates are arranged with the first cutting device,
Next, a method of cutting a multilayer board, characterized in that the remaining edge is cut and cut into portions corresponding to individual inner layer substrates. The method of cutting the remaining edges is to load and hold the multilayer board on the rotary table, and then move the multilayer board by controlling the rotation angle of the rotary table according to the cutting angle adjusted by the first cutting device. Thus, the remaining edge of the multilayer board is positioned with respect to the fixed second cutting device, and then the multilayer board is advanced in the direction in which the inner layer substrates are arranged, and the remaining edge of the second cutting apparatus The method for cutting a multilayer board according to claim 1, wherein the method is a method for cutting a multi-layer board. The method of advancing the multilayer board in the direction in which the inner layer substrates are arranged is a method of passing through the rotation center of the rotary table and seeing through each inner layer substrate on a virtual line extending in the direction in which the inner layer substrates that advance the multilayer board are arranged. Adjust the position of the multilayer board in the direction perpendicular to the direction in which the inner layer substrates are arranged so that the midpoint of the line connecting each two cutting guide marks is arranged in the direction in which the inner layer substrates are arranged. 3. The method for cutting a multilayer board according to claim 2, wherein the multilayer board is advanced.

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