CN111162031A - Overturning clamp for packaging chip - Google Patents
Overturning clamp for packaging chip Download PDFInfo
- Publication number
- CN111162031A CN111162031A CN202010106986.6A CN202010106986A CN111162031A CN 111162031 A CN111162031 A CN 111162031A CN 202010106986 A CN202010106986 A CN 202010106986A CN 111162031 A CN111162031 A CN 111162031A
- Authority
- CN
- China
- Prior art keywords
- plate
- fixed
- plates
- guide groove
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Basic Packing Technique (AREA)
- Clamps And Clips (AREA)
Abstract
The invention discloses a turning clamp for packaging a chip, which comprises a horizontal top plate, wherein two sides of the top plate are bent and formed with vertical side plates, the lower side edges of the side plates are bent and formed with inward inclined elastic plates, the lower side edges of the inclined elastic plates are bent and formed with vertical clamping plates, the inner side walls of the clamping plates are abutted against circular supporting plates, supporting shafts are formed in the middle parts of the outer side walls of the supporting plates, the supporting shafts penetrate through clamping plate inserting sleeves and are fixed with limiting sleeves, arc-shaped guide grooves are formed in the clamping plates on the lower sides of the supporting shafts, cylindrical shifting rods are inserted in the guide grooves, and the inner ends of the shifting rods are fixed on the; the driving lever is fixedly connected with a spring, the other end of the spring is fixed on a fixing block, and the fixing block is fixed on the outer wall of the side plate right above the fulcrum shaft.
Description
Technical Field
The invention relates to the technical field of chip packaging equipment, in particular to a turnover clamp for packaging a chip.
Background
The current chip packaging process comprises chip pasting, silver paste curing, lead welding, optical inspection, injection molding, laser typing, high-temperature curing, flash removal, electroplating annealing, rib cutting and forming and the like; the flash removal refers to removing the injection molding material remained between leads at the periphery of the chip after the injection molding of the chip; the existing excess flash is removed by cutting, but the cutting is easy to damage the lead, so that the lead part is immersed by weak acid, the flash is soaked together, and then the flash is washed by high-pressure water to wash away the flash; the existing flash material soaking adopts manual immersion, then the workpiece is taken manually, the effect is low, the workload of personnel is large, and a production line type soaking structure is needed to improve the production efficiency; in the production line formula process of soaking, because current encapsulation chip is equipped with two rows of leads, the lead wire is located encapsulation chip's both sides, soaks the lead wire that can only submerge encapsulation chip downside to need the design can realize the structure of encapsulation chip upset, the lead wire of the encapsulation chip upside of being convenient for also can realize the submergence.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a turnover clamp for a packaged chip, which can realize turnover of the packaged chip by blocking in the moving process, is not blocked after turnover and can normally move along a guide rail.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a turnover fixture for packaging a chip comprises a horizontal top plate, wherein vertical side plates are formed on two sides of the top plate in a bending mode, an inclined elastic plate inclining inwards is formed on the lower side edge of each side plate in a bending mode, a vertical clamping plate is formed on the lower side edge of the inclined elastic plate in a bending mode, a round supporting plate is abutted to the inner side wall of each clamping plate, a supporting shaft is formed in the middle of the outer side wall of the supporting plate, the supporting shaft penetrates through a clamping plate inserting sleeve and is fixed with a limiting sleeve, an arc-shaped guide groove is formed in the clamping plate on the lower side of the supporting shaft, a cylindrical shifting rod is inserted in the guide groove; the driving lever is fixedly connected with a spring, the other end of the spring is fixed on a fixing block, and the fixing block is fixed on the outer wall of the side plate right above the fulcrum shaft.
Preferably, a plurality of vertical connecting plates are formed at the upper end of the top plate, a plurality of connecting shafts are inserted into the connecting plates, and two ends of the connecting shafts extend out of the connecting plates and are sleeved with the fixed rollers.
Preferably, an annular clamping groove is formed in the connecting shaft between the connecting plates, a limiting ring with an arc line is clamped in the clamping groove of the connecting shaft, and two end faces of the limiting ring abut against the connecting plates.
Preferably, an annular first groove is formed in the deflector rod, the fixing block is in an I shape, hooks are formed at two ends of the spring, and the hooks at two ends of the spring are respectively hung in the first groove of the deflector rod and in the middle of the fixing block.
Preferably, the arc center of the guide groove on the clamping plate is located on the central axis of the fulcrum shaft.
Preferably, the arc radian of the guide groove on the clamping plate is equal to that of a semicircle, two ends of the guide groove are distributed on two sides of the fulcrum shaft, one end of the guide groove is lower than the fulcrum shaft, and the other end of the guide groove is higher than the fulcrum shaft.
Preferably, a T-shaped tab is fixed to the outer end surface of the fulcrum.
Preferably, the springs are distributed on the outer side of the pull buckle; the spring is located the middle part of driving lever, and the outer end of driving lever is located the outside of curb plate.
The invention has the beneficial effects that: the adopted clamp can realize the overturning of the packaged chip by blocking in the moving process, is not blocked after being overturned, and can normally move along the guide rail.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a side view of the present invention;
fig. 4 is a schematic sectional view at a-a in fig. 3.
In the figure: 1. a top plate; 11. a side plate; 12. a slanted elastic plate; 13. a splint; 131. a guide groove; 14. a connecting plate; 2. a support plate; 21. a fulcrum; 3. a limiting sleeve; 4. a deflector rod; 41. a first groove; 5. a fixed block; 6. a spring; 7. pulling the button; 8. a connecting shaft; 9. a roller; 10. a limit ring.
Detailed Description
Example (b): as shown in fig. 1 to 4, the turnover fixture for the packaged chip comprises a horizontal top plate 1, wherein two sides of the top plate 1 are bent and formed with vertical side plates 11, the lower side edges of the side plates 11 are bent and formed with inward-inclined elastic plates 12, the lower side edges of the inclined elastic plates 12 are bent and formed with vertical clamping plates 13, the inner side walls of the clamping plates 13 are abutted against circular supporting plates 2, the middle parts of the outer side walls of the supporting plates 2 are formed with supporting shafts 21, the supporting shafts 21 penetrate through the clamping plates 13 and are fixedly provided with limiting sleeves 3 in an inserting and sleeving manner, the clamping plates 13 on the lower sides of the supporting shafts 21 are formed with arc-shaped guide grooves 131, cylindrical shift levers 4 are inserted and connected into the guide grooves 131, and the inner; the shift lever 4 is fixedly connected with a spring 6, the other end of the spring 6 is fixed on a fixing block 5, and the fixing block 5 is fixed on the outer wall of the side plate 11 right above the fulcrum shaft 21.
Preferably, a plurality of vertical connecting plates 14 are formed at the upper end of the top plate 1, a plurality of connecting shafts 8 are inserted into the connecting plates 14, and two ends of each connecting shaft 8 extend out of the connecting plates 14 to be inserted into the fixed rollers 9.
Preferably, an annular clamping groove 81 is formed in the connecting shaft 8 between the connecting plates 14, the limiting ring 10 with an arc line is clamped in the clamping groove 81 of the connecting shaft 8, and two end faces of the limiting ring 10 abut against the connecting plates 14.
Preferably, an annular first groove 41 is formed in the deflector rod 4, the fixing block 5 is in an I shape, hooks are formed at two ends of the spring 6, and the hooks at two ends of the spring 6 are respectively hung in the first groove 41 of the deflector rod 4 and in the middle of the fixing block 5.
Preferably, the center of the arc of the guide groove 131 of the clamp plate 13 is located on the central axis of the support shaft 21.
Preferably, the arc of the guide groove 131 on the clamping plate 13 is equal to the arc of a semicircle, two ends of the guide groove 131 are distributed on two sides of the support shaft 21, one end of the guide groove 131 is lower than the support shaft 21, and the other end is higher than the support shaft 21.
Preferably, a T-shaped tab 7 is fixed to an outer end surface of the support shaft 21.
Preferably, the spring 6 is distributed on the outer side of the pull buckle 7; the spring 6 is positioned in the middle of the deflector rod 4, and the outer end of the deflector rod 4 is positioned outside the side plate 11.
The working principle is as follows: the invention is a turnover fixture of a packaged chip, the adopted turnover fixture can utilize a support plate 2 to clamp the packaged chip, in the moving process, after a deflector rod 4 on the turnover fixture is blocked by an obstacle, the deflector rod 4 can move along a guide groove 131 on a clamping plate 13, after the deflector rod 4 moves to the other side of a fulcrum shaft 21, the deflector rod 4 is pulled up to the upper end of the guide groove 131 under the action of a spring 6, and the obstacle cannot block the deflector rod 4; and driving lever 4 rotates the in-process, can drive extension board 2 and rotate to the realization is to the encapsulation chip upset 180 degrees, will encapsulate the lead wire upset downside of chip upside, thereby can realize that the lead wire of encapsulation chip both sides all soaks.
The examples are intended to illustrate the invention, but not to limit it. The described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the present invention, and therefore, the scope of the appended claims should be accorded the full scope of the invention as set forth in the appended claims.
Claims (8)
1. The utility model provides a packaged chip's upset anchor clamps, includes horizontally roof (1), and the shaping of buckling in the both sides of roof (1) has vertical curb plate (11), and the shaping of buckling in the lower side of curb plate (11) has oblique elastic plate (12) of leanin, and the shaping of buckling in the lower side of elastic plate (12) has vertical splint (13), its characterized in that to one side: the inner side wall of the clamping plate (13) is abutted against the round supporting plate (2), a fulcrum shaft (21) is formed in the middle of the outer side wall of the supporting plate (2), the fulcrum shaft (21) penetrates through the clamping plate (13) and is fixed with a limiting sleeve (3) in an inserting and sleeving manner, a circular arc-shaped guide groove (131) is formed in the clamping plate (13) on the lower side of the fulcrum shaft (21), a cylindrical shifting lever (4) is inserted in the guide groove (131), and the inner end of the shifting lever (4) is fixed on the supporting plate (2); the driving lever (4) is fixedly connected with a spring (6), the other end of the spring (6) is fixed on a fixing block (5), and the fixing block (5) is fixed on the outer wall of the side plate (11) right above the fulcrum shaft (21).
2. The flip jig for encapsulating chips as claimed in claim 1, wherein: the upper end of the top plate (1) is provided with a plurality of vertical connecting plates (14), a plurality of connecting shafts (8) are inserted into the connecting plates (14), and two ends of each connecting shaft (8) extend out of the connecting plates (14) and are sleeved with the fixed idler wheels (9).
3. The flip jig for encapsulating chips as claimed in claim 2, wherein: an annular clamping groove (81) is formed in the connecting shaft (8) between the connecting plates (14), a limiting ring (10) with an arc line is clamped in the clamping groove (81) of the connecting shaft (8), and two end faces of the limiting ring (10) abut against the connecting plates (14).
4. The flip jig for encapsulating chips as claimed in claim 1, wherein: an annular first groove (41) is formed in the deflector rod (4), the fixing block (5) is H-shaped, hooks are formed at two ends of the spring (6), and the hooks at two ends of the spring (6) are respectively hung in the first groove (41) of the deflector rod (4) and in the middle of the fixing block (5).
5. The flip jig for encapsulating chips as claimed in claim 1, wherein: the circle center of the arc of the guide groove (131) on the clamping plate (13) is positioned on the central axis of the fulcrum shaft (21).
6. The flip jig for encapsulating chips as claimed in claim 2, wherein: the arc radian of the guide groove (131) on the clamping plate (13) is equal to that of a semicircle, two ends of the guide groove (131) are distributed on two sides of the support shaft (21), one end of the guide groove (131) is lower than the support shaft (21), and the other end of the guide groove (131) is higher than the support shaft (21).
7. The flip jig for encapsulating chips as claimed in claim 1, wherein: and a T-shaped pull buckle (7) is fixed on the outer end surface of the fulcrum shaft (21).
8. The flip jig for encapsulating chips as claimed in claim 1, wherein: the springs (6) are distributed on the outer side of the pull buckle (7); the spring (6) is positioned in the middle of the deflector rod (4), and the outer end of the deflector rod (4) is positioned on the outer side of the side plate (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010106986.6A CN111162031B (en) | 2020-02-20 | 2020-02-20 | Overturning clamp for packaged chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010106986.6A CN111162031B (en) | 2020-02-20 | 2020-02-20 | Overturning clamp for packaged chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111162031A true CN111162031A (en) | 2020-05-15 |
| CN111162031B CN111162031B (en) | 2022-08-09 |
Family
ID=70566053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010106986.6A Active CN111162031B (en) | 2020-02-20 | 2020-02-20 | Overturning clamp for packaged chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111162031B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111959916A (en) * | 2020-07-22 | 2020-11-20 | 苍南树蒙机械科技有限公司 | A rotatory clamping device for encapsulating silver thick liquid |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205816A (en) * | 2009-03-02 | 2010-09-16 | Shin Etsu Polymer Co Ltd | Jig for examination of substrate housing container |
| CN205363808U (en) * | 2016-01-22 | 2016-07-06 | 湖州恒大液压设备有限公司 | Board workstation turns over |
| CN109560007A (en) * | 2017-09-27 | 2019-04-02 | 天津天星电子有限公司 | A kind of turnover device for diode package |
| CN109571050A (en) * | 2018-11-30 | 2019-04-05 | 重庆程顺汽车配件制造有限公司 | A kind of automobile parts overturning and positioning device |
| CN208923071U (en) * | 2018-10-18 | 2019-05-31 | 恒泰柯半导体（上海）有限公司 | Turnover device is used in a kind of manufacture of chip production |
| CN209374423U (en) * | 2019-02-21 | 2019-09-10 | 华芯智造微电子(重庆)股份有限公司 | A kind of chip bonding device with chip turning function |
| CN209606575U (en) * | 2019-02-27 | 2019-11-08 | 华芯智造微电子(重庆)股份有限公司 | A kind of turnover mechanism of chip testing machine |
| CN209675262U (en) * | 2019-04-01 | 2019-11-22 | 东泰高科装备科技有限公司 | A kind of turnover device |
-
2020
- 2020-02-20 CN CN202010106986.6A patent/CN111162031B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205816A (en) * | 2009-03-02 | 2010-09-16 | Shin Etsu Polymer Co Ltd | Jig for examination of substrate housing container |
| CN205363808U (en) * | 2016-01-22 | 2016-07-06 | 湖州恒大液压设备有限公司 | Board workstation turns over |
| CN109560007A (en) * | 2017-09-27 | 2019-04-02 | 天津天星电子有限公司 | A kind of turnover device for diode package |
| CN208923071U (en) * | 2018-10-18 | 2019-05-31 | 恒泰柯半导体（上海）有限公司 | Turnover device is used in a kind of manufacture of chip production |
| CN109571050A (en) * | 2018-11-30 | 2019-04-05 | 重庆程顺汽车配件制造有限公司 | A kind of automobile parts overturning and positioning device |
| CN209374423U (en) * | 2019-02-21 | 2019-09-10 | 华芯智造微电子(重庆)股份有限公司 | A kind of chip bonding device with chip turning function |
| CN209606575U (en) * | 2019-02-27 | 2019-11-08 | 华芯智造微电子(重庆)股份有限公司 | A kind of turnover mechanism of chip testing machine |
| CN209675262U (en) * | 2019-04-01 | 2019-11-22 | 东泰高科装备科技有限公司 | A kind of turnover device |
Non-Patent Citations (1)
| Title |
|---|
| 吴明留等: "180°模具翻转机构的设计与仿真", 《宁波大学学报(理工版)》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111959916A (en) * | 2020-07-22 | 2020-11-20 | 苍南树蒙机械科技有限公司 | A rotatory clamping device for encapsulating silver thick liquid |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111162031B (en) | 2022-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111162031B (en) | Overturning clamp for packaged chip | |
| CN205520347U (en) | Jump ring push in device | |
| CN111599736A (en) | Lead immersion equipment of chip packaging piece | |
| CN107486676A (en) | A kind of sheet metal box body welder | |
| CN111610200A (en) | Butt-clamp positioning rotary lifting type computer experiment all-dimensional scanning detector | |
| CN216882316U (en) | Pipe feeding mechanism for pipe cutting of laser cutting machine | |
| CN202539808U (en) | Semi-automatic welding line for laser welding of nut cap of cylindrical cell | |
| CN210998485U (en) | Rubber ring sleeving machine for producing automobile valve sleeves | |
| CN111584418A (en) | Avoid blocked encapsulation chip anchor clamps | |
| CN211971304U (en) | Output device of umbrella frame connecting rope | |
| CN210327308U (en) | Spacing cramp device of automatic cramp machine of motor | |
| CN202540024U (en) | Automatic feeding mechanism for frame assembling machine | |
| CN207564006U (en) | A kind of sheet metal box body welder | |
| CN214557134U (en) | Six-station automatic turntable machine | |
| CN206615732U (en) | One kind clappers positioner | |
| CN206052176U (en) | A kind of cleaning minus plate board-washing machine | |
| CN212443930U (en) | Automatic change welding equipment | |
| CN210587819U (en) | Water pump turbine assembly carrier seat | |
| CN216414697U (en) | Automatic assembling machine for thin film circuit board and middle layer | |
| CN210878431U (en) | Flange sleeving equipment | |
| CN111452296A (en) | Flash removing and immersing device of chip packaging part | |
| CN215879166U (en) | Cleaning machine unloading platform climbing mechanism | |
| CN204369253U (en) | Fabrics automatic trimming device | |
| CN211420259U (en) | Convenient fixed automobile transmission gear shaft quenching frock | |
| CN219383771U (en) | Automatic feeding and discharging production line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220718 Address after: 402460 No. 79, Dongfang Avenue, Changzhou street, Rongchang District, Chongqing Applicant after: CHONGQING DABIAO ELECTRONIC SCIENCE AND TECHNOLOGY CO.,LTD. Address before: Room 1303, building B, Kangxin garden, 569 Wensan Road, Xihu District, Hangzhou City, Zhejiang Province Applicant before: HANGZHOU EZSOFT TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |