CN110323309B - Display panel manufacturing method and display panel manufacturing system - Google Patents
Display panel manufacturing method and display panel manufacturing system Download PDFInfo
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- CN110323309B CN110323309B CN201910604708.0A CN201910604708A CN110323309B CN 110323309 B CN110323309 B CN 110323309B CN 201910604708 A CN201910604708 A CN 201910604708A CN 110323309 B CN110323309 B CN 110323309B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 230000005389 magnetism Effects 0.000 claims abstract description 41
- 239000000725 suspension Substances 0.000 claims abstract description 23
- 238000005339 levitation Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 13
- 230000004308 accommodation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel manufacturing method, which comprises the following steps: step S1, providing a plurality of light emitting diodes, wherein each light emitting diode comprises an electrode with magnetism; step S2, providing a magnetic suspension device having the same magnetic property as the electrode, and placing the light emitting diodes in the magnetic field of the magnetic suspension device to make the light emitting diodes in a suspended state; step S3, providing a transfer substrate, positioning the leds between the transfer substrate and the magnetic levitation device, and configuring the transfer substrate with a magnetic property opposite to the magnetic property of the electrodes to attract the leds to the transfer substrate. The invention also provides a display panel manufacturing system.
Description
Technical Field
The invention relates to the technical field of display devices, in particular to a display panel manufacturing method and a display panel manufacturing system.
Background
With the development of panel display technology, the requirements for resolution and contrast are higher and higher, a Micro Light-Emitting Diode (Micro-LED) display screen appears as a new generation of display technology, and the Micro-LED reduces the size of the LED from hundreds of micrometers to tens of micrometers, even a few micrometers, so that the Micro-LED display screen has higher brightness, better Light-Emitting efficiency and lower power consumption than the existing OLED technology. However, due to the small size of the Micro-LED, the operation of transferring the Micro-LED to the substrate of the display screen is complicated when the display screen is manufactured.
Disclosure of Invention
One aspect of the present invention provides a method for manufacturing a display panel, including:
step S1, providing a plurality of light emitting diodes, wherein each light emitting diode comprises an electrode with magnetism;
step S2, providing a magnetic suspension device having the same magnetic property as the electrode, and placing the light emitting diodes in the magnetic field of the magnetic suspension device to make the light emitting diodes in a suspended state;
step S3, providing a transfer substrate, positioning the leds between the transfer substrate and the magnetic levitation device, and configuring the transfer substrate with a magnetic property opposite to the magnetic property of the electrodes to attract the leds to the transfer substrate.
Another aspect of the present invention provides a display panel manufacturing system, including:
at least one accommodating cavity for accommodating a plurality of light emitting diodes, each of the light emitting diodes including an electrode having magnetism;
the magnetic suspension device has the same magnetism as that of the electrode, so that the plurality of light-emitting diodes accommodated in the accommodating cavity are positioned in the magnetic field of the magnetic suspension device and are in a suspension state; and
and the transfer substrate is movably arranged relative to the at least one accommodating cavity, and generates magnetism opposite to the magnetism of the electrodes of the plurality of light-emitting diodes when passing through any one accommodating cavity so as to attract the plurality of light-emitting diodes.
According to the manufacturing method of the display panel, the electrodes of the light emitting diodes are configured with magnetism, the light emitting diodes are enabled to be in a suspension state by means of the magnetic suspension device with the same magnetism as the electrodes of the light emitting diodes, the transfer substrate is configured with the magnetic materials opposite to the electrodes of the light emitting diodes, and the light emitting diodes are attracted to the transfer substrate, so that transfer of a large number of light emitting diodes can be achieved in a short time, the manufacturing method of the display panel is suitable for manufacturing Micro-LED display screens, and the manufacturing efficiency of the display panel is improved.
Drawings
Fig. 1 is a schematic structural diagram of a display panel manufacturing system according to an embodiment of the present invention.
Fig. 2 is a schematic plan view of the transfer substrate of fig. 1.
Fig. 3 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present invention.
Fig. 4 is a schematic diagram illustrating a state of the transfer substrate in step S3 of fig. 3.
Fig. 5 is another schematic diagram of the transfer substrate in step S3 of fig. 3.
Fig. 6 is a schematic diagram illustrating another state of the transfer substrate in step S3 of fig. 3.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
Referring to fig. 1, the display panel manufacturing system 10 provided in the present embodiment is used for manufacturing a display panel, and is particularly suitable for manufacturing a Micro Light-Emitting Diode (Micro-LED) display panel. The micro light emitting diode described herein refers to a light emitting diode having a size of 100 micrometers or less.
