CN109478547A - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
CN109478547A
CN109478547A CN201780042680.5A CN201780042680A CN109478547A CN 109478547 A CN109478547 A CN 109478547A CN 201780042680 A CN201780042680 A CN 201780042680A CN 109478547 A CN109478547 A CN 109478547A
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CN
China
Prior art keywords
light emitting
light
emitting diode
grade
miniature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780042680.5A
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English (en)
Inventor
叶寅夫
吴维庭
潘科豪
陈宗源
林宏诚
钟权任
周嘉峰
周圣伟
蓝逸生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everlight Electronics Co Ltd
Original Assignee
Everlight Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everlight Electronics Co Ltd filed Critical Everlight Electronics Co Ltd
Publication of CN109478547A publication Critical patent/CN109478547A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

本发明提出一种显示装置，包括发光二极管矩阵或发光二极管条，其包含多个发光二极管，该等发光二极管的半导体层是有部分相连。显示装置另包括萤光体矩阵，设置于发光二极管矩阵或条上，且包括多个萤光体像素，萤光体像素可包含颜料或染料，且可结合光致抗蚀剂材料。另一方面，发光二极管的电极可通过一激光界面层电性连接至基板或基座的接垫上。

Description

PCT国内申请，说明书已公开。

Claims (20)

  1. PCT国内申请，权利要求书已公开。
CN201780042680.5A 2016-08-11 2017-08-09 显示装置 Pending CN109478547A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201662373358P 2016-08-11 2016-08-11
US62/373,358 2016-08-11
US201662429084P 2016-12-02 2016-12-02
US62/429,084 2016-12-02
US201662439904P 2016-12-29 2016-12-29
US62/439,904 2016-12-29
PCT/CN2017/096604 WO2018028593A1 (zh) 2016-08-11 2017-08-09 显示装置

Publications (1)

Publication Number Publication Date
CN109478547A true CN109478547A (zh) 2019-03-15

Family

ID=61161738

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780042680.5A Pending CN109478547A (zh) 2016-08-11 2017-08-09 显示装置

Country Status (3)

Country Link
CN (1) CN109478547A (zh)
TW (1) TWI640109B (zh)
WO (1) WO2018028593A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672683B (zh) * 2018-04-03 2019-09-21 友達光電股份有限公司 顯示面板
TWI708104B (zh) * 2018-05-16 2020-10-21 財團法人工業技術研究院 顯示陣列
CN110504281A (zh) 2018-05-16 2019-11-26 财团法人工业技术研究院 显示阵列的制造方法
CN110379327B (zh) * 2019-08-13 2024-07-16 深圳视爵光旭电子有限公司 一种矩阵式smd-led结构的显示模组
JP2021043378A (ja) * 2019-09-12 2021-03-18 株式会社ジャパンディスプレイ 表示装置及び表示装置の製造方法
TWI730472B (zh) * 2019-10-25 2021-06-11 進化光學有限公司 使用雷射切割道絕緣之全彩ｌｅｄ顯示面板及其製造方法
CN114068503A (zh) 2020-08-10 2022-02-18 深超光电（深圳）有限公司 微型led显示面板及其制备方法
TWI752595B (zh) * 2020-08-18 2022-01-11 東捷科技股份有限公司 自發光畫素裝置
CN115692572A (zh) * 2022-09-23 2023-02-03 业成科技（成都）有限公司 Led晶圆、电路板、显示器及其制备方法

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CN1855407A (zh) * 2005-04-21 2006-11-01 C.R.F.阿西安尼顾问公司 用于制造具有发光二极管(led)的透明器件的方法
CN103456729A (zh) * 2013-07-26 2013-12-18 利亚德光电股份有限公司 发光二极管显示屏
KR20140030887A (ko) * 2012-09-04 2014-03-12 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
US20140091993A1 (en) * 2009-12-09 2014-04-03 Nano And Advanced Materials Institute Limited Monolithic full-color led micro-display on an active matrix panel manufactured using flip-chip technology
CN104584110A (zh) * 2012-08-21 2015-04-29 Lg电子株式会社 使用半导体发光器件的显示装置及其制造方法
US20160126224A1 (en) * 2014-10-29 2016-05-05 Lg Electronics Inc. Display device using semiconductor light emitting device and method of fabricating the same
US20180047876A1 (en) * 2014-06-14 2018-02-15 Hiphoton Co., Ltd Light engine array

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EP1658642B1 (en) * 2003-08-28 2014-02-26 Panasonic Corporation Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
US20080308819A1 (en) * 2007-06-15 2008-12-18 Tpo Displays Corp. Light-Emitting Diode Arrays and Methods of Manufacture
TWI548058B (zh) * 2010-04-19 2016-09-01 鴻海精密工業股份有限公司 Led陣列封裝結構及其製造方法
CN103227274B (zh) * 2012-01-31 2015-09-16 长春藤控股有限公司 发光二极管晶元封装体及其制造方法
CN104009187A (zh) * 2014-05-29 2014-08-27 四川虹视显示技术有限公司 一种多色有机发光二极管照明装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1855407A (zh) * 2005-04-21 2006-11-01 C.R.F.阿西安尼顾问公司 用于制造具有发光二极管(led)的透明器件的方法
US20140091993A1 (en) * 2009-12-09 2014-04-03 Nano And Advanced Materials Institute Limited Monolithic full-color led micro-display on an active matrix panel manufactured using flip-chip technology
CN104584110A (zh) * 2012-08-21 2015-04-29 Lg电子株式会社 使用半导体发光器件的显示装置及其制造方法
KR20140030887A (ko) * 2012-09-04 2014-03-12 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
CN103456729A (zh) * 2013-07-26 2013-12-18 利亚德光电股份有限公司 发光二极管显示屏
US20180047876A1 (en) * 2014-06-14 2018-02-15 Hiphoton Co., Ltd Light engine array
US20160126224A1 (en) * 2014-10-29 2016-05-05 Lg Electronics Inc. Display device using semiconductor light emitting device and method of fabricating the same

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Publication number Publication date
WO2018028593A1 (zh) 2018-02-15
TW201806191A (zh) 2018-02-16
TWI640109B (zh) 2018-11-01

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Application publication date: 20190315