CN109564397B - Measuring apparatus, exposure apparatus, and method of manufacturing article - Google Patents
Measuring apparatus, exposure apparatus, and method of manufacturing article Download PDFInfo
- Publication number
- CN109564397B CN109564397B CN201780048850.0A CN201780048850A CN109564397B CN 109564397 B CN109564397 B CN 109564397B CN 201780048850 A CN201780048850 A CN 201780048850A CN 109564397 B CN109564397 B CN 109564397B
- Authority
- CN
- China
- Prior art keywords
- substrate
- distribution
- height
- detection
- processing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A measuring apparatus that measures a height distribution of a surface having a larger height deviation in one direction than that in the other direction with respect to a substrate having the surface with the larger height deviation in the other direction than the first direction and the second direction different from each other, the measuring apparatus comprising: a detection unit that detects the height of a detection target portion in a detection area; and a processing unit configured to obtain a height distribution of the surface of the substrate in a scanning direction by relatively scanning the substrate and the detection region, wherein the processing unit obtains the height distribution of the surface of the substrate in the first direction as a first distribution by relatively scanning the substrate and the detection region in the first direction, determines whether or not a height deviation in the first distribution is equal to or greater than a reference value, and obtains the height distribution of the surface of the substrate in the second direction by relatively scanning the substrate and the detection region in the second direction when it is determined that the height deviation in the first distribution is smaller than the reference value.
Description
Technical Field
The present invention relates to a measuring apparatus for measuring a height distribution of a surface of a substrate, an exposure apparatus, and a method for manufacturing an article.
Background
In the manufacture of flat panels such as liquid crystal panels and organic EL panels or semiconductor devices, an exposure apparatus is used in which a pattern of a mask is transferred onto a substrate such as a glass plate or a wafer coated with a resist through a projection optical system. In the case of such an exposure apparatus, it is preferable to previously obtain a height distribution of the surface of the substrate because the surface of the substrate is arranged on an image formation plane (focal plane) of the projection optical system in accordance with a position on the substrate to be exposed in the exposure of the substrate. Patent document 1 proposes a method in which: the thickness distribution of the substrate and the height distribution of the holding surface holding the substrate are measured in advance, and the height distribution of the surface of the substrate held on the holding surface is determined based on the measurement results.
Patent document 1: japanese patent laid-open No. 2006-156508
Disclosure of Invention
Problems to be solved by the invention
In a measuring apparatus for measuring a height distribution of a surface of a substrate, a height of a detection target portion in a detection region may be detected. In such a measuring apparatus, the height distribution of the surface of the substrate can be measured by detecting the height of the surface of the substrate in the detection area while relatively scanning the substrate and the detection area. However, when the detection of the height of the surface is performed while scanning the detection area over the entire surface of the substrate, the detection requires a corresponding time, which may be disadvantageous in terms of throughput.
Accordingly, an object of the present invention is to provide a technique advantageous for shortening the time for measuring the height distribution of the surface of the substrate.
Means for solving the problems
In order to achieve the above object, a measuring apparatus as one aspect of the present invention measures a height distribution of a surface having a larger height deviation in one direction than the other direction with respect to a substrate having the surface with the height deviation in the other direction than the first direction and the second direction different from each other, the measuring apparatus including: a detection unit that detects the height of a detection target portion in a detection area; and a processing unit configured to obtain a height distribution of the surface of the substrate in a scanning direction by relatively scanning the substrate and the detection region, wherein the processing unit obtains the height distribution of the surface of the substrate in the first direction as a first distribution by relatively scanning the substrate and the detection region in the first direction, determines whether or not a height deviation in the first distribution is equal to or greater than a reference value, and obtains the height distribution of the surface of the substrate in the second direction by relatively scanning the substrate and the detection region in the second direction when it is determined that the height deviation in the first distribution is smaller than the reference value.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, for example, it is possible to provide a technique advantageous for shortening the time for measuring the height distribution of the surface of the substrate.
Other features and advantages of the present invention will become apparent from the following description, which refers to the accompanying drawings. In the accompanying drawings, the same or similar structures are denoted by the same reference numerals.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic diagram showing the structure of an exposure apparatus.
Fig. 2 is a diagram showing variations in thickness of the glass substrate.
Fig. 3 is a flowchart showing a distribution information generation method according to the first embodiment.
Fig. 4 is a diagram showing a state in which the height of the surface of the substrate is detected by the focus detection unit.
Fig. 5 is a diagram showing a substrate having a plurality of pattern regions.
Fig. 6 is a flowchart showing a distribution information generation method according to the second embodiment.
Fig. 7 is a diagram for explaining the detection principle of the thickness of the substrate.
Detailed Description
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the drawings, the same components and elements are denoted by the same reference numerals, and redundant description thereof is omitted.
< first embodiment >
An exposure apparatus 100 according to a first embodiment of the present invention will be described with reference to fig. 1. Fig. 1 is a schematic diagram showing the structure of an exposure apparatus 100. The exposure apparatus 100 can include, for example, an illumination optical system 1, a mask stage 3 for holding a mask 2, a projection optical system 4, a substrate stage 6 for holding a substrate 5, a position measurement section 7, a focus detection section 8, a processing section 9, and a control section 10. The control unit 10 is constituted by a computer having a CPU, a memory, and the like, for example, and controls a process of transferring the pattern of the mask 2 onto the substrate 5 (a process of exposing the substrate 5).
The illumination optical system 1 uniformly illuminates the mask 2 held by the mask stage 3 with light emitted from a light source (not shown). The projection optical system 4 has a predetermined projection magnification and projects the pattern of the mask 2 onto the substrate 5. The substrate stage 6 includes, for example, a substrate chuck 6a for holding the substrate 5 and a substrate driving unit 6b for driving the substrate chuck 6a (substrate 5), and is configured to be movable in a direction (XY direction) orthogonal to the optical axis of the projection optical system 4. The position measuring unit 7 includes, for example, a laser interferometer for measuring the position of the substrate stage 6. The laser interferometer irradiates a laser beam onto a reflection plate 11 provided on the substrate stage 6, and detects the displacement of the substrate stage 6 using the laser beam reflected by the reflection plate 11. Thus, the position measuring unit 7 can obtain the current position of the substrate stage 6 based on the displacement detected by the laser interferometer.
The focus detection unit 8 detects the height of a detection target portion in the detection area. For example, the focus detection section 8 can include a light source that obliquely enters light to the surface of the substrate 5 and an image sensor having a plurality of pixels arranged two-dimensionally. The focus detection unit 8 detects the height of the detection target portion in the region (detection region) of the surface of the substrate 5 into which light is obliquely incident, based on the position on the image sensor at which the light reflected by the surface of the substrate is incident.
The processing unit 9 is constituted by a computer including, for example, a CPU, a memory, and the like, and obtains the height distribution of the surface of the substrate 5 based on the detection result of the focus detection unit 8. For example, the processing unit 9 causes the focus detection unit 8 to detect the height of the surface of the substrate 5 in the detection area while relatively scanning the substrate 5 and the detection area of the focus detection unit 8 in one of the in-plane directions (XY directions) of the substrate 5 by the substrate stage 6. Thereby, the processing section 9 can obtain the height distribution of the surface of the substrate 5 in this direction (scanning direction). Here, the processing unit 9 of the present embodiment is configured separately from the control unit 10, but may be configured integrally with the control unit 10. Further, the focus detection section 8 and the processing section 9 constitute a measuring device for measuring the height distribution of the surface of the substrate 5. In the present embodiment, the measuring device is provided inside the exposure apparatus 100, but may be provided outside the exposure apparatus 100.
In the exposure apparatus 100 configured as described above, during exposure of the substrate 5, the control unit 10 can control the projection image of the projection optical system 4 so that the surface of the substrate 5 is arranged on the image forming surface (focal surface) of the projection optical system 4 in accordance with the position to be exposed (position of the irradiation region) on the substrate. The control of the projected image can be performed, for example, by driving an optical element (lens) provided in the projection optical system 4 or by driving the substrate 5 in a direction parallel to the optical axis of the projection optical system 4 by the substrate stage 6. Therefore, the exposure apparatus 100 preferably acquires distribution information indicating a height distribution within the surface of the substrate 5 (the entire surface of the substrate 5) in advance. However, in the measuring apparatus, when the detection area is scanned over the entire surface of the substrate and the focus detection section 8 is caused to detect the height of the surface, a corresponding time is required in the detection, which may be disadvantageous in terms of throughput.