The display panel manufacturing system 10 includes a magnetic suspension device 11, a transfer substrate 12, and at least one accommodating cavity, which includes three accommodating cavities, i.e., a first accommodating cavity 131, a second accommodating cavity 132, and a third accommodating cavity 133 in this embodiment. The first accommodating chamber 131, the second accommodating chamber 132 and the third accommodating chamber 133 are respectively used for accommodating light emitting diodes emitting light of different colors. The magnetic levitation device 11 is disposed opposite to the transfer substrate 12, and the first accommodating chamber 131, the second accommodating chamber 132, and the third accommodating chamber 133 are disposed between the magnetic levitation device 11 and the transfer substrate 12.
The first accommodating chamber 131, the second accommodating chamber 132, and the third accommodating chamber 133 are chambers having one end connected to the magnetic levitation device 11 and the other end having an opening 134. The opening 134 is disposed close to the magnetic levitation device 11, and a space between the opening 134 and the magnetic levitation device 11 is used for accommodating a light emitting diode, which in this embodiment is a micro light emitting diode. In another embodiment, the first accommodating chamber 131, the second accommodating chamber 132 and the third accommodating chamber 133 may not be connected to the magnetic levitation device 11.
The first accommodating chamber 131, the second accommodating chamber 132 and the third accommodating chamber 133 are respectively used for accommodating micro light emitting diodes emitting light of different colors. In the present embodiment, the first accommodating chamber 131 is used for accommodating the micro light emitting diode 14R emitting the first color light (red light in the present embodiment), the second accommodating chamber 132 is used for accommodating the micro light emitting diode 14G emitting the second color light (green light in the present embodiment), and the third accommodating chamber 133 is used for accommodating the micro light emitting diode 14B emitting the third color light (blue light in the present embodiment). The micro light emitting diodes 14R, 14G, and 14B each include an electrode 141, and the electrode 141 has magnetism.
The magnetic suspension device 11 is a device having the same magnetism as the electrode 141, and may be a stage made of a material having magnetism itself, or a device generating magnetism by being energized, and it can be understood that when the device generating magnetism by being energized is energized, magnetism is lost by being deenergized. The first accommodating cavity 131, the second accommodating cavity 132 and the third accommodating cavity 133 are all located in the magnetic field generated by the magnetic suspension device 11, so that according to the principle of repelling magnetism, since the magnetic suspension device 11 has the same magnetism as the electrode 141, each of the micro light emitting diodes 14R, 14G and 14B is kept in the floating state in the first accommodating cavity 131, the second accommodating cavity 132 and the third accommodating cavity 133 respectively by the repulsive force of the magnetic suspension device 11. The floating state described herein refers to a state in which each of the micro light emitting diodes 14R, 14G, and 14B is not carried on any carrier, and each of the micro light emitting diodes 14R, 14G, and 14B in the floating state is lifted by the repulsive force of the magnetic levitation device 11 and floats in the first accommodating cavity 131, the second accommodating cavity 132, and the third accommodating cavity 133, respectively. When each of the micro light emitting diodes 14R, 14G, and 14B is in a floating state, the electrode 141 faces the magnetic levitation device 11.
The transfer substrate 12 is movably disposed. In this embodiment, the transfer substrate 12 is an active matrix substrate of a display device. In manufacturing the display panel, the transfer substrate 12 moves through the openings 134 of the first accommodating chamber 131, the second accommodating chamber 132, and the third accommodating chamber 133 in sequence. The transfer substrate 12 is configured with the same magnetism as the electrode 141, and each of the micro light emitting diodes 14R, 14G, 14B is attracted by the transfer substrate 12 according to the principle of opposite attraction of magnetism, so that the transfer substrate 12 can attract each of the micro light emitting diodes 14R, 14G, 14B. By the display panel manufacturing system 10, the micro light emitting diodes can be transferred in a large amount in a short time, which is beneficial to improving the manufacturing efficiency of the display panel.
Referring to fig. 2, a plurality of pixels 121 arranged in an array are defined on the transfer substrate 12, and in the present embodiment, each pixel includes three sub-pixels, respectively a sub-pixel R, G, B and a sub-pixel R, G, B arranged in an array. In other embodiments, a pixel 121 may include other numbers of sub-pixels, for example, a pixel 121 includes four sub-pixels. Each subpixel R, G, B has a corresponding pixel electrode (not shown) configured to be magnetic for the transfer substrate 12, and in particular, configured to be magnetic for each pixel electrode. In this embodiment, the magnetic property of each pixel electrode is specifically configured by applying a predetermined voltage to each pixel electrode to generate magnetic property.
Referring to fig. 1 and fig. 2, when the micro light emitting diodes 14R, 14G, and 14B are adsorbed on the transfer substrate 12, they correspond to the sub-pixels one by one, that is, each sub-pixel corresponds to only one micro light emitting diode. The sub-pixel R is correspondingly provided with a micro light emitting diode 14R emitting red light, the sub-pixel G is correspondingly provided with a micro light emitting diode 14G emitting green light, and the sub-pixel B is correspondingly provided with a micro light emitting diode 14B emitting blue light.
It should be understood that the arrangement of the sub-pixels R, G, B shown in fig. 2 is merely an example, and other arrangements are possible in other embodiments, and the invention is not limited thereto.
Referring to fig. 3, the present embodiment further provides a method for manufacturing a display panel by using the display panel manufacturing system 10, including:
step S1, providing a plurality of light emitting diodes, wherein each light emitting diode comprises an electrode with magnetism;
step S2, providing a magnetic suspension device having the same magnetic property as the electrode, and placing the light emitting diodes in the magnetic field of the magnetic suspension device to make the light emitting diodes in a suspended state;
step S3, providing a transfer substrate, positioning the leds between the transfer substrate and the magnetic levitation device, and configuring the transfer substrate with a magnetic property opposite to the magnetic property of the electrodes to attract the leds to the transfer substrate.
Referring to fig. 1 and fig. 3, in step S1, a plurality of micro light emitting diodes 14R, 14G and 14B are provided, and the micro light emitting diodes 14R, 14G and 14B are respectively accommodated in the first accommodating cavity 131, the second accommodating cavity 132 and the third accommodating cavity 133. Each of the micro light emitting diodes 14R, 14G and 14B includes a magnetic electrode 141. In this embodiment, the number of micro light emitting diodes emitting light of each color is equal; that is, the number of the micro light emitting diodes 14R, 14G and 14B is equal; that is, the number of the micro light emitting diodes accommodated in the first accommodating chamber 131, the second accommodating chamber 132 and the third accommodating chamber 133 is equal.
In step S2, the magnetic levitation device 11 is set to be magnetically the same as the electrode 141 of each of the micro light emitting diodes 14R, 14G, and 14B according to the magnetism of the electrode 141, so that each of the micro light emitting diodes 14R, 14G, and 14B is in a levitated state by the repulsive force.
In step S3, a transfer substrate 12 is provided, the transfer substrate 12 being an active matrix substrate of a display device, and the transfer substrate 12 is moved to pass through the first accommodation chamber 131, the second accommodation chamber 132, and the third accommodation chamber 133 in this order. When the transfer substrate 12 moves to the first accommodating chamber 131, the magnetic force opposite to the electrode 141 is configured only for each sub-pixel R on the transfer substrate 12, so as to attract each micro light emitting diode 14R in the first accommodating chamber 131 to each sub-pixel R. The structure of the transfer substrate 12 after passing through the first receiving chamber 131 is shown in fig. 4.
Then, the transfer substrate 12 is moved to the position of the second accommodating chamber 132, and the sub-pixels R are kept to be arranged with the opposite magnetism to the electrodes 141, so as to attract the micro light emitting diodes 14R and further arrange the opposite magnetism to the electrodes 141 for the sub-pixels G, so as to attract the micro light emitting diodes 14G in the second accommodating chamber 132 to the sub-pixels G. The structure of the transfer substrate 12 after passing through the second accommodation chamber 132 is shown in fig. 5.
Then, the transfer substrate 12 is moved to the position of the third accommodating chamber 133, and the sub-pixels R and G are kept to be arranged with the magnetic property opposite to the electrode 141, so as to attract the micro light emitting diodes 14R and 14G, and the sub-pixels B are further arranged with the magnetic property opposite to the electrode 141, so as to attract the micro light emitting diodes 14B in the third accommodating chamber 133 to the sub-pixels B. The structure of the transfer substrate 12 after passing through the third accommodation chamber 133 is shown in fig. 6.
In the method for manufacturing a display panel according to this embodiment, after step S3, the transfer substrate 12 may be further detected to determine whether each sub-pixel corresponds to one micro led, and if the sub-pixel without the micro led is found on the transfer substrate 12, the sub-pixel needs to be manually added. In addition, in this embodiment, in order to ensure that one sub-pixel only adsorbs one micro light emitting diode, the voltage applied to the pixel electrode corresponding to each sub-pixel may be controlled to control the adsorption force of the sub-pixel on the micro light emitting diode, so that the adsorption force of one sub-pixel is only enough to adsorb one micro light emitting diode.
The method for manufacturing a display panel according to this embodiment further includes fixing the micro light emitting diodes 14R, 14G, and 14B to the transfer substrate 12 and stopping configuring the magnetism for the transfer substrate 12. That is, after the micro light emitting diodes 14R, 14G, and 14B are transferred to the transfer substrate 12, the transfer substrate 12 continuously sucks the micro light emitting diodes 14R, 14G, and 14B. At this time, the micro light emitting diodes 14R, 14G and 14B are fixed on the transfer substrate 12 by a certain technical means, and in the present embodiment, the micro light emitting diodes 14R, 14G and 14B are fixed on the transfer substrate 12 by soldering. After the step of fixedly attaching the micro light emitting diodes 14R, 14G, and 14B is completed, the micro light emitting diodes 14R, 14G, and 14B are not attracted to the transfer substrate by the attraction force, and the magnetic configuration of the transfer substrate 12 may be stopped.
In this embodiment, if it is found that a plurality of micro light emitting diodes are adsorbed to one sub-pixel during the process of fixedly connecting the micro light emitting diodes 14R, 14G and 14B, only one sub-pixel is selected to be fixedly connected to the sub-pixel, and after the configuration of magnetism for the transfer substrate 12 is stopped, the remaining non-fixed micro light emitting diodes can be automatically released because of no adsorption force.
In the method for manufacturing a display panel according to this embodiment, the electrodes 141 of the micro light emitting diodes (including the micro light emitting diodes 14R, 14G, and 14B) are configured with magnetism, and the magnetic suspension device 11 having the same magnetism as the electrodes of the micro light emitting diodes is used to make the micro light emitting diodes in a suspension state, and the transfer substrate 12 is configured with magnetism opposite to the electrodes of the micro light emitting diodes to attract the micro light emitting diodes to the transfer substrate 12, so that the transfer of a large number of micro light emitting diodes can be realized in a short time, which is beneficial to improving the manufacturing efficiency of the display panel.
It will be appreciated by those skilled in the art that the above embodiments are illustrative only and not intended to be limiting, and that suitable modifications and variations may be made to the above embodiments without departing from the true spirit and scope of the invention.
Claims (10)
1. A method for manufacturing a display panel is characterized by comprising the following steps:
step S1, providing a plurality of light emitting diodes, wherein each light emitting diode comprises an electrode with magnetism;
step S2, providing a magnetic suspension device having the same magnetic property as the electrode, and placing the light emitting diodes in the magnetic field of the magnetic suspension device to make the light emitting diodes in a suspended state;
step S3, providing a transfer substrate, positioning the leds between the transfer substrate and the magnetic levitation device, and configuring the transfer substrate with a magnetic property opposite to the magnetic property of the electrodes to attract the leds to the transfer substrate.
2. The method of claim 1, wherein at least some of the plurality of light emitting diodes are configured to emit a first color light and at least some of the light emitting diodes are configured to emit a second color light;
the light emitting diodes emitting the first color light and the second color light are sequentially adsorbed onto the transfer substrate.
3. The method of manufacturing a display panel according to claim 2, wherein the number of light emitting diodes for emitting the first color light is equal to the number of light emitting diodes for emitting the second color light.
4. The method of claim 2, wherein the step of providing a plurality of light emitting diodes comprises receiving a light emitting diode emitting the first color light in a first receiving cavity and a light emitting diode emitting the second color light in a second receiving cavity;
the step of configuring the transfer substrate with a magnetic property opposite to a magnetic property of the electrodes of the plurality of light emitting diodes to attract the plurality of light emitting diodes to the transfer substrate includes:
and configuring magnetism opposite to the magnetism of the electrodes of the plurality of light-emitting diodes for the transfer substrate, and moving the transfer substrate to pass through the first accommodating cavity and the second accommodating cavity in sequence so as to sequentially adsorb the light-emitting diodes emitting the first color light and the light-emitting diodes emitting the second color light to the transfer substrate.
5. The method according to claim 4, wherein a plurality of sub-pixels arranged in an array are defined on the transfer substrate, and when the plurality of light emitting diodes are adsorbed on the transfer substrate, the plurality of sub-pixels correspond to the plurality of light emitting diodes one to one.
6. The method of manufacturing a display panel according to claim 5, wherein while moving the transfer substrate through the first accommodating chamber, magnetism opposite to that of the electrodes of the plurality of light emitting diodes is provided only for sub-pixels of the transfer substrate corresponding to the light emitting diodes emitting the first color light; when the transfer substrate is moved to pass through the second accommodating cavity, the sub-pixels of the light emitting diodes which correspondingly emit the first color light and the sub-pixels of the light emitting diodes which correspondingly emit the second color light on the transfer substrate are configured with magnetism opposite to the magnetism of the electrodes of the light emitting diodes.
7. The method according to claim 5, wherein each of the sub-pixels corresponds to a pixel electrode; the step of configuring the transfer substrate with a magnetic property opposite to the magnetic property of the electrodes of the plurality of light emitting diodes comprises:
and configuring magnetism opposite to that of the electrodes of the plurality of light-emitting diodes for the pixel electrode corresponding to each sub-pixel on the transfer substrate.
8. The method for manufacturing a display panel according to claim 7, wherein the step of configuring the pixel electrode corresponding to each of the sub-pixels on the transfer substrate with a magnetic property opposite to that of the electrodes of the plurality of light emitting diodes comprises:
and applying a preset voltage to the pixel electrode corresponding to each sub-pixel on the transfer substrate to enable the pixel electrode to generate magnetism opposite to the magnetism of the electrodes of the plurality of light-emitting diodes.
9. The method for manufacturing a display panel according to claim 1, wherein the step S3 is followed by further comprising:
and fixedly connecting each light-emitting diode to the transfer substrate and stopping configuring magnetism for the transfer substrate.
10. A display panel manufacturing system, comprising:
at least one accommodating cavity for accommodating a plurality of light emitting diodes, each of the light emitting diodes including an electrode having magnetism;
the magnetic suspension device has the same magnetism as that of the electrode, so that the plurality of light-emitting diodes accommodated in the accommodating cavity are positioned in the magnetic field of the magnetic suspension device and are in a suspension state; and
and the transfer substrate is movably arranged relative to the at least one accommodating cavity, and generates magnetism opposite to the magnetism of the electrodes of the plurality of light-emitting diodes when passing through any one accommodating cavity so as to attract the plurality of light-emitting diodes.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910604708.0A CN110323309B (en) | 2019-07-05 | 2019-07-05 | Display panel manufacturing method and display panel manufacturing system |
| TW108124396A TWI735910B (en) | 2019-07-05 | 2019-07-10 | Display panel manufacture method, display panel manufacture system, and active matrix substrate |
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| CN201910604708.0A CN110323309B (en) | 2019-07-05 | 2019-07-05 | Display panel manufacturing method and display panel manufacturing system |
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| CN110323309B true CN110323309B (en) | 2020-11-13 |
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| CN110634906B (en) * | 2019-10-30 | 2021-10-01 | 深圳市思坦科技有限公司 | Light-emitting diode display |
| CN111584519B (en) * | 2020-05-25 | 2024-01-23 | 京东方科技集团股份有限公司 | Driving backboard, transfer method of light-emitting diode chip and display device |
| CN116936438A (en) * | 2022-03-30 | 2023-10-24 | 深超光电（深圳）有限公司 | Mass transfer system and mass transfer method |
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| KR102416621B1 (en) * | 2015-08-31 | 2022-07-05 | 삼성디스플레이 주식회사 | A light emitting diode transfer |
| KR101874993B1 (en) * | 2016-12-28 | 2018-07-05 | 피에스아이 주식회사 | Electrical contacts improved nano-scale LED electrode assembly and manufacturing method thereof |
| CN208352323U (en) * | 2018-06-29 | 2019-01-08 | 江西兆驰半导体有限公司 | A kind of light-emitting diode chip for backlight unit transfer device |
| CN109003966B (en) * | 2018-07-23 | 2020-10-23 | 上海天马微电子有限公司 | Display panel and manufacturing method thereof |
| CN109065692A (en) * | 2018-08-01 | 2018-12-21 | 厦门多彩光电子科技有限公司 | A kind of packaging method of LED |
| CN109273565B (en) * | 2018-10-15 | 2021-02-02 | 华映科技（集团）股份有限公司 | Transfer method of micro light-emitting diode chip |
| CN109524512B (en) * | 2018-11-15 | 2020-07-03 | 华中科技大学 | Method for transferring micro light-emitting diode in huge amount based on controllable micro-reflector array |
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| CN110323309A (en) | 2019-10-11 |
| TW202103355A (en) | 2021-01-16 |
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