CN109466164B - Screen printing plate blocking point for improving VIA through hole ink residue - Google Patents

Screen printing plate blocking point for improving VIA through hole ink residue Download PDF

Info

Publication number
CN109466164B
CN109466164B CN201811485365.2A CN201811485365A CN109466164B CN 109466164 B CN109466164 B CN 109466164B CN 201811485365 A CN201811485365 A CN 201811485365A CN 109466164 B CN109466164 B CN 109466164B
Authority
CN
China
Prior art keywords
baffle
point
ltoreq
mil
hole diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811485365.2A
Other languages
Chinese (zh)
Other versions
CN109466164A (en
Inventor
封海峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gaode Jiangsu Electronic Technology Co ltd
Original Assignee
Gaode Jiangsu Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gaode Jiangsu Electronic Technology Co ltd filed Critical Gaode Jiangsu Electronic Technology Co ltd
Priority to CN201811485365.2A priority Critical patent/CN109466164B/en
Publication of CN109466164A publication Critical patent/CN109466164A/en
Application granted granted Critical
Publication of CN109466164B publication Critical patent/CN109466164B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/34Screens, Frames; Holders therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41PINDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00Screen printing machines
    • B41P2215/10Screen printing machines characterised by their constructional features
    • B41P2215/12Screens

Abstract

The invention relates to a screen printing plate blocking point for improving the ink residue of a VIA through hole. The edge of the baffle point is uniformly provided with 8 baffle openings, the baffle openings are triangular, a rectangular baffle plate is arranged between two adjacent baffle openings, the width of the baffle plate is a, the lengths of two symmetrical baffle plates are b, the sizes of a and b are related to the aperture D of the VIA through hole, and the value range of a is b+2. The invention has simple structure and compact design, the size of the used rice-shaped baffle point can be modified by adjusting the length and the width of the rectangle, the size of the baffle point is adjustable, the design is simple and easy to process, the design of the product has larger extension, and the diversity of the VIA through holes of the product can be realized.

Description

Screen printing plate blocking point for improving VIA through hole ink residue
Technical Field
The invention relates to a screen printing plate blocking point for improving VIA through hole ink residue, and belongs to the technical field of circuit board design.
Background
With the rapid development of electronic products, many special products are required to meet special requirements, and the traditional circuit board design is difficult to meet some special requirements, such as: the heat dissipation of QFN chip, the welding of plug-in components part, if adopt traditional shelves point mode to make the VIA through-hole of aperture, general diameter is 9.8~15.7mil, and the plate thickness is 60mil and above, if need ordinary shelves point design, can make there is a large amount of printing ink in the VIA hole, be unfavorable for developing the punching a hole, if increase the diameter of ordinary shelves point design, can cause the problem such as copper leakage in drill way.
Disclosure of Invention
The invention aims to solve the problem and provides a screen printing plate blocking point which is simple in structure and compact in design and is used for improving the ink residue of a VIA through hole.
The invention adopts the following technical scheme: 8 baffle openings are uniformly formed in the edge of each baffle point, each baffle opening is triangular, a rectangular baffle plate is arranged between two adjacent baffle openings, the width of each baffle plate is b, the distance between two symmetrical baffle plates is a, the sizes of a and b are related to the aperture D of the VIA through hole, and the value of a is b+2mil; the stop points are in a shape of Chinese character 'mi'.
Further, when VIA hole diameter D is less than 9.8mil, b is 4mil and a is 6mil.
Further, when VIA VIA hole diameter is 9.8mil < D.ltoreq.14.8 mil, b is 5mil and a is 7mil.
Further, when VIA VIA hole diameter is 14.8mil < D.ltoreq.19.8 mil, b is 6mil and a is 8mil.
Further, when VIA VIA hole diameter 19.8mil < D.ltoreq.24.8 mil, b is 7mil and a is 9mil.
Further, when VIA VIA hole diameter is 24.8mil < D.ltoreq.29.8 mil, b is 8mil and a is 10mil.
Further, when VIA VIA hole diameter 29.8mil < D.ltoreq.34.8 mil, b is 9mil and a is 11mil.
Further, when VIA VIA hole diameter 34.8mil < D.ltoreq.39.8 mil, b is 10mil and a is 12mil.
Further, the design process of the shift point comprises the following steps:
(1) First, according to the aspect ratio of the cross section of the VIA through hole, when the aspect ratio is equal to or greater than 8:1, screen printing plate blocking points are required to be set, and when the aspect ratio is smaller than 8:1, the screen printing plate blocking points are not required;
(2) Setting the width a and the length b of the baffle point according to the aperture D of the VIA through hole;
(3) Selecting a screen printing plate with corresponding mesh number as a substrate according to the size of the gear points;
(4) And respectively drawing a plurality of stop points on the screen printing plate to carry out production printing.
The invention has simple structure and compact design, the size of the used rice-shaped baffle point can be modified by adjusting the length and the width of the rectangle, the size of the baffle point is adjustable, the design is simple and easy to process, the design of the product has larger extension, and the diversity of the VIA through holes of the product can be realized.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Reference numerals: a baffle opening 1 and a baffle sheet 2.
Description of the embodiments
The invention will be further described with reference to the accompanying drawings.
As shown in figure 1, a screen printing plate baffle point for improving the ink residue of a VIA through hole is characterized in that 8 baffle openings 1 are uniformly arranged at the edge of the baffle point, the baffle openings 1 are triangular, a rectangular baffle plate 2 is arranged between two adjacent baffle openings 1,
the width of each baffle plate 2 is b, the distance between two symmetrical baffle plates 2 is a, the sizes of a and b are related to the aperture D of the VIA through hole, and the value range of a is b+2mil; the stop points are in a shape of Chinese character 'mi'.
When VIA hole diameter D is less than 9.8mil, b is 4mil and a is 6mil; when 9.8mil < D is less than or equal to 14.8mil, b is 5mil and a is 7mil; when D is more than 14.8mil and less than or equal to 19.8mil, b is 6mil, and a is 8mil; when D is more than 19.8mil and less than or equal to 24.8mil, b is 7mil, and a is 9mil; when D is more than 24.8mil and less than or equal to 29.8mil, b is 8mil, and a is 10mil; when D is more than 29.8mil and less than or equal to 34.8mil, b is 9mil, and a is 11mil;34.8mil < D.ltoreq.39.8 mil, b 10mil, and a 12mil.
The design steps are as follows:
a. confirming the minimum aperture of the VIA through hole on the substrate, and calculating whether the aspect ratio is more than or equal to 8:1; the Gerber data of the customer is used for finding out that the minimum VIA through hole aperture is 9.8mil, the thickness requirement of a finished product plate is 78.4mil, the aspect ratio is calculated to be 8:1, and the design is judged to be required to be started;
b. the design of the meter-shaped baffle points is that the length and width of each rectangle forming the meter-shaped baffle points are calculated according to the aperture of the VIA through hole: 11.8mil x4mil;
c. according to the minimum VIA aperture, calculating the minimum requirement of the mesh number as 110 meshes;
d. and drawing the designed rice-shaped baffle points on the selected screen plate, and carrying out production printing.

Claims (1)

1. A screen printing plate shelves point for improving VIA through-hole printing ink remains which characterized in that: the edge of each baffle point is uniformly provided with 8 baffle openings (1), each baffle opening (1) is triangular, a rectangular baffle plate (2) is arranged between two adjacent baffle openings (1), the width of each baffle plate (2) is b, the distance between two symmetrical baffle plates (2) is a, the sizes of a and b are related to the aperture D of a VIA through hole, and the value of a is b+2mil; the stop points are in a shape of a Chinese character 'mi';
when VIA hole diameter D is less than 9.8mil, b is 4mil and a is 6mil;
when VIA VIA hole diameter is 9.8mil < D.ltoreq.14.8 mil, b is 5mil, a is 7mil;
when VIA VIA hole diameter is 14.8mil < D.ltoreq.19.8 mil, b is 6mil and a is 8mil;
when VIA VIA hole diameter 19.8mil < D.ltoreq.24.8 mil, b is 7mil and a is 9mil;
when VIA VIA hole diameter 24.8mil < D.ltoreq.29.8 mil, b is 8mil, a is 10mil;
when VIA VIA hole diameter is 29.8mil < D.ltoreq.34.8 mil, b is 9mil and a is 11mil;
when VIA VIA hole diameter 34.8mil < D.ltoreq.39.8 mil, b is 10mil and a is 12mil.
CN201811485365.2A 2018-12-06 2018-12-06 Screen printing plate blocking point for improving VIA through hole ink residue Active CN109466164B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811485365.2A CN109466164B (en) 2018-12-06 2018-12-06 Screen printing plate blocking point for improving VIA through hole ink residue

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811485365.2A CN109466164B (en) 2018-12-06 2018-12-06 Screen printing plate blocking point for improving VIA through hole ink residue

Publications (2)

Publication Number Publication Date
CN109466164A CN109466164A (en) 2019-03-15
CN109466164B true CN109466164B (en) 2023-12-12

Family

ID=65675670

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811485365.2A Active CN109466164B (en) 2018-12-06 2018-12-06 Screen printing plate blocking point for improving VIA through hole ink residue

Country Status (1)

Country Link
CN (1) CN109466164B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013188379A1 (en) * 2012-06-11 2013-12-19 Unipixel Displays, Inc. Methods of manufacture and use of customized flexomaster patterns for flexographic printing
CN203482509U (en) * 2013-10-21 2014-03-12 骏亚(惠州)电子科技有限公司 Solder mask printing makeready assembly
CN108112180A (en) * 2017-12-18 2018-06-01 珠海杰赛科技有限公司 A kind of method for substituting welding resistance shelves point net and a kind of web plate for substituting welding resistance shelves point net
CN209534442U (en) * 2018-12-06 2019-10-25 高德(无锡)电子有限公司 One kind is for improving the remaining halftone shelves point of VIA through-hole ink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013188379A1 (en) * 2012-06-11 2013-12-19 Unipixel Displays, Inc. Methods of manufacture and use of customized flexomaster patterns for flexographic printing
CN203482509U (en) * 2013-10-21 2014-03-12 骏亚(惠州)电子科技有限公司 Solder mask printing makeready assembly
CN108112180A (en) * 2017-12-18 2018-06-01 珠海杰赛科技有限公司 A kind of method for substituting welding resistance shelves point net and a kind of web plate for substituting welding resistance shelves point net
CN209534442U (en) * 2018-12-06 2019-10-25 高德(无锡)电子有限公司 One kind is for improving the remaining halftone shelves point of VIA through-hole ink

Also Published As

Publication number Publication date
CN109466164A (en) 2019-03-15

Similar Documents

Publication Publication Date Title
CN103619125B (en) A kind of PCB electro-plating method for improving electroplating evenness
CN102573309A (en) Method for improving graphic precision of substractive process printed circuit board (PCB) by adopting dynamic etching compensation method
CN101616549A (en) The method of manufacturing single-side thick copper stepped plate by electroplating addition
CN103687312A (en) Gold-plated circuit board manufacturing method
CN103582317A (en) Method for manufacturing tin leaking semicircular holes in flexible printed wiring board
CN101494957B (en) Method and substrate for producing multi-layer circuit board
CN202174609U (en) Die for punching positioning holes and shapes of flexible circuits
CN109466164B (en) Screen printing plate blocking point for improving VIA through hole ink residue
CN105430908A (en) Linewidth compensation method for manufacturing printed circuit board
CN105101642B (en) A kind of method and multi-layer PCB board for increasing multi-layer PCB board metal foil area
CN203708620U (en) Printed circuit board (PCB) with multiple alignment system
CN105208769A (en) Printed circuit board and screen printing method thereof
CN104023484A (en) Manufacturing method of printed circuit board overlaid through hole structure
CN209534442U (en) One kind is for improving the remaining halftone shelves point of VIA through-hole ink
CN209949535U (en) IGBT heat conduction printed circuit board
CN111010807A (en) PCB thin plate solder mask hole plugging method with plate thickness less than 600um
CN104735900A (en) Circuit board with side face metal structure and manufacturing method thereof
CN201491379U (en) Printed circuit board comprising LCD bonding pads
CN107846780B (en) Method for wiring in PCB
CN204217231U (en) A kind of PCB jigsaw
CN203194015U (en) PCB (printed circuit board) structure with yin-yang symmetry
CN104551413A (en) Method for forming conductive films
CN103987210A (en) PCB manufacturing method and PCB
CN101460020A (en) Multilayered flexible circuit board
CN102873974A (en) Method for producing collapsible steel mesh

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20230915

Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101

Applicant after: Gaode (Jiangsu) Electronic Technology Co.,Ltd.

Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32

Applicant before: Gultech (Wuxi) Electronics Co.,Ltd.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant