CN109599411B - A kind of controllable dispersion and transfer method for the transfer of Micro-LED flood tide - Google Patents
A kind of controllable dispersion and transfer method for the transfer of Micro-LED flood tide Download PDFInfo
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- 239000006185 dispersion Substances 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000033001 locomotion Effects 0.000 claims abstract description 17
- 238000005119 centrifugation Methods 0.000 claims abstract description 5
- 238000006073 displacement reaction Methods 0.000 claims description 13
- 230000006641 stabilisation Effects 0.000 claims description 8
- 238000011105 stabilization Methods 0.000 claims description 8
- 239000000725 suspension Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 6
- 230000005484 gravity Effects 0.000 claims description 6
- 239000003086 colorant Substances 0.000 claims description 5
- 238000013016 damping Methods 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 4
- 238000009987 spinning Methods 0.000 claims description 4
- 230000003068 static effect Effects 0.000 claims description 4
- 230000001174 ascending effect Effects 0.000 claims description 3
- 238000011084 recovery Methods 0.000 claims description 3
- 230000001133 acceleration Effects 0.000 claims 2
- 238000005516 engineering process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000001338 self-assembly Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000006194 liquid suspension Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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Abstract
A kind of controllable dispersing method and transfer method for the transfer of Micro-LED flood tide, including dispersion platform, dispersion platform carry out lifting or jet while rotating, to make the chip being placed on dispersion platform do free centrifugal movement and then disperse；A) chip shifts, and the Micro-LED chip on wafer is transferred on rubber carrying tablet；B) free centrifugal action, rubber carrying tablet are fixed on centrifugal dispersion platform, and platform carries out lifting or jet while rotation, and chip is made to carry out Centrifugal dispersion, are dispersed by single or for several times, interval needed for reaching chip array and arrangement；C) chip shifts, and the chip on rubber carrying tablet is aligned with the pad on bearing substrate, chip is transferred on the pad of substrate.This programme by Micro-LED dispersion platform do centrifugation projectile motion in the way of and upside-down mounting, realize flood tide Micro-LED it is controllable dispersion with shift.
Description
Technical field
The present invention relates to Micro-LED technical field, especially a kind of the controllable of Micro-LED flood tide transfer is dispersed and is turned
Shifting method.
Background technique
Micro-LED technology, i.e. LED miniatureization and matrixing technology.Refer to the high density integrated on a single die
The LED array of microsize, as LED display each pixel can addressing, be operated alone and light, it is aobvious that outdoor LED can be regarded as
Pixel distance is reduced to micron order from grade by the miniature version of display screen.And Micro LED display, then it is that bottom is used
LED display driver circuit is made in normal CMOS integrated circuit fabrication process, then makes on the integrated of MOCVD machine again
LED array, to realize miniature display screen, that is, the scaled down version of described LED display.
LED is carried out filming, microminiaturization by Micro-LED, and size is only in 1~10 μm of grade or so.Compared to existing
OLED technology, the easy structure of Micro-LED unglazed consumption element because of its self luminous display characteristic and almost, thus have higher
Technology brightness, luminous efficiency, color saturation, lower power consumption and longer service life.Micro-LED can greatly improve aobvious
Show equipment cruise duration, image and color identification and resolution ratio and volume etc., wearable type equipment, oversize TV,
Smart phone and plate and in other in large-size screen monitors market have wide application prospect.
For the application for realizing Micro-LED, need to develop corresponding flood tide transfer techniques, it will be a large amount of (tens of thousands of to several on wafer
Ten million) Micro-LED chip, which is transferred to, forms three mixture of colours, the LED array with specific configuration mode on drive circuit board.
