CN109479393B - 用于将液体或粘性材料分配到基板上的系统和方法 - Google Patents

用于将液体或粘性材料分配到基板上的系统和方法 Download PDF

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Publication number
CN109479393B
CN109479393B CN201780042525.3A CN201780042525A CN109479393B CN 109479393 B CN109479393 B CN 109479393B CN 201780042525 A CN201780042525 A CN 201780042525A CN 109479393 B CN109479393 B CN 109479393B
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height
electronic substrate
applicator
region
regions
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Chinese (zh)
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CN109479393A (zh
Inventor
佩尔·奥拉-詹森
肯尼斯·S·埃斯本切德
帕特里克·T·霍干
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Nordson Corp
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Nordson Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1694—Program controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40425—Sensing, vision based motion planning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40476—Collision, planning for collision free path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45235—Dispensing adhesive, solder paste, for pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49154—Detect position of slide to change hover height of tool to avoid collision
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/41—Tool
    • Y10S901/43—Spray painting or coating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Operations Research (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Computer Hardware Design (AREA)
  • Spray Control Apparatus (AREA)
CN201780042525.3A 2016-06-08 2017-06-01 用于将液体或粘性材料分配到基板上的系统和方法 Active CN109479393B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/176,570 US10881005B2 (en) 2016-06-08 2016-06-08 Methods for dispensing a liquid or viscous material onto a substrate
US15/176,570 2016-06-08
PCT/US2017/035357 WO2017213946A1 (en) 2016-06-08 2017-06-01 Systems and methods for dispensing a liquid or viscous material onto a substrate

Publications (2)

Publication Number Publication Date
CN109479393A CN109479393A (zh) 2019-03-15
CN109479393B true CN109479393B (zh) 2021-12-28

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CN201780042525.3A Active CN109479393B (zh) 2016-06-08 2017-06-01 用于将液体或粘性材料分配到基板上的系统和方法

Country Status (6)

Country Link
US (1) US10881005B2 (https=)
EP (2) EP4210447A1 (https=)
JP (1) JP6949882B2 (https=)
KR (1) KR102389974B1 (https=)
CN (1) CN109479393B (https=)
WO (1) WO2017213946A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018192551A (ja) * 2017-05-16 2018-12-06 セイコーエプソン株式会社 制御装置、ロボットおよびロボットシステム
KR20220140806A (ko) * 2020-02-20 2022-10-18 노드슨 코포레이션 기계 학습을 사용하는 개선된 유체 분배 공정 제어 및 이를 구현하는 시스템
CN115463806A (zh) * 2022-08-04 2022-12-13 东莞市慧视智能科技有限公司 一种速度可控的点胶方法及点胶系统
CN115463804A (zh) * 2022-08-04 2022-12-13 东莞市慧视智能科技有限公司 一种基于点胶路径的点胶方法
CN116351666B (zh) * 2023-04-24 2024-04-30 歌尔股份有限公司 点胶方法和点胶设备

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JPH09314015A (ja) * 1996-05-28 1997-12-09 Matsushita Electric Ind Co Ltd 粘性流体塗布装置
DE69504269D1 (de) * 1994-10-19 1998-10-01 Yamaha Motor Co Ltd Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifischen Position
JP2007073981A (ja) * 2006-10-31 2007-03-22 Fuji Mach Mfg Co Ltd 電子部品保持装置，電子部品装着システムおよび電子部品装着方法
JP2008010554A (ja) * 2006-06-28 2008-01-17 Yamaha Motor Co Ltd 基板の処理装置および部品実装システム
CN101161357A (zh) * 2006-10-11 2008-04-16 诺信公司 细线保形涂敷设备和方法
CN101920235A (zh) * 2009-06-10 2010-12-22 株式会社日立工业设备技术 涂敷装置和涂敷方法
CN105555013A (zh) * 2014-10-23 2016-05-04 三星电子株式会社 制造印刷电路板组件的方法

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CA2489818C (en) * 1995-10-13 2007-07-24 Nordson Corporation A system for dispensing a viscous material onto a substrate
US6132809A (en) * 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US6093251A (en) * 1997-02-21 2000-07-25 Speedline Technologies, Inc. Apparatus for measuring the height of a substrate in a dispensing system
WO2002046713A2 (en) * 2000-12-08 2002-06-13 Cyberoptics Corporation Automated system with improved height sensing
US7150791B2 (en) * 2001-03-29 2006-12-19 Nordson Corporation Floating head liquid dispenser with dispensing head sensor
US7256833B2 (en) * 2002-05-22 2007-08-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for automatically optimizing optical contrast in automated equipment
US7028867B2 (en) 2003-10-30 2006-04-18 Nordson Corporation Conformal coating applicator and method
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US8004860B2 (en) * 2006-08-29 2011-08-23 Texas Instruments Incorporated Radiofrequency and electromagnetic interference shielding
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US8173906B2 (en) * 2007-02-07 2012-05-08 Raytheon Company Environmental protection coating system and method
US8765212B2 (en) * 2007-09-21 2014-07-01 Nordson Corporation Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
US20090107398A1 (en) * 2007-10-31 2009-04-30 Nordson Corporation Fluid dispensers and methods for dispensing viscous fluids with improved edge definition
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DE69504269D1 (de) * 1994-10-19 1998-10-01 Yamaha Motor Co Ltd Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifischen Position
JPH09314015A (ja) * 1996-05-28 1997-12-09 Matsushita Electric Ind Co Ltd 粘性流体塗布装置
JP2008010554A (ja) * 2006-06-28 2008-01-17 Yamaha Motor Co Ltd 基板の処理装置および部品実装システム
CN101161357A (zh) * 2006-10-11 2008-04-16 诺信公司 细线保形涂敷设备和方法
JP2007073981A (ja) * 2006-10-31 2007-03-22 Fuji Mach Mfg Co Ltd 電子部品保持装置，電子部品装着システムおよび電子部品装着方法
CN101920235A (zh) * 2009-06-10 2010-12-22 株式会社日立工业设备技术 涂敷装置和涂敷方法
CN105555013A (zh) * 2014-10-23 2016-05-04 三星电子株式会社 制造印刷电路板组件的方法

Also Published As

Publication number Publication date
JP2019517387A (ja) 2019-06-24
KR102389974B1 (ko) 2022-04-26
CN109479393A (zh) 2019-03-15
EP4210447A1 (en) 2023-07-12
WO2017213946A1 (en) 2017-12-14
US10881005B2 (en) 2020-12-29
US20170359901A1 (en) 2017-12-14
EP3469864A1 (en) 2019-04-17
KR20190015752A (ko) 2019-02-14
JP6949882B2 (ja) 2021-10-13

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