CN109500604A - The adjustment method of five dimension manual displacement platforms, the turning auxiliary system containing five dimension manual displacement platforms and turning auxiliary system - Google Patents
The adjustment method of five dimension manual displacement platforms, the turning auxiliary system containing five dimension manual displacement platforms and turning auxiliary system Download PDFInfo
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- CN109500604A CN109500604A CN201811488251.3A CN201811488251A CN109500604A CN 109500604 A CN109500604 A CN 109500604A CN 201811488251 A CN201811488251 A CN 201811488251A CN 109500604 A CN109500604 A CN 109500604A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
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Abstract
The adjustment method of five dimension manual displacement platforms, the turning auxiliary system and turning auxiliary system of tieing up manual displacement platforms containing five of the invention.It is related to turning auxiliary device and adjustment method, purpose is to overcome existing laser-assisted machining technology, when cutting cylindrical end face, cutter and the geometry site of laser spot cannot keep constant problem, wherein five dimension manual displacement device, including No.1 straight-line displacement platform, No. two straight-line displacement platforms, No. three straight-line displacement platforms, No. four straight-line displacement platforms and swing offset platform；Turning auxiliary system containing five dimension manual displacement devices, including elliptical ultrasonic vibration knife system and laser.The present invention devises one kind five and ties up manual displacement platform and the turning auxiliary system containing the five dimensions manual displacement platform, and for a kind of adjustment method of the turning design in auxiliary system.By the adjusting to lathe and five dimension manual displacement platforms, the geometry site of cutter and laser spot is enabled to keep constant.
Description
Technical field
The present invention relates to turning auxiliary device and adjustment methods, and in particular to turning of the laser in conjunction with elliptical ultrasonic vibration
Auxiliary device and adjustment method.
Background technique
The hard brittle materials such as hard alloy, ceramics, glass suffer from important application in fields such as aviation, photoelectron, medical treatment
Value and wide application prospect, the key components and parts made of these materials with its superior mechanical, optical characteristics compared to
Traditional part substantially increases service life and resists the ability of extreme condition.But these materials due to its own compared with
High hardness or lower fracture toughness etc. lead to all have biggish difficulty of processing；Moreover, in process can be to knife
Tool generates biggish abrasion.Therefore, it is difficult to obtain ideal surface quality and machining accuracy using traditional mechanical processing tools.
Laser-assisted machining and elliptical ultrasonic vibration assisted machining are considered as a kind of effective means of processing hard brittle material.
Laser-assisted machining can reduce the hardness of material surface, reduce difficulty of processing；Elliptical ultrasonic vibration assisted machining is that one kind makes
Cutter generates the high-frequency vibration of elliptical orbit, realizes cutter-material intermittent-cutting method in process, can effectively subtract
The abrasion of few cutter reduces cutting force and improves machined surface quality.
But currently, laser-assisted machining all can be only applied to cylinder facing, laser spot and cutting zone are placed in together
In one periphery.And since radius of machining during the cutting process gradually changes in building up by welding, the geometry of cutter and laser spot
Positional relationship cannot keep constant.
Summary of the invention
The purpose of the invention is to overcome existing laser-assisted machining technology, when cutting cylindrical end face, cutter and swash
The geometry site of optical focus cannot keep constant problem, provides one kind five and ties up manual displacement platform, containing five dimension hands
The turning auxiliary system of dynamic displacement platform and the adjustment method of turning auxiliary system.
Five dimensions manual displacement devices of the invention, including No.1 straight-line displacement platform, No. two straight-line displacement platforms, No. three it is straight
Displacement of the lines platform, No. four straight-line displacement platforms and swing offset platform；
It is XOZ plane, the adjustment axis of No.1 straight-line displacement platform axial direction with the microscope carrier upper surface of No.1 straight-line displacement platform
Rectangular coordinate system in space XYZ is established for X-axis, if W is oriented parallel to XOZ plane and is acute angle with the angle of X-axis, Z axis；
The microscope carrier of No. two straight-line displacement platforms can be moved along Y-axis；The microscope carrier of No. three straight-line displacement platforms can be moved along Z axis
It is dynamic；The microscope carrier of No. four straight-line displacement platforms can be moved along the direction W；The microscope carrier of swing offset platform can be rotated with its main shaft,
The main shaft is parallel to Y-axis；
The base station of No. three straight-line displacement platforms is fixed on the microscope carrier of No.1 straight-line displacement platform, the base of swing offset platform
Platform is fixed on the microscope carrier of No. three straight-line displacement platforms, and the base station of No. two straight-line displacement platforms is fixed on the load of swing offset platform
On platform, the base station of No. four straight-line displacement platforms is fixed on the microscope carrier of No. two straight-line displacement platforms.