The technology of main flood tide transfer at present is divided into several classifications: 1) Fine Pick/Place, which is precisely grabbed, sends, mainly a) electrostatic
Power: using the transfer head with dipolar configuration, imposing on generating positive and negative voltage respectively in transfer process, when grabbing LED from substrate,
Positive electricity is led to a silicon electrode, LED will be adsorbed onto transfer head, when needing LED to be placed on commitment positions, to another silicon
Electrode leads to negative electricity, and transfer can be completed；B) Van der Waals force: using boxing impression, and combined high precision motion control print head utilizes
Van der Waals force allows LED to be attached in transfer head, or print to the pre-determined bit of target substrate piece by changing the speed of print head
It sets；C) magnetic force: before being cut, being mixed into the magnetic materials such as iron-cobalt-nickel on Micro-LED, using electromagnetic adsorption and releases
It puts；2) Selective Release selectively discharges: without link is picked up, directly being turned LED from original substrate
It moves, major technique has patterning laser: using excimer laser, being radiated at sparse dispersion on the gallium nitride thin slice on growth interface
Mold size area, then gallium metal and nitrogen are generated by ultraviolet exposure, accomplish to be transferred to substrate in parallel, realize accurately
Optical array；3) Self-Assembly self assembly is mainly used fluid force technology: being rolled on substrate using brush bucket, so that
LED is placed in liquid suspension, by fluid force, falls into LED in the corresponding well on substrate；4) Roll Printing is transferred,
It is shifted, by TFT component pick and is placed on required substrate, then LED element is picked up and put by way of printing
It sets on the substrate for being placed with TFT element, so that completion combines the active array type Micro-LED panel of two big elements.
Summary of the invention
In view of the foregoing drawbacks, it is an object of the invention to propose a kind of controllable dispersion for the transfer of Micro-LED flood tide
And transfer method, by Micro-LED dispersion platform do centrifugation projectile motion in the way of and upside-down mounting, realize flood tide Micro-
The controllable dispersion and transfer of LED.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of controllable dispersion and transfer method for the transfer of Micro-LED flood tide, including dispersion platform, the dispersion are flat
Platform is gone up and down and is rotated based on rotary shaft, thus while driving the chip being placed on dispersion platform to move in a circle
Throw or carry out jet suspension；
A) chip shifts, and the Micro-LED chip on wafer is transferred on rubber carrying tablet；
B) free centrifugal action, rubber carrying tablet are fixed on centrifugal dispersion platform, by chip while platform rotates
It catches after throwing, disperses by single or for several times, interval needed for reaching chip array and arrangement；
C) chip shifts, and the chip on rubber carrying tablet is aligned with the pad on bearing substrate, chip is transferred to base
On the pad of plate；
D) step repeats, and can once complete three primary colors Micro- on the same substrate using above-mentioned method a), b), c)
The placement of LED chip array.
Preferably, including five stages in the free centrifugal action of step b)；
1) boost phase, platform is begun spinning up by static or low speed state and is maintained at a certain rotation angle speed at this time
Spend ω 0；
2) stage is thrown, platform maintains angular velocity of rotation ω 0, and begins to ramp up along z-axis；
3) aerial stage, platform z-axis ascending motion stop, and chip is tossed and does centrifugation projectile motion, and platform revolves at this time
Tarnsition velocity drops to ω ' and prepares to receive chip；
4) stage is received, chip drops back into before platform in a flash, and platform is begun to decline and the z-axis speed of synchronizing chip is with steadily
Catch chip；
5) stabilization sub stage, platform z-axis are stablized motionless, and stabilization of speed is in ω '.In whole process, the displacement of platform z-axis meets:
Or similar curve, platform angular speed meetOr similarity relation, wherein A is to increase in platform setting
Degree, t1 are to throw phase sets duration,For aerial stage duration, t2 is to receive phase sets duration, and g adds for gravity
Speed.
Further, the carrying tablet in step a) the chip transfer is rubber or conductive rubber, and the carrying tablet has
Stomata inside and outside connection, for applying positive pressure or negative pressure；
Stomata air-breathing on rubber carrying tablet, will be on wafer using the deformability and great friction coefficient of negative pressure and rubber
Micro-LED chip be transferred on rubber carrying tablet.
Preferably, working environment is arranged when use throws mode and carries out Centrifugal dispersion, dispersion platform is arranged in vacuum
In environment and damping environment；
During chip is thrown, z-axis displacement can be made to increase Sz ' (t)=0.5at2 on the original basis, simulated gravity adds
Speed is the overweight condition of (g+a), and after platform catches chip, z-axis slowly slows down and declines recovery to original position.
