CN109564397A - The manufacturing method of measuring device, exposure device and article - Google Patents
The manufacturing method of measuring device, exposure device and article Download PDFInfo
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- CN109564397A CN109564397A CN201780048850.0A CN201780048850A CN109564397A CN 109564397 A CN109564397 A CN 109564397A CN 201780048850 A CN201780048850 A CN 201780048850A CN 109564397 A CN109564397 A CN 109564397A
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- substrate
- height
- distribution
- measuring device
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Abstract
A kind of measuring device, the height distribution on the surface is measured for the substrate with the biggish surface of height tolerance compared with the height tolerance on a direction in mutually different first direction and second direction on another direction, the measuring device includes: test section, is detected to the height at the test object position in detection zone；And processing unit, its height distribution that the surface of the substrate on scanning direction is found out by relatively scanning the substrate and the detection zone, wherein, the processing unit is by relatively scanning the substrate and the detection zone along the first direction, it is distributed to find out the height distribution on the surface of the substrate on the first direction as first, judge height tolerance in first distribution whether on the basis of it is more than value, in the case where the height tolerance being judged as in first distribution is less than a reference value, the distribution of the height on the surface of the substrate in the second direction is found out by relatively scanning the substrate and the detection zone along the second direction.
Description
Technical field
The present invention relates to measuring device, the systems of exposure device and article of a kind of height distribution on surface for measuring substrate
Make method.
Background technique
In the manufacture of the plates such as liquid crystal display panel, organic EL panel or semiconductor equipment, a kind of pattern by mask is used
The exposure device being transferred to via projection optical system on the substrates such as the glass plate for being coated with resist, wafer.In this exposure
In the case where device, in the exposure of substrate, with the position on the substrate to be exposed correspondingly by the surface configuration of substrate in throwing
The imaging surface (focus face) of shadow optical system, therefore the height distribution on the surface of substrate is preferably found out in advance.In patent document 1
It proposes a kind of following method: measuring the height distribution of the thickness distribution and the retaining surface for keeping the substrate of substrate respectively in advance,
The height distribution on the surface for the substrate being maintained in retaining surface is found out hereby based on the measurement result.
Patent document 1: Japanese Unexamined Patent Publication 2006-156508 bulletin
Summary of the invention
Problems to be solved by the invention
In the measuring device of the height distribution on the surface of measurement substrate, sometimes to the test object position in detection zone
Height detected.It, can be by being directed at inspection on one side the relatively scanning substrate and detection zone while in this measuring device
The height on the surface for the substrate surveyed in region is detected to measure the distribution of the height on the surface of substrate.However, when spreading base
The whole surface of plate detection of the Scanning Detction region to carry out the height on the surface when, which needs the corresponding time,
It may be unfavorable on this aspect of handling capacity.
Therefore, the purpose of the present invention is to provide a kind of times of the height distribution on surface for being conducive to shorten measurement substrate
Technology.
The solution to the problem
To achieve the goals above, the measuring device as a side of the invention, which is directed to, has and mutually different the
The biggish surface of height tolerance on another direction is compared with the height tolerance on a direction in second direction in one direction
Substrate measure the surface height distribution, which includes: test section, to the test object position in detection zone
Height detected；And processing unit, scanning side is found out by relatively scanning the substrate and the detection zone
The height on the surface of the upward substrate is distributed, wherein the processing unit is by relatively scanning institute along the first direction
Substrate and the detection zone are stated, is used as first point to find out the height distribution on surface of the substrate on the first direction
Cloth, judge height tolerance in first distribution whether on the basis of it is more than value, be judged as described first be distributed in height
In the case that deviation is less than a reference value, asked by relatively scanning the substrate and the detection zone along the second direction
The height distribution on the surface of the substrate in the second direction out.
The effect of invention
According to the present invention, for example, be capable of providing a kind of surface for being conducive to shorten measurement substrate height distribution time
Technology.
Other features and advantages of the present invention can be specified by referring to the following description of appended attached drawing.In addition,
In appended attached drawing, identical reference number is marked to identical or same structure.
Detailed description of the invention
Appended attached drawing includes in the description, constituting the part of specification and showing embodiments of the present invention, is used
Illustrate the principle of the present invention while the attached drawing appended by describing.
Fig. 1 is the synoptic diagram for indicating the structure of exposure device.
Fig. 2 is the figure for indicating the deviation of thickness of glass substrate.
Fig. 3 is the flow chart for indicating the generation method of distributed intelligence involved in first embodiment.
Fig. 4 is the figure for indicating to be detected the situation of the height on the surface of substrate by focus detection part.
Fig. 5 is the figure for indicating to have the substrate of multiple area of the pattern.
Fig. 6 is the flow chart for indicating the generation method of distributed intelligence involved in second embodiment.
Fig. 7 is the figure for the testing principle for illustrating the thickness of substrate.
Specific embodiment
Hereinafter, illustrating the preferred embodiments of the present invention referring to appended attached drawing.In addition, in the various figures, to same structure
Part or even element mark same reference number, and the repetitive description thereof will be omitted.
<first embodiment>
The exposure device 100 of first embodiment according to the present invention is illustrated referring to Fig.1.Fig. 1 is to indicate to expose
The synoptic diagram of the structure of electro-optical device 100.Exposure device 100 can include for example lamp optical system 1, for keeping mask 2
Mask platform 3, projection optical system 4, the Substrate table 6 for keeping substrate 5, position measurement portion 7, focus detection part 8, processing unit 9
And control unit 10.Control unit 10 turns the pattern of mask 2 to control such as by constituting with computer CPU, memory
The processing (processing for exposing substrate 5) printed on substrate 5.
Lamp optical system 1 using from the light of light source injection (not shown) to the mask 2 kept by mask platform 3 equably into
Row illumination.Projection optical system 4 has defined projection multiplying power, for the pattern of mask 2 to be projected to substrate 5.Substrate table 6
It such as include the substrate chuck 6a for keeping substrate 5 and the substrate driving portion for being driven to substrate chuck 6a (substrate 5)
6b, and be configured to mobile along the direction (XY direction) orthogonal with the optical axis of projection optical system 4.Position measurement portion 7
It include such as laser interferometer, for measuring the position of Substrate table 6.Laser interferometer is shone to the reflecting plate 11 for being set to Substrate table 6
Laser is penetrated, the displacement of Substrate table 6 is detected using the laser reflected by reflecting plate 11.As a result, position measurement portion 7 can based on by
What laser interferometer detected is displaced to find out the current location of Substrate table 6.
Focus detection part 8 detects the height at the test object position in detection zone.For example, focus detection part 8
It can include the light source for making the oblique surface for being mapped to substrate 5 of light and the imaging sensor with the multiple pixels two-dimensionally arranged.
Moreover, focus detection part 8 is based on by the position on the incident imaging sensor of the light of the surface reflection of substrate, to detect substrate
The height by the test object position in the region of oblique incidence light (in detection zone) in 5 surface.
Processing unit 9 is constituted such as the computer by including CPU, memory, and the testing result based on focus detection part 8 is asked
The height distribution on the surface of substrate 5 out.For example, processing unit 9 is on one side using Substrate table 6 along the direction (side XY in the face of substrate 5
To) in a direction relatively scanning substrate 5 and focus detection part 8 detection zone, make 8 pairs of focus detection part detections on one side
The height on the surface of the substrate 5 in region is detected.Processing unit 9 can obtain on this direction (scanning direction) as a result,
The height on the surface of substrate 5 is distributed.Here, the processing unit 9 of present embodiment is dividually constituted with control unit 10, but can also be with
Control unit 10 is integrally formed.In addition, focus detection part 8 and processing unit 9 constitute the height distribution on the surface for measuring substrate 5
Measuring device.In the present embodiment, which is arranged in the inside of exposure device 100, but also can be set and exposing
The outside of electro-optical device 100.
In the case where exposure device 100 constituted like this, in the exposure of substrate 5, it can be controlled using control unit 10
The projection image of projection optical system 4 processed, so that with the position to be exposed (position of irradiation area) on substrate correspondingly by base
The surface configuration of plate 5 is in the imaging surface (focus face) of projection optical system 4.Such as it can be by being set to projection optical system
4 optical element (lens) drive or is driven using Substrate table 6 along the direction parallel with the optical axis of projection optical system 4
Dynamic substrate 5, to carry out the control of the projection image.Therefore, exposure device 100 preferably obtains (base in the surface for indicating substrate 5 in advance
The whole surface of plate 5) height distribution distributed intelligence.However, being swept in measuring device when the whole surface throughout substrate
When retouching detection zone and focus detection part 8 being made to detect the height on the surface, the corresponding time is needed in the detection, in handling capacity
It may be unfavorable on this aspect.