The turning auxiliary system containing five dimension manual displacement devices of the invention, including elliptical ultrasonic vibration knife system and swash
Light device,
Elliptical ultrasonic vibration knife system is fixed on the Z axis workbench of lathe, and the Z axis workbench of the lathe being capable of edge
Z axis is mobile；
Five dimension manual displacement devices are fixed on the Z axis workbench of lathe, and the adjustment axis of No. three straight-line displacement platforms
Axial direction it is parallel with the main shaft of lathe；
Laser is fixed on the microscope carrier of No. four straight-line displacement platforms；The laser optical path of laser transmitting is parallel with the direction W,
And Laser emission direction is towards the main shaft of lathe.
The adjustment method of turning auxiliary system containing five dimension manual displacement devices of the invention, the specific steps are as follows:
Step 1: examination knife is coaxially fixed on the main shaft of lathe, the laser for enabling laser emit gathers in examination knife
It is burnt；
Step 2: examination knife is enabled to move along being parallel to X-direction, laser is set in examination knife ablated surface to go out a row equidistant
Ablation point；Examination knife is turned round into 180 degree around its axis, enables examination knife edge be parallel to X-direction and moves, make laser on examination knife surface
Ablation goes out the equidistant ablation point of a row again；No. two straight-line displacement platforms are adjusted repeatedly and repeat above-mentioned two assisted ablation step, until
Until two groups of ablation points are located on the same line；
Step 3: lathe is fed along Z axis, lathe tool is set to try knife surface to knife and leave cutting annulus, the cutting circle
The depth of ring is 1~3 μm；No.1 straight-line displacement platform is adjusted repeatedly, and leaves laser and cutting annulus on examination knife surface
Concentric ablation annulus, until ablation annulus is completed to debug when being overlapped with cutting annulus.
It ties up manual displacement platform the beneficial effects of the present invention are: the present invention devises one kind five and contains five dimension manually
The turning auxiliary system of displacement platform, and for a kind of adjustment method of the turning design in auxiliary system.Turning auxiliary system
Integrated ultra-precision machine tool, elliptical ultrasonic vibration knife system and laser are integrated, by lathe and five dimension manual displacement platforms
Adjusting, enable the geometry site of cutter and laser spot keep constant, can be realized laser be located at lathe tool near
Workpiece to be machined surface focuses to form heating region, keeps material softening easy to process.
Detailed description of the invention
Fig. 1 is the top view of turning auxiliary system of the present invention containing five dimension manual displacement platforms；
Fig. 2 is the schematic perspective view of turning auxiliary system of the present invention containing five dimension manual displacement platforms；
Fig. 3 is the structural schematic diagram of elliptical ultrasonic vibration knife system in the present invention；
Fig. 4 is the schematic illustration in the focusing of lathe Y direction of system debug method in the present invention；
Fig. 5 is the schematic illustration in the focusing of lathe X-direction of system debug method in the present invention；
Fig. 6 is the structural schematic diagram of laser in the present invention.
Specific embodiment
Specific embodiment one
The dimension manual displacement device of one kind five of the invention, including 7, No. two straight-line displacement platforms 8 of No.1 straight-line displacement platform,
9, No. four straight-line displacement platforms of No. three straight-line displacement platforms and swing offset platform；
It take the microscope carrier upper surface of No.1 straight-line displacement platform 7 as the adjustment axis axis of XOZ plane, No.1 straight-line displacement platform 7
Rectangular coordinate system in space XYZ is established to for X-axis, if W is oriented parallel to XOZ plane and is acute angle with the angle of X-axis, Z axis；
The microscope carrier of No. two straight-line displacement platforms 8 can be moved along Y-axis；The microscope carrier of No. three straight-line displacement platforms 9 can be along Z axis
It is mobile；The microscope carrier of No. four straight-line displacement platforms can be moved along the direction W；The microscope carrier of swing offset platform can be revolved with its main shaft
Turn, which is parallel to Y-axis；
The base station of No. three straight-line displacement platforms 9 is fixed on the microscope carrier of No.1 straight-line displacement platform 7, swing offset platform
Base station is fixed on the microscope carrier of No. three straight-line displacement platforms 9, and the base station of No. two straight-line displacement platforms 8 is fixed on swing offset platform
Microscope carrier on, the base station of No. four straight-line displacement platforms is fixed on the microscope carrier of No. two straight-line displacement platforms 8.