Preferably, the mode that the stomata that also can use carrying tablet is blown realizes the suspension of chip, carrying tablet stomata air-breathing
Mode realize the crawl and reception of chip, can achieve the effect similar with chip is thrown.
Further, this method is suitable for the dispersion and transfer of other types microsize chip or problem chip.
Beneficial effects of the present invention: 1, this programme through the above steps, realizes the dispersion of a large amount of chips and asking for transfer
Topic, compared to the method for existing chip dispersion and patent, the efficiency of this programme is more done, and dispersion is controllable, and energy consumption and material consumption are few, more
It is suitble to apply in production；2, above scheme is that chip needs to carry out in free centrifugal action, due to chip throw and
Dispersion depend on rotating platform rotational angular velocity and chip go up and down inertia, so above scheme ensure that dispersion spacing can
Control；Relative position when being placed on turntable due to chip be it is identical, if there is vibration or air-flow, influence whether chip
When carrying out free centrifugal operation, influence of the air-flow to chip position is the most obvious for position, especially chip.
Detailed description of the invention
Fig. 1 is the installation diagram of one embodiment of the present of invention；
Fig. 2 is Centrifugal dispersion platform z-axis displacement of the present invention and method of controlling rotation schematic diagram；
Fig. 3 is to use Centrifugal dispersion platform and controllable dispersion process schematic diagram for the present invention.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
As shown in Figure 1-3, a kind of controllable dispersion and transfer method for the transfer of Micro-LED flood tide, including dispersion are flat
Platform, the dispersion platform are gone up and down and are rotated based on rotary shaft, so that the chip being placed on dispersion platform be driven to do
Jet suspension is thrown or carried out while circular motion；
A) chip shifts, and the Micro-LED chip on wafer is transferred on rubber carrying tablet；
B) free centrifugal action, rubber carrying tablet are fixed on centrifugal dispersion platform, by chip while platform rotates
It catches after throwing, disperses by single or for several times, interval needed for reaching chip array and arrangement；
C) chip shifts, and the chip on rubber carrying tablet is aligned with the pad on bearing substrate, chip is transferred to base
On the pad of plate；
D) step repeats, and can once complete three primary colors Micro- on the same substrate using above-mentioned method a), b), c)
The placement of LED chip array.
This programme through the above steps, the problem of realizing the dispersion and transfer of a large amount of chips, compared to existing chip
The method of dispersion and patent, the efficiency of this programme are more done, and dispersion is controllable, and energy consumption and material consumption are few, are more suitable for applying in production.
It wherein, include five stages in the free centrifugal action of step b)；
1) boost phase, platform is begun spinning up by static or low speed state and is maintained at a certain rotation angle speed at this time
Spend ω 0；
2) stage is thrown, platform maintains angular velocity of rotation ω 0, and begins to ramp up along z-axis；
3) aerial stage, platform z-axis ascending motion stop, and chip is tossed and does centrifugation projectile motion, and platform revolves at this time
Tarnsition velocity drops to ω ' and prepares to receive chip；
4) stage is received, chip drops back into before platform in a flash, and platform is begun to decline and the z-axis speed of synchronizing chip is with steadily
Catch chip；
5) stabilization sub stage, platform z-axis are stablized motionless, and stabilization of speed is in ω '.In whole process, the displacement of platform z-axis meets:
Or similar curve, platform angular speed meetOr similarity relation, wherein A is to increase in platform setting
Degree, t1 are to throw phase sets duration,For aerial stage duration, t2 is to receive phase sets duration, and g adds for gravity
Speed, reference book attached drawing 2 at this.
Above scheme be chip turn over throwing make in need to carry out, throwing and disperse depending on rotary flat due to chip
The rotational angular velocity and chip of platform go up and down inertia, so above scheme ensure that the controllable of dispersion spacing.
Wherein, the carrying tablet in step a) the chip transfer is rubber or conductive rubber, and the carrying tablet has connection
Inside and outside stomata, for applying positive pressure or negative pressure；
Stomata air-breathing on rubber carrying tablet, will be on wafer using the deformability and great friction coefficient of negative pressure and rubber
Micro-LED chip be transferred on rubber carrying tablet.