Therefore, the measuring device of first embodiment passes through the surface using the substrate 5 as caused by the manufacturing method of substrate 5
The tendency (feature) of interior height distribution reduces relatively scanning substrate 5 and detection zone and focus detection part 8 is made to detect base
The number of the height on the surface of plate 5.That is, in the measuring device of first embodiment, without throughout the entire of substrate 5
The detection that the height on the surface of substrate 5 is outwardly carried out by focus detection part 8 just generates distributed intelligence.Thereby, it is possible to significantly
Shorten the time of the height distribution on the surface of measurement substrate 5.Hereinafter, to the surface of substrate 5 caused by the manufacturing method as substrate 5
Height distribution tendency and the generation method of distributed intelligence be illustrated.
Firstly, being illustrated to the tendency of the height distribution on the surface of substrate 5 caused by the manufacturing method as substrate 5.Example
Such as, it is assumed that the case where glass substrate of transparent rectangular shape used in liquid crystal apparatus etc. is used as substrate 5.By using
Floating method, melting method etc. extend to manufacture glass substrate (making sheet) along some direction.The glass produced by this manufacturing method
Glass substrate can make thickness generally uniform in the direction of extension, but in the direction orthogonal with extending direction (hereinafter, being set as orthogonal side
To) on, since the temperature variation or temperature fluctuation of the part around in manufacture lead to thickness there may be deviations.
For example, having in actually manufacture with a thickness of the glass substrate of 500 μm, the rectangular shape that size is 1.5m × 1.8m
When, as shown in Fig. 2, the deviation of the thickness on the extending direction of glass substrate is 1.4 μm, on the other hand, on orthogonal direction
The deviation of thickness is 12 μm.That is, the thickness deviation on orthogonal direction is about 1 bigger than the thickness deviation on extending direction.This is indicated
For each position in multiple positions of extending direction, the thickness distribution on orthogonal direction is (that is, the surface on orthogonal direction
Height is distributed) it is same tendency.Thus, if it is possible to the height distribution for measuring the surface of the substrate 5 on orthogonal direction then can
It is enough that interpolation (estimation) is carried out to find out the whole surface of substrate 5 according to height of the measurement result to the whole surface of substrate 5
Height is distributed.
In this way, in the surface (face that be exposed processing) of glass substrate, with mutually different first direction and
The height tolerance on a direction in two directions is larger compared to the height tolerance on another direction.Here, first direction and
Second direction distinguishes parallel direction when can be mutually orthogonal in two with the surface of glass substrate (substrate 5).So
And when measuring the distribution of the height on surface of the glass substrate, it is not known which direction in first direction and second direction is
The big orthogonal direction of height tolerance (thickness deviation).
Therefore, processing unit 9 is by the detection zone along first direction relatively scanning substrate 5 and focus detection part 8, to ask
The height distribution on the surface of the substrate 5 on first direction is as the first distribution out.At this point, if first distribution in height tolerance
On the basis of value more than, then first direction is corresponding with the big orthogonal direction of height tolerance.On the other hand, the height in the first distribution
In the case that deviation is less than a reference value, second direction is corresponding with orthogonal direction.In this case, processing unit 9 is by along second party
The height point on the surface of the substrate 5 in second direction is found out to the relatively detection zone of scanning substrate 5 and focus detection part 8
Cloth.Here, a reference value be set on the extending direction of substrate 5 (glass substrate) deviation of issuable thickness with just
Hand over the value on direction between the deviation of issuable thickness.In addition, " (surface of substrate) height " in present embodiment
It can include the concept of " (substrate) thickness ".That is, " (surface of substrate) height is distributed " can include " (substrate) thickness
The concept of distribution ".
Then, it is illustrated referring to generation method of the Fig. 3 and Fig. 4 to distributed intelligence.Fig. 3 is the generation for indicating distributed intelligence
The flow chart of method, Fig. 4 are the figures for indicating to be detected the situation of the height on the surface of substrate 5 by focus detection part 8.In addition, Fig. 3 institute
The each process of the flow chart shown can be carried out by processing unit 9.
In S11, processing unit 9 carries out the following processing the (detection of first direction such as being indicated with arrow 20a of Fig. 4
Processing): relatively the detection zone of scanning substrate 5 and focus detection part 8 makes coke to an edge first direction (such as X-direction) on one side
Point test section 8 detects the height on the surface of substrate 5.The detection processing of multiple first direction can also be carried out, but is based on handling capacity
Viewpoint, preferably only carry out a first direction detection processing.Processing unit 9 can obtain the substrate 5 on first direction as a result,
Surface height distribution.Claim hereinafter, the height on the surface of the substrate 5 on first direction obtained in process by S11 is distributed
For " the first distribution ".Here, can arbitrary position (coordinate) in a second direction carry out the detection of the first direction in S11
Processing.
In S12, processing unit 9 judge the height tolerance in the first distribution whether on the basis of it is more than value.As the first distribution
In height tolerance, be able to use the difference of the maxima and minima of the height in the first distribution, but it is not limited to this, for example,
Also the standard deviation that can be used in the first distribution is equivalent.The situation on the basis of height tolerance in the first distribution more than value
Under, judge that (determination) is corresponding with the bigger orthogonal direction of the height tolerance on the surface of substrate 5 as first direction, and enter S13.
In this case, the not instead of relatively detection zone of scanning substrate 5 and focus detection part 8 in a second direction of processing unit 9, root
Distributed intelligence is generated according to the first distribution.
In S13, processing unit 9 is also estimated as and first party for each position in multiple positions in second direction
The height distribution on the surface of the substrate 5 on parallel direction is the first distribution, and generates distributed intelligence.For example, processing unit 9 is logical
It crosses directly using the first distribution as multiple positions for being each passed through in second direction and the multiple directions parallel with first direction
In all directions on substrate 5 surface height distribution, Lai Shengcheng distributed intelligence.As described above, in the extending direction of substrate 5
In, the deviation of the thickness of substrate 5 is very small, therefore can assume that the deviation for not generating the thickness.Therefore, even if processing unit 9
Distributed intelligence is generated using only the first distribution as described above, can also reduce the height on the surface relative to actual substrate 5
Spend the error of distribution.
On the other hand, in S12, in the case that the height tolerance in the first distribution is less than a reference value, judge (determination)
It is corresponding with the orthogonal direction of substrate 5 for second direction, and enter S14.In S14, such as Fig. 4's of processing unit 9 is used shown in arrow 20b
As carry out processing (detection processing of second direction) below: relatively scan in a second direction (such as Y-direction) on one side
The detection zone of substrate 5 and focus detection part 8 makes the height on the surface of the detection substrate 5 of focus detection part 8 on one side.It can carry out more
The detection processing of secondary second direction, but the viewpoint based on handling capacity preferably only carry out the detection processing of a second direction.By
This, processing unit 9 can obtain the height distribution in a second direction in substrate 5.Hereinafter, by obtained in the process in S14
The height distribution of second direction is known as " the second distribution ".Here, can arbitrary position (coordinate) in a first direction carry out
The detection processing of second direction in S14.
As shown in figure 5, being arranged in the substrate 5 of the object of the detection for the height for carrying out surface by measuring device sometimes
Formd multiple area of the pattern 5a (irradiation area) of base pattern (equipment pattern).In this case, in S11 and S14,
When by height in 8 detection pattern region of focus detection part, sometimes due to the base pattern formed in area of the pattern 5a
And testing result is caused to generate error.It is therefore preferable that in the (drawn area gap area 5b being set between multiple area of the pattern 5a
Domain) in by focus detection part 8 carry out height detection.Thus, processing unit 9 is preferably based on the layout for indicating multiple area of the pattern 5a
The layout information of (configuration) relatively scanning substrate 5 and detection zone, so that being carried out in gap area 5b by focus detection part 8
The detection of height.Such as both layout information, layout information can be obtained by the position of the multiple area of the pattern 5a of actual measurement
It is also possible to the design information of the position of multiple area of the pattern 5a.
In S15, processing unit 9 is based on the first distribution got in S11 and the second distribution pair got in S14
The height of the non-detection part not detected by focus detection part 8 in the surface of substrate 5 carries out interpolation (estimation), thus gives birth to
At distributed intelligence.Obtained by capable of being corrected with the height at the specified position in the second distribution to the first distribution by application
Result as the height distribution across the specified position of second direction and on the direction parallel with first direction, Lai Jinhang do not examine
Survey the interpolation of the height of part.
For example, processing unit 9 is at the detection in the process of S11 by carrying out first direction at the position Y1 of second direction
Reason passes through the detection processing of progress second direction at position X1 in a first direction to obtain the first distribution in the process of S14
To obtain the second distribution.In this case, the application of processing unit 9 is to be distributed height and the position at obtained position Y1 according to second
The difference of height at Yi is corrected obtained result (distribution) to the first distribution, as the position Yi for passing through second direction
And the height distribution on the direction parallel with first direction.In this way, processing unit 9 passes through in multiple positions in second direction
Similarly to correct the first distribution obtained as a result, it is possible to carry out to the height of non-detection part slotting for application for each position
Value generates distributed intelligence.Here, be distributed both distributions in S15 using the first distribution and second and generate distributed intelligence,
But it is not limited to this, can also generate distributed intelligence using only the second distribution.
As described above, the first distribution that the measuring device of first embodiment is obtained in the detection processing by first direction
In height tolerance on the basis of be worth it is above in the case where, distributed intelligence is generated based on the first distribution.On the other hand, at first point
In the case that height tolerance in cloth is less than a reference value, the second distribution is found out by carrying out the detection processing of second direction, and
Distributed intelligence is generated based on the first distribution and the second distribution.It, can by measuring the height distribution on the surface of substrate 5 like this
Significantly shorten the time required for the measurement of height distribution, it can be advantageous on this aspect of handling capacity.Here, in the first embodiment party
In formula, the example for generate to measuring device (processing unit 9) processing of distributed intelligence is illustrated, and but it is not limited to this.
For example, measuring device can also only carry out generating the processing of the first distribution or the first distribution and the second distribution, and filled by exposure
Set 100 control unit 10, outer computer etc. carry out generate distributed intelligence processing.In this case, processing unit 9 is obtained by exposing
The distributed intelligence of the generations such as the control unit 10 of electro-optical device 100, outer computer.
<second embodiment>
In this second embodiment, illustrate another example related with the generation method of distributed intelligence.In the second embodiment party
In formula, first progress first direction detection processing and second direction detection processing, based on it is thus obtained first distribution and
Second distribution carries out interpolation (estimation) to the height of non-detection part, thus generates distributed intelligence.Fig. 6 is to indicate the second embodiment party
The flow chart of the generation method of distributed intelligence involved in formula.The each process of flow chart shown in fig. 6 can by processing unit 9 into
Row.
In S21, processing unit 9 carries out the detection processing of first direction.The detection processing of multiple first direction can be carried out,
But the viewpoint based on handling capacity preferably only carries out the detection processing of a first direction.Processing unit 9 can obtain first as a result,
The height on the surface of the substrate 5 on direction is distributed.Below by the table of the substrate 5 on first direction obtained in the process in S21
The height distribution in face is referred to as " the first distribution ".Here, can arbitrary position (coordinate) in a second direction carry out first party
To detection processing.
In S22, processing unit 9 carries out the detection processing of second direction.The detection processing of multiple second direction can be carried out,
But the viewpoint based on handling capacity preferably only carries out the detection processing of a second direction.Processing unit 9 can obtain second as a result,
The height on the surface of the substrate 5 on direction is distributed.Below by the table of the substrate 5 in second direction obtained in the process in S22
The height distribution in face is known as " the second distribution ".Here, can arbitrary position (coordinate) in a first direction carry out second party
To detection processing.
In S23, processing unit 9 passes through based on the first distribution got in S21 and second point got in S22
Cloth carries out interpolation (estimation) to the height of non-detection part, Lai Shengcheng distributed intelligence.In the process of S23 and the flow chart of Fig. 3
The process of S15 is identical, therefore omits explanation herein.By generating distributed intelligence like this, it can significantly shorten substrate 5
It time needed for the measurement of the height distribution on surface, can be advantageous on this aspect of handling capacity.
<third embodiment>
In first embodiment and second embodiment, the height to the surface for detecting substrate 5 by focus detection part 8
Example is illustrated, but in the third embodiment, and the thickness for detecting substrate 5 replaces the height on the surface of detection substrate 5
The example of degree is illustrated.In this case, processing unit 9 makes detection Substrate table 6 (substrate chuck 6a) in advance of focus detection part 8
The height of retaining surface, and the information for indicating the height distribution of the retaining surface is obtained in advance.Then, processing unit 9 be based on according to Fig. 3 or
The thickness that flow chart shown in fig. 6 makes focus detection part 8 detect substrate 5 is obtained as a result, to find out the thickness for indicating substrate 5
The information of distribution.Processing unit 9 being capable of information and expression substrate 5 based on the height distribution for the retaining surface for indicating Substrate table 6 as a result,
The information of thickness distribution come the information that finds out the height distribution in the surface for indicating the substrate 5 kept by Substrate table 6, (distribution is believed
Breath).
Here, being illustrated referring to principle of the Fig. 7 to the thickness for detecting substrate 5 by focus detection part 8.Focus detection part 8
Such as it can be configured to include projecting the light source 8a for the light that wavelength is 500nm~1200nm or so and being made of CCD, CMOS etc.
Imaging sensor 8b, and make the light projected from light source 8a is oblique to be mapped to substrate 5 (such as glass substrate).From light source 8a (position A)
It projects and the light of the position B on the oblique surface for being mapped to substrate 5 is divided by the light of the surface reflection of substrate 5 and enters in substrate
The light in portion.The position E being incident on by the light of the surface reflection of substrate 5 on imaging sensor.On the other hand, substrate 5 is entered
Internal light reflects at the position C at the back side of substrate 5 and penetrates the position D on the surface of substrate 5, and is incident on imaging sensor
On position F.The difference of position E and position F on the imaging sensor correspond to the thickness t of substrate 5, therefore focus detection part 8
The thickness t of substrate 5 can be found out based on the difference.
<embodiment of the manufacturing method of article>
The manufacturing method of the article of embodiments of the present invention is for example suitable for manufacturing the electronic equipments such as semiconductor equipment, have
Element of minute structure and other items.The manufacturing method of the article of present embodiment includes being coated on base using above-mentioned exposure device
The process (process for making base plate exposure) of latent image pattern is formed in the emulsion of plate and makes to form sub-image figure in above-mentioned operation
The process of the substrate development of case.Above-mentioned manufacturing method further includes that other known processes (film forming, vapor deposition, adulterate, is flat by oxidation
Change, etching, resist removing, cutting, welding, encapsulation etc.).The manufacturing method of the article of present embodiment and previous method phase
Than being advantageous in terms of at least one of the performance of article, quality, productivity, production cost.
<other embodiments>
The present invention can also be realized by following processing: will realize the program of more than one function of above embodiment
It is supplied to system or device via network or storage media, the more than one processor in the computer of the system or device is read
Out and execute program.In addition, also can realize the present invention by realizing the circuit (for example, ASIC) of more than one function.
The present invention is not limited to above embodiment, as long as it does not depart from the spirit of the invention and range is just able to carry out respectively
Kind change and deformation.Thus, it attached claim below for open the scope of the present invention.
The Japanese patent application laid that the application was proposed by August 5th, 2016 is preferential to require based on being willing to 2016-154946
Power, is hereby incorporated its all contents.
Claims (15)
1. a kind of measuring device, for having and the height on a direction in mutually different first direction and second direction
Deviation measures the height distribution on the surface, the measuring device compared to the substrate on the biggish surface of height tolerance on another direction
It is characterized in that having:
Test section detects the height at the test object position in detection zone；And
Processing unit finds out the substrate on scanning direction by relatively scanning the substrate and the detection zone
The height on surface is distributed,
Wherein, the processing unit is by relatively scanning the substrate and the detection zone along the first direction, to find out
The height distribution on the surface of the substrate on the first direction judges the height in first distribution as the first distribution
Spend deviation whether on the basis of value more than, be judged as it is described first distribution in height tolerance be less than a reference value in the case where, lead to
It crosses and relatively scans the substrate and the detection zone along the second direction to find out the base in the second direction
The height on the surface of plate is distributed.
2. measuring device according to claim 1, which is characterized in that
The substrate includes the interstitial area to form figuratum multiple area of the pattern and be arranged between the multiple area of the pattern
Domain,
Layout information of the processing unit based on the multiple area of the pattern relatively scans the substrate and the detection zone
Domain, so that the test section carries out the detection of height in the gap area.
3. measuring device according to claim 1 or 2, which is characterized in that
The processing unit along substrate and the detection zone described in the first direction only relatively run-down by finding out
First distribution, in the case where the height tolerance being judged as in first distribution is less than a reference value, by along institute
Stating second direction, only relatively substrate and the detection zone described in run-down finds out the base in the second direction
The height on the surface of plate is distributed.
4. measuring device according to any one of claims 1 to 3, which is characterized in that
The substrate has rectangular shape,
The first direction and the second direction respectively mutually orthogonal two in the surface of the substrate while put down
Row.
5. measuring device according to any one of claims 1 to 4, which is characterized in that
The processing unit obtains root in the case where the height tolerance being judged as in first distribution is a reference value or more
The distributed intelligence that height in the surface of the expression substrate generated according to first distribution is distributed.
6. measuring device according to any one of claims 1 to 4, which is characterized in that
The processing unit is in the case where the height tolerance being judged as in first distribution is a reference value or more, according to institute
State the distributed intelligence for the height distribution that the first distribution generates in the surface for indicating the substrate.
7. measuring device according to any one of claims 1 to 4, which is characterized in that
The processing unit is in the case where the height tolerance being judged as in first distribution is a reference value or more, not along institute
It states second direction and relatively scans the substrate and the detection zone, being generated according to first distribution indicates the substrate
The distributed intelligence of height distribution in surface.
8. the measuring device according to any one of claim 5 to 7, which is characterized in that
The processing unit is directly answered in the case where the height tolerance being judged as in first distribution is a reference value or more
Use first distribution as multiple positions for being each passed through in the second direction and parallel with the first direction multiple
The height on the surface of the substrate in all directions in direction is distributed, and thus generates the distributed intelligence.
9. according to claim 1 to measuring device described in any one of 8, which is characterized in that
The processing unit is in the case where the height tolerance being judged as in first distribution is less than a reference value, based on described
The height on the surface of the substrate in second direction is distributed to generate point of the distribution of the height in the surface for indicating the substrate
Cloth information.
10. measuring device according to claim 9, which is characterized in that
The processing unit is also based on institute in the case where the height tolerance being judged as in first distribution is less than a reference value
The first distribution is stated to generate the distributed intelligence.
11. according to claim 1 to measuring device described in any one of 8, which is characterized in that
The processing unit is in the case where the height tolerance being judged as in first distribution is less than a reference value, based on described
First distribution and the second direction on the substrate surface high Degree distributions described in substrate surface in not by institute
The height for stating the non-detection part that test section is detected carries out interpolation, thus generates the height in the surface for indicating the substrate
The distributed intelligence of distribution.
12. according to claim 1 to measuring device described in any one of 11, which is characterized in that
Height tolerance in first distribution includes the difference of the maxima and minima of the height in first distribution.
13. according to claim 1 to measuring device described in any one of 12, which is characterized in that
Including having the platform for keeping the retaining surface of the substrate,
The test section detects the thickness of the substrate, the testing result and the expression retaining surface of the thickness based on the substrate
The information of height distribution find out the height on the surface of the substrate kept by the retaining surface.
14. a kind of exposure device, makes base plate exposure, which is characterised by comprising:
Projection optical system projects to the pattern of mask on the substrate；
According to claim 1 to measuring device described in any one of 13, the height distribution on the surface of the substrate is measured；
And
Control unit controls the exposure of the substrate based on the measurement result of the measuring device.
15. a kind of manufacturing method of article characterized by comprising
Make the process of base plate exposure using exposure device according to claim 14；And
The process for making the substrate exposed in the process develop,
Wherein, article is obtained from the substrate after development.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016154946A JP6704813B2 (en) | 2016-08-05 | 2016-08-05 | Measuring apparatus, exposure apparatus, and article manufacturing method |
| JP2016-154946 | 2016-08-05 | ||
| PCT/JP2017/022039 WO2018025515A1 (en) | 2016-08-05 | 2017-06-15 | Measuring device, exposure device, and method for manufacturing article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109564397A true CN109564397A (en) | 2019-04-02 |
| CN109564397B CN109564397B (en) | 2021-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201780048850.0A Active CN109564397B (en) | 2016-08-05 | 2017-06-15 | Measuring apparatus, exposure apparatus, and method of manufacturing article |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6704813B2 (en) |
| KR (1) | KR102137986B1 (en) |
| CN (1) | CN109564397B (en) |
| WO (1) | WO2018025515A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220365450A1 (en) * | 2019-07-04 | 2022-11-17 | Asml Netherlands B.V. | Non-correctable error in metrology |
| JP7475185B2 (en) | 2020-04-10 | 2024-04-26 | キヤノン株式会社 | MEASUREMENT METHOD, IMPRINT APPARATUS, AND PRODUCTION METHOD OF ARTICLE |
| JP2021184423A (en) * | 2020-05-21 | 2021-12-02 | キヤノン株式会社 | Processing apparatus, measuring method, and article manufacturing method |
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| JP2004184994A (en) * | 2002-11-19 | 2004-07-02 | Advanced Lcd Technologies Development Center Co Ltd | Method and device for exposure and processor |
| JP2006349351A (en) * | 2005-06-13 | 2006-12-28 | Matsushita Electric Ind Co Ltd | Three-dimensional microstructure measuring method |
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| CN104024793A (en) * | 2011-10-24 | 2014-09-03 | 株式会社日立制作所 | Shape inspection method and device |
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| JPH06249621A (en) * | 1993-02-24 | 1994-09-09 | Sumitomo Heavy Ind Ltd | Instrument for measuring film thickness distribution |
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| JP5406623B2 (en) * | 2009-08-10 | 2014-02-05 | キヤノン株式会社 | Measuring apparatus, exposure apparatus, and device manufacturing method |
| JP2012132754A (en) * | 2010-12-21 | 2012-07-12 | Panasonic Corp | Texture evaluation device, texture evaluation method |
| JP6014572B2 (en) * | 2013-11-06 | 2016-10-25 | Ｊｆｅスチール株式会社 | Thickness measuring device, thickness measuring method and corrosion depth measuring method |
| JP6491833B2 (en) * | 2014-07-31 | 2019-03-27 | 株式会社日立ハイテクノロジーズ | Height measuring device |
| KR102519334B1 (en) * | 2014-12-19 | 2023-04-07 | 호야 가부시키가이샤 | Substrate for mask blank, mask blank, methods for manufacturing substrate for mask blank and mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
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2016
- 2016-08-05 JP JP2016154946A patent/JP6704813B2/en active Active
-
2017
- 2017-06-15 CN CN201780048850.0A patent/CN109564397B/en active Active
- 2017-06-15 KR KR1020197005133A patent/KR102137986B1/en active IP Right Grant
- 2017-06-15 WO PCT/JP2017/022039 patent/WO2018025515A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004184994A (en) * | 2002-11-19 | 2004-07-02 | Advanced Lcd Technologies Development Center Co Ltd | Method and device for exposure and processor |
| CN1918518A (en) * | 2003-12-22 | 2007-02-21 | Asml荷兰有限公司 | Lithographic apparatus and method of measurement |
| JP2006349351A (en) * | 2005-06-13 | 2006-12-28 | Matsushita Electric Ind Co Ltd | Three-dimensional microstructure measuring method |
| CN101410945A (en) * | 2006-08-31 | 2009-04-15 | 株式会社尼康 | Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
| CN104024793A (en) * | 2011-10-24 | 2014-09-03 | 株式会社日立制作所 | Shape inspection method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6704813B2 (en) | 2020-06-03 |
| KR102137986B1 (en) | 2020-07-27 |
| CN109564397B (en) | 2021-01-29 |
| WO2018025515A1 (en) | 2018-02-08 |
| JP2018022114A (en) | 2018-02-08 |
| KR20190032486A (en) | 2019-03-27 |
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