CN209534442U - One kind is for improving the remaining halftone shelves point of VIA through-hole ink - Google Patents
One kind is for improving the remaining halftone shelves point of VIA through-hole ink Download PDFInfo
- Publication number
- CN209534442U CN209534442U CN201822039273.3U CN201822039273U CN209534442U CN 209534442 U CN209534442 U CN 209534442U CN 201822039273 U CN201822039273 U CN 201822039273U CN 209534442 U CN209534442 U CN 209534442U
- Authority
- CN
- China
- Prior art keywords
- hole
- shelves
- improving
- aperture
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
Abstract
The utility model relates to one kind for improving the remaining halftone shelves point of VIA through-hole ink.The edge of shelves point is evenly arranged with 8 shelves mouths, and shelves mouth is triangle, and rectangle washer is set as between two neighboring shelves mouth, and the width of washer is a, and the length of symmetrical two washers is that the size of b, a and b are related with the aperture D of VIA through-hole, and the value range of a is b+2.The utility model structure is simple, compact to design, and the size of the rice word shelves point used can be modified by adjusting rectangular aspect, adjustable, designs simple easy processing, so that the design of product has bigger extension, and then the diversity of product VIA through-hole may be implemented.
Description
Technical field
The utility model relates to one kind for improving the remaining halftone shelves point of VIA through-hole ink, belong to wiring board design skill
Art field.
Background technique
With the high speed development of electronic product, many special products are in requisition for special demand, traditional wiring board
Design is difficult to meet some specific demands, such as: the heat dissipation of QFN chip, the welding of plug-in unit part, according to traditional shelves point side
Formula makes the VIA through-hole of small-bore, and general diameter is in 9.8 ~ 15.7mil, and plate thickness is in 60mil or more, if needing common shelves point
Design, can make has a large amount of ink in the hole VIA, is unfavorable for punching of developing, if the diameter of common shelves point design is increased, at aperture
The problems such as will cause leakage copper.
Utility model content
Purpose of the utility model is to solve problem, provide that a kind of structure is simple, it is compact to design for improving
The remaining halftone shelves point of VIA through-hole ink.
The utility model adopts the following technical solution: one kind is described for improving the remaining halftone shelves point of VIA through-hole ink
The edge of shelves point is evenly arranged with 8 shelves mouths, and the shelves mouth is triangle, is set as rectangle shelves between the two neighboring shelves mouth
Piece, the width of the washer are a, and the length of symmetrical two washers is the size of b, a and b and the aperture D of VIA through-hole
It is related, and the value range of a is b+2.
Further, the shelves are selected in rice font.
Further, when VIA through-hole aperture D is less than 9.8 mil, b 4mil, a 6mil.
Further, as 9.8 < D≤14.8 of VIA through-hole aperture, b 5mil, a 7mil.
Further, as 14.8 < D≤19.8 of VIA through-hole aperture, b is 6 mil, a 8mil.
Further, as 19.8 < D≤24.8 of VIA through-hole aperture, b is 7 mil, a 9mil.
Further, as 24.8 < D≤29.8 of VIA through-hole aperture, b 8mil, a 10mil.
Further, as 29.8 < D≤34.8 of VIA through-hole aperture, b 9mil, a 11mil.
Further, as 34.8 < D≤39.8 of VIA through-hole aperture, b 10mil, a 12mil.
Further, the design process of shelves point includes the following steps:
(1) need to be arranged halftone shelves point as aspect ratio >=8:1 according to the aspect ratio in the section of VIA through-hole first, when vertical
Horizontal ratio does not need then when being less than 8:1;
(2) the width a and length b of shelves point are set according to the aperture D of VIA through-hole;
(3) select the halftone of corresponding mesh number for substrate according to the size of shelves point;
(4) several grade of point is plotted on halftone respectively, carries out production printing.
The utility model structure is simple, compact to design, the size of the rice word shelves point used can by adjust rectangular aspect into
Row modification, it is adjustable, simple easy processing is designed, so that the design of product has bigger extension, and then product may be implemented
The diversity of VIA through-hole.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Appended drawing reference: shelves mouth 1, washer 2.
Specific embodiment
Below in conjunction with attached drawing, the utility model will be further described.
As shown in Figure 1, a kind of for improving the remaining halftone shelves point of VIA through-hole ink, the edge of shelves point is evenly arranged with
8 shelves mouths 1, shelves mouth 1 are triangle, are set as rectangle washer 2 between two neighboring shelves mouth 1, and the width of washer 2 is a, and symmetrical two
The length of a washer 2 is that the size of b, width a and length b are related with the aperture D of VIA through-hole, and the value range of a is b+2;
When VIA through-hole aperture D is less than 9.8 mil, b 4mil, a 6mil;As 9.8 < D≤14.8, b 5mil,
A is 7mil;When 14.8 < D≤19.8, b is 6 mil, a 8mil;When 19.8 < D≤24.8, b is 7 mil, a 9mil;
When 24.8 < D≤29.8, b 8mil, a 10mil;When 29.8 < D≤34.8, b 9mil, a 11mil;34.8 < D≤
When 39.8, b 10mil, a 12mil.
Design procedure is as follows:
A, confirm VIA through-hole minimum-value aperture on substrate, calculate whether its aspect ratio is more than or equal to 8:1;Pass through client's
Gerber data, finds out that its minimum VIA through-hole aperture is 9.8mil, finished product plate thickness requirement is 78.4mil, calculates aspect ratio
For 8:1, judgement needs to enable such design;
B, the design of rice font shelves point calculates the length and width of each rectangle of composition rice font shelves point according to VIA through-hole aperture
Are as follows: 11.8milX4mil;
C, it according to the minimum aperture VIA, calculates the minimum of halftone mesh number and requires to be 110 mesh;
D, by designed rice font shelves point-rendering to selected halftone, production printing is carried out.
Claims (9)
1. one kind is for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: the edge of the shelves point is uniformly arranged
There are 8 shelves mouths (1), the shelves mouth (1) is triangle, is set as rectangle washer (2), institute between the two neighboring shelves mouth (1)
The width for stating washer (2) is a, and the length of symmetrical two washers (2) is the size of b, a and b and the aperture of VIA through-hole
D is related, and the value range of a is b+2.
2. as described in claim 1 for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: the shelves point
In rice font.
3. as described in claim 1 for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: when VIA through-hole
When aperture D is less than 9.8 mil, b 4mil, a 6mil.
4. as described in claim 1 for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: when VIA through-hole
When 9.8 < D≤14.8 of aperture, b 5mil, a 7mil.
5. as described in claim 1 for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: when VIA through-hole
When 14.8 < D≤19.8 of aperture, b is 6 mil, a 8mil.
6. as described in claim 1 for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: when VIA through-hole
When 19.8 < D≤24.8 of aperture, b is 7 mil, a 9mil.
7. as described in claim 1 for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: when VIA through-hole
When 24.8 < D≤29.8 of aperture, b 8mil, a 10mil.
8. as described in claim 1 for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: when VIA through-hole
When 29.8 < D≤34.8 of aperture, b 9mil, a 11mil.
9. as described in claim 1 for improving the remaining halftone shelves point of VIA through-hole ink, it is characterised in that: when VIA through-hole
When 34.8 < D≤39.8 of aperture, b 10mil, a 12mil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201822039273.3U CN209534442U (en) | 2018-12-06 | 2018-12-06 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201822039273.3U CN209534442U (en) | 2018-12-06 | 2018-12-06 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209534442U true CN209534442U (en) | 2019-10-25 |
Family
ID=68263715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201822039273.3U Active CN209534442U (en) | 2018-12-06 | 2018-12-06 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209534442U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109466164A (en) * | 2018-12-06 | 2019-03-15 | 高德(无锡)电子有限公司 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
-
2018
- 2018-12-06 CN CN201822039273.3U patent/CN209534442U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109466164A (en) * | 2018-12-06 | 2019-03-15 | 高德(无锡)电子有限公司 | One kind is for improving the remaining halftone shelves point of VIA through-hole ink |
CN109466164B (en) * | 2018-12-06 | 2023-12-12 | 高德(江苏)电子科技股份有限公司 | Screen printing plate blocking point for improving VIA through hole ink residue |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102573309A (en) | Method for improving graphic precision of substractive process printed circuit board (PCB) by adopting dynamic etching compensation method | |
CN209534442U (en) | One kind is for improving the remaining halftone shelves point of VIA through-hole ink | |
CN109466164A (en) | One kind is for improving the remaining halftone shelves point of VIA through-hole ink | |
CN202998694U (en) | Welding tool for PCB | |
CN111010807A (en) | PCB thin plate solder mask hole plugging method with plate thickness less than 600um | |
CN102873974B (en) | Method for producing collapsible steel mesh | |
CN203942697U (en) | Flexible printed wiring board | |
CN108463053A (en) | A kind of pcb board design method and pcb board | |
CN103987210A (en) | PCB manufacturing method and PCB | |
CN204131824U (en) | A kind of flexible PCB | |
CN103108486A (en) | Design method of cross-layer reference loss reduction | |
CN202738275U (en) | Wave soldering jig capable of preventing solder bridge | |
CN111432567A (en) | Processing method of independent tiny bonding pad on PCB | |
CN207271714U (en) | PCB paste solder printings automatic rinser steel mesh | |
CN202347116U (en) | Accompany-plating shunt bar for electroplating | |
CN203446112U (en) | Plate turnover machine with finger plate grabbing function | |
CN203057682U (en) | Display screen PCB plate suitable for steel mesh printing and machine plug-in unit | |
CN202475934U (en) | Inner layer thin plate structure | |
CN106102349B (en) | A kind of technique improving plating filling perforation recess value | |
CN209545983U (en) | A kind of pcb board structure optimizing plated through-hole impedance | |
CN110139474B (en) | Substrate circuit structure convenient for gold plating | |
CN204014276U (en) | Can improve the pcb board of Jafani effect | |
CN207542242U (en) | A kind of circuit lead frame structure of dense arrangement | |
CN205987573U (en) | SMT paster anchor clamps | |
CN211744872U (en) | PCB structure for reducing ground impedance of power supply |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230831 Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee before: Gultech (Wuxi) Electronics Co.,Ltd. |