CN209534442U - One kind is for improving the remaining halftone shelves point of VIA through-hole ink - Google Patents
One kind is for improving the remaining halftone shelves point of VIA through-hole ink Download PDFInfo
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- CN209534442U CN209534442U CN201822039273.3U CN201822039273U CN209534442U CN 209534442 U CN209534442 U CN 209534442U CN 201822039273 U CN201822039273 U CN 201822039273U CN 209534442 U CN209534442 U CN 209534442U
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- ink residue
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- 240000007594 Oryza sativa Species 0.000 claims description 2
- 235000007164 Oryza sativa Nutrition 0.000 claims description 2
- 235000009566 rice Nutrition 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
Abstract
本实用新型涉及一种用于改善VIA通孔油墨残留的网版档点。档点的边缘均匀设置有8个档口,档口均为三角形,相邻两个档口间设置为矩形档片,档片的宽度为a,对称两个档片的长度为b,a和b的大小与VIA通孔的孔径D有关,且a的取值范围为b+2。本实用新型结构简单,设计紧凑,使用的米字档点的大小可通过调节矩形长宽进行修改,其大小可调,设计简单易加工,使得产品的设计有更大的延伸,进而可以实现产品VIA通孔的多样性。
The utility model relates to a screen block for improving VIA through-hole ink residue. There are 8 stalls evenly arranged on the edge of the stalls, and the stalls are all triangular. A rectangular stall is set between two adjacent stalls. The width of the stall is a, and the lengths of the two symmetrical stalls are b, a and The size of b is related to the aperture D of the VIA through hole, and the value range of a is b+2. The utility model is simple in structure and compact in design. The size of the rice-shaped stalls used can be modified by adjusting the length and width of the rectangle. Variety of via vias.
Description
技术领域technical field
本实用新型涉及一种用于改善VIA通孔油墨残留的网版档点,属于线路板设计技术领域。The utility model relates to a screen block for improving VIA through-hole ink residue, which belongs to the technical field of circuit board design.
背景技术Background technique
随着电子产品的高速发展,很多特殊的产品对应需要特殊的需求,传统的线路板设计很难满足一些特殊需求,比如:QFN芯片的散热、插件零件的焊接,若采用传统的档点方式制作小孔径的VIA通孔,一般直径在9.8~15.7mil,板厚在60mil及以上,若需普通的档点设计,会造VIA孔中有大量油墨,不利于显影冲孔,若加大普通的档点设计的直径,在孔口处会造成漏铜等问题。With the rapid development of electronic products, many special products correspond to special needs. Traditional circuit board design is difficult to meet some special needs, such as: heat dissipation of QFN chips, soldering of plug-in parts, if the traditional way of manufacturing is used VIA through holes with small apertures generally have a diameter of 9.8~15.7mil and a plate thickness of 60mil or above. If ordinary gear design is required, there will be a lot of ink in the VIA hole, which is not conducive to developing and punching. If the ordinary The diameter of the gear point design will cause problems such as copper leakage at the orifice.
实用新型内容Utility model content
本实用新型的目的是为了解决问题,提供了一种结构简单,设计紧凑的用于改善VIA通孔油墨残留的网版档点。The purpose of the utility model is to solve the problem, providing a simple structure and compact design for improving the ink residue of VIA through-hole screen stalls.
本实用新型采用如下技术方案:一种用于改善VIA通孔油墨残留的网版档点,所述档点的边缘均匀设置有8个档口,所述档口均为三角形,所述相邻两个档口间设置为矩形档片,所述档片的宽度为a,所述对称两个档片的长度为b,所述a和b的大小与VIA通孔的孔径D有关,且a的取值范围为b +2。The utility model adopts the following technical scheme: a screen stall for improving VIA through-hole ink residue, the edge of the stall is evenly provided with 8 stalls, and the stalls are all triangles, and the adjacent A rectangular bracket is arranged between the two stalls, the width of the bracket is a, the length of the two symmetrical brackets is b, the size of a and b is related to the aperture D of the VIA through hole, and a The value range of is b +2.
进一步的,所述档点呈米字型。Further, the stalls are in the shape of a rice.
进一步的,当VIA通孔孔径D小于9.8 mil时,b为4mil,a为6mil。Further, when the via hole diameter D of the VIA is less than 9.8 mil, b is 4 mil, and a is 6 mil.
进一步的,当VIA通孔孔径9.8<D≤14.8时,b为5mil,a为7mil。Further, when the via hole diameter of VIA is 9.8<D≤14.8, b is 5 mil, and a is 7 mil.
进一步的,当VIA通孔孔径14.8<D≤19.8时,b为6 mil,a为8mil。Further, when the via hole diameter of VIA is 14.8<D≤19.8, b is 6 mil, and a is 8 mil.
进一步的,当VIA通孔孔径19.8<D≤24.8时,b为7 mil,a为9mil。Further, when the via hole diameter of VIA is 19.8<D≤24.8, b is 7 mil, and a is 9 mil.
进一步的,当VIA通孔孔径 24.8<D≤29.8时,b为8mil,a为10mil。Further, when the via hole diameter of VIA is 24.8<D≤29.8, b is 8mil, and a is 10mil.
进一步的,当VIA通孔孔径29.8<D≤34.8时,b为9mil,a为11mil。Further, when the via hole diameter of VIA is 29.8<D≤34.8, b is 9 mil, and a is 11 mil.
进一步的,当VIA通孔孔径34.8<D≤39.8时,b为10mil,a为12mil。Further, when the via hole diameter of the VIA is 34.8<D≤39.8, b is 10 mil, and a is 12 mil.
进一步的,档点的设计过程包括如下步骤:Furthermore, the design process of the stalls includes the following steps:
(1)首先根据VIA通孔的截面的纵横比,当纵横比≥8:1时需要设置网版档点,当纵横比小于8:1时则不需要;(1) First, according to the aspect ratio of the section of the VIA through hole, when the aspect ratio is ≥ 8:1, it is necessary to set the screen gear point, and when the aspect ratio is less than 8:1, it is not necessary;
(2)根据VIA通孔的孔径D设置档点的宽度a和长度b;(2) Set the width a and length b of the gear point according to the aperture D of the VIA through hole;
(3)根据档点的大小选择相应目数的网版为基底;(3) According to the size of the stalls, select the screen with the corresponding mesh number as the base;
(4)将若干个档点分别绘制到网版上,进行生产印刷。(4) Draw several dots on the screen respectively for production printing.
本实用新型结构简单,设计紧凑,使用的米字档点的大小可通过调节矩形长宽进行修改,其大小可调,设计简单易加工,使得产品的设计有更大的延伸,进而可以实现产品VIA通孔的多样性。The utility model is simple in structure and compact in design. The size of the rice-shaped stalls used can be modified by adjusting the length and width of the rectangle. Variety of via vias.
附图说明Description of drawings
图1为本实用新型的结构示意图。Fig. 1 is the structural representation of the utility model.
附图标记:档口1、档片2。Reference signs: stall opening 1, stall sheet 2.
具体实施方式Detailed ways
下面将结合附图对本实用新型作进一步的描述。The utility model will be further described below in conjunction with the accompanying drawings.
如图1所示,一种用于改善VIA通孔油墨残留的网版档点, 档点的边缘均匀设置有8个档口1,档口1均为三角形,相邻两个档口1间设置为矩形档片2,档片2的宽度为a,对称两个档片2的长度为b,宽度a和长度b的大小与VIA通孔的孔径D有关,且a的取值范围为b+2;As shown in Figure 1, it is a screen stall for improving VIA through-hole ink residue. There are 8 stalls 1 evenly arranged on the edge of the stall, and the stalls 1 are all triangles, and there is a space between two adjacent stalls. It is set as a rectangular piece 2, the width of the piece 2 is a, the length of the two symmetrical pieces 2 is b, the size of the width a and the length b is related to the aperture D of the VIA through hole, and the value range of a is b +2;
当VIA通孔孔径D小于9.8 mil时,b为4mil,a为6mil;当9.8<D≤14.8时,b为5mil,a为7mil;14.8<D≤19.8时,b为6 mil,a为8mil;19.8<D≤24.8时,b为7 mil,a为9mil;24.8<D≤29.8时,b为8mil,a为10mil;29.8<D≤34.8时,b为9mil,a为11mil;34.8<D≤39.8时,b为10mil,a为12mil。When the hole diameter D of VIA is less than 9.8 mil, b is 4 mil and a is 6 mil; when 9.8<D≤14.8, b is 5 mil and a is 7 mil; when 14.8<D≤19.8, b is 6 mil and a is 8 mil ;19.8<D≤24.8, b is 7 mil, a is 9mil; 24.8<D≤29.8, b is 8mil, a is 10mil; 29.8<D≤34.8, b is 9mil, a is 11mil; 34.8<D When ≤39.8, b is 10mil, a is 12mil.
设计步骤如下:The design steps are as follows:
a、确认基材上VIA通孔最小孔径,计算出其纵横比是否大于等于8:1;通过客户的Gerber资料,查找出其最小VIA通孔孔径为9.8mil、成品板厚要求为78.4mil,计算出纵横比为8:1,判断需要启用此种设计;a. Confirm the minimum aperture of the VIA through hole on the base material, and calculate whether its aspect ratio is greater than or equal to 8:1; through the customer's Gerber data, find out that the minimum aperture of the VIA through hole is 9.8mil, and the thickness of the finished product is 78.4mil. The aspect ratio is calculated to be 8:1, and it is judged that this design needs to be enabled;
b、米字型档点的设计,根据VIA通孔孔径计算出组成米字型档点的各矩形的长宽为:11.8milX4mil;b. For the design of the rice-shaped stalls, the length and width of the rectangles that make up the rice-shaped stalls are calculated according to the diameter of the VIA through hole: 11.8milX4mil;
c、根据最小VIA孔径,计算出网版目数的最小要求为110目;c. According to the minimum VIA aperture, the minimum requirement for the screen mesh number is calculated to be 110 mesh;
d、将设计好的米字型档点绘制到所选择的网版上,进行生产印刷。d. Draw the designed rice-shaped dots on the selected screen for production printing.
Claims (9)
Priority Applications (1)
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CN201822039273.3U CN209534442U (en) | 2018-12-06 | 2018-12-06 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
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CN201822039273.3U CN209534442U (en) | 2018-12-06 | 2018-12-06 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109466164A (en) * | 2018-12-06 | 2019-03-15 | 高德(无锡)电子有限公司 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109466164A (en) * | 2018-12-06 | 2019-03-15 | 高德(无锡)电子有限公司 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
CN109466164B (en) * | 2018-12-06 | 2023-12-12 | 高德(江苏)电子科技股份有限公司 | Screen printing plate blocking point for improving VIA through hole ink residue |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230831 Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee before: Gultech (Wuxi) Electronics Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191025 |
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CF01 | Termination of patent right due to non-payment of annual fee |