The straight-line displacement platform 9 of straight-line displacement platform 8, three of No.1 straight-line displacement platform 7, two and No. four displacement platforms 10
It is uniaxial manual displacement platform, swing offset platform 11 is rotary manual displacement platform, uniaxial manual displacement platform and rotation
Displacement platform includes underlying base station, the microscope carrier being located above and adjustment axis, rotates the tune of uniaxial manual displacement platform
Nodal axisn can make microscope carrier moving axially with respect to base station along adjustment axis；And adjustment axis in swing offset platform is rotated, it can make
Microscope carrier is with the middle shaft rotation perpendicular to microscope carrier plane.
Since the angle in the direction W needs to determine in actual use, No.1 straight-line displacement platform 7 and No. three are straight
After displacement of the lines platform 9 is relatively fixed, No. four displacement platforms 10 are needed through swing offset platform 11 and No.1 straight-line displacement platform 7
It is indirectly fixed with No. three straight-line displacement platforms 9；In this way can be in the case where X-axis and Z axis determine, the adjusting direction W, and No. two
Displacement of the straight-line displacement platform 8 due to adjusting vertical direction, can " No. four displacement platforms 10 needs pass through rotation in satisfaction
Displacement platform 11 and No.1 straight-line displacement platform 7 and No. three straight-line displacement platforms 9 are indirectly relatively fixed " under the premise of, setting exists
The five dimension any one layers of manual displacement device.
Specific embodiment two
Present embodiment two and the difference of specific embodiment one are, as shown in Fig. 2, further including L-type laser
Platform 14, No.1 connector 16 and No. two connectors 17,
L-type Laser platform 14 includes two joint faces, and two joint faces are end to end and vertical fixation, L-type laser
The section of device platform 14 is L shape；
The base station of No. two straight-line displacement platforms 8 is fixed on the microscope carrier of swing offset platform 11 by No.1 connector 16；L
One of joint face of type Laser platform 14 is fixed on the microscope carrier of No. two straight-line displacement platforms 8, L-type Laser platform 14
The upper surface of another joint face fixed by the base station of No. two connectors 17 and No. four straight-line displacement platforms 10.Due to No. two
Straight-line displacement platform 8 is arranged perpendicular to the microscope carrier of swing offset platform 11, it is therefore desirable to the No.1 of angle bar is similar to by shape
Connector 16 connects orthogonal No. two straight-line displacement platforms 8 and swing offset platform 11.
Specific embodiment three
The turning auxiliary system of five dimension manual displacement devices of the invention, as shown in Figure 1, including that elliptical ultrasonic vibration knife fills
1 and light device 2 are set,
Elliptical ultrasonic vibration knife system 1 is fixed on the Z axis workbench of lathe, and the Z axis workbench of the lathe can
It is moved along Z axis；
Five dimension manual displacement devices 6 are fixed on the Z axis workbench of lathe, and the adjusting of No. three straight-line displacement platforms 9
The axial direction of axis is parallel with the main shaft 15 of lathe；
Laser 2 is fixed on the microscope carrier of No. four straight-line displacement platforms 10；The laser optical path and the direction W that laser 2 emits
In parallel, and Laser emission direction towards lathe main shaft 15.
Any uniaxial manual displacement platform is adjusted, laser 2 can be made to be conditioned the tune of uniaxial manual displacement platform along this
The axial movement of nodal axisn adjusts swing offset platform, laser 2 can be made around the middle shaft rotation for being parallel to Y-axis.
As shown in fig. 6, laser 2 is integrated with all accessories of laser system in one, its advantages are that integration is good, section
Save space, the laser 2 include: protection glass pane 18, convergent mirror system 19, calibration lens system 20, laser fiber 21, water cooling connection
First 22, rear wing 23, laser QBH export head 24, base plate 25, shield 26 and front fender 27.
The working principle of turning auxiliary system containing five dimension manual displacement platforms of the invention is to use oval ultrasound
During vibration knife system 1 is processed, laser 2 emits continuous laser and focuses on being added near 4 point of a knife of lathe tool
On work workpiece planarization, workpiece to be machined surfacing is made to soften or be modified.In elliptical ultrasonic vibration knife system 1, ultrasonic vibration knife
Frame 3 is whole to drive lathe tool 4 to generate elliptical orbit ultrasonic vibration, changes cooked mode.
As shown in Figure 1, due to spatial relation, laser must be obliquely incident on workpiece to be machined surface, therefore
Need to rotate five dimension manual displacement platforms 6 to realize the deflection of laser 2；8, No. three straight-line displacements of No. two straight-line displacement platforms are flat
The effect of platform 9 and a No.1 straight-line displacement platform 7 is the fine position for realizing laser 2 in Y, Z, X-direction respectively；No. four straight
The effect of displacement of the lines platform 0 is to adjust laser 2 along the position on the direction laser optical path W, changes laser output point and quilt
The distance between workpieces processing plane, the straight-line displacement platform 8, three of No.1 straight-line displacement platform 7, two straight-line displacement platform 9,
The stroke of No. four straight-line displacement platforms 10 all can be 25mm.
As depicted in figs. 1 and 2, the present invention contains the installation method of the turning auxiliary system of five dimension manual displacement platforms such as
Under:
1, elliptical ultrasonic vibration knife system 1 is installed.
2, five dimension manual displacement platform 6 of installation: in installation straight line X-direction manual displacement platform 7 and the manual position of straight line Z-direction
Move platform 9, when using dial gauge and amesdial cooperate lathe X-axis and machine Z-axis, make lathe X-axis and No.1 straight-line displacement platform 7
The parallel accuracy error of the axis of adjustment axis within 5 μm, the axis of machine Z-axis and No. three 9 adjustment axis of straight-line displacement platform
Parallel accuracy error is all within 5 μm；Guarantee lathe Y-axis and No. two straight-line displacement platforms 8 when No. two straight-line displacement platforms 8 are installed
The parallel accuracy error of the axis of adjustment axis is also within 5 μm；
3, guarantee No. four when 2, No. four straight-line displacement platforms 10 of laser, No.1 connector 16 and No. two connectors 17 are installed
The depth of parallelism in the direction of displacement of straight-line displacement platform 10, the i.e. direction W and laser optical path direction is within 10 μm.The above position precision
It is required that being to be able to the displacement error for generating other directions as less as possible when adjusting laser spot single direction position.
Above-mentioned lathe X-axis, lathe Y-axis, machine Z-axis are the three-dimensional rectangular coordinate system established with lathe itself, machine Z-axis
Parallel with the axis of main shaft 15 of lathe, lathe X-axis is perpendicular to Z axis and is parallel to XOY plane, and lathe Y-axis is flat perpendicular to XOY
Face.
Specific embodiment four
Present embodiment four and the difference of specific embodiment three are that the laser that laser 2 emits is that wavelength is
Infrared light, rated power 250W, the operating mode of 1080nm is continuous mode.
The diameter when light beam that laser 2 emits laser is emitted from protection glass pane is about 19mm, until the focus of laser
Designed distance is 150mm ± 10mm.
Specific embodiment five
Present embodiment five and the difference of specific embodiment three or four are that elliptical ultrasonic vibration knife system 1 wraps
Ultrasonic vibration knife rest 3 and lathe tool 4 are included, ultrasonic vibration knife rest 3 is fixed on machine by straight line Y-direction hand slide rest displacement platform 5
On the workbench of bed Z axis, lathe tool 4 is mounted on ultrasonic vibration knife rest 3, and the lathe tool 4 towards machine tool chief axis 15.
Also, as shown in figure 3, can also be installed between ultrasonic vibration knife rest 3 and Y-direction hand slide rest displacement platform 5
There is dynamometer sensor 13, the effect of dynamometer sensor 13 is to be monitored in process to cutting force.And Y-direction hand knife
The effect of frame displacement platform 5 is to carry out high fine-tuning to elliptical ultrasonic vibration knife system 1 in the vertical direction, makes 4 knife of lathe tool
Sword and machine tool chief axis 15 are located at identical height.
Specific embodiment six
The adjustment method of turning auxiliary system containing five dimension manual displacement platforms of the invention, the specific steps are as follows:
Step 1: examination knife 12 is coaxially fixed on the main shaft 15 of lathe, the laser for enabling laser 2 emit is in examination knife
It is focused on 12；
Step 2: examination knife 12 is enabled to move along X-direction is parallel to, laser is made to go out row etc. in examination 12 ablated surface of knife
Away from ablation point；Examination knife 12 around its axis is turned round into 180 degree, enables examination knife 12 move along being parallel to X-direction, is trying laser
Ablation goes out the equidistant ablation point of a row again on knife 12 surface；No. two straight-line displacement platforms 8 are adjusted repeatedly and repeat above-mentioned two burning
Step is lost, until two groups of ablation points are located on the same line；
As shown in figure 4, the half of the distance between two rows of ablation point institutes line is laser spot distance in adjustment process
The difference in height of the axis of the main shaft 15 of 4 point of a knife of lathe tool or lathe can be adjusted at this time by straight line Y-direction manual displacement platform 8
Section laser 2 the displacement of Y direction compensate and be iteratively repeated it is above-mentioned two burn step, until two groups of ablation points are one
On straight line, then laser realizes precisely focusing in Y direction.
Step 3: lathe is fed along Z axis, lathe tool 4 is set to try 12 surface of knife to knife and leave cutting annulus, the cutting
The depth of annulus is 1~3 μm；No.1 straight-line displacement platform 7 is adjusted repeatedly, and laser is made to leave and cut on examination 12 surface of knife
The concentric ablation annulus of annulus, until ablation annulus is completed to debug when being overlapped with cutting annulus.
In lathe before Z-direction feeding, 6 withdrawing 5mm of manual displacement platform first can be tieed up by five.
As shown in figure 5, detection ablation annulus and the semidiameter for cutting annulus are between 4 point of a knife of laser spot and lathe tool
In X-direction distance, adjusting No.1 straight-line displacement platform 7 repeatedly makes ablation point move closer to cutting annulus, until ablation circle
Ring is overlapped with cutting annulus can be realized laser spot and 4 point of a knife of lathe tool process it is accurate to knife in plane.
Specific embodiment seven
Present embodiment seven and the difference of specific embodiment six are that examination knife 12 is aluminium disks, the examination knife
Part 12 is pasted with aluminium foil towards lathe tool 4 on one side, aluminium foil with a thickness of 0.2~0.5mm.
As shown in figure 4, when laser irradiation is when on aluminium foil burn mark can be left on aluminium foil, burn mark diameter is by laser
Spot size determine, when burn mark area minimum be believed that laser successfully focus on aluminium foil.
Specific embodiment eight
Present embodiment eight and the difference of specific embodiment six or seven are, in the present invention, by laser spot
Adjust with the processing plane of the same machine tool chief axis 15 of 4 point of a knife of lathe tool in.Step 1 includes:
Examination knife 12 is coaxially fixed on the main shaft 15 of lathe, and enables the main shaft 15 of lathe tool 4 Yu lathe by step 1 one
Centering；
Step 1 two, lathe feed lathe tool 4 along Z axis, enable lathe tool 4 and examination knife 12 to knife, knife depth is less than etc.
In 3 μm；
Step 1 three, rotation swing offset platform 11, the laser inclination transmitting for emitting laser 2 to examination 12 table of knife
Face, and the facula position of laser is enabled to be in the range of 4 point of a knife of lathe tool, which is using 4 point of a knife of lathe tool as the center of circle, diameter
For the disc of 10mm；
Step 1 four adjusts the dynamic displacement platform 9 of three trumpeters, enables positive direction (such as Fig. 1 of five dimension manual displacement platforms 6 to Z axis
It is shown) after mobile 4~5mm, closed loop lathe；Wherein, the positive direction of Z axis is that the direction of examination knife 12 is directed toward by 4 point of a knife of lathe tool；
No. four displacement platforms 10 are adjusted, focal position and locking of the laser in examination knife 12 are found.
Specific embodiment nine
Present embodiment nine and the difference of specific embodiment eight be, step 1 five specifically:
The equidistant direction the straight line W manual displacement platform 10 that adjusts controls each laser ablation along the displacement in the direction W direction
Time it is identical, to examination knife 12 surface carry out mark, that observes mark burns trace size, is at minimum ablation trace
The focal position of laser locks the position of No. four displacement platforms 9 at this time.
The equidistant direction the straight line W manual displacement platform 10 that adjusts is the position for changing manual displacement platform 10 on the direction of the direction W
It moves, focuses the focus of laser in examination knife 12, and focus error control in front and back is within 10mm.
As shown in Fig. 2, on the joint face of L-type Laser platform 14 and multiple groups can be arranged on No. two connectors 17 respectively
Parallel connecting hole, every group of connection pitch of holes can be set to 12.5mm.If in the adjusting displacement limits of five dimension manual displacement platforms 6
It is interior to observe laser focusing phenomenon, then change connection of the laser head 4 in L-type Laser platform 14 and No. two connectors 17
The position in hole, until laser can be in the displacement range inner focusing of examination knife 12.
Shape, the size that burn mark is observed after focusing leave the smallest burning on examination 12 surface of knife until finding laser
Trace is lost, this position is laser focus position.
Specific embodiment ten
Present embodiment ten and the difference of specific embodiment nine are, in step 1 five, the power of laser is sharp
The 30%~50% of 2 rated power of light device., the time of laser ablation is 5~15s.
Claims (10)
1. five dimension manual displacement devices, which is characterized in that including No.1 straight-line displacement platform (7), No. two straight-line displacement platforms
(8), No. three straight-line displacement platforms (9), No. four straight-line displacement platforms (10) and swing offset platform (11)；
It take the microscope carrier upper surface of No.1 straight-line displacement platform (7) as the adjustment axis axis of XOZ plane, No.1 straight-line displacement platform (7)
Rectangular coordinate system in space XYZ is established to for X-axis, if W is oriented parallel to XOZ plane and is acute angle with the angle of X-axis, Z axis；
The microscope carrier of No. two straight-line displacement platforms (8) can be moved along Y-axis；The microscope carrier of No. three straight-line displacement platforms (9) can be along Z axis
It is mobile；The microscope carrier of No. four straight-line displacement platforms (10) can be moved along the direction W；The microscope carrier of swing offset platform (11) can be with it
Main shaft rotation, the main shaft are parallel to Y-axis；
The base station of No. three straight-line displacement platforms (9) is fixed on the microscope carrier of No.1 straight-line displacement platform (7), swing offset platform
(11) base station is fixed on the microscope carrier of No. three straight-line displacement platforms (9), and the base station of No. two straight-line displacement platforms (8) is fixed on rotation
On the microscope carrier for turning displacement platform (11), the base station of No. four straight-line displacement platforms (10) fixes the load of No. two straight-line displacement platforms (8)
On platform.
2. it is according to claim 1 five dimension manual displacement device, which is characterized in that further include L-type Laser platform (14),
No.1 connector (16) and No. two connectors (17),
L-type Laser platform (14) includes two joint faces, and two joint faces are end to end and vertical fixation, L-type laser
The section of platform (14) is L shape；
The base station of No. two straight-line displacement platforms (8) is fixed on the microscope carrier of swing offset platform (11) by No.1 connector (16)
On；One of joint face of L-type Laser platform (14) is fixed on the microscope carrier of No. two straight-line displacement platforms (8), L-type laser
The upper surface of another joint face of device platform (14) passes through the base of No. two connectors (17) and No. four straight-line displacement platforms (10)
Platform is fixed.
3. the turning auxiliary system containing five dimensions manual displacement device of any of claims 1 or 2, including elliptical ultrasonic vibration knife
Device (1) and laser (2),
It is characterized in that, elliptical ultrasonic vibration knife system (1) is fixed on the Z axis workbench of lathe, the Z axis work of the lathe
Platform can be moved along Z axis；
Five dimensions manual displacement device (6) are fixed on the Z axis workbench of lathe, and the adjusting of No. three straight-line displacement platforms (9)
The axial direction of axis is parallel with main shaft (15) of lathe；
Laser (2) is fixed on the microscope carrier of No. four straight-line displacement platforms (10)；The laser optical path of laser (2) transmitting and the side W
To parallel, and Laser emission direction is towards the main shaft (15) of lathe.
4. turning auxiliary system according to claim 3, which is characterized in that the laser of laser (2) transmitting is that wavelength is
Infrared light, laser (2) rated power of 1080nm are 250W, laser (2) operating mode is continuous mode.
5. turning auxiliary system according to claim 3 or 4, which is characterized in that elliptical ultrasonic vibration knife system (1) includes
Ultrasonic vibration knife rest (3) and lathe tool (4), ultrasonic vibration knife rest (3) are fixed on by Y-direction hand slide rest displacement platform (5)
On the Z axis workbench of lathe, lathe tool (4) is mounted on ultrasonic vibration knife rest (3), and the lathe tool (4) towards lathe
Main shaft (15).
6. the adjustment method of the turning auxiliary system based on five dimension manual displacement devices, which is characterized in that specific step is as follows:
Step 1: examination knife (12) is coaxially fixed on the main shaft (15) of lathe, the laser for enabling laser (2) to emit is in examination knife
Part focuses on (12)；
It is moved Step 2: examination knife (12) edge is enabled to be parallel to X-direction, laser is made to go out row etc. in examination knife (12) ablated surface
Away from ablation point；Examination knife (12) is turned round into 180 degree around its axis, enables examination knife (12) edge be parallel to X-direction and moves, make laser
On examination knife (12) surface, ablation goes out the equidistant ablation point of a row again；No. two straight-line displacement platforms (8) are adjusted repeatedly and are repeated
Two assisted ablation steps are stated, until two groups of ablation points are located on the same line；
Step 3: lathe is fed along Z axis, lathe tool (4) is set to try knife (12) surface to knife and leave cutting annulus, the cutting
The depth of annulus is 1~3 μm；Repeatedly adjust No.1 straight-line displacement platform (7), and make laser examination knife (12) surface leave with
The concentric ablation annulus of annulus is cut, until ablation annulus is completed to debug when being overlapped with cutting annulus.
7. adjustment method according to claim 6, which is characterized in that examination knife (12) is aluminium disks, the examination knife
(12) be pasted with aluminium foil on one side towards lathe tool (4), aluminium foil with a thickness of 0.2~0.5mm.
8. adjustment method according to claim 6 or 7, which is characterized in that step 1 includes:
Examination knife (12) is coaxially fixed on the main shaft (15) of lathe, and enables the main shaft of lathe tool (4) and lathe by step 1 one
(15) centering；
Step 1 two, lathe feed lathe tool (4) along Z axis, enable lathe tool (4) and examination knife (12) to knife, are less than to knife depth
Equal to 3 μm；
Step 1 three, rotation swing offset platform (11), the laser inclination transmitting for emitting laser (2) to examination knife (12) table
Face, and the facula position of laser is enabled to be in the range of lathe tool (4) point of a knife, the range be using lathe tool (4) point of a knife as the center of circle,
Diameter is the disc of 10mm；
Step 1 four adjusts No. four straight-line displacement platforms (10), finds focal position and locking of the laser in examination knife (12).
9. adjustment method according to claim 8, which is characterized in that step 1 five specifically:
No. four straight-line displacement platforms (10) are equidistantly adjusted along the displacement in the direction W, and the time for controlling each laser ablation is identical,
Mark is carried out to the surface of examination knife (12), that observes mark burns trace size, is the poly- of laser at minimum ablation trace
Burnt position locks the position of No. four straight-line displacement platforms (10) at this time.
10. adjustment method according to claim 9, which is characterized in that in step 1 five, the power of laser is laser
(2) the 30%~50% of rated power, the time of laser ablation are 5~15s.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811488251.3A CN109500604B (en) | 2018-12-06 | 2018-12-06 | Five-dimensional manual displacement platform, turning auxiliary system comprising five-dimensional manual displacement platform and debugging method of turning auxiliary system |
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| CN201811488251.3A CN109500604B (en) | 2018-12-06 | 2018-12-06 | Five-dimensional manual displacement platform, turning auxiliary system comprising five-dimensional manual displacement platform and debugging method of turning auxiliary system |
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| CN109500604B CN109500604B (en) | 2020-08-11 |
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| CN (1) | CN109500604B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110000609A (en) * | 2019-04-16 | 2019-07-12 | 哈尔滨工业大学 | A kind of ultrasonic vibration cutting and cutting force real-time monitoring integrate tooling system |
| CN110899981A (en) * | 2019-12-04 | 2020-03-24 | 哈尔滨工业大学 | Laser-modified ultra-precision cutting laser-assisted hard and brittle material processing method |
| CN111702189A (en) * | 2020-06-22 | 2020-09-25 | 陕西师范大学 | Giant magnetostrictive elliptical vibration turning device and turning method |
| CN113523968A (en) * | 2021-08-06 | 2021-10-22 | 大连理工大学 | Laser and ultrasonic auxiliary grinding manufacturing equipment and method for quartz hemispherical harmonic oscillator |
| CN113649686A (en) * | 2021-07-07 | 2021-11-16 | 长春工业大学 | Laser-ultrasonic vibration composite auxiliary cutting device |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459458A (en) * | 1982-08-30 | 1984-07-10 | The Warner & Swasey Company | Machine tool with laser heat treating |
| EP1266719A2 (en) * | 2001-06-13 | 2002-12-18 | DaimlerChrysler AG | Milling machine and milling method |
| US20140099170A1 (en) * | 2006-10-12 | 2014-04-10 | Purdue Research Foundation | Integrated Laser Material Processing Cell |
| CN104924096A (en) * | 2015-06-17 | 2015-09-23 | 浙江大学 | Five-axis linkage bevel angle workbench |
| CN105598703A (en) * | 2016-02-19 | 2016-05-25 | 广州中国科学院先进技术研究所 | Laser-aided machining system and method |
| CN106312567A (en) * | 2016-08-26 | 2017-01-11 | 长春理工大学 | Laser-assisted orthogonal micro-cutting device and method having automatic laser focus following function |
| KR101695795B1 (en) * | 2015-10-26 | 2017-01-12 | 창원대학교 산학협력단 | Laser assisted machining |
| CN107234444A (en) * | 2017-07-12 | 2017-10-10 | 华中科技大学 | Laser preheating auxiliary turning adjusting apparatus and the laser preheating auxiliary turning system comprising it |
| US20170320164A1 (en) * | 2016-05-04 | 2017-11-09 | Purdue Research Foundation | Laser-assisted micromachining systems and methods |
| CN107363552A (en) * | 2017-07-04 | 2017-11-21 | 南京航空航天大学 | A kind of induced with laser oxidation assist turning machining device and its method |
| CN107443075A (en) * | 2016-05-31 | 2017-12-08 | 中国科学院福建物质结构研究所 | A kind of five axles super sound Digit Control Machine Tool that shakes of recombination laser processing |
| CN108161854A (en) * | 2017-06-13 | 2018-06-15 | 北京中天星控科技开发有限公司 | A kind of four-degree-of-freedom platform applied under radiation environment |
| CN108817489A (en) * | 2018-06-20 | 2018-11-16 | 华中科技大学 | Collimator pose regulating device and method for free form surface laser assisted milling |
-
2018
- 2018-12-06 CN CN201811488251.3A patent/CN109500604B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459458A (en) * | 1982-08-30 | 1984-07-10 | The Warner & Swasey Company | Machine tool with laser heat treating |
| EP1266719A2 (en) * | 2001-06-13 | 2002-12-18 | DaimlerChrysler AG | Milling machine and milling method |
| US20140099170A1 (en) * | 2006-10-12 | 2014-04-10 | Purdue Research Foundation | Integrated Laser Material Processing Cell |
| CN104924096A (en) * | 2015-06-17 | 2015-09-23 | 浙江大学 | Five-axis linkage bevel angle workbench |
| KR101695795B1 (en) * | 2015-10-26 | 2017-01-12 | 창원대학교 산학협력단 | Laser assisted machining |
| CN105598703A (en) * | 2016-02-19 | 2016-05-25 | 广州中国科学院先进技术研究所 | Laser-aided machining system and method |
| US20170320164A1 (en) * | 2016-05-04 | 2017-11-09 | Purdue Research Foundation | Laser-assisted micromachining systems and methods |
| CN107443075A (en) * | 2016-05-31 | 2017-12-08 | 中国科学院福建物质结构研究所 | A kind of five axles super sound Digit Control Machine Tool that shakes of recombination laser processing |
| CN106312567A (en) * | 2016-08-26 | 2017-01-11 | 长春理工大学 | Laser-assisted orthogonal micro-cutting device and method having automatic laser focus following function |
| CN108161854A (en) * | 2017-06-13 | 2018-06-15 | 北京中天星控科技开发有限公司 | A kind of four-degree-of-freedom platform applied under radiation environment |
| CN107363552A (en) * | 2017-07-04 | 2017-11-21 | 南京航空航天大学 | A kind of induced with laser oxidation assist turning machining device and its method |
| CN107234444A (en) * | 2017-07-12 | 2017-10-10 | 华中科技大学 | Laser preheating auxiliary turning adjusting apparatus and the laser preheating auxiliary turning system comprising it |
| CN108817489A (en) * | 2018-06-20 | 2018-11-16 | 华中科技大学 | Collimator pose regulating device and method for free form surface laser assisted milling |
Non-Patent Citations (1)
| Title |
|---|
| 吴雪峰 等: ""激光加热辅助切削技术及研究进展"", 《哈尔滨理工大学学报》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110000609A (en) * | 2019-04-16 | 2019-07-12 | 哈尔滨工业大学 | A kind of ultrasonic vibration cutting and cutting force real-time monitoring integrate tooling system |
| CN110899981A (en) * | 2019-12-04 | 2020-03-24 | 哈尔滨工业大学 | Laser-modified ultra-precision cutting laser-assisted hard and brittle material processing method |
| CN110899981B (en) * | 2019-12-04 | 2021-07-02 | 哈尔滨工业大学 | Laser-modified ultra-precision cutting laser-assisted hard and brittle material processing method |
| CN111702189A (en) * | 2020-06-22 | 2020-09-25 | 陕西师范大学 | Giant magnetostrictive elliptical vibration turning device and turning method |
| CN113649686A (en) * | 2021-07-07 | 2021-11-16 | 长春工业大学 | Laser-ultrasonic vibration composite auxiliary cutting device |
| CN113523968A (en) * | 2021-08-06 | 2021-10-22 | 大连理工大学 | Laser and ultrasonic auxiliary grinding manufacturing equipment and method for quartz hemispherical harmonic oscillator |
| CN113523968B (en) * | 2021-08-06 | 2022-05-27 | 大连理工大学 | Laser and ultrasonic auxiliary grinding manufacturing equipment and method for quartz hemispherical harmonic oscillator |
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