CN109511181B - Graphene electrothermal film of copper conductive electrode and preparation method thereof - Google Patents
Graphene electrothermal film of copper conductive electrode and preparation method thereof Download PDFInfo
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 222
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 218
- 239000010949 copper Substances 0.000 title claims abstract description 193
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 190
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 190
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
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- 239000007789 gas Substances 0.000 claims description 9
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- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- -1 graphite alkene Chemical class 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 12
- 229910052709 silver Inorganic materials 0.000 abstract description 12
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
- H05B3/08—Heater elements structurally combined with coupling elements or holders having electric connections specially adapted for high temperatures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The invention provides a graphene electrothermal film with copper conductive electrodes and a preparation method thereof, and provides a novel graphene electrothermal film with copper conductive electrodes, which comprises a substrate, a graphene conductive film covered on the substrate and an upper substrate, wherein the copper conductive electrodes are respectively arranged on two sides of the upper surface of the graphene conductive film, which are close to the edge, one surface of the copper conductive electrode, which is in contact with the graphene conductive film, is coated with a layer of graphene slurry, and the graphene conductive substrate and the upper substrate are tightly connected by adopting an adhesive. According to the invention, the surface of the traditional copper conductive electrode is coated with a layer of graphene slurry, so that the conductivity of the copper conductive electrode is improved, the graphene-coated copper conductive electrode is pasted on the surface of the graphene thermoelectric film by using the adhesive, and the graphene thermoelectric film has the same good conductive effect as the traditional graphene thermoelectric film adopting the silver-coated copper conductive electrode. Compared with the traditional process, the preparation process of printing the conductive silver paste is simplified, the structure is simple, the operation is easy, and the industrial application is facilitated.
Description
Technical Field
The invention relates to an electronic device with a silver heat conduction layer structure and a packaging method thereof, in particular to an electronic device with a silver-based composite heat conduction layer structure and a packaging method thereof, which are applied to the technical field of electronic packaging.
Background
Graphene (Graphene) has many excellent properties, and thus is widely applied to the fields of energy storage materials, environmental engineering, sensors and the like. And the film material is considered to be the best choice for preparing the film material due to the advantages of super-strong thermal stability, light transmittance, high electron mobility and the like. The graphene film has excellent optical, electrical, thermal and mechanical properties, has great application potential in the fields of sensors, liquid crystal display, optoelectronic devices and the like, and can be applied to the fields of light-emitting diodes, intelligent wearing, solar cells, gas detectors and the like.
In recent years, a graphene electrothermal film, also called a graphene heating film or a graphene heating film, draws extensive attention in the field of intelligent wearing, because graphene has the following multiple advantages:
1. the raw materials are wide in source and easy to obtain, and the graphene film is a carbon-based material, so that the density is low, the cost of the electric heating material can be effectively reduced, and the electric heating material can be used in a large area;
2. the graphene film has good toughness, can be bent at will, keeps good conductivity, has extremely high machinability, and is beneficial to meeting the requirements of various shapes and applications;
3. the graphene electrothermal film has proper resistivity, ultra-fast heating rate, extremely high thermal conductivity and rapid heat dissipation capacity, almost no thermal inertia, and can rapidly conduct heat to other materials, which is difficult to achieve by carbon materials and metal materials with other structures;
4. the heat conduction is fast, the temperature is uniform and stable, and the service life is long; the thickness of the graphene film is 1 millimeter to 1 micrometer, so that the graphene film can be well compounded with other materials, and an electric heating system can be designed simply and effectively;
5. the graphene electrothermal film has low ground hole voltage and working voltage, and can work below the safe voltage of a human body;
6. convenient to use is nimble, can a plurality of graphite alkene electric heat membrane connect to use in groups etc..
The traditional graphene conductive electrode is prepared by a screen printing conductive silver paste mode, the process of the mode is complicated, a longer preparation period is needed, and great limitation exists in the process aspect.
Due to the needs of practical application and preparation production, how to effectively and efficiently prepare the conductive electrode for practical application of the composite graphene electrothermal film is a technical problem which is widely concerned and urgently needed to be solved by first-line researchers in many fields.
Disclosure of Invention
In order to solve the problems of the prior art, the invention aims to overcome the defects of the prior art and provide a graphene electrothermal film of a copper conductive electrode and a preparation method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
a graphene electrothermal film of a copper conductive electrode is formed by tightly combining a substrate, a conductive film, a bonding layer and an upper substrate film in a layered combination manner from bottom to top in sequence, wherein the conductive film is a graphene film, two copper conductive electrodes are embedded in a bonding layer between the upper-layer substrate film and the conductive film, the two copper conductive electrodes are arranged at the positions of the graphene film close to the edges of two sides, the copper conductive electrodes are electrically connected with the graphene film through graphene slurry, the copper conductive electrodes are fixedly connected on the graphene film after the graphene slurry is solidified, the bonding layer is made of adhesive, the upper-layer base film and the graphene film are tightly connected together through the bonding layer, and the two copper conductive electrodes are separated by the adhesive, so that the copper conductive electrodes are fixed between the upper-layer base film and the graphene film to form a sandwich-type packaging structure.
Preferably, a lead is used to connect the two copper conductive electrodes to an external power source through the corresponding leads.
As a preferred technical scheme of the invention, the copper conductive electrode is in a strip shape, two ends of the copper conductive electrode are respectively positioned in the bonding layer between the upper-layer base coating film and the conductive film, the copper conductive electrode is packaged in the bonding layer and isolated from the outside, and two ends of the copper conductive electrode are close to the edge of the conductive film.
Preferably, the graphene slurry uniformly distributed on the surface of the copper conductive electrode is solidified and then is electrically connected with the graphene film to form a graphene solidification connection interface between the copper conductive electrode and the graphene film.
The substrate or the upper-layer substrate film is preferably made of any one material or a composite material of any mixture of PET, PE, PVC and glass.
The adhesive layer is preferably made of any one or a mixture of a hot melt adhesive and a non-setting adhesive.
The invention discloses a preparation method of a graphene electrothermal film of a copper conductive electrode, which comprises the following steps:
a. transferring the graphene film on the growth substrate on which the graphene film grows onto a target substrate to obtain a component combining the graphene electric heating film and the target substrate; as a preferred technical scheme, a growth substrate is placed in a reaction furnace body, reaction is carried out at a set temperature through reaction gas, the growth substrate with the surface covered with the graphene film is obtained, a reaction gas source adopts mixed gas of hydrogen and gaseous carbon source gas, and the reaction furnace adopts a chemical vapor deposition tube furnace; the growth substrate is preferably a Cu substrate or a Ni substrate;
b. uniformly coating graphene slurry on the surface of the copper conductive electrode to obtain the copper conductive electrode combined with the graphene slurry film;
c. placing two copper conductive electrodes combined with the graphene slurry film obtained in the step b on the graphene electric heating film prepared in the step a, enabling the two copper conductive electrodes to be located at positions close to the edge of the graphene electric heating film, enabling the two copper conductive electrodes not to be in direct contact with each other, enabling a second substrate with an adhesive to serve as an upper covering film to be bonded on the graphene electric heating film, enabling the two copper conductive electrodes to be located between the second substrate and the graphene electric heating film, enabling the adhesive to be filled between the two copper conductive electrodes, enabling the second substrate and the graphene electric heating film to be bonded through the adhesive, enabling the copper conductive electrodes to be fixed between the second substrate and the graphene electric heating film to form a sandwich-type packaging structure, and obtaining the graphene electric heating film with the copper conductive electrodes.
Compared with the prior art, the invention has the following obvious and prominent substantive characteristics and remarkable advantages:
1. compared with the existing graphene electrothermal film conductive electrode, the graphene electrothermal film of the copper conductive electrode provided by the invention is a novel graphene electrothermal film of the copper conductive electrode, and graphene slurry is coated on the surface of the traditional copper conductive electrode, so that the conductivity of the copper conductive electrode is improved;
2. according to the invention, the graphene-coated copper conductive electrode is pasted on the surface of the graphene electrothermal film by using the adhesive, and the graphene electrothermal film has a good conductive effect as that of a graphene film of a traditional silver-coated copper conductive electrode;
3. compared with the traditional process, the preparation method simplifies the traditional preparation process of printing the conductive silver paste, has mild process conditions, simple structure, easy operation and low cost, and is beneficial to industrial application.
Drawings
Fig. 1 is a schematic cross-sectional stacked structure diagram of a graphene electrothermal film with a copper conductive electrode according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a copper conductive electrode on a graphene film according to an embodiment of the invention.
Detailed Description
The above-described scheme is further illustrated below with reference to specific embodiments, which are detailed below:
example one
In this embodiment, referring to fig. 1 and 2, a graphene electrothermal film of a copper conductive electrode is formed by tightly combining a substrate 6, a conductive thin film 1, a bonding layer 5 and an upper substrate coating 4 in a layered combination manner from bottom to top, wherein the conductive thin film 1 is a graphene thin film, the substrate 6 is a glass substrate, the upper substrate coating 4 is made of PET, two copper conductive electrodes 2 are embedded in the bonding layer 5 between the upper substrate coating 4 and the conductive thin film 1, the two copper conductive electrodes 2 are disposed at positions of the graphene thin film near two side edges, the copper conductive electrodes 2 are electrically connected with the graphene thin film through graphene slurry, the copper conductive electrodes 2 are fixedly connected to the graphene thin film after the graphene slurry is solidified, the bonding layer 5 is made of hot melt adhesive, the upper substrate coating 4 and the graphene thin film are tightly connected together through the bonding layer 5, the two copper conductive electrodes 2 are separated by the hot melt adhesive, so that the copper conductive electrodes 2 are fixed between the upper-layer substrate coating film 4 and the graphene film to form a sandwich-type packaging structure.
In the present embodiment, referring to fig. 1 and 2, two copper conductive electrodes 2 are connected to an external power source through respective leads 3 using leads 3.
In this embodiment, referring to fig. 1 and fig. 2, the copper conductive electrode 2 is in a strip shape and is disposed in parallel, two ends of the copper conductive electrode 2 are respectively located in the adhesive layer 5 between the upper base coating film 4 and the conductive thin film 1, the copper conductive electrode 2 is encapsulated in the adhesive layer 5 and isolated from the outside, and two ends of the copper conductive electrode 2 are close to the edge of the conductive thin film 1.
In this embodiment, referring to fig. 1 and fig. 2, after the graphene slurry uniformly distributed on the surface of the copper conductive electrode 2 is solidified, the graphene slurry is electrically and thermally connected to the graphene thin film, so as to form a graphene solidification connection interface between the copper conductive electrode 2 and the graphene thin film.
In this embodiment, referring to fig. 1 and fig. 2, a method for preparing a graphene electrothermal film of a copper conductive electrode in this embodiment includes the following steps:
a. the method comprises the following steps of placing a growth substrate into a reaction furnace body by using a Cu substrate, reacting the growth substrate at a set temperature by using reaction gas, obtaining the growth substrate with the surface covered with a graphene film after the reaction is finished, wherein a reaction gas source adopts mixed gas of hydrogen and gaseous carbon source gas, and the reaction furnace adopts a chemical vapor deposition tube furnace; then transferring the graphene film on the growth substrate on which the graphene film grows to a target substrate made of a glass material to obtain a component combining the graphene electric heating film and the target substrate, namely transferring the graphene electric heating film to a glass substrate 6;
b. uniformly coating graphene slurry on the surface of the copper conductive electrode 2 to obtain the copper conductive electrode 2 combined with a graphene slurry film;
c. placing two copper conductive electrodes 2 combined with the graphene slurry film obtained in the step b on the graphene electric heating film prepared in the step a, enabling the two copper conductive electrodes 2 to be located at positions close to the edge of the graphene electric heating film, enabling the two copper conductive electrodes 2 not to be in direct contact with each other, enabling a second substrate with a hot melt adhesive to serve as an upper substrate film 4 to be bonded on the graphene electric heating film, enabling the two copper conductive electrodes 2 to be located between the second substrate and the graphene electric heating film, enabling the hot melt adhesive to be filled between the two copper conductive electrodes 2, enabling the second substrate and the graphene electric heating film to be bonded through the hot melt adhesive, enabling the copper electric heating film conductive electrodes 2 to be fixed between the second substrate and the graphene electric heating film to form a sandwich-shaped packaging structure, and obtaining the graphene provided with the copper conductive electrodes 2.
The graphene electrothermal film of the copper conductive electrode comprises a substrate 6, a conductive film covering the substrate 6, an electrode layer and an upper substrate film 4, wherein the conductive film is a graphene film, the edges of two opposite sides of the graphene film are respectively provided with a copper conductive electrode 2, one surface of the copper conductive electrode 2, which is in contact with the graphene film, is coated with graphene slurry, and the graphene film and the upper substrate film 4 are bonded together through hot melt adhesive. Adopt wire 3, make two copper conductive electrode 2 be connected with external power source through corresponding wire 3 respectively, can guarantee that the graphite alkene electric heat membrane of copper conductive electrode switches on. The copper conductive electrode 2 is strip-shaped, and two ends of the copper conductive electrode 2 are close to the edge of the conductive film 1, so that the copper conductive electrode 2 is ensured to be fully contacted with the surface of the graphene film. The graphene slurry uniformly distributed on the surface of the copper conductive electrode 2 is electrically and thermally connected with the graphene film after being solidified, so that a graphene solidification connection interface between the copper conductive electrode 2 and the graphene film is formed, and good electric conduction performance can be guaranteed. The two ends of the copper conductive electrode 2 are respectively positioned in the bonding layer 5 between the upper-layer base coating film 4 and the conductive film 1, the copper conductive electrode 2 is packaged in the bonding layer 5 and isolated from the outside, the bonding layer 5 is made of hot melt adhesive, the upper-layer base coating film 4 and the graphene film are tightly connected together through the bonding layer 5, the copper conductive electrode 2 is fixed between the upper-layer base coating film 4 and the graphene film to form a sandwich-type packaging structure, the position fixation of the two copper conductive electrodes 2 is ensured, the copper conductive electrode 2 is positioned between the graphene film and the upper-layer base coating film 4, and the parts, which are not blocked by the copper conductive electrode 2, between the graphene film and the upper-layer base coating film 4 are bonded through the hot melt adhesive; thereby obtaining the graphene electrothermal film provided with the copper conductive electrode 2.
Example two
The present embodiment is substantially the same as the first embodiment, and the special points are that:
in the embodiment, a graphene electrothermal film of a copper conductive electrode is formed by tightly combining a substrate 6, a conductive thin film 1, a bonding layer 5 and an upper substrate film 4 in a layered combination manner from bottom to top in sequence, wherein the conductive thin film 1 is a graphene thin film, the substrate 6 is a PET substrate, the upper substrate film 4 is made of PET, two copper conductive electrodes 2 are embedded in the bonding layer 5 between the upper substrate film 4 and the conductive thin film 1, the two copper conductive electrodes 2 are arranged at positions of the graphene thin film close to edges at two sides, the copper conductive electrodes 2 are electrically connected with the graphene thin film through graphene slurry, the copper conductive electrodes 2 are fixedly connected to the graphene thin film after the graphene slurry is solidified, the bonding layer 5 is made of non-setting adhesive, the upper substrate film 4 and the graphene thin film are tightly connected together through the bonding layer 5, the two copper conductive electrodes 2 are separated by the non-setting adhesive, so that the copper conductive electrode 2 is fixed between the upper-layer substrate coating 4 and the graphene film to form a sandwich-type packaging structure. The graphene electrothermal film of the copper conductive electrode prepared by the embodiment has flexibility, and can be applied to the fields of wearable equipment and the like.
In the present embodiment, referring to fig. 1 and 2, two copper conductive electrodes 2 are connected to an external power source through respective leads 3 using the leads 3.
In this embodiment, referring to fig. 1 and fig. 2, the copper conductive electrode 2 is in a strip shape, two ends of the copper conductive electrode 2 are respectively located in the adhesive layer 5 between the upper base coating film 4 and the conductive thin film 1, the copper conductive electrode 2 is packaged in the adhesive layer 5 and isolated from the outside, and two ends of the copper conductive electrode 2 are close to the edge of the conductive thin film 1.
In this embodiment, referring to fig. 1 and fig. 2, after the graphene slurry uniformly distributed on the surface of the copper conductive electrode 2 is solidified, the graphene slurry is electrically and thermally connected to the graphene thin film, so as to form a graphene solidification connection interface between the copper conductive electrode 2 and the graphene thin film.
In this embodiment, referring to fig. 1 and fig. 2, a method for preparing a graphene electrothermal film of a copper conductive electrode in this embodiment includes the following steps:
a. the method comprises the following steps of placing a growth substrate into a reaction furnace body by adopting a Ni substrate, reacting the growth substrate at a set temperature by using reaction gas, obtaining the growth substrate with the surface covered with a graphene film after the reaction is finished, wherein a reaction gas source adopts mixed gas of hydrogen and gaseous carbon source gas, and the reaction furnace adopts a chemical vapor deposition tube furnace; then transferring the graphene film on the growth substrate on which the graphene film grows to a target substrate made of a PET material to obtain a component combining the graphene electric heating film and the target substrate, namely transferring the graphene electric heating film to a PET substrate 6;
b. uniformly coating graphene slurry on the surface of the copper conductive electrode 2 to obtain the copper conductive electrode 2 combined with a graphene slurry film;
c. placing two copper conductive electrodes 2 combined with the graphene slurry film obtained in the step b on the graphene electric heating film prepared in the step a, enabling the two copper conductive electrodes 2 to be located at positions close to the edge of the graphene electric heating film, enabling the two copper conductive electrodes 2 not to be in direct contact with each other, enabling a second substrate with a non-setting adhesive to serve as an upper substrate film 4 to be bonded on the graphene electric heating film, enabling the two copper conductive electrodes 2 to be located between the second substrate and the graphene electric heating film, enabling the non-setting adhesive to be filled between the two copper conductive electrodes 2, enabling the second substrate and the graphene electric heating film to be bonded through the non-setting adhesive, enabling the copper electric heating film conductive electrodes 2 to be fixed between the second substrate and the graphene electric heating film to form a sandwich-type packaging structure, and obtaining the graphene provided with the copper conductive electrodes 2. The graphene electrothermal film of the copper conductive electrode prepared by the embodiment has flexibility.
Comparative example one:
a copper-coated copper conductive electrode 2 is adopted, a graphene electrothermal film of the copper conductive electrode is formed by tightly combining a substrate 6, a conductive thin film 1, a bonding layer 5 and an upper substrate film 4 in a layered combination mode from bottom to top in sequence, wherein the conductive thin film 1 is a graphene thin film, the substrate 6 is a PET substrate, the upper substrate film 4 is made of PET, two copper conductive electrodes 2 are embedded in a bonding layer 5 between the upper substrate film 4 and the conductive thin film 1, the two copper conductive electrodes 2 are arranged at positions, close to edges of two sides, of the graphene thin film, the interfaces of the copper conductive electrodes 2 and the graphene thin film are connected through copper-coated layers, the copper conductive electrodes 2 are fixedly connected onto the graphene thin film through the copper-coated layers, the bonding layer 5 is made of hot melt adhesive, the upper substrate film 4 and the graphene thin film are tightly connected together through the bonding layer 5, the two copper conductive electrodes 2 are separated by the hot melt adhesive, so that the copper conductive electrodes 2 are fixed between the upper-layer substrate coating film 4 and the graphene film to form a sandwich-type packaging structure. The graphene electrothermal film of the copper conductive electrode is prepared by the copper-coated copper conductive electrode 2 in the comparative example.
Comparative example two:
the copper conductive electrode 2 coated with silver is adopted, a graphene electrothermal film of the copper conductive electrode is formed by tightly combining a substrate 6, a conductive thin film 1, a bonding layer 5 and an upper substrate film 4 in a layered combination mode from bottom to top in sequence, wherein the conductive thin film 1 is a graphene thin film, the substrate 6 is a PET substrate, the upper substrate film 4 is made of PET, two copper conductive electrodes 2 are embedded in the bonding layer 5 between the upper substrate film 4 and the conductive thin film 1, the two copper conductive electrodes 2 are arranged at the positions, close to the edges of two sides of the graphene thin film, the interface of the copper conductive electrode 2 and the graphene thin film is connected through a silver coating layer, the copper conductive electrode 2 is fixedly connected onto the graphene thin film by utilizing a silver coating layer, the bonding layer 5 is made of hot melt adhesive, the upper substrate film 4 and the graphene thin film are tightly connected together through the bonding layer 5, the two copper conductive electrodes 2 are separated by using a hot melt adhesive, so that the copper conductive electrodes 2 are fixed between the upper-layer substrate covering film 4 and the graphene film to form a sandwich-type packaging structure. The comparative example uses a silver coated copper conductive electrode 2 to prepare a graphene electrothermal film of the copper conductive electrode.
Experimental test analysis:
in the embodiment and the comparative example, the copper conductive electrode 2 coated with graphene, the copper conductive electrode coated with copper and the copper conductive electrode coated with silver are respectively adopted, the graphene electric heating films of three different copper conductive electrodes are respectively prepared, different composite copper conductive electrodes of the three graphene electric heating films are respectively connected with an external power supply through leads to be electrified, then thermal imaging of the surfaces of the three graphene electric heating films is observed through an infrared thermal imager, and through experimental tests, the thermal imaging effect of the graphene electric heating film of the copper conductive electrode prepared by adopting the copper conductive electrode coated with copper in the comparative example I is poor, and the heating is uneven. Therefore, the graphene electrothermal film of the copper conductive electrode prepared by using the graphene-coated copper conductive electrode 2 in the embodiment of the present invention has the same good conductivity as the graphene electrothermal film of the copper conductive electrode prepared by using the silver-coated copper conductive electrode 2 in the conventional method, but the preparation cost of the graphene electrothermal film of the copper conductive electrode prepared by using the graphene-coated copper conductive electrode 2 in the embodiment of the present invention is lower than that of the graphene electrothermal film of the copper conductive electrode prepared by using the silver-coated copper conductive electrode 2 in the conventional method, and obviously, the graphene electrothermal film of the copper conductive electrode prepared by using the graphene-coated copper conductive electrode 2 in the embodiment of the present invention has industrial and application advantages.
In summary, the embodiments of the present invention provide a novel graphene electrothermal film with a copper conductive electrode, including a substrate, a graphene conductive film covering the substrate, copper conductive electrodes respectively disposed on two sides of the upper surface of the graphene conductive film near the edge, a layer of graphene slurry coated on the surface of the copper conductive electrode contacting the graphene conductive film, and an upper substrate film, wherein the graphene conductive substrate and the upper substrate film are tightly connected by an adhesive. The graphene electrothermal film of the copper conductive electrode can better keep the excellent performance of the graphene electrothermal film. According to the embodiment of the invention, the surface of the traditional copper conductive electrode is coated with the graphene slurry, so that the conductivity of the copper conductive electrode is further improved, the graphene-coated copper conductive electrode is pasted on the surface of the graphene thermoelectric film by using the adhesive, and the graphene thermoelectric film has the same good conductive effect as the traditional graphene thermoelectric film adopting the silver-coated copper conductive electrode. But compared with the traditional process, the preparation process of printing the conductive silver paste is simplified, the structure is simple, the operation is easy, and the industrial application is facilitated.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes and modifications can be made according to the purpose of the invention, and any changes, modifications, substitutions, combinations or simplifications made according to the spirit and principle of the technical solution of the present invention shall be equivalent substitution ways, so long as the purpose of the present invention is met, and the graphene electrothermal film of the copper conductive electrode and the preparation method thereof shall fall within the protection scope of the present invention as long as the technical principle and inventive concept of the present invention do not depart.
Claims (6)
1. A graphite alkene electric heat membrane of copper conducting electrode which characterized in that: form with stratiform combination mode by basement (6), conductive film (1), tie coat (5) and upper strata basement tectorial membrane (4) in proper order from bottom to top, wherein conductive film (1) adopts graphene film, buries two copper conductive electrode (2), two in tie coat (5) between upper basement tectorial membrane (4) and conductive film (1) copper conductive electrode (2) set up in the position department that graphene film is close to both sides edge, copper conductive electrode (2) carry out the electricity through graphite alkene thick liquids and graphene film and are connected, and copper conductive electrode (2) fixed connection is on graphene film after the graphite alkene thick liquids solidify, adopts wire (3), makes two copper conductive electrode (2) are connected with external power supply through corresponding wire (3) respectively, copper conductive electrode (2) are rectangular form, and the both ends of copper conductive electrode (2) are located upper basement tectorial membrane (4) and conductive film (1) respectively In the bonding layer (5), the copper conductive electrode (2) is packaged in the bonding layer (5) and isolated from the outside, and two ends of the copper conductive electrode (2) are close to the edge of the conductive film (1); the bonding layer (5) is made of an adhesive, the upper-layer substrate coating film (4) and the graphene film are tightly connected together through the bonding layer (5), and the two copper conductive electrodes (2) are arranged in a separated mode through the adhesive, so that the copper conductive electrodes (2) are fixed between the upper-layer substrate coating film (4) and the graphene film to form a sandwich-type packaging structure; and the graphene slurry uniformly distributed on the surface of the copper conductive electrode (2) is solidified and then electrically connected with the graphene film to form a graphene solidification connection interface between the copper conductive electrode (2) and the graphene film.
2. The graphene electrothermal film of the copper conductive electrode according to claim 1, wherein: the substrate (6) or the upper substrate covering film (4) is made of any one material or a composite material of any mixture of PET, PE, PVC and glass.
3. The graphene electrothermal film of the copper conductive electrode according to claim 1, wherein: the adhesive layer (5) is made of any one or a mixture of a hot melt adhesive and a non-setting adhesive.
4. A preparation method of a graphene electrothermal film of the copper conductive electrode as claimed in claim 1, characterized by comprising the following steps:
a. transferring the graphene film on the growth substrate on which the graphene film grows onto a target substrate to obtain a component combining the graphene electric heating film and the target substrate;
b. uniformly coating graphene slurry on the surface of the copper conductive electrode to obtain the copper conductive electrode combined with the graphene slurry film;
c. placing two copper conductive electrodes combined with the graphene slurry film obtained in the step b on the graphene electric heating film prepared in the step a, enabling the two copper conductive electrodes to be located at positions close to the edge of the graphene electric heating film, enabling the two copper conductive electrodes not to be in direct contact with each other, enabling a second substrate with an adhesive to serve as an upper-layer covering film to be bonded on the graphene electric heating film, enabling the two copper conductive electrodes to be located between the second substrate and the graphene electric heating film, enabling the adhesive to be filled between the two copper conductive electrodes, enabling the second substrate and the graphene electric heating film to be bonded through the adhesive, enabling the copper conductive electrodes to be fixed between the second substrate and the graphene electric heating film to form a sandwich-type packaging structure, and obtaining the graphene electric heating film with the copper conductive electrodes.
5. The preparation method of the graphene electrothermal film of the copper conductive electrode according to claim 4, characterized in that: in the step a, a growth substrate is placed in a reaction furnace body, reaction is carried out at a set temperature through reaction gas, the growth substrate with the surface covered with the graphene film is obtained, a reaction gas source adopts mixed gas of hydrogen and gaseous carbon source gas, and the reaction furnace adopts a chemical vapor deposition tube furnace.
6. The preparation method of the graphene electrothermal film of the copper conductive electrode according to claim 4, characterized in that: the growth substrate adopts a Cu substrate or a Ni substrate.
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| CN110267372B (en) * | 2019-05-07 | 2022-02-01 | 宁波柔碳电子科技有限公司 | Graphene electric heating composite part and manufacturing method thereof |
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| CN110267375B (en) * | 2019-06-25 | 2022-03-08 | 宁波柔碳电子科技有限公司 | Preparation process of graphene electric heating film and graphene electric heating film |
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| CN110933782A (en) * | 2019-10-21 | 2020-03-27 | 珠海烯蟀科技有限公司 | Method and device for using flexible graphene electrode as high borosilicate graphene conducting layer |
| CN111712001A (en) * | 2020-06-11 | 2020-09-25 | 安徽宇航派蒙健康科技股份有限公司 | Graphite alkene electric heat membrane for warm up |
| CN111669846A (en) * | 2020-06-11 | 2020-09-15 | 安徽宇航派蒙健康科技股份有限公司 | Preparation method of graphene electrothermal film for floor heating |
| CN114643186B (en) * | 2020-12-18 | 2024-02-20 | 晨柔点智能科技(北京)有限公司 | High-barrier flexible packaging material and manufacturing method thereof |
| CN112940629B (en) * | 2021-02-01 | 2023-01-13 | 中国科学院过程工程研究所 | Graphene RFID tag and preparation method and application thereof |
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