CN109560018A - Substrate board treatment and substrate processing method using same - Google Patents

Substrate board treatment and substrate processing method using same Download PDF

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Publication number
CN109560018A
CN109560018A CN201811120882.XA CN201811120882A CN109560018A CN 109560018 A CN109560018 A CN 109560018A CN 201811120882 A CN201811120882 A CN 201811120882A CN 109560018 A CN109560018 A CN 109560018A
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CN
China
Prior art keywords
substrate
cup body
treatment fluid
treatment
fluid
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Granted
Application number
CN201811120882.XA
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Chinese (zh)
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CN109560018B (en
Inventor
古矢正明
山崎克弘
森秀树
林航之介
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Shibaura Mechatronics Corp
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Shibaura Engineering Works Co Ltd
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Publication of CN109560018A publication Critical patent/CN109560018A/en
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Publication of CN109560018B publication Critical patent/CN109560018B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)

Abstract

The present invention provides substrate board treatment and substrate processing method using same, can realize separation and recovery according to every kind for the treatment of fluid.Substrate board treatment successively supplies a variety for the treatment of fluids to handle substrate, comprising: remains the substrate rotating member of substrate (12) rotation；To the nozzle of the substrate supply treatment fluid rotated by substrate rotating member；It is located at around substrate and the cup body (51) for the treatment fluid that reception is dispersed from substrate；The various recycling piping (55) accordingly flowed through for the treatment fluid from cup body with the type of the received treatment fluid of cup body；Revolving member makes cup body horizontally rotate and cup body is switched to recycling corresponding with the type for the treatment of fluid and is piped be located at direction；And lift component, it goes up and down cup body along the vertical direction and is switched to following height and position: the 1st height and position for making cup body and recycling piping corresponding with the type for the treatment of fluid be connected by revolving member；With so that the received treatment fluid of cup body is flowed to the 2nd height and position in waste liquid path (61).

Description

Substrate board treatment and substrate processing method using same
Technical field
The present invention relates at the substrate board treatment and substrate to the substrate of rotation supply treatment fluid to carry out processing substrate Reason method.
Background technique
As semiconductor wafer or the surface processing device of photomask glass substrate, from the uniform of raising surface treatment Property, from the perspective of reproducibility, it is intended to using the single chip mode (piece leaf mode) for handling substrate one by one.In monolithic side In the substrate board treatment of formula, the horizontal substrate kept is made to be rotated about its center axis (spin) on one side, it on one side will be such as medical fluid Treatment fluid is supplied to the face center of substrate.It supplies to the treatment fluid of substrate and extends to due to centrifugal force the whole table of substrate Face.The processing of substrate entirety is carried out as a result,.When processing terminate for defined medical fluid, carry out for by flushing liquor to remaining on The flushing processing that the medical fluid of substrate surface is rinsed.Processing is rinsed to the substrate of rotation in the same manner as described above, is being rinsed After treatment makes substrate high speed rotation, carries out the drying process of substrate.
Treatment fluid (medical fluid or flushing liquor etc.) in the substrate board treatment of above-mentioned single chip mode, on the substrate of rotation The rotation body end of the rotary body kept due to centrifugal force from edge of substrate (outer peripheral edge of substrate) or to substrate is to outside substrate It disperses.The treatment fluid to disperse concentrates on the predetermined region in treatment trough and becomes waste liquid, or is recovered (example to recycle Such as, referring to patent document 1).
Patent document 1: No. 2533339 bulletins of Japanese Utility Model Registration Section No.
In the rotary processor of the substrate documented by patent document 1, it is being configured to around covering rotary chuck It is formed with leakage fluid dram on the bottom of inner pressurd vessel, in the position opposed with the leakage fluid dram, bucket portion part can be rotatably provided with, pass through Make the bucket portion part rotate, make in bucket portion part lower part 1 waste liquor stream egress selection be set to it is multiple on outer container 1 in discharge port (recovery approach) is opposed, and thereby, it is possible to realize the separation and recovery of a variety for the treatment of fluids.
But in the rotary processor of the substrate documented by patent document 1, make bucket along with the switching for the treatment of fluid When component rotates and waste liquid outflux is located in the position opposed with defined discharge port, waste liquid outflux is sometimes other Pass through above discharge port.Since used treatment fluid remains on bucket portion part so far, there is following risk: The Liquid Residue immerses in the discharge port except original discharge port.It, can be to the place based on separation and recovery if treatment fluid is mixed into It manages liquid and recycles generation obstacle.
Summary of the invention
The object of the present invention is to provide the substrate board treatments for the separation and recovery that can be carried out efficiently a variety for the treatment of fluids And substrate processing method using same.
In order to solve the above problems, substrate board treatment of the invention is configured to, and a variety for the treatment of fluids are successively supplied to base Substrate is handled on plate, wherein the substrate board treatment includes substrate rotating member, and it holds the substrates to be revolved Turn；Treatment fluid supply member supplies treatment fluid to the substrate rotated by the substrate rotating member；Cup body is set It is placed in around the substrate, receives the treatment fluid to disperse from the substrate；Various recovery approaches, they and the cup body The type of received treatment fluid is accordingly flowed through for the treatment fluid from the cup body；Revolving member makes the cup body Horizontally rotate, the cup body is switched to the direction that recovery approach corresponding with the type of the treatment fluid is located at；And Lift component makes the cup body go up and down along the vertical direction and be switched to the 1st height and position and the 2nd height and position, wherein described 1st height and position is that the cup body and recovery approach corresponding with the type of the treatment fluid is made to be connected by the revolving member Logical height and position, the 2nd height and position are that the received treatment fluid of the cup body is made to flow to the height in waste fluid channel Position.
In addition, substrate processing method using same of the invention is configured to, a variety for the treatment of fluids are successively supplied on substrate and handle base Plate, wherein the substrate processing method using same includes the step of rotating the substrate by substrate rotating member；By the processing Liquid is supplied to the step on the substrate rotated by the substrate rotating member；It is received using cup body from the substrate and is flown The step of scattered treatment fluid；The cup body is set to horizontally rotate and the cup body is switched to the type phase with the treatment fluid The step of direction that corresponding recovery approach is located at；The cup body is set to go up and down along the vertical direction and be moved to the 1st height and position The step of, wherein the 1st height and position is that the cup body and recovery approach corresponding with the type of the treatment fluid are connected Height and position；And the step of making the cup body be moved to 2 height and position, wherein the 2nd height and position be make it is described The received treatment fluid of cup body flows to the height and position in waste fluid channel.
In accordance with the invention it is possible to efficiently carry out the separation and recovery of a variety for the treatment of fluids.
Detailed description of the invention
Fig. 1 is the longitudinal sectional view (high bit after cup body rising of the substrate board treatment of the 1st embodiment of the invention Set (the 1st height and position)).
Fig. 2 is longitudinal sectional view (the relatively low level after cup body decline of the substrate board treatment of the 1st embodiment of the invention Set (the 2nd height and position)).
Fig. 3 is the cross-sectional view of the line A-A in Fig. 1.
Fig. 4 is the cross-sectional view of the line B-B in Fig. 2.
Fig. 5 A is to show treatment fluid from the outflow hole portion at the higher position (the 1st height and position) after cup body rising to recycling It is piped the partial sectional view (1) of outflow.
Fig. 5 B is to show treatment fluid from the outflow hole portion at the higher position (the 1st height and position) after cup body rising to recycling It is piped the partial sectional view (2) of outflow.
Fig. 5 C is to show treatment fluid from the outflow hole portion at the higher position (the 1st height and position) after cup body rising to recycling It is piped the partial sectional view (3) of outflow.
Fig. 6 A is that the exhaust gas including showing comprising treatment fluid is piped the part flowed out towards exhaust from the exhaust clearance of cup body Cross-sectional view (1).
Fig. 6 B is the partial cutaway that the exhaust gas including showing comprising treatment fluid is flowed out from the exhaust clearance of cup body to exhaust piping View (2).
Fig. 6 C is the partial cutaway that the exhaust gas including showing comprising treatment fluid is flowed out from the exhaust clearance of cup body to exhaust piping View (3).
Fig. 7 A is to show treatment fluid from the outflow hole portion at the lower position (the 2nd height and position) after cup body decline to waste liquid The partial sectional view (1) that path 61 is flowed out.
Fig. 7 B is to show treatment fluid from the outflow hole portion at the lower position (the 2nd height and position) after cup body decline to waste liquid The partial sectional view (2) that path 61 is flowed out.
Fig. 7 C is to show treatment fluid from the outflow hole portion at the lower position (the 2nd height and position) after cup body decline to waste liquid The partial sectional view (3) that path 61 is flowed out.
Fig. 8 is the cross-sectional view of the line C-C in Fig. 1.
Fig. 9 A is the partial perspective view of the recycling piping in the substrate board treatment of the 1st embodiment of the invention.
Fig. 9 B is the partial perspective view of the exhaust piping in the substrate board treatment of the 1st embodiment of the invention.
Figure 10 is the transverse sectional view of the substrate board treatment of the 2nd embodiment of the invention.
Figure 11 is the longitudinal sectional view for showing the variation 1 of cup body.
Figure 12 is the longitudinal sectional view for showing the variation 2 of cup body.
Label declaration
11,11a: substrate board treatment；
12: substrate；
13: rotary body；
15: cover portion；
18: clamping pin；
20 (20a~20d): nozzle；
21: power transmission body；
22: drive motor；
26a: rotor；
26b: stator；
33: swivel plate；
35: pin rotary body；
36: sub- gear；
37: female gear；
51,51a: cup body；
55 (55a~55c): recycling piping；
58: outflow hole portion；
61: waste liquid path；
62: waste liquid piping；
63: exhaust clearance；
65 (65a~65c): exhaust piping；
67: lifting shaft；
68: swivel becket；
69: motor；
71: roller；
72: lifting unit；
75: telescoping cylinder；
76: lifting guiding piece；
77: column component.
Specific embodiment
(the 1st embodiment)
Hereinafter, being illustrated using attached drawing to the 1st embodiment of the invention.
The basic structure of the substrate board treatment of the 1st embodiment of the invention is shown in FIG. 1 to FIG. 4.
In longitudinal sectional view, that is, Fig. 1 of the substrate board treatment of present embodiment, substrate board treatment 11 includes plectane The rotary body 13 of shape is used for the semiconductor wafer for making to be transported by the conveying machine people (not shown) as external device (ED) Equal substrates 12 rotate；With the cover portion 15 of circular plate shape, the top of the rotary body is located in a manner of covering rotary body 13.In cover In circumferential direction in the periphery side surface in portion 15, located in defined position with 60 degree of intervals configured with 6 swivel plates 17 (in Fig. 1 Illustrate only 2).In the upper surface of each swivel plate 17, at the central axis T eccentric position from swivel plate 17, it is equipped with to load The clamping pin 18 (4 are illustrated only in Fig. 1) that the substrate 12 being placed on rotary body 13 is kept and discharged.In substrate 12 Top configures the nozzle 20 of front (upper surface) supply treatment fluid (for example, etching solution, flushing liquor etc.) of oriented substrate 12 (20a,20b,20c,20d).On rotary body 13, it is provided integrally with the power transmission body of the cylinder part as rotary shaft 21, which is rotated by drive motor 22 drives.Also, rotary body 13 clamps pin 18 and 22 structure of drive motor At substrate rotating member.
Drive motor 22 is configured to rotor 26a and stator 26b.Rotor 26a perforation shape on the base plate 23 of lower part At circular through-hole 25 be configured, stator 26b is set to around rotor 26a in the lower section of base plate 23.As cylinder The upper end of the rotor 26a of component links into an integrated entity with the power transmission body 21 as cylinder part.Become such knot as a result, Structure: the rotor 26a of drive motor 22 rotates rotary body 13 by power transmission body 21, thus makes to clamp the base that pin 18 is kept Plate 12 rotates.Also, drive motor 22 is electrically connected with control unit 100, and driving basis is stored at the substrate in control unit 100 It manages information or various programs and is controlled.
In the hollow inside of rotor 26a and power transmission body 21, coaxially it is equipped with not with rotor 26a and power transmission body 21 The holding cylinder 27 of rotation.In the upper end of the holding cylinder 27, the nozzle head 28 of the recess portion with cone shape is installed, in the spray Mouth 28 is equipped with multiple nozzles 29 to the back side of substrate 12 injection treatment fluid etc..Each nozzle 29 and treatment fluid supply unit are (not Diagram) connection.In order to which the treatment fluid etc. that will be sprayed from each nozzle 29 is discharged, hollow tube body 31 is equipped in holding cylinder 27, it should One end of tube body 31 penetrates through nozzle head 28, connect with the bottom for the recess portion for being formed in nozzle head 28, the other end and exhausted bath box etc. are (not Diagram) connection.In addition, be formed with opening portion 15a in the center of cover portion 15, opening portion 15a is for making from nozzle 29 towards base The treatment fluid of the back side injection of plate 12 passes through.Nozzle 20 and nozzle 29 constitute treatment fluid supply member.Also, nozzle 29 be for The back side (being lower surface in Fig. 1) of substrate 12 is handled and is arranged, but (is being schemed in the front for only handling substrate 12 It is upper surface in 1) the case where, it also can be omitted nozzle 29.Also, according to the processing substrate information being stored in control unit 100 Or various programs, to control the supply for the treatment of fluid from nozzle 20 and nozzle 29.
In the lower surface for supporting each swivel plate 17 for clamping pin 18, coaxial (T) be combined with pin rotary body 35, also, The lower end of rotary body 35 is sold, coaxially (T) being combined with sub- gear 36 (in Fig. 1, illustrates only 2 pin rotary bodies 35 and sub- tooth Wheel is 36).Sub- gear 36 is engaged with female gear 37, which is arranged to and coaxial (the substrate rotary shaft of Fig. 1 of rotary body 13 S).Mother's gear 37 passes through the periphery that female gear-bearing 38 is located at power transmission body 21.Each pin rotary body 35 passes through cylindrical shape Bearing canister portion 41 positioned in a manner of it can rotate, the bearing canister portion 41 is located at plectane in the circumferential with 60 degree of interval (in Fig. 1,2 bearing canister portions 41 are illustrated only) in the rotary body 13 of shape.According to this structure, when rotary body 13 and female gear When 37 relative rotation, sub- gear 36, pin rotary body 35 and swivel plate 17 integrally rotate.When swivel plate 17 rotates, clamp Pin 18 is eccentrically rotated, and therefore, clamping pin 18 is kept according to the direction of rotation of swivel plate 17 or release substrate 12.
Fastening spring (torsion-coil spring) 42 as biasing member is installed on female gear 37.The fastening spring 42 Engage one end with rotary body 13, engage the other end with female gear 37, (is thus side counterclockwise when vertical view along direction of rotation To) exert a force to female gear 37.Sub- gear 36 sells rotary body 35 and swivel plate 17 and the sub- gear by along force clockwise as a result, 36 rotation linkage, clamps pin 18 and is eccentrically rotated to the center position of rotary body 13, abut and carry out with the outer peripheral surface of substrate 12 It keeps (lock state).
In addition, in order to release based on the lock state for clamping the substrate 12 that pin 18 is realized, as defined in base plate 23 Position is equipped with chuck and discharges cylinder 43.The piston rod 43a of chuck release cylinder 43 extends and connects with female gear 37, can prevent Female gear 37 rotates.
If making rotor by drive motor 22 in the state that cylinder 43 prevents female gear 37 from rotating discharging by chuck 26a and power transmission body 21 are rotated in the counterclockwise direction, then rotary body 13 is also rotated in the counterclockwise direction.As a result, with female gear The sub- gear 36 of 37 engagements is rotated in the counterclockwise direction.As a result, clamping pin 18 to the direction for the outer peripheral surface for leaving substrate 12 It is eccentrically rotated, therefore, is released from based on the hold mode for clamping the substrate 12 that pin 18 is realized.
Next, being illustrated to the cup body 51 for the treatment fluid that reception is dispersed from substrate 12.In rotary body 13 and cover portion 15 Periphery, equipped with the sidewall portion 13a stretched downward, the end of sidewall portion 13a be held in insertion cup body 51 inside At position, the cup body 51 is the cricoid container that top is opening portion.Cup body 51 as described later by lift component above and below It is mobile, but the end of sidewall portion 13a is always positioned at the inside of cup body 51.In the peripheral side of rotary body 13, from rotary body 13 every The cricoid movable liquid undertake part 53 that can be gone up and down is equipped at the position in gap as defined in opening.About movable liquid carrier Part 53, upper part are made of liquid carrier 53a, and the liquid carrier 53a is oblique by rolling towards the rotary shaft S of rotary body 13 Inclination peripheral wall and vertical peripheral wall constitute, the lower part of movable liquid undertake part 53 formed by the double-deck wall portion, the bilayer wall portion It is made of inside wall portion 53b and external side wall 53c, movable liquid undertake part 53 can be by lift drive mechanism (not shown) Execute lifting action.Also, the inside wall portion 53b of movable liquid undertake part 53 is in the following state always: having regulation Gap in the state of be inserted into the inside of cup body 51, thus, in order to avoid disperse from the treatment fluid that substrate 12 disperses to outside.Also, By making inside wall portion 53b and sidewall portion 13a be inserted into the inside of cup body 51, thereby, it is possible to will disperse from the end of substrate 12 Treatment fluid is guided to cup body 51.Movable liquid undertake part 53 is configuration as follows: position after it, which is in, rises When, the treatment fluid to disperse from the substrate 12 of rotation is received by liquid carrier and drips to the treatment fluid in cup body 51, At position after decline, avoids contacting with the fork of conveying machine people (not shown), thus allow for the replacement etc. of substrate 12.
Cup body 51 as annular container is the container being made of inner circumferential wall portion 51a, periphery wall portion 51b and week bottom 51c, All bottom 51c are the structures tilted down from inner circumferential wall portion 51a towards periphery wall portion 51b.About cup body 51, on the whole or extremely It is few at the part that treatment fluid flows into, by with water repellency and drug resistance fluidity material, formed such as fluororesin, alternatively, with The surface for the treatment of fluid contact carries out coating by fluororesin.Cup body 51 can be gone up and down by aftermentioned lift component 54.In periphery At a part of the contact of wall portion 51b and week bottom 51c, i.e. lowest part, it is formed with outflow hole portion (opening portion) 58.When cup body 51 When being positioned in the 1st height and position shown in FIG. 1 (rising end position), the outflow hole portion 58 and recycling are from the inflow of substrate 12 The recycling for managing liquid is piped 55 (recovery approaches) connection.In addition, when cup body 51 is located in the 2nd height and position shown in Fig. 2 (decline End position) when, outflow hole portion 58 is connect with waste liquid path 61, and the waste liquid path 61 is for giving up the treatment fluid flowed into from substrate 12 It abandons.
As shown in figure 3,55 (55a~55c) of recycling piping make the opening of end be inserted into waste liquid path 61 towards 51 side of cup body Periphery wall portion 61b and supported.Recycling piping 55 is configured according to the species number of the treatment fluid of recycling to be separated, in this reality It applies in mode, 3 piping 55a, 55b, 55c are located in circumferential direction setting of the state along cup body 51 of sustained height to be open.Such as Described afterwards, by horizontally rotating cup body 51 centered on central axis S, thereby, it is possible to position the outflow hole portion 58 of cup body 51 In the position of the open end of 1 corresponding with the type for the treatment of fluid recycling piping 55a (55b, 55c), so as to realize Recycling corresponding with the type for the treatment of fluid.
In Fig. 1, the waste liquid path 61 for being formed as annular container is equipped in the lower section of cup body 51.Waste liquid path 61 be by with The container that cricoid inner circumferential wall portion 61a, periphery wall portion 61b and week bottom 61c centered on substrate rotary shaft S are constituted, Being connected on all bottom 61c makes treatment fluid flow out to external waste liquid piping 62 as waste liquid.Waste liquid path 61 is not used to The container of waste liquid is stored, but the container of the waste liquid guiding waste liquid piping 62 for will be flowed into from outflow hole portion 58.Waste liquid path 61 and waste liquid piping 62 constitute waste fluid channel.Also, about waste liquid path 61, the on the whole or at least part that flows into for the treatment of fluid It is formed by the material of water repellency and drug resistance fluidity, alternatively, the surface contacted with treatment fluid can carry out coating by fluororesin.
Other than the treatment fluid being supplied on substrate 12, the gas (mist including the treatment fluid that is generated by the treatment fluid Gas inside) also across the inner circumferential wall portion 53b of movable liquid undertake part 53 and the periphery wall portion 51b of cup body 51 between Gap, and be discharged via the exhaust in the outside for the exhaust clearance 63 (referring to Fig.1, Fig. 9 B) for being located at recess portion piping 65, wherein institute State the outer peripheral surface that exhaust clearance 63 is formed in cup body 51.
As shown in figure 3, in the 1st embodiment, 65 (65a~65c) of exhaust piping have 3 exhausts be piped 65a, 65b, 65c.Also, exhaust 65 (65a~65c) of piping and exhaust clearance 63 constitute exhaust passage.Each exhaust piping 65a~65c's Inner surface of the one end in the periphery wall portion 61b in waste liquid path 61 is open, and the other end is connect with suction device (not shown).In periphery On wall portion 61b, when looking down, the opening of exhaust piping 65a is configured in the insertion section with mentioned-above recycling piping 55a At (interconnecting piece) opposed position.Equally, the opening of exhaust piping 65b is configured in (connect with the insertion section of recycling piping 55b Portion) at opposed position, the opening of exhaust piping 65c is configured in and recycles that be piped insertion section (interconnecting piece) of 55c opposed At position.When cup body 51 is in the higher position in up and down direction (the 1st height and position) by lift component 54, if by Aftermentioned revolving member horizontally rotates cup body 51 and makes to flow out hole portion 58 towards the open end of recycling piping 55a, then is flowing The symmetrical position of hole portion 58, the exhaust clearance 63 formed at 180 degree opposite side become the opening towards exhaust piping 65a out The configuration of end.In addition, make to flow out open end of the hole portion 58 towards recycling piping 55b if horizontally rotating cup body 51, Then exhaust clearance 63 is piped the open end of 65b towards exhaust, if further making to flow out hole portion 58 towards recycling piping 55c's Open end, then exhaust clearance 63 becomes the configuration of the open end towards exhaust piping 65c.Thereby, it is possible to will flow into cup body Treatment fluid in 51 is recycled from outflow hole portion 58 via 55 (55a~55c) of recycling piping, further, it is possible to will include mist Treatment fluid including gas from exhaust clearance 63 via exhaust piping 65 (65a~65c) be discharged to the outside, therefore, be formed as Can be realized treatment fluid be separately recovered and the exhaust respectively of the gas containing treatment fluid.
As shown in Figure 9 A, the open end of 55 (55a~55c) of recycling piping is connected to the periphery wall portion 51b of cup body 51, cup Body 51 can be in the open-ended upper sliding of recycling piping 55.In figure 9 a, treatment fluid is from the outflow hole portion 58 of cup body 51 (with void Line indicates) it flows into recycling piping 55a.In addition, as shown in Figure 9 B, the open end insertion of 65 (65a~65c) of exhaust piping is useless In the periphery wall portion 61b of fluid path diameter 61, the gas flowed into cup body 51 is passed through in the periphery of periphery wall portion 51b and waste liquid path 61 The exhaust clearance 63 (being represented by dotted lines) formed between wall portion 61b is flowed into afterwards in exhaust piping 65.Also, exhaust clearance 63 is upper Lower section is formed upwards with specific length, no matter 51 oscilaltion of cup body and in higher position (the 1st height and position) and compared with low level Which side in (the 2nd height and position) is set, gas can all flow into selected same exhaust and be piped in 65 (65a~65c).
In addition, as shown in Figure 2, Figure 4 shows, being formed as, when cup body 51 is in lower position (the 2nd height position in up and down direction Set) when, if horizontally rotating cup body 51 by aftermentioned revolving member makes to flow out in a top view hole portion 58 towards recycling It is piped the open end of 55a, then the exhaust clearance 63 formed at the 180 degree opposite side of outflow hole portion 58, which becomes towards exhaust, matches The configuration of the open end of pipe 65a.At this point, since outflow hole portion 58 is located at the inside in waste liquid path 61, cup body 51 is connect The treatment fluid of receipts flows to waste liquid path 61 by flowing out hole portion 58, and then is sent to outside from waste liquid path 61 by waste liquid piping 62 Portion.The inner circumferential wall portion 53b and cup body that gas including becoming the misty treatment fluid passes through movable liquid undertake part 53 Gap between 51 periphery wall portion 51b is piped from the exhaust clearance 63 for being formed in cup body 51 by being located at the exhaust on the outside of it The open end of 65a and flow out in exhaust piping 65a, and be discharged to the outside.In addition, when looking down, if making to flow out hole portion 58 Towards the open end of recycling piping 55b, then exhaust clearance 63 is piped the open end of 65b towards exhaust, if further made Hole portion 58 is flowed out towards the open end of recycling piping 55c, then exhaust clearance 63 is piped the open end of 65c towards exhaust.By This, can be such that the treatment fluid flowed into the cup body 51 in lower position flows in waste liquid path 61 from outflow hole portion 58, also, By horizontally rotating the cup body 51 in lower position, thereby, it is possible to pass through any one in exhaust piping 65a~65c The gas generated by treatment fluid is recycled in exhaust piping from exhaust clearance 63, and the gas is discharged to the outside, and therefore, can will locate It manages the waste liquid of liquid and is discharged respectively by the gas that treatment fluid generates.
For the lift component 54 of cup body 51, also it is illustrated using Fig. 8 other than Fig. 1.Relative to base plate 23 along vertical Histogram is connect to the upper end of the lifting shaft 67 (supporting part) of setting with the outer surface of all bottom 51c of cup body 51, lower end with turn Rotating ring 68 (rotation section) connection.Lifting shaft 67 is in the circumferential direction of cup body 51 with 120 degree of spaced 3 rod-like members.It rises Drop axis 67 is can move (defined angle along the slot 23a of the circumferential arc-shaped on all bottom 61c for being located at waste liquid path 61 Degree R: referring to Fig. 8) mode penetrate through base plate 23.Swivel becket 68 is the ring component of plate, and is configured to, in the swivel becket 68 Inner circumferential side, with 60 degree of intervals in circumferential direction and rotatably equipped with 6 rollers 71, roller 71 is by the outer of swivel becket 68 The motor 69 (driving portion) of side setting is L-shaped ring component, horizontally rotates on lifting unit 72 in section.Motor 69 passes through Swivel becket 68 carries out rotate driving to cup body 51 and moves it in the range of defined angle R.In addition, in order to remain above-mentioned Swivel becket 68 horizontally rotate, in 60 degree of intervals in the circumferential and between adjacent roller 71,71, deflector roll 73 is arranged at liter It drops on unit 72.About lifting unit 72, the lifting guiding piece 76 being connect with lifting unit 72 by the driving of telescoping cylinder 75 and It is moved along the track 77a of the column component 77 erected in the up-down direction, the lifting unit 72 can be gone up and down as a result,.Lifting is single The lifting moving of member 72 goes up and down cup body 51 in the up-down direction via swivel becket 68, lifting shaft 67.Lifting shaft 67, swivel becket 68, motor 69 and roller 71 constitute the revolving member 74 of cup body 51.In addition, lifting shaft 67, lifting unit 72, telescoping cylinder 75, Lifting guiding piece 76, column component 77 and track 77a constitute the lift component 54 of cup body 51.Also, motor 69 and telescoping cylinder 75 are electrically connected with control unit 100, control theirs according to the processing substrate information or various programs that are stored in control unit 100 Driving.
Then, for the substrate board treatment 11 for having used present embodiment, substrate 12 processing step, below into Row explanation.In substrate board treatment 11, as used treatment fluid, successively using treatment fluid A, (etching solution: phosphoric acid is molten Liquid), treatment fluid B (alkaline cleaning fluid: APM (mixed liquor of ammonia and hydrogen peroxide)), treatment fluid C (organic solvent: IPA (isopropyl Alcohol)).The movable liquid undertake part 53 of substrate board treatment 11 is contacted with baseplate transportation robot (not shown) in order to prevent, First passing through lift drive mechanism (not shown) in advance makes movable liquid undertake part 53 drop to defined position.Then, using removing It send robot that untreated substrate 12 is moved in substrate board treatment 11, and is kept by clamping pin 18.In 12 quilt of substrate After moving in, keep out of the way conveying machine people, at this point, the treatment fluid caused by rotating in order to prevent because of substrate 12 flies to outside device It dissipates, movable liquid undertake part 53 is made to return to lifting position.
Before being supplied substrate 12 to substrate board treatment 11 using conveying machine people, clamping pin 18 becomes release shape State.When clamping pin 18 is in release conditions, untreated substrate 12 is placed in by conveying machine people (not shown) and clamps pin 18 Shoulder.If substrate 12, which is supplied to and is configured at, clamps pin 18, by the movement described, so that substrate 12 is clamped Pin 18 is kept.
Next, making cup body 51 is horizontal to turn by the movement of motor 69 in the state that cup body 51 is located at 2 height and position It is dynamic, it is moved to outflow hole portion 58 at the open-ended following location directly of recycling piping 55a.By the movement of telescoping cylinder 75 Increase cup body 51, by the configuration of the outflow hole portion 58 of cup body 51 recycle process fluids A position, i.e. with time of recycle process fluids A It receives at the higher position (the 1st height and position) of the open-ended connection of piping 55a (referring to Fig. 5 A).It is configured in cup body 51 Behind the position of the recycle process fluids A stated, drive motor 22 is acted, makes substrate 12 with rotary body 13 together to be most suitable for treatment fluid The revolving speed of the processing of A rotates.
The nozzle 20a for supplying treatment fluid A is moved to the front center of substrate 12 from position of readiness (on substrate rotary shaft S) Treatment fluid A is supplied the preset processing time to the front of substrate 12 by top.The treatment fluid A being supplied on substrate 12 exists It radiates out on the substrate 12 of rotation due to centrifugal force and from the center of substrate 12, and disperses from the end of substrate 12.It disperses Treatment fluid A and movable liquid undertake part 53 inner circumferential wall portion 53b collide, in the inner circumferential wall portion of movable liquid undertake part 53 It falls and flows into cup body 51 between 53b and the sidewall portion 13a of rotary body 13.Since the outflow hole portion 58 of cup body 51 is in and is returned The higher position of the open communication of the end of piping 55a is received, therefore, the treatment fluid A in cup body 51 is flowed into back from outflow hole portion 58 Piping 55a (referring to Fig. 5 A) is received, and is recycled to (not shown) (processing in the accumulator tank for the treatment fluid A that recycling piping 55a is connected The recycling of liquid A).
When the outflow hole portion 58 of cup body 51 is in the position with the opening in communication of the open end of recycling piping 55a, The clearance space 63 formed on the periphery wall portion 51b of cup body 51 is in the opening (exhaust with the open end of exhaust piping 65a It is piped one end of 65a) position (referring to Fig. 6 A) of connection, gas (exhaust gas of the treatment fluid A) warp including the mist comprising treatment fluid A It is flowed into exhaust piping 65a by clearance space 63, and the accumulator tank for flowing to the treatment fluid A that exhaust piping 65a is connected (is not schemed Show) in and carry out waste gas recovery (waste gas recovery for the treatment of fluid A).Also, 55a is piped with recycling even if being in outflow hole portion 58 The cup body 51 of higher position of open communication do not horizontally rotate, but directly decline and be in lower position (the 2nd height position Set) when, clearance space 63 is also at the position with the open communication of the open end of exhaust piping 65a.
Next, when substrate 12 based on treatment fluid A processing terminate when, stop supply treatment fluid A from nozzle 20a, and Keep out of the way nozzle 20a to position of readiness from the center of substrate 12.It acts telescoping cylinder 75 and shrinks piston rod 75a, thus make It goes up and down guiding piece 76 to decline, at this point, the position of cup body 51 drops to lower position (the 2nd height and position) by lifting shaft 67 (referring to Fig. 2).The outflow hole portion 58 of cup body 51 is positioned at the position of the inside in waste liquid path 61 as a result,.Then, make Nozzle 20d is mobile to the top at the center of substrate 12 from position of readiness, from nozzle 20d using pure water as the cleaning of substrate 12 Flushing liquor supplies the preset time to the front of the substrate 12 of rotation.Also, the revolving speed of substrate 12 is redefined for fitting Close the revolving speed of the cleaning of pure water.The pure water on substrate 12 is supplied to due to centrifugal force and is expanded on the substrate 12 from center to end Exhibition, and dispersing together with residual treatment fluid A on the substrate 12 from the end of substrate 12, then with movable liquid undertake part 53 Inner circumferential wall portion 53b collision, between the inner circumferential wall portion 53b of movable liquid undertake part 53 and the sidewall portion 13a of rotary body 13 It falls and flows into cup body 51.The pure water containing treatment fluid A flowed into cup body 51 contains the treatment fluid A remained in cup body 51 It is flowed out together from outflow hole portion 58 to waste liquid path 61, and the piping of the waste liquid by connecting with waste liquid path 61 62 flows into waste liquid tank Become waste liquid in (not shown).Therefore, the treatment fluid A remained in cup body 51 is washed away by pure water.Also, supply pure water Time be set to it is aftermentioned can by pure water by the treatment fluid A remained in cup body 51 discard time.Moreover, because Clearance space 63 is in the position with the open communication of the open end of exhaust piping 65a, and therefore, the exhaust gas for the treatment of fluid A is to row Gas is piped 65a outflow, and flows into the accumulator tank (not shown) for the treatment of fluid A.Also, it when pure water flows into cup body 51, can produce The mist of raw pure water, and the gas including the mist of pure water, to exhaust piping 65a outflow, still, this only makes treatment fluid A The thin degree of exhaust gas, obstacle will not be caused to the exhaust gas of recycle process fluids A.
After the cleaning for having carried out pure water with the stipulated time, stop supplying pure water from nozzle 20d.Then, about cup body 51, Horizontally rotate the roller being set on swivel becket 68 71 on cricoid lifting unit 72 by the movement of motor 69, to make to flow Hole portion 58 is moved to the open-ended following location directly of the recycling piping 55b for the treatment of fluid B out.Then, it is in position of readiness The nozzle 20b for supplying treatment fluid B be moved to substrate 12 front center top, just to substrate 12 by treatment fluid B Face supplies the preset time.The treatment fluid B supplied is together with pure water remaining on the substrate 12 of rotation by centrifugation Power is radiated out from the center of substrate 12, and is dispersed from the end of substrate 12.What is dispersed includes that the treatment fluid B of pure water is fallen And flow into cup body 51, then contain the remaining pure water in cup body 51 flows out from outflow hole portion 58 to waste liquid path 61 together, Being flowed by waste liquid piping 62 becomes waste liquid in waste liquid tank (not shown).Also, match since clearance space 63 is in exhaust The position of the open communication of the open end of pipe 65b, therefore, the exhaust gas for the treatment of fluid B is to exhaust piping 65b outflow, and to processing The flowing (not shown) of the accumulator tank of liquid B.
When from being initially supplied treatment fluid B by the preset stipulated time, pure water in cup body 51 is remained in It is processed liquid B to wash away, there is only treatment fluid B in cup body 51.By the elongation of the piston rod 75a of telescoping cylinder 75, so that place In lower position cup body 51 rise, thus, outflow hole portion 58 be moved to recycling piping 55b end open communication compared with High position (the 1st height and position).In the 1st embodiment, the 1st height and position is risen to from the 2nd height and position in cup body 51 During, continue to supply treatment fluid B to substrate 12 from nozzle 20b.Also, only can also temporarily it stop during cup body 51 rises Treatment fluid B only is supplied from nozzle 20b, but from the viewpoint of the uniform treatment for substrate, it is preferred that even if in cup body 51 Treatment fluid persistently also is supplied to substrate 12 during rising.When cup body 51 is in the 1st height and position and flows out hole portion 58 and recycling When being piped the open communication of the end of 55b, the treatment fluid B in cup body 51 flows into recycling piping 55b (referring to figure from outflow hole portion 58 5B), and towards the accumulator tank (not shown) of the recycling piping 55b treatment fluid B connected (recycling for the treatment of fluid B) is recycled. At this point, the clearance space 63 formed on the periphery wall portion 51b of cup body 51 is in the open communication with the end of exhaust piping 65b Position (referring to Fig. 6 B), the gas (exhaust gas for the treatment of fluid B) including the mist comprising treatment fluid B is flowed to via clearance space 63 to be arranged Gas is piped 65b, and flows to the accumulator tank (not shown) for the treatment fluid B that exhaust piping 65b is connected and carry out waste gas recovery (processing The waste gas recovery of liquid B).
When substrate 12 based on treatment fluid B processing terminate when, stop supply treatment fluid B from nozzle 20b, and make nozzle 20b keeps out of the way from the central upper of substrate 12 to position of readiness.It acts telescoping cylinder 75 and shrinks piston rod 75a, thus make to rise It drops guiding piece 76 to decline, at this point, the position of cup body 51 drops to lower position with lifting shaft 67 together.Cup in lower position The outflow hole portion 58 of body 51 is positioned at the position of the inside in waste liquid path 61.Then, make nozzle 20d from standby again Position is mobile to the overcentre of substrate 12, supplies the preset time to the front of substrate 12 from nozzle 20d by pure water.For The pure water on the substrate 12 of rotation is given to due to centrifugal force and on the substrate 12 from center to end extended, and with remain in substrate Treatment fluid B on 12 disperses from the end of substrate 12 together, then touches with the inner circumferential wall portion 53b of movable liquid undertake part 53 It hits, is fallen between the inner circumferential wall portion 53b of movable liquid undertake part 53 and the sidewall portion 13a of rotary body 13 and flow into cup body 51 In.Flowing into cup body 51 includes that the pure water for the treatment of fluid B further contains the treatment fluid B remained in cup body 51 together from cup The outflow hole portion 58 of body 51 is flowed out to waste liquid path 61, flows into waste liquid tank by the waste liquid piping 62 connecting with waste liquid path 61 Become waste liquid in (not shown).Therefore, the treatment fluid B remained in cup body 51 is washed away by pure water.Also, supply pure water when Between be set to it is aftermentioned can by pure water by the treatment fluid B remained in cup body 51 discard time.Moreover, because gap Space 63 is in the position with the open communication of the open end of exhaust piping 65b, and therefore, the exhaust gas for the treatment of fluid B is matched to exhaust Pipe 65b outflow, and flowed to the accumulator tank for the treatment of fluid B is (not shown).Also, it when pure water flows into cup body 51, can generate pure The mist of water, and the gas including the mist of pure water, to exhaust piping 65b outflow, still, this only makes giving up for treatment fluid B The thin degree of gas will not cause obstacle to the exhaust gas of recycle process fluids B.
After the cleaning for having carried out pure water with the stipulated time, stop supplying pure water from nozzle 20d.Then, about cup body 51, Horizontally rotate the roller being set on swivel becket 68 71 on cricoid lifting unit 72 by the movement of motor 69, to make to flow Hole portion 58 is moved at the open-ended following location directly of recycling piping 55c for the treatment of fluid C out.Then, handle supply The nozzle 20c of liquid C is moved to the top of the front center of substrate 12 from position of readiness, and treatment fluid C is supplied in advance to substrate 12 The processing time of setting.The treatment fluid C supplied together with pure water remaining on the substrate 12 of rotation due to centrifugal force and from The center of substrate 12 radiates out, and disperses from the end of substrate 12, the inner circumferential wall portion 53b with movable liquid undertake part 53 Collision, falls between the inner circumferential wall portion 53b of movable liquid undertake part 53 and the sidewall portion 13a of rotary body 13 and flows into cup body In 51, then contains the pure water remained in cup body 51 and flowed out together from outflow hole portion 58 to waste liquid path 61, matched by waste liquid Pipe 62 flows into waste liquid tank (not shown) and becomes waste liquid.Also, since clearance space 63 is in the opening with exhaust piping 65c The position of the open communication of end, therefore, the exhaust gas for the treatment of fluid C is to exhaust piping 65c outflow, and to the accumulator tank for the treatment of fluid C Flowing (not shown).
The pure water after the preset stipulated time, remained in cup body 51 from being initially supplied treatment fluid C It is processed liquid C to wash away, there is only treatment fluid C in cup body 51.By the elongation of the piston rod 75a of telescoping cylinder 75, so that place In lower position cup body 51 rise, thus, outflow hole portion 58 be moved to recycling piping 55c end open communication compared with High position.During the movement, continue to supply treatment fluid C to substrate 12 from nozzle 20c.Also, it can also be at temporarily stopping Manage the supply of liquid C.When flowing out the open communication of end of hole portion 58 and recycling piping 55c, treatment fluid C in cup body 51 is from stream The inflow of hole portion 58 recycling is piped in 55c (referring to Fig. 5 C) out, and the accumulator tank for the treatment fluid C that 55c is connected is piped towards recycling (not shown) is recycled (recycling for the treatment of fluid C).At this point, the clearance space 63 formed on the periphery wall surface of cup body 51 is in With the position (referring to Fig. 6 C) of the open communication of the end of exhaust piping 65c, gas including the mist comprising treatment fluid C via The flow direction exhaust piping 65c of gap space 63, and flow to the accumulator tank (not shown) for the treatment of fluid C that exhaust piping 65c is connected and into Row waste gas recovery (waste gas recovery for the treatment of fluid C).
Substrate 12 based on treatment fluid C processing terminate when, stop supplying treatment fluid C from nozzle 20c, and make nozzle 20c keeps out of the way from the center of substrate 12 to position of readiness.It acts telescoping cylinder 75 and shrinks piston rod 75a, thus draw lifting Guiding element 76 declines, at this point, the position of cup body 51 drops to lower position (the 2nd height and position) with lifting shaft 67 together.In compared with The outflow hole portion 58 of the cup body 51 of lower position is at the position of the inside in waste liquid path 61.Pass through drive motor 22, rotary body 13 etc. make 12 high speed rotation of substrate, so that treatment fluid C is dispersed from substrate 12 and keep substrate 12 dry.
After the preset stipulated time, if being dried terminates, rotary body 13 is made to stop rotating, discharged Clamp holding of the pin 18 to substrate 12.After the hold mode of substrate 12 is released from, movable liquid undertake part 53 declines, and utilizes The substrate 12 for completing processing is transported to outside by conveying machine people (not shown).
For next processing substrate, horizontally rotate cup body 51, is moved to the end of the recycling piping 55a for the treatment of fluid A The following position directly of portion's opening, executes since this position.As described above, before by clamping 18 pairs of processing transported of pin Substrate 12 is kept and makes its rotation, and then nozzle 20a is made to be moved to the overcentre of substrate 12 from position of readiness, to rotation Substrate 12 supply treatment fluid A.At this point, from the treatment fluid A in the inflow cup body 51 of substrate 12 and remaining on the processing in cup body 51 Liquid C is flowed out from outflow hole portion 58 to waste liquid path 61 together, and is flowed into waste liquid tank (not shown) and formed by waste liquid piping 62 For waste liquid.From being initially supplied treatment fluid A after the preset stipulated time, by the piston rod 75a of telescoping cylinder 75 Elongation, make in as at the lower position of waste liquid position cup body 51 rise, outflow hole portion 58 towards with treatment fluid A time The higher position for receiving the open communication of the end of piping 55a is mobile, carries out treatment fluid A recycling.Hereinafter, according to the work of above-mentioned steps Sequence is handled substrate 12 likewise by treatment fluid B, C and pure water.
Also, it is also possible to before supplying treatment fluid A to substrate 12, pure water first is supplied to substrate 12 from nozzle 20d, The treatment fluid C remained in cup body 51 is set to become waste liquid from the outflow of outflow hole portion 58 together with pure water.Unfavorable processing as a result, Liquid A cleans the treatment fluid C remained in cup body 51, and the mixed liquor for the treatment of fluid A and treatment fluid C is not made to become waste liquid, from And without lavishly recycle process fluids A.
In the present embodiment, the time receiving is switched back into progress treatment fluid, depending on declining the outflow hole portion 58 of cup body 51 Position makes to flow at the position (the 2nd height and position) of the inside in waste liquid path 61, and after making mixed treatment fluid become waste liquid Therefore hole portion is moved to out leads to the position (the 1st height and position) of the open communication of the end of the recycling piping of every kind for the treatment of fluid Horizontally rotating for cup body 51 is crossed, outflow hole portion 58 does not pass through in the opening of the recycling piping other than treatment fluid to be recycled, because This, can recycle the treatment fluid to be recycled of target in the case where not being mixed into other treatment fluids.In addition, due to making to be formed in cup Exhaust clearance 63 on the periphery wall portion 51b of body 51 is connected to the exhaust of each treatment fluid piping, therefore, can be according to each treatment fluid The exhaust gas of the treatment fluid of atomization is separated and recovered.In the present embodiment, this 3 kinds for the treatment of fluids of A, B, C have been separated and recovered, but It is without being limited thereto.The quantity that can be piped by increasing recycling piping and exhaust, is recycled to be more than 3 kinds or less than 3 kinds of ground.And And it can also be by the quantity in increase waste liquid path, to discard every kind of mixed liquor of each treatment fluid.In addition, from being initially supplied After treatment fluid have passed through the stipulated time, increase cup body 51, but not limited to this, for example, it is also possible to be set on waste liquid path 61 Densimeter is set, the concentration of the treatment fluid flowed out in waste liquid path 61 is measured, reaches defined in the concentration for the treatment of fluid When more than concentration, increase cup body 51.
In the processing step of the substrate 12 of above-mentioned present embodiment, from nozzle 20 (20a~20d) to substrate 12 just Face supplies treatment fluid and carries out processing substrate, but is also able to carry out double treatment as follows: also by nozzle 29 (29a~ 29d) to 12 spray treatment liquid of substrate, the back side process of substrate is carried out.In the back side process of substrate 12, during each treatment fluid passes through Empty tube body 31 is admitted in waste liquid tank.
(the 2nd embodiment)
Next, referring to Fig.1 0, the substrate board treatment 11a of the 2nd embodiment of the invention is illustrated.Also, It is illustrated for the distinctive points with the 1st embodiment, it is for identical point, then appropriate to omit.In addition, for the 1st embodiment party The identical constituent element of formula, is illustrated using identical title and label.
In the present embodiment, it is equipped with 2 outflow hole portions 58a, 58b on cup body 51a, is additionally provided with 2 exhaust clearances 63a,63b.Outflow hole portion 58a and outflow hole portion 58b is configured in center A (shown in Figure 10) as axis at symmetrical position. That is, outflow hole portion 58b is configured in the 180 degree opposite side of outflow hole portion 58a.In addition, exhaust clearance 63a and exhaust clearance 63b It is configured in using center A as axis and at symmetrical position.That is, exhaust clearance 63b is configured in the 180 degree phase of exhaust clearance 63a It tosses about.In addition, outflow hole portion 58 (58a, 58b) and exhaust clearance 63 (63a, 63b) are alternately located at cup body every 90 degree In circumferential direction.Also, in a manner of corresponding with the outflow hole portion 58a be equipped with recycling piping 55a1,55b1,55c1, with tap hole 58b corresponding mode in portion is equipped with recycling piping 55a2,55b2,55c2.Moreover, being equipped in a manner of corresponding with exhaust clearance 63a Exhaust piping 65a1,65b1,65c1 are equipped with exhaust piping 65a2,65b2,65c2 in a manner of corresponding with exhaust clearance 63b.? Following aspects are identical as the 1st embodiment: so that cup body 51a is dropped to lower position (the 2nd position), from outflow hole portion 58 to waste liquid Path 61 is flowed out, and is flowed into waste liquid tank (not shown) by waste liquid piping 62 as waste liquid.
It is identical as the 1st embodiment, when setting treatment fluid to be recycled as treatment fluid A, treatment fluid B and treatment fluid C, make cup Body 51a horizontally rotates and makes opening for the end for flowing out recycling piping 55a1,55a2 that hole portion 58a, 58b is respectively at treatment fluid A At the following location directly of mouth, in turn, cup body 51 is made to rise to higher position (the 1st height and position), makes to flow out hole portion 58a, 58b It is respectively moved to and recycle process fluids A at the position of the open communication of the end of recycling piping 55a1,55a2 for the treatment of fluid A. In addition, at this point, exhaust clearance 63a, 63b are respectively at and exhaust piping 65a1,65a2 of the exhaust gas for recycle process fluids A The position of the open communication of end, so as to recycle atomization treatment fluid A exhaust gas.Equally, the recycling about treatment fluid B, Horizontally rotate cup body 51a and makes the end for flowing out recycling piping 55b1,55b2 that hole portion 58a, 58b is respectively at treatment fluid B Opening following location directly at, in turn, cup body 51 is made to rise to higher position (the 1st height and position), make flow out hole portion 58a, 58b are respectively moved at the position for recycling the open communication of end for being piped 55b1,55b2 with treatment fluid B and at recycling Manage liquid B.At this point, exhaust clearance 63a, 63b are respectively at and the exhaust of the exhaust gas for recycle process fluids B piping 65b1,65b2 End opening in communication position at, so as to recycle atomization treatment fluid B exhaust gas.Equally, about treatment fluid C's Recycling, the recycling for horizontally rotating cup body 51a and outflow hole portion 58a, 58b being made to be respectively at treatment fluid C are piped 55c1,55c2 At the following location directly of the opening of end, in turn, so that cup body 51 is risen to higher position (the 1st height and position), make tap hole Portion 58a, 58b be respectively moved to treatment fluid C recycling piping 55c1,55c2 end opening in communication position at back and forth Receive treatment fluid C.At this point, exhaust clearance 63a, 63b be respectively at for recycle process fluids C exhaust gas exhaust piping 65c1, At the position of the opening in communication of the end of 65c2, come recycle atomization treatment fluid C exhaust gas.
According to the present embodiment, can be distinguished by multiple pipings to each treatment fluid and by the gas that each treatment fluid generates It recycled, be vented, therefore, other than the original purpose for being separated and recovered, being separated exhaust, by increasing recycling piping and row Gas piping, additionally it is possible to promptly recycle and be vented.In particular, can disappear when large supply treatment fluid is to carry out processing substrate The worry overflowed except treatment fluid from cup body 51a.
(variation 1)
Next, referring to Fig.1 1, to the cup body in the substrate board treatment 11 of the first and second embodiments of the invention, 11a 51 variation 1 is illustrated.Periphery wall portion 51b and week as shown in the longitudinal sectional view of cup body 51, i.e. Figure 11, in cup body 55 The lower end of the outflow hole portion 58 formed at the contact that bottom 51c is in contact i.e. lowest part rolls tiltedly equipped with being piped 55 towards recycling Protruding portion 57.Open end in 58 side of outflow hole portion of recycling piping 55, is formed with the notch 59 of tilted shape, this is cut The shape in a manner of being engaged is corresponding with protruding portion 57 for oral area 59.When being connected to cup body 51 with defined recycling piping 55, Protruding portion 57 and notch 59 engage since shape is corresponding, flow out hole portion 58 as a result, and recycling is piped 55 parts engaged Lower part be fastened togather, so as to reduce gap, therefore, be able to suppress from cup body 51 flow to recycling piping 55 treatment fluid The liquid leakage of (shown in dash-dot line in Figure 11).
About the corresponding notch of mode shape for being set to the protruding portion 57 of outflow hole portion 58, He Yiyu protruding portion 57 engages The shape in portion 59 is not limited to above-mentioned tilted shape and shape corresponding with this shape, such as both sides can be card The stairstepping of conjunction.As long as protruding portion 57 is simultaneously unlimited in addition, the rotational action to cup body 51 and lifting action do not generate obstacle Due to the lower end for being located at outflow hole portion 58, can also be located at around outflow hole portion 58.Furthermore, it is also possible in outflow hole portion 58 The component being sealed around is set.
(variation 2)
Next, referring to Fig.1 2, to the cup body in the substrate board treatment 11 of the first and second embodiments of the invention, 11a 51 variation 2 is illustrated.In this variation, the wiper mechanism 60 cleaned equipped with the inside to cup body 51.Such as cup Shown in longitudinal sectional view, that is, Figure 12 of body 51, the tubular piping 61 of the wiper mechanism 60 cleaned in cup body 51 is annularly matched It sets in the top of the periphery wall portion 51b of cup body 51.Multiple sprays are equipped at intervals with predetermined angular in cricoid tubular piping 61 Mouth 61a, nozzle 61a are with predetermined angular towards the inside of cup body 51.It is connected in tubular piping 61 from ejected wash water supply unit The cleaning water supplying pipe (not shown) (not shown) for importing ejected wash water (pure water).Tubular piping 61, nozzle 61a, ejected wash water supply Piping and ejected wash water supply unit constitute wiper mechanism 60.The ejected wash water being supplied in cricoid tubular piping 61 is configured to From each nozzle 61a towards the internal spray of cup body 51, so as to being cleaned in cup body 51 (in Figure 12, with chain-dotted line Indicate the ejected wash water of injection).Wiper mechanism 60 is electrically connected with control unit 100, according to the processing substrate being stored in control unit 100 Information or various programs control to drive to it.
Between the processing based on above-mentioned treatment fluid A and treatment fluid B of substrate 12 to substrate 12 supply pure water when and When supplying pure water to substrate 12 between the processing based on treatment fluid B and treatment fluid C of substrate 12, pass through 60 pairs of cups of wiper mechanism Body 51 is cleaned.Before wiper mechanism 60 is set, it is supplied to the pure water on substrate 12 and flows into cup body 51, carry out cup body 51 Cleaning, therefore, for the pure water supplied to substrate 12, need be cleaning cup body 51 needed for service time.In this change In shape example, by the way that wiper mechanism 60 is arranged, cup body 51 can be directly cleaned by pure water, therefore, for what is supplied to substrate 12 For pure water, service time needed for the cleaning without the concern for cup body 51.It therefore, can be only needed for the cleaning of substrate 12 Service time is supplied, and therefore, can shorten the time of processing substrate.In addition, before this, at the place for starting next substrate When reason, need using the treatment fluid newly handled, to the treatment fluid remained in cup body 51 in the processing of substrate before Certain time is rinsed, so that the mixed treatment fluid of specified amount becomes waste liquid.But according to this modification, under treatment Before one substrate 12, cup body 51 is cleaned with pure water using wiper mechanism 60 by being set as, new without lavishly discharge Treatment fluid simultaneously recycles it.Also, wiper mechanism 60 is not limited to using pure water the cleaning of cup body 51, can also pass through gas Remaining treatment fluid is blown in the injection of (for example, nitrogen etc. as inert gas) to be flown in waste fluid channel.
More than, the variation of several embodiments of the invention and each portion is illustrated, but the embodiment and each The variation in portion is to propose as an example, is not used to limit the range of invention.These above-mentioned new embodiments can To implement in the form of various other, various omissions, displacement, change can be carried out without departing from the spirit of the invention.This A little embodiments and its deformation are contained in the range or purport of invention, are also contained in the invention described in the claims.

Claims (14)

1. a kind of substrate board treatment, a variety for the treatment of fluids are successively supplied on substrate and handle substrate,
It is characterized in that,
The substrate board treatment includes
Substrate rotating member, it holds the substrates to be rotated；
Treatment fluid supply member supplies treatment fluid to the substrate rotated by the substrate rotating member；
Cup body is set to around the substrate, receives the treatment fluid to disperse from the substrate；
The type of various recovery approaches, they and the received treatment fluid of the cup body accordingly supplies the place from the cup body Manage liquid stream mistake；
Revolving member horizontally rotates the cup body, the cup body is switched to corresponding with the type of the treatment fluid The direction that recovery approach is located at；And
Lift component makes the cup body go up and down along the vertical direction and be switched to the 1st height and position and the 2nd height and position, wherein 1st height and position is to make the cup body and recovery approach corresponding with the type of the treatment fluid by the revolving member The height and position being connected, the 2nd height and position flow to the cup body received treatment fluid in waste fluid channel Height and position.
2. substrate board treatment according to claim 1, which is characterized in that
The cup body is the cricoid container of upper opening, is formed with outflow hole portion, the tap hole in the lower part of the cup body Portion is for flowing to the treatment fluid in the recovery approach or the waste fluid channel.
3. substrate board treatment according to claim 2, which is characterized in that
The liquid carrier of the periphery wall portion of the substrate rotating member and configuration in the peripheral side of the substrate rotating member Inner circumferential wall portion is inserted into the opening of the cup body with specific length.
4. substrate board treatment according to claim 1 or 2, which is characterized in that
The recovery approach is open-ended multiple recycling pipings with configuration in the peripheral side of the substrate.
5. according to claim 1 to substrate board treatment described in any one in 3, which is characterized in that
The substrate board treatment also has various exhaust passages, and the various exhaust passages are corresponding with the type of the treatment fluid Ground makes the gas containing the treatment fluid flow to outside from the cup body,
The cup body is being switched to the recovery approach corresponding with the type of the treatment fluid by the revolving member When the direction being located at, the exhaust clearance of the recess shapes formed on the outer peripheral surface of the cup body and the kind with the treatment fluid The corresponding exhaust passage connection of class.
6. substrate board treatment according to claim 5, which is characterized in that
The exhaust passage is open-ended multiple exhaust pipings with configuration in the peripheral side of the substrate.
7. substrate board treatment according to claim 2, which is characterized in that
The waste fluid channel is the waste liquid piping that the treatment fluid is discarded to outside, and treatment fluid is configured from by the lift component The outflow hole portion of the cup body at the 2nd height and position flows in the waste fluid channel.
8. according to claim 1 to substrate board treatment described in any one in 3, which is characterized in that
The revolving member includes
Supporting part supports the cup body；
Rotation section rotates the supporting part in the ambient level of the rotary shaft of the substrate rotating member；And
Driving portion drives the rotation section.
9. substrate board treatment according to claim 7, which is characterized in that
The lift component is the telescoping cylinder for making the revolving member lifting.
10. substrate board treatment according to claim 2 or 3, which is characterized in that
It is equipped on the cup body from the outflow hole portion towards recovery approach protruding portion outstanding, in the recovery approach The end of outflow hole portion side be formed with notch, the form shape pair that the notch engages with the protruding portion It answers.
11. according to claim 1 to substrate board treatment described in any one in 3, which is characterized in that
The substrate board treatment also has the wiper mechanism that the inside to the cup body is cleaned.
12. a variety for the treatment of fluids are successively supplied on substrate and handle substrate by a kind of substrate processing method using same,
It is characterized in that,
The substrate processing method using same includes
The step of rotating the substrate by substrate rotating member；
The treatment fluid is supplied to the step on the substrate rotated by the substrate rotating member；
The step of being received using cup body from the treatment fluid that the substrate disperses；
The cup body is set to horizontally rotate and the cup body is switched to recovery approach institute corresponding with the type of the treatment fluid The step of direction being located at；
The step of making the cup body go up and down along the vertical direction and be moved to 1 height and position, wherein the 1st height and position is The height and position that the cup body and recovery approach corresponding with the type of the treatment fluid are connected；And
The step of making the cup body be moved to 2 height and position, wherein the 2nd height and position is to keep the cup body received The treatment fluid flows to the height and position in waste fluid channel.
13. substrate processing method using same according to claim 12, which is characterized in that
Type pair when the cup body and recovery approach corresponding with the type of the treatment fluid are connected, with the treatment fluid Gas containing the treatment fluid is discharged in the various exhaust passages made outside the gas flow from the cup body with answering.
14. substrate processing method using same according to claim 12 or 13, which is characterized in that
The substrate processing method using same also has using the wiper mechanism for cleaning the cup body come the step of cleaning cup body,
The step of cleaning the cup body is executed while cleaning the substrate.
CN201811120882.XA 2017-09-26 2018-09-26 Substrate processing apparatus and substrate processing method Active CN109560018B (en)

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