CN109560007A - A kind of turnover device for diode package - Google Patents
A kind of turnover device for diode package Download PDFInfo
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- CN109560007A CN109560007A CN201710893311.9A CN201710893311A CN109560007A CN 109560007 A CN109560007 A CN 109560007A CN 201710893311 A CN201710893311 A CN 201710893311A CN 109560007 A CN109560007 A CN 109560007A
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- packaging process
- diode package
- baking mechanism
- turnover
- wall surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The present invention provides a kind of turnover device for diode package, including pedestal, column, packaging process one, toast mechanism one, packaging process two and baking mechanism two, vertical two columns of corresponding setting on the pedestal, baking mechanism one is from top to bottom successively horizontally disposed between two columns, packaging process one, toast mechanism two and packaging process two, the both ends of packaging process one and packaging process two are arranged on two columns, and packaging process one and the equal rotating 180 deg of packaging process two, baking mechanism one and the one end for toasting mechanism two are sheathed on right side uprights, and baking mechanism one and baking mechanism two can overturn 180 degree around right side uprights.The present invention uses the device, it can be realized the unitary packed of bottom material piece during diode package, chip and lid tablet, it effectively avoids three when artificial or semi-artificial encapsulation from influencing to occur pasting offset issue vulnerable to extraneous factor, to guarantee encapsulation process quality, and improves production efficiency.
Description
Technical field
The present invention relates to diode package technical field of auxiliary equipment more particularly to a kind of turning over for diode package
Rotary device.
Background technique
Currently, not only playing installation, fixation, sealing, protection chip and enhancing electric heating property etc. for the encapsulation of diode
The effect of aspect, but also be wired on the pin of package casing by the contact on chip, these pins further through
Conducting wire on printed circuit board is connected with other devices, to realize the connection of inside chip and external circuit.After encapsulation
Chip can effectively prevent corrosion of the outside air to chip circuit, and chip is made to be easily installed and transport.In diode
In encapsulation process, it is a very important process that chip, which is fitted between the lid of diode, bottom material piece,.To realize in diode
The encapsulation of chip mostly uses artificial or semi-artificial mode to assist completing the technical process now, and still, aforementioned production method is in reality
There are still following problems in the use process of border:
1, artificial or semi-artificial mode is often difficult to ensure the good patch between bottom material piece, chip and lid tablet three
It closes, so that due to the problems such as easily being deviated from each other when dispensing, which does not solidify, is transported to subsequent processing between three, therefore reduce
The quality of production.
2, to guarantee the quality of production, need to carry out the mutual centering between bottom material piece, chip and lid tablet three, to prolong
The production time has been grown, labor intensity is increased.
3, after the completion of bottom material piece and chip are pasted, it is transported to the mistake that the fitting of lid tablet is carried out at subsequent processing
Journey not only extends production technology, reduces production efficiency, so that chip surface is invaded in transport process vulnerable to external environment
Erosion, and increase production cost.
Summary of the invention
It is a primary object of the present invention to solve problems of the prior art, it is simple to provide a kind of structure, Neng Goushi
The unitary packed of bottom material piece, chip and lid tablet, effectively avoids artificial or semi-artificial encapsulation during existing diode package
Shi Sanzhe influences to occur pasting offset issue vulnerable to extraneous factor, to guarantee encapsulation process quality, and improves production efficiency, and
The turnover device for diode package of labor intensity can be reduced.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: a kind of overturning dress for diode package
It sets, wherein the turnover device for diode package includes pedestal, column, packaging process one, baking mechanism one, encapsulation work
Sequence two and baking mechanism two, two columns of vertical corresponding setting on the pedestal, between two columns from top to bottom according to
The baking mechanism one, the packaging process one, the baking mechanism two and the packaging process two, the envelope is arranged in sub-level
The both ends of dress process one and the packaging process two are arranged on two columns, and the packaging process one and the encapsulation
One end of the equal rotating 180 deg of process two, the baking mechanism one and the baking mechanism two is sheathed on the right side column
On, and the baking mechanism one and the baking mechanism two can be around the right side upright post overturning 180 degrees.