Carrying sheet material may be selected rubber or other materials with low modulus, high resiliency, high-damping and great friction coefficient,
Secondary motion is done with buffer chip and after avoiding chip from dropping back into platform, is also convenient for that the chip on wafer is directly transferred to carrying tablet
On.To avoid the influence of electrostatic that the materials such as conductive rubber also can be selected.
In addition, working environment is arranged when preparing free centrifugal action, dispersion platform is arranged in vacuum environment and damping
In environment；
During chip is thrown, z-axis displacement can be made to increase Sz ' (t)=0.5at2 on the original basis, simulated gravity adds
Speed is the overweight condition of (g+a), and after platform catches chip, z-axis slowly slows down and declines recovery to original position.
Relative position when being placed on turntable due to chip be it is identical, if there is vibration or air-flow, influence whether
When carrying out turning over polishing working, influence of the air-flow to chip position is the most obvious for the position of chip, especially chip.
In addition it is also possible to the suspension of chip is realized in the way of the air blowing of the stomata of carrying tablet, carrying tablet stomata air-breathing
Mode realizes the crawl and reception of chip, can achieve the effect similar with chip is thrown.
There are many kinds of the implementations for turning over throwing work, also can achieve identical effect by the way of pneumatic floating.
In addition, this method is suitable for the dispersion and transfer of other types microsize chip or problem chip.
In Fig. 1, if the angular speed that all chips rotate on dispersion platform is ω 0, is thrown in the sky or passed through simultaneously
Jet suspends the skyborne time as Δ t.If horizontal distance of a certain chip apart from disc rotary center is R, then chip exists
The distance that 0 Δ t of R ω will be moved on along the tangential direction of original circular motion in the air, by platform after chip is fallen
It catches, during this section, chip is increased at a distance from platform rotation center by RMagnification ratio isMeanwhile all chips in the sky all will rotationAngle.Since chip moves horizontally in the sky
0 Δ t distance of R ω, the angular speed of chip opposed platforms rotation center becomeCore is caught to reduce platform
Relative motion when piece between the two, before catching chip, the angular speed of platform should drop to ω '.'s
Magnification ratio is an amount unrelated with R, i other words, all chips pass through a dispersion process, and the spacing of all chips can amplify
It is originalTimes.By this process, mass center between chip can be kept while increasing chip spacing
Relative position and arrangement mode are constant.
In Fig. 2, black curve indicates platform angular velocity of rotation ω (t) in figure, and blue curve indicates that platform z-axis is displaced Sz
(t), z-axis displacement when red parabola represents chip in the sky.Curve can be divided into 5 stages, be respectively: a) boost phase,
Platform is begun spinning up by static or low speed state and is maintained at a certain angular velocity of rotation ω 0 at this time, and z-axis displacement is kept not
The stage b) is thrown in change, and platform maintains angular velocity of rotation ω 0, and begins to ramp up along z-axis, and z-axis displacement when rising can be with cut-off
Line, sine curve or similar curve are sine curve in figure, this section of process time is t1；C) aerial stage, platform z-axis side
Stopping (the blue straight line in figure) or speed to movement reduces (the blue dashed curve in figure), chip be tossed and do from
Heart projectile motion, platform angular velocity of rotation drops to ω ' and prepares to receive chip at this time, this section of process time is Δ t；D) rank is received
Section, chip drop back into before platform in a flash, and platform is begun to decline and the z-axis speed of synchronizing chip (makes blue steadily to catch chip
Curve and red curve are tangent), rear platform slow down and keep in the center rapidly, this section of process time is t2；E) stabilization sub stage puts down
Platform z-axis is stablized motionless, and stabilization of speed is in ω '.In whole process, the displacement of platform z-axis meets:
Or similar curve, platform angular speed meetOr similarity relation, the setting condition of Sz (t) in figure
Under, when aerial stage, is a length ofThrowing height isMeet other passes when throwing the displacement of stage platform z-axis
System is that Δ t is also referred to asIt is noted that working asWhen, amplification factor02 Δ t2 of ω is that second order is a small amount of.It means that can use throwing for very little amplitude, to core
Piece angle is finely adjusted, without cause chip chamber every significantly increase.