Therefore, the measuring apparatus of the first embodiment reduces the number of times of relatively scanning the substrate 5 and the detection region and causing the focus detection section 8 to detect the height of the surface of the substrate 5 by utilizing the tendency (characteristic) of the height distribution in the surface of the substrate 5 caused by the manufacturing method of the substrate 5. That is, in the measuring apparatus of the first embodiment, the distribution information is generated without performing the detection of the height of the surface of the substrate 5 by the focus detection section 8 over the entire surface of the substrate 5. This can significantly shorten the time for measuring the height distribution of the surface of the substrate 5. Hereinafter, a tendency of the height distribution of the surface of the substrate 5 and a method of generating distribution information by the method of manufacturing the substrate 5 will be described.
First, the tendency of the height distribution of the surface of the substrate 5 due to the method of manufacturing the substrate 5 will be described. For example, assume a case where a transparent rectangular glass substrate used in a liquid crystal device or the like is used as the substrate 5. A glass substrate (plate) is manufactured by extending in a certain direction using a float method, a fusion method, or the like. The glass substrate manufactured by this manufacturing method can have a substantially uniform thickness in the extending direction, but may have a variation in thickness in a direction orthogonal to the extending direction (hereinafter, orthogonal direction) due to local temperature variation or temperature fluctuation around the glass substrate during manufacturing.
For example, when a glass substrate having a rectangular shape with a thickness of 500 μm and a size of 1.5m × 1.8m is actually manufactured, as shown in fig. 2, the variation in thickness in the extending direction of the glass substrate is 1.4 μm, while the variation in thickness in the orthogonal direction is 12 μm. That is, the thickness deviation in the orthogonal direction is about 1 bit larger than the thickness deviation in the extending direction. This indicates that the thickness distribution in the orthogonal direction (i.e., the surface height distribution in the orthogonal direction) tends to be the same for each of the plurality of positions in the extending direction. Therefore, if the height distribution of the surface of the substrate 5 in the orthogonal direction can be measured, the height distribution of the entire surface of the substrate 5 can be found by interpolating (estimating) the height of the entire surface of the substrate 5 from the measurement result.
In this way, in the surface (surface to be subjected to exposure processing) of the glass substrate, the height deviation in one direction is larger than the height deviation in the other direction than the mutually different first direction and second direction. Here, the first direction and the second direction may be directions parallel to two sides orthogonal to each other among the sides of the surface of the glass substrate (substrate 5). However, when the height distribution of the surface of the glass substrate is measured, it is not known which of the first direction and the second direction is the orthogonal direction in which the height deviation (thickness deviation) is large.
Therefore, the processing unit 9 relatively scans the substrate 5 and the detection area of the focus detection unit 8 in the first direction, and thereby obtains the height distribution of the surface of the substrate 5 in the first direction as a first distribution. At this time, if the height deviation in the first distribution is equal to or greater than the reference value, the first direction corresponds to the orthogonal direction in which the height deviation is large. On the other hand, in the case where the height deviation in the first distribution is smaller than the reference value, the second direction corresponds to the orthogonal direction. In this case, the processing unit 9 obtains the height distribution of the surface of the substrate 5 in the second direction by relatively scanning the substrate 5 and the detection area of the focus detection unit 8 in the second direction. Here, the reference value is set to a value between a deviation in thickness that may occur in the extending direction of the substrate 5 (glass substrate) and a deviation in thickness that may occur in the orthogonal direction. In addition, the "height" (of the surface of the substrate) "in the present embodiment can include a concept of" thickness (of the substrate) ". That is, "height distribution (of the surface of the substrate)" can include the concept of "thickness distribution (of the substrate)".
Next, a method of generating distribution information will be described with reference to fig. 3 and 4. Fig. 3 is a flowchart showing a method of generating distribution information, and fig. 4 is a diagram showing a state in which the height of the surface of the substrate 5 is detected by the focus detection unit 8. The respective steps of the flowchart shown in fig. 3 can be performed by the processing unit 9.
