CN109466164B - Screen printing plate blocking point for improving VIA through hole ink residue - Google Patents
Screen printing plate blocking point for improving VIA through hole ink residue Download PDFInfo
- Publication number
- CN109466164B CN109466164B CN201811485365.2A CN201811485365A CN109466164B CN 109466164 B CN109466164 B CN 109466164B CN 201811485365 A CN201811485365 A CN 201811485365A CN 109466164 B CN109466164 B CN 109466164B
- Authority
- CN
- China
- Prior art keywords
- baffle
- point
- ltoreq
- mil
- hole diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007650 screen-printing Methods 0.000 title claims abstract description 11
- 230000000903 blocking effect Effects 0.000 title abstract description 7
- 238000007639 printing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
- B41P2215/12—Screens
Abstract
The invention relates to a screen printing plate blocking point for improving the ink residue of a VIA through hole. The edge of the baffle point is uniformly provided with 8 baffle openings, the baffle openings are triangular, a rectangular baffle plate is arranged between two adjacent baffle openings, the width of the baffle plate is a, the lengths of two symmetrical baffle plates are b, the sizes of a and b are related to the aperture D of the VIA through hole, and the value range of a is b+2. The invention has simple structure and compact design, the size of the used rice-shaped baffle point can be modified by adjusting the length and the width of the rectangle, the size of the baffle point is adjustable, the design is simple and easy to process, the design of the product has larger extension, and the diversity of the VIA through holes of the product can be realized.
Description
Technical Field
The invention relates to a screen printing plate blocking point for improving VIA through hole ink residue, and belongs to the technical field of circuit board design.
Background
With the rapid development of electronic products, many special products are required to meet special requirements, and the traditional circuit board design is difficult to meet some special requirements, such as: the heat dissipation of QFN chip, the welding of plug-in components part, if adopt traditional shelves point mode to make the VIA through-hole of aperture, general diameter is 9.8~15.7mil, and the plate thickness is 60mil and above, if need ordinary shelves point design, can make there is a large amount of printing ink in the VIA hole, be unfavorable for developing the punching a hole, if increase the diameter of ordinary shelves point design, can cause the problem such as copper leakage in drill way.
Disclosure of Invention
The invention aims to solve the problem and provides a screen printing plate blocking point which is simple in structure and compact in design and is used for improving the ink residue of a VIA through hole.
The invention adopts the following technical scheme: 8 baffle openings are uniformly formed in the edge of each baffle point, each baffle opening is triangular, a rectangular baffle plate is arranged between two adjacent baffle openings, the width of each baffle plate is b, the distance between two symmetrical baffle plates is a, the sizes of a and b are related to the aperture D of the VIA through hole, and the value of a is b+2mil; the stop points are in a shape of Chinese character 'mi'.
Further, when VIA hole diameter D is less than 9.8mil, b is 4mil and a is 6mil.
Further, when VIA VIA hole diameter is 9.8mil < D.ltoreq.14.8 mil, b is 5mil and a is 7mil.
Further, when VIA VIA hole diameter is 14.8mil < D.ltoreq.19.8 mil, b is 6mil and a is 8mil.
Further, when VIA VIA hole diameter 19.8mil < D.ltoreq.24.8 mil, b is 7mil and a is 9mil.
Further, when VIA VIA hole diameter is 24.8mil < D.ltoreq.29.8 mil, b is 8mil and a is 10mil.
Further, when VIA VIA hole diameter 29.8mil < D.ltoreq.34.8 mil, b is 9mil and a is 11mil.
Further, when VIA VIA hole diameter 34.8mil < D.ltoreq.39.8 mil, b is 10mil and a is 12mil.
Further, the design process of the shift point comprises the following steps:
(1) First, according to the aspect ratio of the cross section of the VIA through hole, when the aspect ratio is equal to or greater than 8:1, screen printing plate blocking points are required to be set, and when the aspect ratio is smaller than 8:1, the screen printing plate blocking points are not required;
(2) Setting the width a and the length b of the baffle point according to the aperture D of the VIA through hole;
(3) Selecting a screen printing plate with corresponding mesh number as a substrate according to the size of the gear points;
(4) And respectively drawing a plurality of stop points on the screen printing plate to carry out production printing.
The invention has simple structure and compact design, the size of the used rice-shaped baffle point can be modified by adjusting the length and the width of the rectangle, the size of the baffle point is adjustable, the design is simple and easy to process, the design of the product has larger extension, and the diversity of the VIA through holes of the product can be realized.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Reference numerals: a baffle opening 1 and a baffle sheet 2.
Description of the embodiments
The invention will be further described with reference to the accompanying drawings.
As shown in figure 1, a screen printing plate baffle point for improving the ink residue of a VIA through hole is characterized in that 8 baffle openings 1 are uniformly arranged at the edge of the baffle point, the baffle openings 1 are triangular, a rectangular baffle plate 2 is arranged between two adjacent baffle openings 1,
the width of each baffle plate 2 is b, the distance between two symmetrical baffle plates 2 is a, the sizes of a and b are related to the aperture D of the VIA through hole, and the value range of a is b+2mil; the stop points are in a shape of Chinese character 'mi'.
When VIA hole diameter D is less than 9.8mil, b is 4mil and a is 6mil; when 9.8mil < D is less than or equal to 14.8mil, b is 5mil and a is 7mil; when D is more than 14.8mil and less than or equal to 19.8mil, b is 6mil, and a is 8mil; when D is more than 19.8mil and less than or equal to 24.8mil, b is 7mil, and a is 9mil; when D is more than 24.8mil and less than or equal to 29.8mil, b is 8mil, and a is 10mil; when D is more than 29.8mil and less than or equal to 34.8mil, b is 9mil, and a is 11mil;34.8mil < D.ltoreq.39.8 mil, b 10mil, and a 12mil.
The design steps are as follows:
a. confirming the minimum aperture of the VIA through hole on the substrate, and calculating whether the aspect ratio is more than or equal to 8:1; the Gerber data of the customer is used for finding out that the minimum VIA through hole aperture is 9.8mil, the thickness requirement of a finished product plate is 78.4mil, the aspect ratio is calculated to be 8:1, and the design is judged to be required to be started;
b. the design of the meter-shaped baffle points is that the length and width of each rectangle forming the meter-shaped baffle points are calculated according to the aperture of the VIA through hole: 11.8mil x4mil;
c. according to the minimum VIA aperture, calculating the minimum requirement of the mesh number as 110 meshes;
d. and drawing the designed rice-shaped baffle points on the selected screen plate, and carrying out production printing.
Claims (1)
1. A screen printing plate shelves point for improving VIA through-hole printing ink remains which characterized in that: the edge of each baffle point is uniformly provided with 8 baffle openings (1), each baffle opening (1) is triangular, a rectangular baffle plate (2) is arranged between two adjacent baffle openings (1), the width of each baffle plate (2) is b, the distance between two symmetrical baffle plates (2) is a, the sizes of a and b are related to the aperture D of a VIA through hole, and the value of a is b+2mil; the stop points are in a shape of a Chinese character 'mi';
when VIA hole diameter D is less than 9.8mil, b is 4mil and a is 6mil;
when VIA VIA hole diameter is 9.8mil < D.ltoreq.14.8 mil, b is 5mil, a is 7mil;
when VIA VIA hole diameter is 14.8mil < D.ltoreq.19.8 mil, b is 6mil and a is 8mil;
when VIA VIA hole diameter 19.8mil < D.ltoreq.24.8 mil, b is 7mil and a is 9mil;
when VIA VIA hole diameter 24.8mil < D.ltoreq.29.8 mil, b is 8mil, a is 10mil;
when VIA VIA hole diameter is 29.8mil < D.ltoreq.34.8 mil, b is 9mil and a is 11mil;
when VIA VIA hole diameter 34.8mil < D.ltoreq.39.8 mil, b is 10mil and a is 12mil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811485365.2A CN109466164B (en) | 2018-12-06 | 2018-12-06 | Screen printing plate blocking point for improving VIA through hole ink residue |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811485365.2A CN109466164B (en) | 2018-12-06 | 2018-12-06 | Screen printing plate blocking point for improving VIA through hole ink residue |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109466164A CN109466164A (en) | 2019-03-15 |
CN109466164B true CN109466164B (en) | 2023-12-12 |
Family
ID=65675670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811485365.2A Active CN109466164B (en) | 2018-12-06 | 2018-12-06 | Screen printing plate blocking point for improving VIA through hole ink residue |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109466164B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013188379A1 (en) * | 2012-06-11 | 2013-12-19 | Unipixel Displays, Inc. | Methods of manufacture and use of customized flexomaster patterns for flexographic printing |
CN203482509U (en) * | 2013-10-21 | 2014-03-12 | 骏亚(惠州)电子科技有限公司 | Solder mask printing makeready assembly |
CN108112180A (en) * | 2017-12-18 | 2018-06-01 | 珠海杰赛科技有限公司 | A kind of method for substituting welding resistance shelves point net and a kind of web plate for substituting welding resistance shelves point net |
CN209534442U (en) * | 2018-12-06 | 2019-10-25 | 高德(无锡)电子有限公司 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
-
2018
- 2018-12-06 CN CN201811485365.2A patent/CN109466164B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013188379A1 (en) * | 2012-06-11 | 2013-12-19 | Unipixel Displays, Inc. | Methods of manufacture and use of customized flexomaster patterns for flexographic printing |
CN203482509U (en) * | 2013-10-21 | 2014-03-12 | 骏亚(惠州)电子科技有限公司 | Solder mask printing makeready assembly |
CN108112180A (en) * | 2017-12-18 | 2018-06-01 | 珠海杰赛科技有限公司 | A kind of method for substituting welding resistance shelves point net and a kind of web plate for substituting welding resistance shelves point net |
CN209534442U (en) * | 2018-12-06 | 2019-10-25 | 高德(无锡)电子有限公司 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
Also Published As
Publication number | Publication date |
---|---|
CN109466164A (en) | 2019-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103619125B (en) | A kind of PCB electro-plating method for improving electroplating evenness | |
CN102573309A (en) | Method for improving graphic precision of substractive process printed circuit board (PCB) by adopting dynamic etching compensation method | |
CN101616549A (en) | The method of manufacturing single-side thick copper stepped plate by electroplating addition | |
CN103687312A (en) | Gold-plated circuit board manufacturing method | |
CN103582317A (en) | Method for manufacturing tin leaking semicircular holes in flexible printed wiring board | |
CN101494957B (en) | Method and substrate for producing multi-layer circuit board | |
CN202174609U (en) | Die for punching positioning holes and shapes of flexible circuits | |
CN109466164B (en) | Screen printing plate blocking point for improving VIA through hole ink residue | |
CN105430908A (en) | Linewidth compensation method for manufacturing printed circuit board | |
CN105101642B (en) | A kind of method and multi-layer PCB board for increasing multi-layer PCB board metal foil area | |
CN203708620U (en) | Printed circuit board (PCB) with multiple alignment system | |
CN105208769A (en) | Printed circuit board and screen printing method thereof | |
CN104023484A (en) | Manufacturing method of printed circuit board overlaid through hole structure | |
CN209534442U (en) | One kind is for improving the remaining halftone shelves point of VIA through-hole ink | |
CN209949535U (en) | IGBT heat conduction printed circuit board | |
CN111010807A (en) | PCB thin plate solder mask hole plugging method with plate thickness less than 600um | |
CN104735900A (en) | Circuit board with side face metal structure and manufacturing method thereof | |
CN201491379U (en) | Printed circuit board comprising LCD bonding pads | |
CN107846780B (en) | Method for wiring in PCB | |
CN204217231U (en) | A kind of PCB jigsaw | |
CN203194015U (en) | PCB (printed circuit board) structure with yin-yang symmetry | |
CN104551413A (en) | Method for forming conductive films | |
CN103987210A (en) | PCB manufacturing method and PCB | |
CN101460020A (en) | Multilayered flexible circuit board | |
CN102873974A (en) | Method for producing collapsible steel mesh |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20230915 Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101 Applicant after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Applicant before: Gultech (Wuxi) Electronics Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |