CN102468205A - Tray and wafer processing equipment with same - Google Patents
Tray and wafer processing equipment with same Download PDFInfo
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- CN102468205A CN102468205A CN2010105499164A CN201010549916A CN102468205A CN 102468205 A CN102468205 A CN 102468205A CN 2010105499164 A CN2010105499164 A CN 2010105499164A CN 201010549916 A CN201010549916 A CN 201010549916A CN 102468205 A CN102468205 A CN 102468205A
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- pallet
- groove
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- tray body
- raceway groove
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Abstract
The invention provides a tray. The tray comprises a tray body and an upper convex part, wherein a groove used for accommodating a wafer is formed on the surface of the tray body; an air passage is arranged on the tray body; the upper convex part is arranged on the bottom face of the groove, so that an upper ditch is limited in the groove; and the air passage is communicated with the upper ditch. According to the tray provided by the invention, the ditch is formed in the groove on the upper surface of the tray body, so when the wafer is placed in the groove, a relatively big clearance is formed between the wafer and the bottom face of the groove, and a fine vacuum clearance is not formed; and heat transfer air smoothly flows between the bottom face of the groove and the back face of the wafer, and the heat transfer effect between the wafer and the tray is good, so the cooling effect on the tray and the wafer is improved, the temperature of the wafer is more uniform, and the wafer processing effect is good. The invention also provides wafer processing equipment with the tray.
Description
Technical field
The present invention relates to technical field of semiconductors, particularly a kind of pallet and have its wafer processing apparatus.
Background technology
The plasma process technology is meant the gas ionization that will feed reative cell under certain condition, produces the plasma that comprises positive and negative charged particle and free atom group.Wherein, plasma and substrate generation physics and chemical reaction are to obtain needed semiconductor structure.
In the LED process for making, particularly in the etching technics, in order to fix, to support and transmit wafer and realize temperature control, and move or inconsistent phenomenon for fear of in technical process, occurring, often need use pallet.This type pallet apparatus has been widely used in the semiconductor plasma etching reaction chamber.
As depicted in figs. 1 and 2, be provided with a plurality of grooves 110 ' at the upper surface of pallet 100 ', be used for the wafer that placement need be carried out Cement Composite Treated by Plasma (like etching processing etc.).Through after the Cement Composite Treated by Plasma, the temperature of wafer raises, through helium is blowed to the lower surface of wafer from gas passage, with the cooling wafer.
But; The bottom surface of the placement wafer of the groove 110 ' of traditional tray 100 ' is the plane; Therefore between the bottom surface of groove 110 ' and wafer, possibly there is tiny vacuum gap, thereby causes between pallet and the wafer heat transfer property bad, poor to the cooling effect of wafer; Make that the temperature of wafer is too high and uniformity is relatively poor, influence the processing quality of wafer.In addition, because the bottom surface of the placement wafer of groove 110 ' is the plane, so refrigerating gas flowing between the bottom surface of groove 110 ' and wafer is not smooth, has influenced the cooling effect to wafer yet.
Summary of the invention
The object of the invention is intended to solve at least one of above-mentioned technological deficiency.
For this reason, the objective of the invention is to propose a kind of pallet, this pallet has good gas heat conduction structure, promotes heat transfer gas to flow good cooling results.
Another object of the present invention is to propose a kind of wafer processing apparatus with above-mentioned pallet.
To achieve these goals, the embodiment of first aspect present invention has proposed a kind of pallet, comprises tray body, and the upper surface of said tray body is provided with the groove that is used to hold wafer, and said tray body is provided with gas passage; With raising portion, said raising portion is arranged on the bottom surface of said groove in said groove, to limit raceway groove, and wherein said gas passage is communicated with the said raceway groove of going up.
Pallet according to the embodiment of the invention; Through forming raceway groove in the groove on the tray body upper surface, in the time of in wafer is placed into said groove, formed bigger gap between wafer and the said groove floor; Not having tiny vacuum gap exists; And heat transfer gas mobile smooth and easy between groove floor and chip back surface, the thermal conduction effect between wafer and the pallet is good, thereby the cooling effect of pallet and wafer is improved; And make that the temperature of wafer is more even, processing of wafers is effective.