In S11, the processing unit 9 performs the following processing (first-direction detection processing) as indicated by the arrow 20a in fig. 4: the height of the surface of the substrate 5 is detected by the focus detection section 8 while relatively scanning the substrate 5 and the detection area of the focus detection section 8 along a first direction (for example, the X direction). The detection process of the first direction may be performed a plurality of times, but from the viewpoint of throughput, it is preferable to perform the detection process of the first direction only once. Thereby, the processing portion 9 can obtain the height distribution of the surface of the substrate 5 in the first direction. Hereinafter, the height distribution of the surface of the substrate 5 in the first direction obtained in the step of S11 is referred to as a "first distribution". Here, the detection process of the first direction in S11 can be performed at an arbitrary position (coordinate) in the second direction.
In S12, the processing unit 9 determines whether or not the height deviation in the first distribution is equal to or greater than a reference value. As the height deviation in the first distribution, the difference between the maximum value and the minimum value of the height in the first distribution can be used, but the present invention is not limited to this, and for example, the value of the standard deviation in the first distribution may also be used. When the height deviation in the first distribution is equal to or greater than the reference value, it is determined (specified) that the first direction corresponds to the orthogonal direction in which the height deviation of the surface of the substrate 5 is relatively large, and the process proceeds to S13. In this case, the processing section 9 generates the distribution information from the first distribution, instead of relatively scanning the detection areas of the substrate 5 and the focus detection section 8 in the second direction.
In S13, the processing section 9 also estimates that the height distribution of the surface of the substrate 5 in the direction parallel to the first direction is the first distribution for each of the plurality of positions in the second direction, and generates distribution information. For example, the processing section 9 generates the distribution information by directly applying the first distribution as a height distribution of the surface of the substrate 5 in each of a plurality of directions that respectively pass through a plurality of positions in the second direction and are parallel to the first direction. As described above, since the variation in the thickness of the substrate 5 in the extending direction of the substrate 5 is very small, it can be assumed that the variation in the thickness does not occur. Therefore, even if the processing unit 9 generates the distribution information using only the first distribution as described above, it is possible to reduce an error in the height distribution with respect to the actual surface of the substrate 5.
On the other hand, in S12, in the case where the height deviation in the first distribution is smaller than the reference value, it is determined (determined) that the second direction corresponds to the orthogonal direction of the substrate 5, and the process proceeds to S14. In S14, the processing unit 9 performs the following processing (second direction detection processing) as indicated by the arrow 20b in fig. 4: the substrate 5 and the detection area of the focus detection section 8 are relatively scanned along a second direction (for example, Y direction) while the focus detection section 8 detects the height of the surface of the substrate 5. The detection process of the second direction may be performed a plurality of times, but it is preferable to perform the detection process of the second direction only once from the viewpoint of throughput. Thereby, the processing portion 9 can obtain the height distribution in the second direction in the substrate 5. Hereinafter, the height distribution in the second direction obtained in the step of S14 is referred to as "second distribution". Here, the detection process of the second direction in S14 can be performed at an arbitrary position (coordinate) in the first direction.
As shown in fig. 5, a plurality of pattern regions 5a (irradiation regions) in which base patterns (device patterns) have already been formed may be arranged on a substrate 5 to be detected for the height of the surface by a measuring device. In this case, in S11 and S14, when the height within the pattern region is detected by the focus detection section 8, an error may occur in the detection result due to the base pattern formed in this pattern region 5 a. Therefore, it is preferable that the height be detected by the focus detection unit 8 in the gap region 5b (scribe line region) provided between the plurality of pattern regions 5 a. Therefore, the processing unit 9 preferably relatively scans the substrate 5 and the detection region based on layout information indicating the layout (arrangement) of the plurality of pattern regions 5a so that the height is detected by the focus detection unit 8 in the gap region 5 b. For example, the layout information may be acquired by actually measuring the positions of the plurality of pattern regions 5a, or may be design information of the positions of the plurality of pattern regions 5 a.
In S15, the processing section 9 interpolates (estimates) the heights of the undetected portions, which are not detected by the focus detection section 8, in the surface of the substrate 5 based on the first distribution acquired in S11 and the second distribution acquired in S14, thereby generating distribution information. The interpolation of the heights of the undetected portions can be performed by applying the result of correcting the first distribution by the height at the prescribed position in the second distribution as the height distribution in the direction passing through the prescribed position in the second direction and parallel to the first direction.
For example, the processing section 9 acquires the first distribution by performing the detection processing of the first direction at the position Y1 of the second direction in the process of S11, and acquires the second distribution by performing the detection processing of the second direction at the position X1 of the first direction in the process of S14. In this case, the processing section 9 applies, as the height distribution in the direction passing through the position Yi in the second direction and parallel to the first direction, a result (distribution) obtained by correcting the first distribution based on the difference between the height at the position Y1 and the height at the position Yi obtained by the second distribution. In this way, the processing unit 9 can interpolate the height of the undetected portion to generate distribution information by similarly applying the result of correcting the first distribution to each of the plurality of positions in the second direction. Here, in S15, the distribution information is generated using two distributions, that is, the first distribution and the second distribution, but the present invention is not limited to this, and the distribution information may be generated using only the second distribution.
As described above, the measuring apparatus according to the first embodiment generates the distribution information based on the first distribution when the height deviation in the first distribution obtained by the detection processing in the first direction is equal to or greater than the reference value. On the other hand, when the height deviation in the first distribution is smaller than the reference value, the second distribution is obtained by performing the detection processing in the second direction, and the distribution information is generated based on the first distribution and the second distribution. By measuring the height distribution of the surface of the substrate 5 in this manner, the time required for measuring the height distribution can be significantly shortened, which is advantageous in terms of throughput. Here, in the first embodiment, an example in which the measurement device (the processing unit 9) performs processing for generating the distribution information is described, but the present invention is not limited to this. For example, the measurement device may perform only the process of generating the first distribution or the first and second distributions, and the control unit 10 of the exposure apparatus 100, an external computer, or the like may perform the process of generating the distribution information. In this case, the processing unit 9 acquires distribution information generated by the control unit 10 of the exposure apparatus 100, an external computer, or the like.
< second embodiment >
In the second embodiment, another example related to a method of generating distribution information is described. In the second embodiment, first, the detection processing in the first direction and the detection processing in the second direction are performed, and the height of the undetected portion is interpolated (estimated) based on the first distribution and the second distribution thus obtained, thereby generating distribution information. Fig. 6 is a flowchart showing a distribution information generation method according to the second embodiment. Each step of the flowchart shown in fig. 6 can be performed by the processing unit 9.
In S21, the processing unit 9 performs the first direction detection processing. The detection process of the first direction may be performed a plurality of times, but it is preferable to perform the detection process of the first direction only once from the viewpoint of throughput. Thereby, the processing portion 9 can obtain the height distribution of the surface of the substrate 5 in the first direction. The height distribution of the surface of the substrate 5 in the first direction obtained in the step of S21 is hereinafter referred to as "first distribution". Here, the detection processing in the first direction can be performed at an arbitrary position (coordinate) in the second direction.
In S22, the processing unit 9 performs the second direction detection processing. The detection process of the second direction may be performed a plurality of times, but it is preferable to perform the detection process of the second direction only once from the viewpoint of throughput. Thereby, the processing portion 9 can obtain the height distribution of the surface of the substrate 5 in the second direction. The height distribution of the surface of the substrate 5 in the second direction obtained in the step of S22 is hereinafter referred to as "second distribution". Here, the detection processing in the second direction can be performed at an arbitrary position (coordinate) in the first direction.
In S23, the processing section 9 generates distribution information by interpolating (estimating) the height of the undetected portion based on the first distribution acquired in S21 and the second distribution acquired in S22. The step of S23 is the same as the step of S15 in the flowchart of fig. 3, and therefore, the description thereof is omitted. By generating the distribution information in this manner, the time required for measuring the height distribution of the surface of the substrate 5 can be significantly shortened, which is advantageous in terms of throughput.
< third embodiment >
In the first and second embodiments, the example in which the height of the surface of the substrate 5 is detected by the focus detection unit 8 is described, but in the third embodiment, the example in which the height of the surface of the substrate 5 is replaced by the thickness of the substrate 5 is described. In this case, the processing unit 9 causes the focus detection unit 8 to detect the height of the holding surface of the substrate stage 6 (substrate chuck 6a) in advance, and acquires information indicating the height distribution of the holding surface in advance. Then, the processing unit 9 obtains information indicating the thickness distribution of the substrate 5 based on the result of causing the focus detection unit 8 to detect the thickness of the substrate 5 according to the flowchart shown in fig. 3 or 6. Thus, the processing unit 9 can obtain information (distribution information) indicating the height distribution in the surface of the substrate 5 held by the substrate stage 6 based on the information indicating the height distribution of the holding surface of the substrate stage 6 and the information indicating the thickness distribution of the substrate 5.
Here, the principle of detecting the thickness of the substrate 5 by the focus detection unit 8 will be described with reference to fig. 7. The focus detection unit 8 may include a light source 8a that emits light having a wavelength of about 500nm to 1200nm, and an image sensor 8b that is configured by a CCD, a CMOS, or the like, for example, and may be configured to obliquely enter light emitted from the light source 8a into the substrate 5 (e.g., a glass substrate). The light emitted from the light source 8a (position a) and obliquely incident on the position B of the surface of the substrate 5 is divided into light reflected by the surface of the substrate 5 and light entering the inside of the substrate. The light reflected by the surface of the substrate 5 is incident on a position E on the image sensor. On the other hand, the light entering the inside of the substrate 5 is reflected at a position C on the back surface of the substrate 5, passes through a position D on the front surface of the substrate 5, and enters a position F on the image sensor. Since the difference between the position E and the position F on the image sensor corresponds to the thickness t of the substrate 5, the focus detection unit 8 can determine the thickness t of the substrate 5 based on the difference.
< embodiment of Process for producing article >
The method of manufacturing an article according to the embodiment of the present invention is suitable for manufacturing articles such as electronic devices such as semiconductor devices and devices having a microstructure, for example. The method of manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate (a step of exposing the substrate) using the exposure apparatus, and a step of developing the substrate on which the latent image pattern has been formed in the step. The above-mentioned manufacturing method may further include other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, soldering, packaging, and the like). The method of manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article, as compared with conventional methods.
< other examples >
The present invention can also be realized by the following processing: a program for realizing one or more functions of the above embodiments is supplied to a system or an apparatus via a network or a storage medium, and one or more processors in a computer of the system or the apparatus read out and execute the program. The present invention can also be realized by a circuit (for example, ASIC) that realizes one or more functions.
The present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Accordingly, the following claims are made in order to disclose the scope of the invention.
This application claims priority based on Japanese patent application No. 2016-.
Claims (15)
1. A measuring apparatus for measuring a height distribution of a surface of a substrate having a surface with a larger height deviation in one direction than a height deviation in the other direction, the surface having a larger height deviation in the other direction than the first direction and the second direction, the measuring apparatus comprising:
a detection unit that detects the height of the surface of the substrate in a detection area; and
a processing unit that obtains a height distribution of a surface of the substrate in a scanning direction by relatively scanning the substrate and the detection region,
wherein the processing unit obtains a height distribution of the surface of the substrate in the first direction as a first distribution by relatively scanning the substrate and the detection region in the first direction, determines whether or not a height deviation in the first distribution is a reference value or more, and obtains the height distribution of the surface of the substrate in the second direction by relatively scanning the substrate and the detection region in the second direction when it is determined that the height deviation in the first distribution is smaller than the reference value.
2. The measuring device of claim 1,
the substrate includes a plurality of pattern regions where a pattern is formed and a gap region disposed between the plurality of pattern regions,
the processing section relatively scans the substrate and the detection region based on layout information of the plurality of pattern regions so that the detection section performs height detection in the gap region.
3. The measuring device of claim 1,
the processing unit obtains the first distribution by relatively scanning the substrate and the detection region only once in the first direction, and obtains the height distribution of the surface of the substrate in the second direction by relatively scanning the substrate and the detection region only once in the second direction when it is determined that the height deviation in the first distribution is smaller than the reference value.
4. The measuring device of claim 1,
the substrate has a rectangular shape and the substrate has a rectangular shape,
the first direction and the second direction are respectively parallel to two mutually orthogonal sides among sides of the surface of the substrate.
5. The measuring device of claim 1,
the processing unit acquires distribution information indicating a height distribution within the surface of the substrate generated from the first distribution when it is determined that the height deviation in the first distribution is equal to or greater than the reference value.
6. The measuring device of claim 1,
the processing unit generates distribution information indicating a height distribution within the surface of the substrate from the first distribution when it is determined that the height deviation in the first distribution is equal to or greater than the reference value.
7. The measuring device of claim 1,
the processing unit generates distribution information indicating a height distribution within the surface of the substrate from the first distribution without relatively scanning the substrate and the detection area in the second direction when it is determined that the height deviation in the first distribution is equal to or greater than the reference value.
8. A measuring device according to claim 6,
the processing unit estimates that the height distribution of the surface of the substrate in the direction parallel to the first direction is the first distribution for the plurality of positions in the second direction and generates the distribution information when it is determined that the height deviation in the first distribution is equal to or greater than the reference value.
9. The measuring device of claim 1,
the processing unit generates distribution information indicating a height distribution within the surface of the substrate based on the height distribution of the surface of the substrate in the second direction when it is determined that the height deviation in the first distribution is smaller than the reference value.
10. The measurement arrangement according to claim 9,
the processing unit generates the distribution information based on the first distribution when determining that the height deviation in the first distribution is smaller than the reference value.
11. The measuring device of claim 1,
the processing unit interpolates the height of an undetected portion of the surface of the substrate, which is not detected by the detecting unit, based on the first distribution and the height distribution of the surface of the substrate in the second direction, when determining that the height deviation in the first distribution is smaller than the reference value, thereby generating distribution information indicating the height distribution within the surface of the substrate.
12. The measuring device of claim 1,
the height deviation in the first distribution comprises a difference between a maximum and a minimum of the heights in the first distribution.
13. The measuring device of claim 1,
comprising a stage having a holding surface for holding the substrate,
the detection unit detects the thickness of the substrate, and determines the height of the surface of the substrate held by the holding surface based on the detection result of the thickness of the substrate and information indicating the height distribution of the holding surface.
14. An exposure apparatus for exposing a substrate, comprising:
a projection optical system that projects a pattern of a mask onto the substrate;
the measurement apparatus according to claim 1, which measures a height distribution of a surface of the substrate; and
a control unit that controls exposure of the substrate based on a measurement result of the measurement device.
15. A method of manufacturing an article, comprising:
exposing a substrate using the exposure apparatus according to claim 14; and
a step of developing the substrate exposed in the step,
wherein the article is obtained from the developed substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-154946 | 2016-08-05 | ||
| JP2016154946A JP6704813B2 (en) | 2016-08-05 | 2016-08-05 | Measuring apparatus, exposure apparatus, and article manufacturing method |
| PCT/JP2017/022039 WO2018025515A1 (en) | 2016-08-05 | 2017-06-15 | Measuring device, exposure device, and method for manufacturing article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109564397A CN109564397A (en) | 2019-04-02 |
| CN109564397B true CN109564397B (en) | 2021-01-29 |
Family
ID=61073384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780048850.0A Active CN109564397B (en) | 2016-08-05 | 2017-06-15 | Measuring apparatus, exposure apparatus, and method of manufacturing article |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6704813B2 (en) |
| KR (1) | KR102137986B1 (en) |
| CN (1) | CN109564397B (en) |
| WO (1) | WO2018025515A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114026499A (en) * | 2019-07-04 | 2022-02-08 | Asml荷兰有限公司 | Uncorrectable error in metrology |
| JP7475185B2 (en) | 2020-04-10 | 2024-04-26 | キヤノン株式会社 | MEASUREMENT METHOD, IMPRINT APPARATUS, AND PRODUCTION METHOD OF ARTICLE |
| JP7489829B2 (en) * | 2020-05-21 | 2024-05-24 | キヤノン株式会社 | Processing device, measuring method and article manufacturing method |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06249621A (en) * | 1993-02-24 | 1994-09-09 | Sumitomo Heavy Ind Ltd | Instrument for measuring film thickness distribution |
| JP4405241B2 (en) * | 2002-11-19 | 2010-01-27 | 株式会社 液晶先端技術開発センター | Exposure method, exposure apparatus and processing apparatus for glass substrate for liquid crystal display |
| US20050134816A1 (en) * | 2003-12-22 | 2005-06-23 | Asml Netherlands B.V. | Lithographic apparatus, method of exposing a substrate, method of measurement, device manufacturing method, and device manufactured thereby |
| JP2006156508A (en) | 2004-11-26 | 2006-06-15 | Nikon Corp | Method of deciding target value, moving method, exposing method, exposing device, and lithography system |
| JP2006349351A (en) * | 2005-06-13 | 2006-12-28 | Matsushita Electric Ind Co Ltd | Three-dimensional microstructure measuring method |
| TWI590005B (en) * | 2006-08-31 | 2017-07-01 | 尼康股份有限公司 | Exposure method and exposure apparatus, and device manufacturing method |
| JP5406623B2 (en) | 2009-08-10 | 2014-02-05 | キヤノン株式会社 | Measuring apparatus, exposure apparatus, and device manufacturing method |
| JP2012132754A (en) * | 2010-12-21 | 2012-07-12 | Panasonic Corp | Texture evaluation device, texture evaluation method |
| WO2013061976A1 (en) * | 2011-10-24 | 2013-05-02 | 株式会社日立製作所 | Shape inspection method and device |
| JP6014572B2 (en) | 2013-11-06 | 2016-10-25 | Ｊｆｅスチール株式会社 | Thickness measuring device, thickness measuring method and corrosion depth measuring method |
| JP6491833B2 (en) * | 2014-07-31 | 2019-03-27 | 株式会社日立ハイテクノロジーズ | Height measuring device |
| JP6033987B1 (en) * | 2014-12-19 | 2016-11-30 | Hoya株式会社 | Mask blank substrate, mask blank and manufacturing method thereof, transfer mask manufacturing method, and semiconductor device manufacturing method |
-
2016
- 2016-08-05 JP JP2016154946A patent/JP6704813B2/en active Active
-
2017
- 2017-06-15 CN CN201780048850.0A patent/CN109564397B/en active Active
- 2017-06-15 KR KR1020197005133A patent/KR102137986B1/en active IP Right Grant
- 2017-06-15 WO PCT/JP2017/022039 patent/WO2018025515A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018022114A (en) | 2018-02-08 |
| KR20190032486A (en) | 2019-03-27 |
| WO2018025515A1 (en) | 2018-02-08 |
| KR102137986B1 (en) | 2020-07-27 |
| CN109564397A (en) | 2019-04-02 |
| JP6704813B2 (en) | 2020-06-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI572993B (en) | Method for determining a process window for a lithographic process, associated apparatuses and a computer program | |
| KR102191685B1 (en) | Projection exposure apparatus and method | |
| TWI518464B (en) | Lithographic apparatus and monitoring method | |
| TW201717297A (en) | Indirect determination of a processing parameter | |
| CN109564397B (en) | Measuring apparatus, exposure apparatus, and method of manufacturing article | |
| TW201729003A (en) | Methods for identifying a process window boundary | |
| KR102078079B1 (en) | Exposure apparatus, exposure method, and article manufacturing method | |
| JP6267530B2 (en) | Exposure apparatus and article manufacturing method | |
| JP2015056449A (en) | Method for determining position, exposure method and method of producing article | |
| KR102242152B1 (en) | Lithography apparatus and article manufacturing method | |
| KR102566155B1 (en) | Patterning method, lithography apparatus, and article manufacturing method | |
| TWI474129B (en) | Method for a lithographic apparatus | |
| US10133177B2 (en) | Exposure apparatus, exposure method, and article manufacturing method | |
| JP2016100590A (en) | Focus control method, pattern transfer apparatus, and manufacturing method of article | |
| CN109932876B (en) | Measuring device, lithographic apparatus, method of manufacturing article, and measuring method | |
| JP6688330B2 (en) | Exposure method, exposure apparatus, determination method, and article manufacturing method | |
| JP6185724B2 (en) | Exposure apparatus and article manufacturing method | |
| CN110244518B (en) | Determining method, exposure apparatus, article manufacturing method, and storage medium | |
| TWI627497B (en) | Lithographic apparatus and device manufacturing method | |
| JP2016009767A (en) | Exposure device and method of manufacturing article | |
| JP2019090885A (en) | Lithography apparatus, lithography method, decision method, and article manufacturing method | |
| US11397384B2 (en) | Signal recognition during substrate patterning via digital photolithography | |
| JP2020109531A (en) | Exposure device, exposure method and method for producing article | |
| JP2023077924A (en) | Exposure apparatus, exposure method, and article manufacturing method | |
| JP2014203984A (en) | Measuring device, measuring method, lithography device, and method of manufacturing article |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |