CN109545698A - A kind of device for positioning and securing and the method to silicon-based tellurium-cadmium mercury disk testing flatness - Google Patents
A kind of device for positioning and securing and the method to silicon-based tellurium-cadmium mercury disk testing flatness Download PDFInfo
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- CN109545698A CN109545698A CN201811299672.1A CN201811299672A CN109545698A CN 109545698 A CN109545698 A CN 109545698A CN 201811299672 A CN201811299672 A CN 201811299672A CN 109545698 A CN109545698 A CN 109545698A
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- positioning
- securing
- silicon
- sample
- cadmium mercury
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
The invention discloses a kind of device for positioning and securing and to the method for silicon-based tellurium-cadmium mercury disk testing flatness, the present invention passes through setting one device for positioning and securing to silicon-based tellurium-cadmium mercury disk testing flatness, the centre of the device for positioning and securing is equipped with sample support, and discharge guiding groove of the setting for ventilation in sample support, the discharge of gas when to realize to test, it avoids in test, the problem of elapsing the gas driven out of between silicon substrate and glass plate repeatedly is needed, the problems such as so as to avoid the damage for causing sample due to misoperation.
Description
Technical field
The present invention relates to infrared detector technical fields, more particularly to a kind of device for positioning and securing and to silicon-based tellurium-cadmium mercury
The method of disk testing flatness.
Background technique
In infrared semiconductor Material Field, HgCdTe material is due to itself being a kind of direct band-gap semicondictor material and having
Adjustable forbidden bandwidth can cover entire infrared band, a kind of ideal infrared detector material is become, from 70 years
In generation, begins to be widely used in preparing different types of infrared detector, and it is most widely used currently to have become infrared acquisition field
General material for detector.By nearly continuous development in 30 years, have been able at present a variety of using LPE, MOVPE and MBE etc.
Method prepares the Hg1-xCdxTe epitaxial film and high performance infrared detector of many high quality, large area, low cost
Mercury cadmium telluride thin film need molecular beam epitaxy technique to prepare.
For large scale mercury cadmium telluride substrate, surface smoothness influences bigger, Si to subsequent device flip-chip interconnection technique
It is influenced in base mercury cadmium telluride process by factors such as Si piece thickness, annealing temperature, annealing rates, the surface of Si base mercury cadmium telluride is flat
Whole degree difference if surface smoothness is difficult to ensure can cause the uniformity of thicknesses of layers to be deteriorated, then will be unable to realize high
The preparation requirement of performance HgCdTe infrared focal plane detector.Therefore accurately measure mercury cadmium telluride substrate surface smoothness and its
Face shape situation, for control substrate material uniformity, optimization molecular beam epitaxial process and the tellurium cadmium mercury epitaxial lining for obtaining high quality
Bottom is vital.For focal plane device, the signal output of photosensitive member needs to complete by reading circuit on device, reads
The coupling between circuit and the photosensitive member of device is then realized by In column out.In order to guarantee the connected ratio of interconnection, to device
Profile pattern have very high requirement, and the surface smoothness of device is determined by the profile pattern of epitaxial substrate completely.
When testing silicon-based tellurium-cadmium mercury surface smoothness, usually using glass plate, although different size silicon substrates can be tested
Mercury cadmium telluride disk surfaces flatness, but placed on a glass by silicon-based tellurium-cadmium mercury disk material, it needs to carry out material anti-
Multiple passage, drives the gas between silicon substrate and glass plate out of, and causes the problem of print surprisingly slides in test process.
Summary of the invention
The present invention provides a kind of device for positioning and securing and to the method for silicon-based tellurium-cadmium mercury disk testing flatness, to solve
Existing silicon-based tellurium-cadmium mercury disk needs the problem of elapsing the gas driven out of between silicon substrate and glass plate repeatedly when being tested.
One aspect of the present invention provides a kind of device for positioning and securing, comprising:
Plummer, for carrying sample support；
The sample support is the circular hollow structure for the groove type being arranged on the plummer, for fixing
Silicon-based tellurium-cadmium mercury disk；
Multiple discharge guiding grooves are uniformly arranged in the sample support, for ventilating.
Preferably, further includes: the tangent line interface point of the quarter circular arc of the sample support is arranged in start mark point
Place.
Preferably, further includes: groove is arranged between the sample support and the plummer.
Preferably, the groove is rectangular.
Preferably, the plummer is rectangle or circle.
Preferably, the diameter of the annulus of the sample support is matched with the diameter of the silicon-based tellurium-cadmium mercury disk.
Second aspect of the present invention provides the method for a kind of pair of silicon-based tellurium-cadmium mercury disk testing flatness, comprising:
Step A: silicon-based tellurium-cadmium mercury wafer sample is fitted into device for positioning and securing；
Step B: device for positioning and securing is placed on sample stage, and the start mark point in device for positioning and securing is placed on pre-
Fixed position；
Step C: it is aligned in the vision periphery of 1X1 with start mark point and right-angle side in structure；
Step D: the visual field is moved on silicon-based tellurium-cadmium mercury wafer sample, and lifting object lens are focused, and adjusts sample stage knob
Broaden interference fringe；
Step E: starting point is returned, the concatenation of testing flatness is carried out；
Step F: constituency is carried out to splicing result and is analyzed.
The present invention has the beneficial effect that:
The present invention is fixed by setting one device for positioning and securing to silicon-based tellurium-cadmium mercury disk testing flatness, the positioning
The centre of device is equipped with sample support, and discharge guiding groove of the setting for ventilation in sample support, thus when realizing to test
Gas discharge, avoid test when, the problem of elapsing the gas driven out of between silicon substrate and glass plate repeatedly is needed, to keep away
The problems such as damage of sample is caused due to misoperation is exempted from.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the device for positioning and securing of the embodiment of the present invention；
Fig. 2 is the front view of the device for positioning and securing of this embodiment of the present invention；
Fig. 3 is the top view of the device for positioning and securing of the embodiment of the present invention.
Specific embodiment
It is cumbersome in order to solve searching starting point difficulty and degasification in existing silicon-based tellurium-cadmium mercury surface smoothness test method
The problem of, the present invention provides a kind of device for positioning and securing, and the present invention is by setting one to silicon-based tellurium-cadmium mercury disk flatness
The centre of the device for positioning and securing of test, the device for positioning and securing is equipped with sample support, and is arranged in sample support for leading to
The discharge guiding groove of gas, thus realize to test when gas discharge, avoid test when, need to elapse repeatedly drive out of silicon substrate with
The problem of gas between glass plate, the problems such as so as to avoid the damage for causing sample due to misoperation.Below in conjunction with
Attached drawing and embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, the present invention is not limited.
First embodiment of the invention provides a kind of device for positioning and securing, referring to figure 1, figure 2 and figure 3, the fixed dress of the positioning
Setting includes: plummer 4, for carrying sample support 2；
When it is implemented, plummer 4 is designed as rectangle, circular configuration by the embodiment of the present invention.
The sample support 2 is the circular hollow structure for the groove type being arranged on the plummer 4, for fixing silicon
Base mercury cadmium telluride disk；
When it is implemented, the embodiment of the present invention is to realize to hold silicon-based tellurium-cadmium mercury wafer sample by sample support 2
Support is carried, the diameter of the annulus of the sample support 2 is matched with the diameter of the silicon-based tellurium-cadmium mercury disk.
Relative to plummer 4, the embodiment of the present invention is by setting groove structure for sample support 2, to be more advantageous to
Sample is accommodated, and to a certain extent can be to avoid the landing of sample.
Multiple discharge guiding grooves 3 are uniformly arranged in the sample support 2, for ventilating.
The embodiment of the present invention is exhausted by the way that discharge guiding groove 3 is arranged, and easily causes sample sliding so as to avoid manual exhaust
The problem of falling.
When it is implemented, device described in the embodiment of the present invention is additionally provided with start mark point 1, which is set
It sets at the tangent line interface point of the quarter circular arc of the sample support 2, is being surveyed by setting start mark point 1 to realize
Registration process is carried out to sample during examination.
When it is implemented, device described in the embodiment of the present invention is additionally provided with groove 5, which is arranged in the sample
Between support 2 and the plummer 4, by the groove 5 can aspect laboratory technician sample put into sample support 2.
Groove 5 in the embodiment of the present invention be it is rectangular, certainly when it is implemented, those skilled in the art can also basis
Groove 5 is set other shapes by actual needs.
Surface smoothness is to test to obtain by optical profilometer, and test philosophy is to be mapped to sample surfaces by illumination
Later, light forms interference fringe after the plane of reference and sample surfaces reflection.Any variation of optical path difference can very between coherent light
Delicately lead to the mobile variation of interference fringe, the change in optical path length of coherent light is mainly the variation of the geometry distance passed through by it
Cause, so can measure the minor alteration amount of light path geometrical length by the mobile variation of interference fringe, to measure sample table
The variation of face face shape situation.Surface smoothness is calculated by the optical path difference between sample and the plane of reference.
When using optical profilometer test material surface smoothness, material need to be placed into device for positioning and securing sample support
On 2, the sample support 2 on device for positioning and securing can slide to avoid sample, while sample support 2 is equipped with multiple exhausts and falls
Slot, it is convenient to omit deaeration step；Then lifting object lens are focused sample surfaces, since optical profilometer is realizing flatness
It is that the measurement result of each rectangular field of view is spliced when test, is tested so having to setting in test
Point.It can be reference substance using four vertex of rectangle and right-angle side when rectangle prototype test, be aligned and tested；And circular piece
Son does not have characteristic point and object of reference, need to record the coordinate of disk top side and leftmost side point to calculate initial point coordinate, then into
Row test, now using there is the structure subtest of mark point that can simplify this operation, can effectively improve safety when test
And testing efficiency.
Second embodiment of the invention provides a kind of solid based on positioning described in any one in first embodiment of the invention
Device is determined to the method for silicon-based tellurium-cadmium mercury disk testing flatness, this method comprises:
Step A: silicon-based tellurium-cadmium mercury wafer sample is fitted into device for positioning and securing；
Step B: device for positioning and securing is placed on sample stage, and the start mark point in device for positioning and securing is placed on pre-
Fixed position；
Step C: it is aligned in the vision periphery of 1X1 with start mark point and right-angle side in structure；
Step D: the visual field is moved on silicon-based tellurium-cadmium mercury wafer sample, and lifting object lens are focused, and adjusts sample stage knob
Broaden interference fringe；
Step E: starting point is returned, the concatenation of testing flatness is carried out；
Step F: constituency is carried out to splicing result and is analyzed.
The structure subtest of the start mark point of setting of the embodiment of the present invention, can simplify this operation, omit degasification behaviour
Make and is not necessarily to record the coordinate of disk top side and leftmost side point to calculate initial point coordinate；Sample support design is avoided that sample
It sliding, the gas between print and structure can be effectively discharged in the design of discharge guiding groove, and can be avoided the sliding of sample, so this
Safety and testing efficiency when the device for positioning and securing that inventive embodiments obtain can effectively improve test.
Although for illustrative purposes, the preferred embodiment of the present invention has been disclosed, those skilled in the art will recognize
It is various improve, increase and replace be also it is possible, therefore, the scope of the present invention should be not limited to the above embodiments.
Claims (7)
1. a kind of device for positioning and securing characterized by comprising
Plummer, for carrying sample support；
The sample support is the circular hollow structure for the groove type being arranged on the plummer, for fixing silicon substrate tellurium cadmium
Mercury disk；
Multiple discharge guiding grooves are uniformly arranged in the sample support, for ventilating.
2. device for positioning and securing according to claim 1, which is characterized in that further include:
Start mark point, is arranged at the tangent line interface point of the quarter circular arc of the sample support.
3. device for positioning and securing according to claim 1, which is characterized in that further include:
Groove is arranged between the sample support and the plummer.
4. device for positioning and securing according to claim 1, which is characterized in that
The groove is rectangular.
5. device for positioning and securing according to claim 1, which is characterized in that
The plummer is rectangle or circle.
6. device for positioning and securing according to claim 1, which is characterized in that
The diameter of the annulus of the sample support is matched with the diameter of the silicon-based tellurium-cadmium mercury disk.
7. a kind of survey silicon-based tellurium-cadmium mercury disk flatness based on device for positioning and securing described in any one in claim 1-6
The method of examination characterized by comprising
Step A: silicon-based tellurium-cadmium mercury wafer sample is fitted into device for positioning and securing；
Step B: device for positioning and securing is placed on sample stage, and the start mark point in device for positioning and securing is placed on and is pre-fixed
Position；
Step C: it is aligned in the vision periphery of 1X1 with start mark point and right-angle side in structure；
Step D: the visual field is moved on silicon-based tellurium-cadmium mercury wafer sample, and lifting object lens are focused, and adjusts the broadening of sample stage knob
Interference fringe；
Step E: starting point is returned, the concatenation of testing flatness is carried out；
Step F: constituency is carried out to splicing result and is analyzed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811299672.1A CN109545698B (en) | 2018-11-02 | 2018-11-02 | Positioning and fixing device and method for testing flatness of silicon-based tellurium-cadmium-mercury wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811299672.1A CN109545698B (en) | 2018-11-02 | 2018-11-02 | Positioning and fixing device and method for testing flatness of silicon-based tellurium-cadmium-mercury wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109545698A true CN109545698A (en) | 2019-03-29 |
| CN109545698B CN109545698B (en) | 2021-09-03 |
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ID=65846000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811299672.1A Active CN109545698B (en) | 2018-11-02 | 2018-11-02 | Positioning and fixing device and method for testing flatness of silicon-based tellurium-cadmium-mercury wafer |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110797273A (en) * | 2019-10-21 | 2020-02-14 | 中国电子科技集团公司第十一研究所 | Tool and method for detecting flatness of chip substrate |
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| JP2008146990A (en) * | 2006-12-08 | 2008-06-26 | Hitachi High-Technologies Corp | Sample fixing table, charged particle beam device equipped with it, and observation/analysis object part identifying method |
| CN101196693A (en) * | 2007-11-28 | 2008-06-11 | 上海微电子装备有限公司 | Silicon slice fixing part |
| CN101276151A (en) * | 2008-05-14 | 2008-10-01 | 上海微电子装备有限公司 | Method and apparatus for measuring wafer surface flatness |
| KR20120027936A (en) * | 2010-09-14 | 2012-03-22 | 주식회사 엘지실트론 | Apparatus for receving wafer and deposition apparatus having the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110797273A (en) * | 2019-10-21 | 2020-02-14 | 中国电子科技集团公司第十一研究所 | Tool and method for detecting flatness of chip substrate |
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| Publication number | Publication date |
|---|---|
| CN109545698B (en) | 2021-09-03 |
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