When the mode to be suspended using jet, the jet of stage progress in the sky is only needed, is added in other stage stuffiness or air-breathing
Strong chip grabs effect, and identical dispersion effect may be implemented.
Embodiment one
Use with leachy conductive rubber as carrying tablet, stomata air-breathing, using negative pressure by the Micro-LED on wafer
Chip is transferred on rubber carrying tablet.Rubber carrying tablet is fixed on Centrifugal dispersion platform later.Platform revolving speed is set as ω 0
=20rad/s, setting the displacement of platform z-axis makes to throw time Δ t=52.36 (π/60) ms, by 6 dispersion processes, chip
Spacing rises to original 9.22 times.
Chip on rubber carrying tablet is aligned with the pad on bearing substrate, so that chip is transferred to base by heating pressurization
On the pad of plate, the transfer of monochrome Micro-LED chip is completed at this time.
Embodiment two
Use with leachy conductive rubber as carrying tablet, stomata air-breathing, using negative pressure by the Micro-LED on wafer
Chip is transferred on rubber carrying tablet.Rubber carrying tablet is fixed on Centrifugal dispersion platform later.Platform revolving speed is set as ω 0
=40rad/s sets platform stomata jet suspension time as Δ t=19.63 (π/160) ms, and other times keep air-breathing to fix
Chip, by 12 dispersion processes, chip chamber is away from rising to original 17.87 times.Before final step dispersion, using small size
Degree throws process, is finely adjusted to chip angle.
Chip on rubber carrying tablet is aligned with the pad on bearing substrate, so that chip is transferred to base by heating pressurization
On the pad of plate, the transfer of monochrome Micro-LED chip is completed at this time.
Repetition takes the chip of other two kinds of color chips, and is dispersed with same settings, makes chip by heating pressurization
It is transferred on the pad for being placed with the substrate of chip, completes the transfer of three primary colors Micro-LED chip on the same substrate.
Embodiment three
Use with leachy conductive rubber as carrying tablet, stomata air-breathing, using negative pressure by the other types on wafer
Microsize chip is transferred on rubber carrying tablet.Rubber carrying tablet is fixed on Centrifugal dispersion platform later.Set platform
Revolving speed is ω 0=40rad/s, sets platform stomata jet suspension time as Δ t=19.63 (π/160) ms, other times are kept
Air-breathing fixed chip, by 12 dispersion processes, chip chamber is away from rising to original 17.87 times.Before final step dispersion,
Using process is thrown by a small margin, chip angle is finely adjusted.
Chip on rubber carrying tablet is aligned with the pad on bearing substrate, so that chip is transferred to base by heating pressurization
On the pad of plate, the transfer of chip is completed at this time.
The technical principle of the invention is described above in combination with a specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and shall not be construed in any way as a limitation of the scope of protection of the invention.Based on the explanation herein, the technology of this field
Personnel can associate with other specific embodiments of the invention without creative labor, these modes are fallen within
Within protection scope of the present invention.
Claims (5)
1. a kind of controllable dispersion and transfer method for the transfer of Micro-LED flood tide, which is characterized in that including dispersing platform,
The dispersion platform is gone up and down and is rotated based on rotary shaft, so that the chip being placed on dispersion platform be driven to do circumference
Jet suspension is thrown or carried out while movement；
A) chip shifts, and the Micro-LED chip on wafer is transferred on rubber carrying tablet；
B) free centrifugal action, rubber carrying tablet are fixed on centrifugal dispersion platform, and platform throws chip while rotation
After catch, disperse by single or for several times, interval needed for reaching chip array and arrangement；
C) chip shifts, and the chip on rubber carrying tablet is aligned with the pad on bearing substrate, chip is transferred to substrate
On pad；
D) step repeats, and can once complete three primary colors Micro-LED on the same substrate using above-mentioned method a), b), c)
The placement of chip array.
2. the controllable dispersion and transfer method, feature according to claim 1 for the transfer of Micro-LED flood tide exists
In including five stages in the free centrifugal action of step b)；
1) boost phase, platform is begun spinning up by static or low speed state and is maintained at a certain angular velocity of rotation ω at this time
0；
2) stage is thrown, platform maintains angular velocity of rotation ω 0, and begins to ramp up along z-axis；
3) aerial stage, platform z-axis ascending motion stop, and chip is tossed and does centrifugation projectile motion, at this time platform rotation angle
Speed drops to ω ' and prepares to receive chip；
4) stage is received, chip drops back into before platform in a flash, and platform is begun to decline and the z-axis speed of synchronizing chip is steadily to catch
Chip；
5) stabilization sub stage, platform z-axis stablize it is motionless, stabilization of speed in ω ', whole process, platform z-axis displacement meet:
Platform angular speed meetsWherein A is that platform sets lifting height, and t1 is to throw phase sets duration,For aerial stage duration, t2 is to receive phase sets duration, and g is acceleration of gravity.
3. the controllable dispersion and transfer method, feature according to claim 1 for the transfer of Micro-LED flood tide exists
In the carrying tablet in step a) the chip transfer is rubber, and the carrying tablet has the stomata inside and outside connection, for applying just
Pressure or negative pressure；
Stomata air-breathing on rubber carrying tablet, will be on wafer using the deformability and great friction coefficient of negative pressure and rubber
Micro-LED chip is transferred on rubber carrying tablet.
4. the controllable dispersion and transfer method, feature according to claim 1 for the transfer of Micro-LED flood tide exists
In,
When use throws mode and carries out Centrifugal dispersion, working environment is set, dispersion platform is arranged in vacuum environment and damping
In environment；
During chip is thrown, z-axis displacement can be made to increase Sz ' (t)=0.5at2, simulated gravity acceleration on the original basis
For the overweight condition of (g+a), after platform catches chip, z-axis slowly slows down and declines recovery to original position.
5. the controllable dispersion and transfer method, feature according to claim 1 for the transfer of Micro-LED flood tide exists
In, by the stomata of carrying tablet blow in the way of realize the suspension of chip, the mode of carrying tablet stomata air-breathing realizes grabbing for chip
It takes and receives, achieve the effect that throw chip.
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| CN110767582B (en) * | 2019-11-06 | 2020-05-26 | 广东工业大学 | Transfer method of Micro-LED chip |
| CN110817424B (en) * | 2019-11-20 | 2021-07-20 | 颜色空间(北京)科技有限公司 | Method for adjusting huge distance of tiny electronic components, huge transfer method and equipment |
| WO2021114028A1 (en) * | 2019-12-09 | 2021-06-17 | 重庆康佳光电技术研究院有限公司 | Transfer unit of miniature light-emitting diode, display module and display device |
| CN111430523B (en) * | 2020-02-24 | 2021-06-01 | 錼创显示科技股份有限公司 | Micro light-emitting diode structure, manufacturing method thereof and micro light-emitting diode device |
| US11843073B2 (en) | 2020-02-24 | 2023-12-12 | PlayNitride Display Co., Ltd. | Micro LED display device and manufacturing method thereof |
| CN115241111B (en) * | 2022-09-05 | 2023-03-24 | 广州纳动半导体设备有限公司 | Rectification and alignment system for chip mass transfer packaging and application method thereof |
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| CN101281192A (en) * | 2008-05-13 | 2008-10-08 | 东南大学 | Micro-nano particle electrogyration chip based on light mode virtual electrode as well as operation method thereof |
| CN104001562A (en) * | 2014-06-09 | 2014-08-27 | 南京大学 | Disc centrifugation type micro-fluidic chip and device for rapid chromium form separation |
| CN106650013A (en) * | 2016-11-24 | 2017-05-10 | 中北大学 | Reliability simulation method of microaccelerometer in high-speed revolving environment |
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| CN101281192A (en) * | 2008-05-13 | 2008-10-08 | 东南大学 | Micro-nano particle electrogyration chip based on light mode virtual electrode as well as operation method thereof |
| CN104001562A (en) * | 2014-06-09 | 2014-08-27 | 南京大学 | Disc centrifugation type micro-fluidic chip and device for rapid chromium form separation |
| CN106650013A (en) * | 2016-11-24 | 2017-05-10 | 中北大学 | Reliability simulation method of microaccelerometer in high-speed revolving environment |
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