Pallet according to the embodiment of the invention can also have following additional technical feature:
Said groove is a plurality of, and said tray body is provided with a plurality of said gas passages, said a plurality of gas passages respectively with said a plurality of grooves in the said raceway groove of going up be communicated with.Thus, can use a pallet that a plurality of wafers are handled simultaneously, and to the good cooling results of wafer, the temperature of wafer is even.
The said area of going up raceway groove is 20～80% of a said tray body upper surface area.When the area of last raceway groove was set to aforementioned proportion, heat transfer gas flowing in last raceway groove can further be improved the cooling effect to wafer.
And then the said area of going up raceway groove is 40% of a said tray body upper surface area.
Said gas passage extends in the said groove from the bottom surface of said tray body.
Said raising portion comprises the column of a plurality of discrete distribution on said groove floor.Through raising portion being formed the column of a plurality of discrete distribution on groove floor, can increase the area of going up raceway groove, thereby strengthen cooling effect wafer.
In one embodiment of the invention, said raising portion comprises that a plurality of arc bodies are to limit raceway groove on a plurality of a plurality of sons that communicate with each other in said groove.
In one embodiment of the invention; Said a plurality of arc body is arranged in the form of concentric ring; Said concentric ring is the center of circle with the center of said groove, and raceway groove comprises raceway groove and the radially sub raceway groove of going up that is communicated with raceway groove on the said circumferential son on the circumferential son that is arranged in the concentric ring form on said a plurality of son.
Thus, last raceway groove is even in the difference of groove floor, and is easy to process, can further improve the cooling effect to wafer, improves the temperature homogeneity of wafer simultaneously.
In one embodiment of the invention, said gas passage is formed on the center of said groove.
In one embodiment of the invention, the neighboring, bottom surface of said groove is provided with to the sealing ring holding tank that extends below and be used to hold the wafer sealing ring.Thus,, can seal the heat transfer gas between wafer and the groove floor effectively, prevent the leakage of heat transfer gas through the wafer sealing ring is set.
In one embodiment of the invention, further comprise according to the pallet of the embodiment of the invention: the neighboring closure, said neighboring closure is along the periphery edge that circumferentially is formed on the lower surface of tray body; With lower convexity portion, said lower convexity portion is provided with on the lower surface of said tray body and is positioned within the closure of said neighboring, and wherein said lower convexity portion highly is not more than the height of said neighboring closure.Thus, form lower channel through the lower surface at pallet, it is unobstructed to make that heat-conduction medium flows between pallet and chuck, strengthens the cooling effect to pallet thus, and the temperature of pallet is more even, and then can reduce the temperature that is positioned at wafer equably.
The embodiment of second aspect present invention has proposed a kind of wafer processing apparatus, comprising: chamber body is limited with reative cell in the said chamber body; Pedestal, said pedestal are contained in the said reative cell;
Chuck, said chuck are arranged on the said pedestal; Pallet, said pallet are arranged on the said chuck, and wherein said pallet is according to the described pallet of first aspect present invention; Hold down assembly, said holding down assembly is used for said pallet is fixed to said chuck; With the gas feed path, said gas feed path is communicated with the gas passage of said pallet and is used for heat transfer gas is supplied in the groove of said pallet.
Wafer processing apparatus according to the embodiment of the invention passes through to adopt aforesaid pallet; Promote heat-conduction medium flowing between pallet and wafer; Improved cooling effect, and the temperature homogeneity of wafer is good, has improved the treatment effect to wafer to pallet and wafer.
In one embodiment of the invention, said wafer processing apparatus further comprises the chuck sealing ring, and said chuck sealing ring is arranged between the upper surface of lower surface and said chuck of said pallet.Thus,, can seal the heat transfer gas between chuck and the pallet effectively, prevent the leakage of heat transfer gas through the chuck sealing ring is set.
In one embodiment of the invention, said holding down assembly comprises: cover plate, said cover plate are arranged on the said pallet; Pressure ring; Said pressure ring is pressed on the said cover plate; With the pressure ring elevating mechanism, said pressure ring elevating mechanism links to each other with said pressure ring and is used to go up and down said pressure ring.
Aspect that the present invention adds and advantage part in the following description provide, and part will become obviously from the following description, or recognize through practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously with easily understanding becoming the description of embodiment below in conjunction with accompanying drawing, wherein:
Fig. 1 is the vertical view of traditional tray;
Fig. 2 is the main pseudosection of traditional tray;
Fig. 3 is the vertical view of pallet according to an embodiment of the invention;
Fig. 4 is the vertical view of a groove on the pallet among Fig. 3;
Fig. 5 is the vertical view of pallet according to another embodiment of the invention;
Fig. 6 is the vertical view of a groove among Fig. 5;
Fig. 7 is the upward view of pallet among Fig. 3; And
Fig. 8 is the sketch map of wafer processing apparatus according to an embodiment of the invention.
Embodiment
Describe embodiments of the invention below in detail, the example of said embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Be exemplary through the embodiment that is described with reference to the drawings below, only be used to explain the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention; Term " on ", the orientation of indications such as D score, " left side ", " right side ", " vertically ", " level ", " interior ", " outward " or position relation be for based on orientation shown in the drawings or position relation; Only be for the ease of describing the present invention rather than requiring the present invention therefore can not be interpreted as limitation of the present invention with specific azimuth configuration and operation.
With reference to figure 3 and 4 pallet 100 is according to an embodiment of the invention described below.
Particularly, the upper surface of tray body 120 is provided with the groove 110 that is used to hold wafer 400 (with reference to figure 8), and tray body 120 is provided with gas passage 130.Raising portion 111 is arranged on the bottom surface of groove 110; Thereby raising portion 111 limits raceway groove 112 in groove 110; Gas passage 130 is communicated with last raceway groove 112; Be used for upwards supplying with heat transfer gas in the raceway groove 112, helium for example is so that cool off pallet 100 and the wafer 400 that is placed into groove 110.
It will be appreciated that,, also we can say, formed raceway groove 112, also on the bottom surface of groove 110, formed raising portion 111 thus in the bottom surface of groove 110 raising portion 111 being set on the bottom surface of groove 110 with raceway groove on limiting 112.For example, can directly process raceway groove 112 on the bottom surface of groove 110, also process raising portion 111 simultaneously.Can not exceed the degree of depth of groove 110 for the height that persons of ordinary skill in the art may appreciate that raising portion 111, in other words, raising portion 111 can not stretch out from the upper surface of tray body 120.
In a concrete example of the present invention, as shown in Figure 3, on the bottom surface of tray body 120, be provided with a plurality of grooves 110, correspondingly, tray body 120 is provided with a plurality of gas passages 130, and gas passage 130 is communicated with a plurality of grooves 110 interior last raceway grooves 112 respectively.Through a plurality of grooves 110 are set, can handle a plurality of wafers 400 simultaneously on tray body 120.Certainly, it is understandable that, all formed last raceway groove 112 separately on the bottom surface of each groove 110.
In the further embodiment of the present invention; In order to improve cooling effect to wafer 400 and pallet 100; The area of last raceway groove 112 be tray body 120 upper surface area 20～80%, more preferably, the area of last raceway groove 112 be tray body 120 upper surface area 40%.Certainly, it will be appreciated that, when tray body 120 is provided with a plurality of groove 110, the area of last raceway groove 112 be meant the area sum of the last raceway groove 112 in fluted 110.
In a specific embodiment of the present invention, gas passage 130 extends up in the groove 110 from the bottom surface of raising portion 111.
As shown in Figure 4, in a preferred embodiment of the invention, the raising portion 111 in each groove 110 comprises a plurality of arc body 111a, thereby in groove 110, limits raceway groove on a plurality of a plurality of sons that communicate with each other.
One of the present invention more specifically in the example; As shown in Figure 4; A plurality of arc body 111a are arranged in the form of concentric ring; Said concentric ring is the center of circle with the center of groove 110, and raceway groove comprises that raceway groove 112a goes up raceway groove 112b with the radially son that is communicated with circumferentially sub upward raceway groove 112a on the circumferential son that is arranged in the concentric ring form on said a plurality of son.Eight radially sub raceway groove 112b of going up have been shown among Fig. 4, and radially son is gone up raceway groove 112b and is gone up raceway groove 112a along the radially extension of groove 110 so that be communicated with circumferential son.
As shown in Figure 4, gas passage 130 is formed on the center of groove 110.
Shown in Fig. 8, Fig. 3 and 4, in some embodiments of the invention, the neighboring, bottom surface of groove 110 is provided with to the sealing ring holding tank 113 that extends below and be used to hold wafer sealing ring 500.In the time of in wafer 400 is placed into groove 110, wafer sealing ring 500 can seal the space between the bottom surface of lower surface and groove 110 of wafer 400, avoids heat transfer gas to escape.
With reference to figure 5 and Fig. 6 pallet 100 is according to another embodiment of the present invention described below.In Fig. 5 and embodiment shown in Figure 6, raising portion 111 comprises the column 1110 of a plurality of discrete distribution on the bottom surface of groove 110, for example cylinder.Column 1110 can be evenly distributed on the bottom surface of groove 110, thereby heat transfer gas can flow in last raceway groove 112 more swimmingly, improves the temperature homogeneity of cooling effect and wafer 400.Column 1110 can be integrally formed with tray body 120, is connected on the bottom surface of groove 110 after also can forming separately.
Other structures according to Fig. 5 and pallet 100 embodiment illustrated in fig. 6 can be identical with the pallet 100 of the embodiment that describes with reference to figure 3 and Fig. 4, no longer is repeated in this description here.
As shown in Figure 7, in some embodiments of the invention, pallet 100 further comprises neighboring closure 45 and lower convexity portion 43.Neighboring closure 45 is along the periphery edge that circumferentially is formed on the lower surface of tray body 120.Lower convexity portion 43 is provided with on the lower surface of tray body 120 and is positioned within the neighboring closure 45, and the height of lower convexity portion 43 is not more than the height of neighboring closure 45, and in other words, lower convexity portion 43 can not extend beyond neighboring closure 45 downwards.Similar with raising portion 111; Lower convexity portion 43 goes out lower channel 44 in the lower surface defining of tray body 120; Thereby when pallet 100 is placed into 600 last times of chuck; Heat transfer gas can flow between the upper surface of the lower surface of tray body 120 and chuck 600 swimmingly, and further arrives through gas passage 130 and go up in the raceway groove 112 so that pallet 100 and wafer 400 are cooled off.
Alternatively, lower convexity portion 43 also can form arc body, thereby lower channel 44 forms the circumferential sub-lower channel and the radially sub-lower channel that is communicated with circumferential sub-lower channel of concentric ring form.
Thereby through lower surface lower convexity portion 43 is set and forms lower channel 44, can further improve the uniformity of cooling effect and chip temperature in tray body 120.
The wafer processing apparatus of describing according to the embodiment of the invention with reference to figure 8 below 1.
Wafer processing apparatus 1 according to an embodiment of the invention, and for example LED etching machine comprises chamber body 200, pedestal 700, and chuck 600, pallet 100 holds down assembly and gas feed path 1000.
Particularly, be limited with reative cell in the chamber body 200.Pedestal 700 is contained in the said reative cell, for example is arranged on the bottom of said reative cell.Chuck 600 is arranged on the pedestal 700.Pallet 100 is arranged on the chuck 600, and pallet 100 can wherein be provided with wafer sealing ring 500 for the pallet of describing with reference to top embodiment 100 in sealing ring holding tank 113, is used to seal the space between the bottom surface of lower surface and groove 110 of wafer 400.Hold down assembly and be used for pallet 100 fixing (promptly compressing) to chuck 600.Gas feed path 100 is communicated with the gas passage 130 of pallet 100 and is used for heat transfer gas is supplied in the groove 110 on the pallet 100.
As shown in Figure 8, gas feed path 100 runs through pedestal 700 and forms with chuck 600.
Wafer processing apparatus 1 according to the embodiment of the invention; Owing to formed raceway groove 112 in the groove 110 on pallet 100; Therefore heat transfer gas can get into gas passage 130 through gas feed path 100 and go up in the raceway groove 112, can not form tiny vacuum gap between the bottom surface of the lower surface of wafer 400 and groove 110, and heat transfer gas flows unobstructed; Heat-conductive characteristic is good between wafer 400 and the pallet 100; Therefore to the good cooling results of wafer 400 and pallet 100, the temperature of wafer 400 is even, and the etching quality is good.
As shown in Figure 8; In one embodiment of the invention; Wafer processing apparatus 1 further comprises chuck sealing ring 900; Chuck sealing ring 900 is arranged between the upper surface of lower surface and chuck 600 of pallet 100, thereby space between the upper surface of the lower surface of sealing pallet 100 and chuck 600 avoids heat transfer gas to escape.
As shown in Figure 8, in a specific embodiment of the present invention, holding down assembly comprises cover plate 300, pressure ring 800 and pressure ring elevating mechanism 2000.Cover plate 300 is arranged on the pallet 100; Pressure ring 800 is pressed on the cover plate 300; Pressure ring elevating mechanism 2000 links to each other with pressure ring 800 and is used to go up and down pressure ring 800; For example when pressure ring elevating mechanism 2000 rises pressure ring 800, can cover plate 300 be taken off, then chuck 600 and pallet 100 taken out from reative cell.When pressure ring elevating mechanism 2000 compresses pressure ring 800 downwards, pressure ring 800 holddown plates 300, thus pallet 100 is pressed on the chuck 600.
As shown in Figure 8, in a concrete example of the present invention, pressure ring elevating mechanism 2000 comprises bracing frame 2003, the axis of guide 2005, a plurality of connecting axles 2004, driver 2007 and driver link 2006.
The upper end of the axis of guide 2005 links to each other with bracing frame 2003 respectively, and the pilot hole that the lower end of the axis of guide 2005 is passed driver link 1 respectively slidably stretches out downwards.
The upper end of a plurality of connecting axles 2004 links to each other with the pressure ring that is positioned at reative cell 800 through a plurality of bellowss 2002 respectively.Bellows 2002 is arranged between the upper surface of bottom surface and bracing frame 2003 of reative cell, and pressure ring 800 links to each other with the upper end of bellows 2002 through connecting rod, and the lower end of bellows 2002 links to each other with the upper end of connecting axle 2004.
In some embodiment of the utility model, driver 2007 for example is a cylinder, and the free end of the cylinder bar of cylinder links to each other with driver link 2006.
Certainly, pressure ring elevating mechanism 2000 is not limited to said structure, and those of ordinary skill in the art can adopt other any suitable mechanism's up-down pressure rings 800.
According to the wafer processing apparatus of the embodiment of the invention, owing to the cooling effect to pallet and wafer, the temperature of wafer is even, and is therefore good to the treatment effect of wafer.
In the description of this specification, reference term " embodiment ", " some embodiment ", " example ",
The description of " concrete example " or " some examples " etc. means the concrete characteristic, structure, material or the characteristics that combine this embodiment or example to describe and is contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete characteristic, structure, material or the characteristics of description can combine with suitable manner in any one or more embodiment or example.
Although illustrated and described embodiments of the invention; For those of ordinary skill in the art; Be appreciated that under the situation that does not break away from principle of the present invention and spirit and can carry out multiple variation, modification, replacement and modification that scope of the present invention is accompanying claims and be equal to and limit to these embodiment.
Claims (14)
1. a pallet is characterized in that, comprising:
Tray body, the upper surface of said tray body is provided with the groove that is used to hold wafer, and said tray body is provided with gas passage; With
Raising portion, said raising portion are arranged on the bottom surface of said groove in said groove, to limit raceway groove, and wherein said gas passage is communicated with the said raceway groove of going up.
2. pallet as claimed in claim 1 is characterized in that, said groove is a plurality of, and said tray body is provided with a plurality of said gas passages, said a plurality of gas passages respectively with said a plurality of grooves in the said raceway groove of going up be communicated with.
3. pallet as claimed in claim 2 is characterized in that, the said area of going up raceway groove is 20～80% of a said tray body upper surface area.
4. pallet as claimed in claim 3 is characterized in that, the said area of going up raceway groove is 40% of a said tray body upper surface area.
5. pallet as claimed in claim 1 is characterized in that, said gas passage extends in the said groove from the bottom surface of said tray body.
6. pallet as claimed in claim 1 is characterized in that, said raising portion comprises the column of a plurality of discrete distribution on said groove floor.
7. pallet as claimed in claim 1 is characterized in that, said raising portion comprises that a plurality of arc bodies are to limit raceway groove on a plurality of a plurality of sons that communicate with each other in said groove.
8. pallet as claimed in claim 7; It is characterized in that; Said a plurality of arc body is arranged in the form of concentric ring; Said concentric ring is the center of circle with the center of said groove, and raceway groove comprises raceway groove and the radially sub raceway groove of going up that is communicated with raceway groove on the said circumferential son on the circumferential son that is arranged in the concentric ring form on said a plurality of son.
9. pallet as claimed in claim 1 is characterized in that said gas passage is formed on the center of said groove.
10. pallet as claimed in claim 1 is characterized in that, the neighboring, bottom surface of said groove is provided with to the sealing ring holding tank that extends below and be used to hold the wafer sealing ring.
11. pallet as claimed in claim 1 is characterized in that, further comprises:
The neighboring closure, said neighboring closure is along the periphery edge that circumferentially is formed on the lower surface of tray body; With
Lower convexity portion, said lower convexity portion are provided with on the lower surface of said tray body and are positioned within the closure of said neighboring, and the height of wherein said lower convexity portion is not more than the height of said neighboring closure.
12. a wafer processing apparatus is characterized in that, comprising:
Chamber body is limited with reative cell in the said chamber body;
Pedestal, said pedestal are contained in the said reative cell;
Chuck, said chuck are arranged on the said pedestal;
Pallet, said pallet are arranged on the said chuck, and wherein said pallet is like arbitrary described pallet among the claim 1-11;
Hold down assembly, said holding down assembly is used for said pallet is fixed to said chuck; With
Gas feed path, said gas feed path are communicated with the gas passage of said pallet and are used for heat transfer gas is supplied in the groove of said pallet.
13. wafer processing apparatus as claimed in claim 12 is characterized in that, further comprises the chuck sealing ring, said chuck sealing ring is arranged between the upper surface of lower surface and said chuck of said pallet.
14. wafer processing apparatus as claimed in claim 12 is characterized in that, said holding down assembly comprises:
Cover plate, said cover plate are arranged on the said pallet;
Pressure ring; Said pressure ring is pressed on the said cover plate; With
The pressure ring elevating mechanism, said pressure ring elevating mechanism links to each other with said pressure ring and is used to go up and down said pressure ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105499164A CN102468205A (en) | 2010-11-18 | 2010-11-18 | Tray and wafer processing equipment with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105499164A CN102468205A (en) | 2010-11-18 | 2010-11-18 | Tray and wafer processing equipment with same |
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| CN102468205A true CN102468205A (en) | 2012-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105499164A Pending CN102468205A (en) | 2010-11-18 | 2010-11-18 | Tray and wafer processing equipment with same |
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| CN (1) | CN102468205A (en) |
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| CN103887137A (en) * | 2012-12-21 | 2014-06-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction cavity and plasma device provided with same |
| CN104538333A (en) * | 2014-12-16 | 2015-04-22 | 瑞德兴阳新能源技术有限公司 | Tray for eliminating warping of wafer |
| CN104576484A (en) * | 2013-10-12 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Tray structure in semiconductor equipment |
| CN104835763A (en) * | 2015-04-27 | 2015-08-12 | 沈阳拓荆科技有限公司 | Temperature-controllable heating disc with petal-shaped surface structure |
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| WO2016180007A1 (en) * | 2015-05-14 | 2016-11-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and semiconductor processing apparatus |
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| CN107305857A (en) * | 2016-04-20 | 2017-10-31 | 北京北方华创微电子装备有限公司 | Wafer support assembly, reaction chamber and semiconductor processing equipment |
| WO2018133482A1 (en) * | 2017-01-19 | 2018-07-26 | 江苏鲁汶仪器有限公司 | Lower electrode wafer chuck of etching machine |
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| CN103887137A (en) * | 2012-12-21 | 2014-06-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction cavity and plasma device provided with same |
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| CN104835763A (en) * | 2015-04-27 | 2015-08-12 | 沈阳拓荆科技有限公司 | Temperature-controllable heating disc with petal-shaped surface structure |
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Application publication date: 20120523 |