Further, the packaging process one is set as identical structure, and the packaging process with the packaging process two
One is disposed as including driving device, shaft one, hollow turnover disc, vacuum evacuation device, shaft two, limit with the packaging process two
Position device and auxiliary pushing device, the driving device is set on the column of left side, and the output end of the driving device is set
It is set to the left end for connecting the shaft one, the right end of the shaft one is horizontal through the left side column and the connection middle somersault
The left wall face of turntable, the hollow turnover disc are set as connecting the vacuum evacuation device, and in the right wall of the hollow turnover disc
Connect the left end of the shaft two, the right end level of the shaft two is arranged on the column of right side, the limiting device with
The auxiliary pushing device is all set on the top wall surface of the hollow turnover disc.
Further, the hollow turnover disc is set as including overturning disc main body, tablet processing platform, bleeding point and suction
The tablet processing platform is arranged in the top wall surface center of mouth, the overturning disc main body, and sets on the wall surface of the overturning disc main body
The bleeding point being connected with its inner cavity is set, the bleeding point is set as connecting the vacuum evacuation device, and the suction nozzle is uniform
It is set to the lower section of the tablet processing platform, and the lower end of the suction nozzle is disposed as being connected to the overturning disc main body.
Further, the limiting device is set as two groups, and limiting device described in two groups is along the tablet processing platform
The corresponding setting of diagonal.
Further, the limiting device is set as including fixing seat, elastic element one, auxiliary positioning part, sliding block and cunning
Slot, the fixing seat are set on the top wall surface of the hollow turnover disc, and the fixing seat is close to the tablet processing platform
One end of the elastic element one is vertically connected on surface, the other end of the elastic element one is connected to the auxiliary positioning part
On, the sliding block is set on the bottom wall of the auxiliary positioning part, and the sliding block, which matches, to be set in the sliding slot, the sliding slot
It is opened on the top wall surface of the overturning disc main body, and the central axes of the sliding slot are set perpendicularly to the bottom wall of the fixing seat.
Further, the auxiliary positioning part is set as including located lateral portion and longitudinal register portion, the located lateral
The one end in portion and the longitudinal register portion intersects vertically.
Further, the auxiliary pushing device is set as including guide groove, pushing block and elastic element two, the guide groove
It is opened on the tablet processing platform vertically, and the guide groove is set as blind slot, the pushing block is coaxially arranged leads in described
The upper end of the elastic element two is connected into slot, and on the bottom wall of the pushing block, institute is fixed in the lower end of the elastic element two
It states on the bottom wall of guide groove.
Further, the baking mechanism one is set as identical structure, and the baking mechanism with the baking mechanism two
One is disposed as including rotary sleeve, connecting rod, cover and heating layer with the baking mechanism two, and the rotary sleeve coaxial line is arranged
In on the column of right side, and in the side wall surface of the rotary sleeve the horizontal fixed connecting rod one end, the connecting rod it is another
One end connects the lateral wall of the cover, and the heating layer, and a left side for the cover are arranged on the inner wall of the roof of the cover
An arc shaped slider is respectively set in the lower end of right side wall.
Further, two groups of arc chutes of the parallel setting in the left and right sides of the top wall surface of the overturning disc main body, two groups
The structure setting of the arc chute be matched with the structure of the arc shaped slider, and between arc chute described in two groups between
Away from the distance between arc shaped slider described in being equal to two groups.
Further, limited block is set on the inner wall of the rotary sleeve, it is corresponding in the side wall surface of the right side column
Two groups of limiting slots are opened up, the structure setting of the limited block is to match with the structure of the limiting slot.
The advantages and positive effects of the present invention are:
(1) the point glue laminating of bottom material piece and chip is able to carry out by packaging process one, and is used for by baking mechanism a pair
The dispensing that bottom material piece is connect with chip carries out roasting toast hardening, and to guarantee the good fixation of bottom material piece and chip, packaging process one is turned over
When turnback falls to the assembly of bottom material piece and chip just above lid tablet, second packaging process can carry out lid material
The point glue laminating of piece and bottom material piece and chipset zoarium, and baking mechanism two can assist making its hardening, complete post package process two
180 degree is overturn, so that adhesive product is fallen to carry out post-order process processing on conveyer belt, thus realize the encapsulation of diode,
Production efficiency is improved, guarantees the quality of production.
(2) make hollow turnover disc inner cavity in vacuum state by vacuum evacuation device, to guarantee that bottom material piece or lid tablet exist
Good fixation on tablet processing platform, and limiting device can carry out the position of bottom material piece or lid tablet on tablet processing platform
Limitation, avoids it from deviateing influence of the tablet processing platform center to diode package quality, and auxiliary pushing device can then seal
After filling process one or the overturning 180 degree of packaging process two, auxiliary encapsulation finished piece(s) in limiting device by being detached from and falling into vertically next
In procedure, to further increase diode package machining accuracy.
(3) vacuumize process is carried out to overturning disc main body by the bleeding point being connected with vacuum evacuation device, then in suction nozzle
Under the action of, bottom material piece or lid tablet can be tightly adsorbed on tablet processing platform, postorder caused by moving to avoid it
Process middle cover tablet, chip and bottom material piece non co axial line problem, to guarantee diode package processing quality.
(4) it is in cornerwise structure setting by two groups of limiting devices, is able to carry out the lateral, vertical of lid tablet or bottom material piece
To positioning, to prevent lid tablet or the mobile influence to processing quality of bottom material piece, wherein elastic element one pushes auxiliary positioning part
Move linearly along the chute, thus realize to the clamping of lid tablet or bottom material piece with loosen.
(5) pass through the setting of auxiliary pushing device, can make after packaging process one or packaging process two overturn 180 degree
The product on its station is obtained under the action of auxiliary pushing device and gravity, by dropping to subsequent processing vertically in limiting device
On, with guarantee diode package quality and its continuous high-efficient production.
Detailed description of the invention
Fig. 1 is structural scheme of mechanism of the invention.
Fig. 2 is the overlooking structure diagram of hollow overturning disc portion in Fig. 1.
Fig. 3 is the partial enlargement structural representation of limiting device part in Fig. 2.
Fig. 4 is the structural schematic diagram of auxiliary pushing device part in Fig. 1.
Fig. 5 is the schematic cross-section of the right end portion of shaft one in Fig. 1.
Fig. 6 is that rotary sleeve is assemblied in the cross section structure schematic diagram on column in Fig. 1.
Fig. 7 is a working state structure schematic diagram of the invention.
Fig. 8 is another working state structure schematic diagram of the present invention.
In figure: pedestal 10, column 20, limiting slot 201, packaging process 1, driving device 301, shaft 1, shaft
2 303, overturning disc main body 304, bleeding point 305, suction nozzle 306, fixing seat 307, elastic element 1, auxiliary positioning part 309,
Sliding block 310, sliding slot 311, guide groove 312, pushing block 313, elastic element 2 314, arc chute 315 toast mechanism 1, rotation
Set 401, limited block 4011, connecting rod 402, cover 403, heating layer 404, packaging process 2 50 toast mechanism 2 60.
Specific embodiment
In order to better understand the present invention, the present invention is further retouched with attached drawing combined with specific embodiments below
It states.
As Figure 1-Figure 8, a kind of turnover device for diode package, including pedestal 10, column 20, packaging process
One 30, mechanism 1, packaging process 2 50 are toasted and toasts mechanism 2 60, two columns 20 of vertical corresponding setting on pedestal 10,
Baking mechanism 1, packaging process 1, baking mechanism 2 60 and encapsulation are from top to bottom successively horizontally disposed between two columns 20
The both ends of process 2 50, packaging process 1 and packaging process 2 50 are arranged on two columns 20, and packaging process 1 with
The equal rotating 180 deg of packaging process 2 50, baking mechanism 1 and the one end for toasting mechanism 2 60 are sheathed on right side uprights 20
On, and toasting mechanism 1 and baking mechanism 2 60 can be around the overturning 180 degree of right side uprights 20, it can by packaging process 1
The point glue laminating of bottom material piece and chip is carried out, and is baked by the one 40 pairs of dispensings being connect for bottom material piece with chip of baking mechanism
Toast hardening, to guarantee the good fixation of bottom material piece and chip, packaging process 1 overturns the group that 180 degree makes bottom material piece and chip
When zoarium is just fallen to above lid tablet, packaging process 2 50 can carry out the point of lid tablet Yu bottom material piece and chipset zoarium
Glue laminating, and baking mechanism 2 60 can assist making its hardening, completion post package process 2 50 overturns 180 degree, so that adhesive product
It falls to carry out post-order process processing on conveyer belt, to realize the encapsulation of diode, improves production efficiency, guarantee production matter
Amount.
Packaging process 1 and packaging process 2 50 are set as identical structure, and packaging process 1 and packaging process 2 50
Be disposed as include driving device 301, shaft 1, hollow turnover disc, vacuum evacuation device, shaft 2 303, limiting device and
Auxiliary pushing device, driving device 301 is set on the column 20 of left side, and the output end of the driving device 301 is set as connecting
The left end of shaft 1, the right end of shaft 1 horizontal through left side column 20 and the hollow turnover disc of connection left wall face, in
Somersault turntable is set as connection vacuum evacuation device, and the left end of shaft 2 304, shaft are connected in the right wall of the hollow turnover disc
2 303 right end level is arranged on right side uprights 20, and limiting device and auxiliary pushing device are all set in hollow turnover disc
On top wall surface, driving device 301 may be configured as rotating electric machine, and the output end of the motor shaft of rotating electric machine is set as passing through shaft coupling
The left end of shaft 1 is connected, specification and model of rotating electric machine etc. can be according to the actual demands of diode package process flow
It carries out type selecting to determine, opens up two groups of limiting grooves along its axis direction is corresponding on the right end sidewalls face of shaft 1, left side is vertical
Limited block is set in the side wall surface of column 20, and the structure setting of limited block is to match with the structure of limiting groove, passes through pumping
Vacuum plant makes hollow turnover disc inner cavity in vacuum state, to guarantee that bottom material piece or lid tablet are good on tablet processing platform
It is good fixed, and limiting device can carry out the position limitation of bottom material piece or lid tablet on tablet processing platform, it is avoided to deviate material
Influence of the piece processing platform center to diode package quality, auxiliary pushing device then can be in packaging process 1 or encapsulation works
After sequence 2 50 overturns 180 degree, auxiliary encapsulation finished piece(s) is by disengaging in limiting device and falls into next process vertically, thus into
One step improves diode package machining accuracy.
Hollow turnover disc is set as including overturning disc main body 304, tablet processing platform, bleeding point 305 and suction nozzle 306, turns over
Tablet processing platform is arranged in the top wall surface center of turntable body 304, and on the wall surface of the overturning disc main body 304 in setting and its
The bleeding point 305 that chamber is connected, bleeding point 305 are set as connection vacuum evacuation device, and it is flat that suction nozzle 306 is uniformly arranged on tablet processing
The lower section of platform, and the lower end of suction nozzle 306 is disposed as connection overturning disc main body 304, passes through the pumping being connected with vacuum evacuation device
305 pairs of overturning disc main bodies 304 of port carry out vacuumize processs, then under the action of suction nozzle 306, bottom material piece or lid tablet can be by
It is tightly adsorbed on tablet processing platform, postorder process middle cover tablet, chip and bottom material piece caused by being moved to avoid it
Non co axial line problem, to guarantee diode package processing quality.
Limiting device is set as two groups, and two groups of limiting devices corresponding are set along the diagonal of tablet processing platform
It sets.
Limiting device is set as including fixing seat 307, elastic element 1, auxiliary positioning part 309, sliding block 310 and sliding slot
311, fixing seat 307 is set on the top wall surface of hollow turnover disc, and the fixing seat 307 is on the surface of tablet processing platform
One end of vertical connection elastic element 1, the other end of elastic element 1 are connected on auxiliary positioning part 309, and auxiliary is fixed
Sliding block 310 is set on the bottom wall of position part 309, sliding block 310, which matches, to be set in sliding slot 311, and sliding slot 311 is opened in turnover disc master
On the top wall surface of body 304, and the central axes of the sliding slot 311 are set perpendicularly to the bottom wall of fixing seat 307, and sliding slot 311 is set in parallel
Be placed in the underface of elastic element 1, by two groups of limiting devices be in cornerwise structure setting, be able to carry out lid tablet or
The transverse direction of bottom material piece, longitudinal register, to prevent lid tablet or the mobile influence to processing quality of bottom material piece, wherein elastic element
One 308 push 311 linear movement along the chute of auxiliary positioning parts 309, thus realize to the clamping of lid tablet or bottom material piece with loosen.
Auxiliary positioning part 309 is set as including located lateral portion and longitudinal register portion, located lateral portion and longitudinal register portion
One end intersect vertically, located lateral portion and longitudinal register portion are integrally formed, one end phase in located lateral portion and longitudinal register portion
Connection, and the corner structure matching of structure and tablet that located lateral portion and longitudinal register portion are formed close to tablet processing platform
It closes, by the structure setting in located lateral portion and longitudinal register portion, auxiliary positioning part 309 is enabled to be arranged in lid tablet or bottom
The corner of tablet, the good location to lid tablet or bottom material piece is effectively ensured.
Auxiliary pushing device is set as including guide groove 312, pushing block 313 and elastic element 2 314, and guide groove 312 is vertical
It being opened on tablet processing platform, and the guide groove 312 is set as blind slot, pushing block 313 is coaxially arranged in guide groove 312,
And the upper end of elastic element 2 314 is connected on the bottom wall of the pushing block 313, guide groove 312 is fixed in the lower end of elastic element 2 314
Bottom wall on, auxiliary pushing device is set as several groups, and several groups auxiliary pushing device is uniformly arranged in tablet processing platform,
On the side wall of pushing block 313 can also corresponding setting guide pad, the structure setting of guide pad is and the structure of guide groove 312 matches
Close, by the setting of auxiliary pushing device, can after packaging process 1 or packaging process 2 50 overturn 180 degree so that its
Product on station is under the action of auxiliary pushing device and gravity, by being dropped on subsequent processing vertically in limiting device, with
Guarantee diode package quality and its continuous high-efficient production.
Baking mechanism 1 and baking mechanism 2 60 are set as identical structure, and toast mechanism 1 and baking mechanism 2 60
It is disposed as including rotary sleeve 401, connecting rod 402, cover 403 and heating layer 404,401 coaxial line of rotary sleeve is sheathed on right side
On column 20, and in the side wall surface of the rotary sleeve 401 horizontal fixed connecting rod 402 one end, connecting rod 402 the other end connection
The lateral wall of cover 403, is arranged heating layer 404 on the inner wall of the roof of cover 403, and the left and right sidewall of the cover 403
An arc shaped slider is respectively set in lower end, and the bottom surface of the front and back wall surface of cover 403 is set as the upper surface with tablet processing platform
Coaxial line, heating layer 404 are also connected with a temperature sensor, can by the design of baking mechanism 1 and baking mechanism 2 60
After the product fitting on packaging process 1 and packaging process 2 50, roasting toast hardening is carried out to dispensing thereon, to avoid it
Uncured influence when falling to subsequent processing and being processed, to shift between fitting part to product qualified rate.
Overturn two groups of arc chutes 315 of the parallel setting in the left and right sides of the top wall surface of disc main body 304, two groups of arc chutes
315 structure setting is to match with the structure of arc shaped slider, and the spacing between two groups of arc chutes 315 is equal to two
Distance between group arc shaped slider can guarantee baking machine by the cooperation of arc shaped slider and arc chute 315 on cover 403
Structure 1 or baking mechanism 2 60 are buckled on tablet processing platform, to realize to good roasting toast for dispensing glue between fitting part thereon
Hardening.
Limited block 4011 is set on the inner wall of rotary sleeve 401, it is corresponding in the side wall surface of right side uprights 20 to open up two groups
Limiting slot 201, the structure setting of limited block 4011 are to match with the structure of limiting slot 201, pass through limited block 4011 and limit
The cooperation of slot 201 enables baking mechanism 1 or baking mechanism 2 60 to rotate 180 degree around column, to guarantee that diode seals
The continuous good progress of dress.
Using the turnover device provided by the present invention for diode package, structure is simple, can be realized diode package
The unitary packed of bottom material piece, chip and lid tablet in the process, three is vulnerable to outer when effectively avoiding artificial or semi-artificial encapsulation
Boundary's factor influences to occur pasting offset issue, to guarantee encapsulation process quality, and improves production efficiency, and can reduce artificial labor
Fatigue resistance.The course of work of the turnover device in diode package process is as follows:
1, bottom material piece is placed on the tablet processing platform that packaging process 1 overturns disc main body 304, so that limiting device
In auxiliary positioning part 309 under the action of elastic element 308, corresponding two corner of clamping bottom material piece, thus realize the bottom of to
The horizontal and vertical positioning of tablet；
2, starting vacuum evacuation device work, so that 305 pairs of overturning disc main bodies 304 of the bleeding point being connected with vacuum evacuation device
Vacuumize process is carried out, then under the action of suction nozzle 306 and bottom material piece self gravity, bottom material piece can be tightly adsorbed to tablet
On processing platform；
3, dispensing is carried out to the upper surface of bottom material piece, chip is fitted in the upper surface of bottom material piece, while in packaging process
Lid tablet is placed on the tablet processing platform of 2 50 overturning disc main bodies 304, so that the auxiliary positioning part 309 in limiting device is in bullet
Under the action of property element 308, corresponding two corner of clamping bottom material piece, and make the bleeding point being connected with vacuum evacuation device
305 pairs of overturning disc main bodies 304 carry out vacuumize process, then under the action of suction nozzle 306 and bottom material piece self gravity, bottom material piece energy
It is enough to be tightly adsorbed on tablet processing platform；
4, baking mechanism 1 is rotated into 180 degree, cover 403 is made to be buckled in packaging process along the sliding of arc chute 315
On one 30 tablet processing platform, to realize, good roasting toast for dispensing glue is hard between the fitting part formed to bottom material piece thereon and chip
Change, meanwhile, dispensing is carried out to the upper surface of the lid tablet in packaging process 2 50；
5, baking one 40 opposite direction of mechanism is rotated into 180 degree, is fixed on by the drive of driving device 301 of packaging process 1
Hollow turnover disc between shaft 1 and shaft 2 303 overturns 180 degree, and it is true to close connection pumping on connection packaging process 1
The valve of empty device, so that bleeding point 305 is connected to (or in order to improve the production efficiency, in the pipe of bleeding point 305 with ambient atmosphere
Road connection air blower), to guarantee that the pressure of inner cavity of overturning disc main body 304 is consistent with outer atmospheric pressure, then bottom material piece and core
The fitting part that piece is formed falls within the envelope that diode is completed on lid tablet vertically under the action of self gravity and auxiliary pushing device
Dress；
6, it is driven again by the driving device 301 of packaging process 1 in being fixed between shaft 1 and shaft 2 303
Somersault turntable opposite direction overturns 180 degree, while baking mechanism 2 60 is rotated 180 degree, makes cover 403 along arc chute 315
Sliding is buckled on the tablet processing platform of packaging process 1, integrally for dispensing glue good to diode encapsulating parts thereon to realize
Roasting toast hardening；
7, baking 2 60 opposite direction of mechanism is rotated into 180 degree, is fixed on by the drive of driving device 301 of packaging process 2 50
Hollow turnover disc between shaft 1 and shaft 2 303 overturns 180 degree, and it is true to close connection pumping on connection packaging process 2 50
The valve of empty device, so that bleeding point 305 is connected to (or in order to improve the production efficiency, in the pipe of bleeding point 305 with ambient atmosphere
Road connection air blower), to guarantee that the pressure of inner cavity of overturning disc main body 304 is consistent with outer atmospheric pressure, then diode package
To carry out postorder processing on the conveyer belt that part falls within subsequent processing vertically under the action of self gravity and auxiliary pushing device；
8, it is finally fixed between shaft 1 and shaft 2 303 by the drive of driving device 301 of packaging process 2 50
Hollow turnover disc opposite direction overturns 180 degree, while the 1-7 that repeats the above steps to be to realize being carried out continuously for diode package, thus
While guaranteeing the quality of production, production efficiency is improved.
The embodiments of the present invention have been described in detail above, but content is only the preferred embodiment of the present invention,
It should not be considered as limiting the scope of the invention.All changes and improvements made in accordance with the scope of the present invention, should all
It still belongs within this patent covering scope.
Claims (10)
1. a kind of turnover device for diode package, it is characterised in that: the turnover device packet for diode package
It includes pedestal, column, packaging process one, baking mechanism one, packaging process two and toasts mechanism two, it is vertical corresponding on the pedestal
Two columns are set, the baking mechanism one, the packaging process are from top to bottom successively horizontally disposed between two columns
One, the baking mechanism two and the packaging process two, the both ends of the packaging process one and the packaging process two are worn
In on two columns, and the packaging process one and the equal rotating 180 deg of the packaging process two, the baking mechanism one and
One end of the baking mechanism two is sheathed on the column of right side, and the baking mechanism one and the baking mechanism two are
It can be around the right side upright post overturning 180 degree.
2. the turnover device according to claim 1 for diode package, it is characterised in that: the packaging process one with
The packaging process two is set as identical structure, and the packaging process one and the packaging process two are disposed as including driving
Device, shaft one, hollow turnover disc, vacuum evacuation device, shaft two, limiting device and auxiliary pushing device, the driving device
It is set on the column of left side, and the output end of the driving device is set as connecting the left end of the shaft one, the shaft
Horizontal through the left wall face of the left side column and the connection hollow turnover disc, the hollow turnover disc is set as one right end
The vacuum evacuation device is connected, and connects the left end of the shaft two in the right wall of the hollow turnover disc, the shaft two
Right end level is arranged on the column of right side, and the limiting device and the auxiliary pushing device are all set in the middle somersault
On the top wall surface of turntable.
3. the turnover device according to claim 2 for diode package, it is characterised in that: the hollow turnover disc is set
It is set to including overturning disc main body, tablet processing platform, bleeding point and suction nozzle, institute is arranged in the top wall surface center of the overturning disc main body
Tablet processing platform is stated, and the bleeding point being connected with its inner cavity, the pumping are set on the wall surface of the overturning disc main body
Port is set as connecting the vacuum evacuation device, and the suction nozzle is uniformly arranged on the lower section of the tablet processing platform, and described
The lower end of suction nozzle is disposed as being connected to the overturning disc main body.
4. the turnover device according to claim 3 for diode package, it is characterised in that: the limiting device setting
It is two groups, and limiting device described in two groups is along the corresponding setting of diagonal of the tablet processing platform.
5. the turnover device according to claim 4 for diode package, it is characterised in that: the limiting device setting
Being includes fixing seat, elastic element one, auxiliary positioning part, sliding block and sliding slot, and the fixing seat is set to the hollow turnover disc
Top wall surface on, and the fixing seat vertically connects the one of the elastic element one on the surface of the tablet processing platform
End, the other end of the elastic element one are connected on the auxiliary positioning part, and institute is arranged on the bottom wall of the auxiliary positioning part
Sliding block is stated, the sliding block, which matches, to be set in the sliding slot, and the sliding slot is opened on the top wall surface of the overturning disc main body,
And the central axes of the sliding slot are set perpendicularly to the bottom wall of the fixing seat.
6. the turnover device according to claim 5 for diode package, it is characterised in that: the auxiliary positioning part is set
It is set to including located lateral portion and longitudinal register portion, the one end in the located lateral portion and the longitudinal register portion intersects vertically.
7. the turnover device according to claim 3 for diode package, it is characterised in that: the auxiliary pushing device
It is set as including guide groove, pushing block and elastic element two, the guide groove is opened in vertically on the tablet processing platform, and should
Guide groove is set as blind slot, and the pushing block is coaxially arranged in the guide groove, and the bullet is connected on the bottom wall of the pushing block
The upper end of property element two, the lower end of the elastic element two is fixed on the bottom wall of the guide groove.
8. the turnover device according to claim 3 for diode package, it is characterised in that: the baking mechanism one with
The baking mechanism two is set as identical structure, and the baking mechanism one and the baking mechanism two are disposed as including rotation
Set, connecting rod, cover and heating layer, the rotary sleeve coaxial line is sheathed on the column of right side, and the side wall of the rotary sleeve
One end of the horizontal fixed connecting rod, the other end of the connecting rod connect the lateral wall of the cover, the cover on face
Roof inner wall on the heating layer is set, and an arc shaped slider is respectively set in the lower end of the left and right sidewall of the cover.
9. the turnover device according to claim 8 for diode package, it is characterised in that: the overturning disc main body
Two groups of arc chutes of the parallel setting in the left and right sides of top wall surface, the structure setting of arc chute described in two groups are and the arc
The structure of sliding block matches, and the spacing between arc chute described in two groups be equal to two groups described between arc shaped slider away from
From.
10. the turnover device according to claim 8 for diode package, it is characterised in that: the rotary sleeve it is interior
Limited block is set on wall surface, it is corresponding in the side wall surface of the right side column to open up two groups of limiting slots, the structure of the limited block
It is set as matching with the structure of the limiting slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710893311.9A CN109560007B (en) | 2017-09-27 | 2017-09-27 | A turning device for diode encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710893311.9A CN109560007B (en) | 2017-09-27 | 2017-09-27 | A turning device for diode encapsulation |
Publications (2)
| Publication Number | Publication Date |
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| CN109560007A true CN109560007A (en) | 2019-04-02 |
| CN109560007B CN109560007B (en) | 2020-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710893311.9A Active CN109560007B (en) | 2017-09-27 | 2017-09-27 | A turning device for diode encapsulation |
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| Country | Link |
|---|---|
| CN (1) | CN109560007B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277928A (en) * | 2019-06-22 | 2019-09-24 | 冯睿鸣 | A kind of rectifier diode |
| CN111128849A (en) * | 2020-01-08 | 2020-05-08 | 深圳市华龙精密模具有限公司 | Rotary material taking and placing mechanism and automatic semiconductor punching equipment |
| CN111162031A (en) * | 2020-02-20 | 2020-05-15 | 杭州易正科技有限公司 | Overturning clamp for packaging chip |
| CN116504681A (en) * | 2023-06-20 | 2023-07-28 | 深圳市朗帅科技有限公司 | Packaging equipment for integrated circuit production and processing |
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| CN204338416U (en) * | 2014-10-30 | 2015-05-20 | 木林森股份有限公司 | A kind of Glue dripping head for LED lamp bar point glue |
| CN205731824U (en) * | 2016-01-25 | 2016-11-30 | 深圳世宗瑞迪自动化设备有限公司 | Point glue equipment |
| CN106216173A (en) * | 2016-09-05 | 2016-12-14 | 珠海市宏泰机械科技有限公司 | A kind of Full-automatic spot gluing, frictioning, unloader |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204338416U (en) * | 2014-10-30 | 2015-05-20 | 木林森股份有限公司 | A kind of Glue dripping head for LED lamp bar point glue |
| CN205731824U (en) * | 2016-01-25 | 2016-11-30 | 深圳世宗瑞迪自动化设备有限公司 | Point glue equipment |
| CN106216173A (en) * | 2016-09-05 | 2016-12-14 | 珠海市宏泰机械科技有限公司 | A kind of Full-automatic spot gluing, frictioning, unloader |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277928A (en) * | 2019-06-22 | 2019-09-24 | 冯睿鸣 | A kind of rectifier diode |
| CN110277928B (en) * | 2019-06-22 | 2021-07-13 | 冯睿鸣 | Rectifier diode fixing device |
| CN111128849A (en) * | 2020-01-08 | 2020-05-08 | 深圳市华龙精密模具有限公司 | Rotary material taking and placing mechanism and automatic semiconductor punching equipment |
| CN111162031A (en) * | 2020-02-20 | 2020-05-15 | 杭州易正科技有限公司 | Overturning clamp for packaging chip |
| CN111162031B (en) * | 2020-02-20 | 2022-08-09 | 重庆达标电子科技有限公司 | Overturning clamp for packaged chip |
| CN116504681A (en) * | 2023-06-20 | 2023-07-28 | 深圳市朗帅科技有限公司 | Packaging equipment for integrated circuit production and processing |
| CN116504681B (en) * | 2023-06-20 | 2023-09-15 | 深圳市朗帅科技有限公司 | Packaging equipment for integrated circuit production and processing |
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| Publication number | Publication date |
|---|---|
| CN109560007B (en) | 2020-10-09 |
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