CN109456193B - 一种不饱和氟碳化合物及其制备方法和应用 - Google Patents

一种不饱和氟碳化合物及其制备方法和应用 Download PDF

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CN109456193B
CN109456193B CN201811360848.XA CN201811360848A CN109456193B CN 109456193 B CN109456193 B CN 109456193B CN 201811360848 A CN201811360848 A CN 201811360848A CN 109456193 B CN109456193 B CN 109456193B
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潘庆崇
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Guangdong Guangshan New Materials Co ltd
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Abstract

本发明提供一种不饱和氟碳化合物及其制备方法和应用。所述不饱和氟碳化合物制备得到的材料具有优异的介电性能以及机械性能，且制备工艺简单，原料价格低廉，可有效减少投资，降低成本。

Description

一种不饱和氟碳化合物及其制备方法和应用
技术领域
本发明属于聚合物材料领域，涉及一种不饱和氟碳化合物及其制备方法和应用。
背景技术
5G网络是第五代通信网络，其性能相较于现今使用的4G网络4G网络技术有一个质的超越。5G网络技术进步明显的体现在无线信号的传输时效、覆盖性、通信安全保障等方面。5G网络通信技术深入结合其他无线移动技术，形成了全新的通信网络，满足互联网移动通信网速不断增长的要求。而且5G移动网络技术还可以实现智能化与自动化之间的相互调整，具有一定的灵活性，这是因为我们现如今使用的通信技术和无线技术为5G通信系统打下了良好的基础。
5G网络的主要目标是让终端用户始终处于联网状态。5G网络将来支持的设备远远不止是智能手机——它还要支持智能手表、健身腕带、智能家庭设备如鸟巢式室内恒温器等。5G网络是指下一代无线网络。5G网络将是4G网络的真正升级版，它的基本要求并不同于今天的无线网络。未来5G网络的传输速率可达10Gbps，这意味着手机用户在不到一秒时间内即可完成一部高清电影的下载。
5G用通信材料要求材料有非常低的介电常数以及介电损耗，现今4G通信领用使用的材料多以聚四氟乙烯为主，将聚四氟乙烯涂覆在铜箔上，再使用激光或化学方法使表现粗糙话，再进行粘结。但是聚四氟乙烯材料的多层化能力较差，不能满足5G基站材料多层化的要求，同时聚四氟乙烯材料的在制备时通常为大面积生产，很难制造尺寸小的材料，应用于5G通信终端存在阻碍。且聚四氟乙烯的玻璃化转变温度低，由于大功率的通信传输会产生大量热量，因此聚四氟乙烯的稳定性也存在缺陷。
发明内容
为解决上述技术问题，本发明提供一种不饱和氟碳化合物及其制备方法和应用，所述不饱和氟碳化合物制备得到的聚合物材料具有较低的介电常数以及介电损耗，同时具有优异的机械性能以及耐热性能，适用于通信用基站以及终端。
为达到上述目的，本发明采用以下技术方案：
本发明目的之一在于提供一种不饱和氟碳化合物，所述化合物由氟代化合物与含有至少一个不饱和基团的化合物通过分子间消除反应制备得到。
作为发明优选的技术方案，所述氟代化合物包括氟代酚、氟代醇或氟代酸中的任意一种或至少两种的组合。
优选地，所述氟代化合物的氟含量为25～67％，如25％、30％、35％、40％、45％、50％、55％、60％、65％或67％等，但并不仅限于所解决的数值，该数值范围内其他未列举的数值同样适用。
本发明中，氟代化合物优选为全氟酚、全氟醇或全氟酸。
作为发明优选的技术方案，所述氟代酚包括五氟苯酚以及五氟苯硫酚。
优选地，所述氟代醇包括C4～C18的氟代烷基醇，如C4、C5、C6、C7、C8、C9、C10、C11、C12、C13、C14、C15、C16、C17或C18中的任意一种，优选为C6～C12的氟代烷基醇。
优选地，所述氟代酸包括C2～C18的氟代烷基酸或五氟苯甲酸，如C2、C3、C4、C5、C6、C7、C8、C9、C10、C11、C12、C13、C14、C15、C16、C17或C18中的任意一种，优选为C4～C10的全氟烷基酸。
本发明中，氟代烷基醇为C4～C18的直链或支链烷基醇中除了α碳上的氢外，、烷基链上的氢原子全部或部分被氟原子所取代的化合物。本发明优选为全氟直链烷基醇，其结构式为F3C-(CF2)n-CH2OH，其中n为2～16的正整数，优选为n＝4～10。
本发明中，氟代烷基酸为C2～C18的直链或支链烷基酸中烷基链上的氢原子部分或全部被氟原子所取代的化合物。本发明优选为全氟直链烷基酸，其结构式为F3C-(CF2)n-COOH，其中n为0～16的正整数，优选为n＝2～8。
作为本发明优选的技术方案，所述有至少一个不饱和基团的化合物为含有至少一个羟基、巯基或羧基的化合物。
本发明中，所述含有至少一个不饱和基团的化合物中还至少含有一个活性基团，所述活性基团可以是羟基、巯基或羧基等，但并不仅限于上述基团，可以是和全氟酚、全氟醇以及全氟酸中的羟基或羧基放生反应的任意基团。例如可以是4-乙烯基苯甲酸、2-甲基-1,4-二氢苯甲酸、5-乙烯基-2-吡啶甲酸、丁醇-3-烯、3-(3-烯-丁基)苯酚、羟基双环戊二烯、辛醇-7-烯、6,8-二乙烯基-2萘酚或4-(5-烯-己基)-苯硫酚中的任意一种，但并不仅限于上述化合物。
作为本发明优选的技术方案，所述分子间消除反应包括醚化反应、硫醚化反应或酯化反应中的任意一种。
本发明中，所述分子间消去反应即化合物A与化合物B间脱去一分子小分子化合物得到A-B化合物的反应，所述小分子可以是水、卤化氢、硫化氢或甲醇等，对应的反应可以是醚化反应、硫醚化反应、酯化反应、酰胺化反应或酯交换反应等。
本发明中，所述的化合物典型但非限制性的结构式有：
Figure BDA0001867295660000041
Figure BDA0001867295660000051
Figure BDA0001867295660000052
中的任意一种。
本发明目的之二在于提供一种上述不饱和氟碳化合物的制备方法，所述制备方法为：氟代化合物与含有至少一个不饱和基团的化合物通过分子间消除反应制备得到所述化合物。
本发明目的之三在于提供一种氟碳预聚物，所述预聚物由权利要上述不饱和氟碳化合物通过聚合反应制备得到。
本发明目的之四在于提供一种上述不饱和氟碳化合物或氟碳预聚物的应用，所述不饱和氟碳化合物或氟碳预聚物用于制备粘结片、覆铜板和线路板。
作为本发明优选的技术方案，所述粘结片由树脂组合物制备得到。
优选地，所述树脂组合物包括所述不饱和氟碳化合物和/或所述氟碳预聚物以及碳氢树脂，或包括所述树脂组合物包括所述不饱和氟碳化合物和/或所述氟碳预聚物聚合反应得到的氟碳聚合物以及碳氢树脂。
本发明中，所述聚合反应优选为自由基聚合，自由基聚合即本发明提供的不饱和氟碳化合物在引发剂作用下，不饱和键(如碳碳双键和碳碳三键等)发生聚合。所述自由基聚合可以是上述不饱和氟碳化合物自聚合，也可以是上述不饱和氟碳化合物与其他含有不饱和键的添加剂共聚合。
本发明中，所述氟碳化合物或氟碳预聚物通过聚合反应制备得到的氟碳聚合物为常温液态或可溶于溶剂的固态。所述氟碳聚合物常温下为液态或可溶解的固态，使得所述氟碳聚合物容易加工，也更易于和其他添加混合，减少了加工成本。同时更容易用于制作小尺寸器件，使得所述材料可用于手机、笔记本电脑或平板电脑等小型或微型通信终端的制作。
作为本发明优选的技术方案，所述覆铜板的制备方法为：所述树脂组合物分散于溶剂中制备得到树脂胶液，所述树脂胶液涂布于基材表面得到预浸板，所述预浸板单侧或两侧贴合金属箔得到覆铜板，或至少两层预浸板叠合得到多层预浸板，与所述多层预浸板单侧或两侧贴合金属箔得到覆铜板。
优选地，所述溶剂为酮类、烃类、醚类、酯类或非质子溶剂中的一种或者至少两种的组合，优选丙酮、甲基乙基酮、甲基异丁基酮、甲苯、二甲苯、甲醇、乙醇、伯醇、乙二醇单甲醚、丙二醇单甲醚、丙二醇甲醚醋酸酯、乙酸乙酯、N,N-二甲基甲酰胺或N,N-二乙基甲酰胺中的一种或者至少两种的混合物，所述组合典型但非限制性实例有：丙酮和甲基乙基酮的组合、甲基乙基酮和甲基异丁基酮的组合、甲苯和二甲苯的组合、甲醇和乙醇的组合、乙醇和异丙醇的组合、乙二醇单甲醚和丙二醇单甲醚的组合、丙二醇甲醚醋酸酯和乙酸乙酯的组合、N,N-二甲基甲酰胺和N,N-二乙基甲酰胺的组合或甲醇、乙二醇单甲醚和甲基乙基酮的组合。
优选地，所述基材为玻璃纤维基材、聚酯基材、聚酰亚胺基材、陶瓷基材或碳纤维基材中的任意一种。
优选地，所述线路板由所述覆铜板表面加工线路而成。
本发明提供的氟碳化合物或氟碳预聚物通过聚合反应制备得到的氟碳聚合物具有极低的介电常数以及介电损耗，满足5G通信技术对于材料在介电常数以及介电损耗上的要求，同时所述通信材料具有良好的耐热性能和机械性能，更适用于大功率通信设备的制作。
本发明中，提供的不饱和氟碳化合物可以与乙烯基POSS、碳氢树脂等原料混合共聚，也可以使用不饱和氟碳化合物或氟碳预聚物自由基聚合后得到的材料与乙烯基POSS、碳氢树脂等原料混合，上述两种混合物高温成型制备得到的板材，具有优异的机械性能以及介电性能，适用于5G通信基站的建造。
不仅如此，由于聚四氟乙烯的熔点高达327℃，使得其在加工方面存在诸多困难，且聚四氟乙烯的临界表面张力仅为18×10-5N·cm-1，而在多层板的制备中使用的胶粘剂的张力均要大于18×10-5N·cm-1，不利于胶粘剂在聚四氟乙烯表面的均匀涂布，因此聚四氟乙烯材料虽然具有良好的介电性能，但是很难用于多层板的制备。由于高频高速通信，尤其是5G通信的信号发射功率要远高于现有的4G通信技术，由于基站以及通信设备的体积有限，因此单层板材以很难满足需求，就需要多层线路板来提高线路的面积，从而提高发射功率。本发明提供的氟碳材料，在介电性能与聚四氟乙烯材料接近，能够满足高频高速通信需求的前提下，相比于聚四氟乙烯具有更低的熔点以及更高的临界表面张力，适用于多层板的生产。
与现有技术相比，本发明至少具有以下有益效果：
(1)本发明提供一种不饱和氟碳化合物，所述化合物聚合得到高分子化合物具有优异的介电性能，介电常数可低至2.2C2/N·M2，介电损耗可低至2.9×10-4，适用于5G通信等高频高速通信领域；
(2)本发明提供一种不饱和氟碳化合物，所述化合物与其他添加剂混合后制备得到的板材具有优异的机械性能以及介电性能，性能全面优于传统聚四氟乙烯板材，更适用于5G通信基站的建造；
(3)本发明提供一种不饱和氟碳化合物，所述化合物在介电性能与聚四氟乙烯材料接近，能够满足高频高速通信需求的前提下，相比于聚四氟乙烯具有更低的熔点以及更高的临界表面张力，适用于多层板的生产。
具体实施方式
为便于理解本发明，本发明列举实施例如下。本领域技术人员应该明了，所述实施例仅仅是帮助理解本发明，不应视为对本发明的具体限制。
实施例1
本发明提供一种不饱和氟碳化合物，其结构是如式I所示：
Figure BDA0001867295660000081
式I所示化合物的制备方法为：1mol全氟十二醇与1.2mol 4-乙烯基-苯甲酸混合，加入0.1mol/L氢氧化钠溶液100mL，机械搅拌在80℃下加热反应2h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式I所示化合物。
1H NMR(CDCl3,500MHz):δ7.95～7.89(m，2H，Ar-H)，7.43～7.36(m，2H，Ar-H)，6.65～6.60(m，H，CH2＝CH)，5.63～5.57(t，H，CH 2＝CH)，5.21～5.16(t，H，CH 2＝CH)，4.62～4.55(s，2H，CH2)。
实施例2
本发明提供一种不饱和氟碳化合物，其结构是如式II所示：
Figure BDA0001867295660000091
式II所示化合物的制备方法为：1mol全氟丁醇与1.2mol 2-甲基-1,4-二氢苯甲酸混合，加入0.1mol/L氢氧化钠溶液100mL，机械搅拌在80℃下加热反应2.5h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式II所示化合物。
1H NMR(CDCl3,500MHz):δ5.58～5.48(m，H，CH＝CH)，5.38～5.30(t，H，CH＝C)，4.45～4.39(s，2H，CH2)，3.71～3.65(d，H，CH)，2.67～2.60(t，2H，CH2)，1.75～1.68(t，3H，CH3)。
实施例3
本发明提供一种不饱和氟碳化合物，其结构是如式III所示：
Figure BDA0001867295660000092
式III所示化合物的制备方法为：1mol全氟辛醇与1.2mol 5-乙烯基-2-吡啶甲酸混合，加入0.1mol/L氢氧化钠溶液100mL，机械搅拌在70℃下加热反应3h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式III所示化合物。
1H NMR(CDCl3,500MHz):δ9.03～8.96(m，H，Ar-H)，8.23～8.15(m，2H，Ar-H)，6.66～6.61(m，H，CH2＝CH)，5.71～5.65(t，H，CH 2＝CH)，5.28～5.22(t，H，CH 2＝CH)，4.67～4.61(s，2H，CH2)。
实施例4
本发明提供一种不饱和氟碳化合物，其结构是如式IV所示：
Figure BDA0001867295660000101
式IV所示化合物的制备方法为：1mol全氟己酸与1.1mol丁醇-3-烯混合，加入0.1mol/L氢氧化钠溶液100mL，机械搅拌在75℃下加热反应2h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式IV所示化合物。
1H NMR(CDCl3,500MHz):δ5.73～5.68(m，H，CH2＝CH)，5.05～4.95(t，2H，CH 2＝CH)，4.15～4.08(t，2H，CH2)，2.25～2.17(m，2H，CH2)。
实施例5
本发明提供一种不饱和氟碳化合物，其结构是如式V所示：
Figure BDA0001867295660000102
式V所示化合物的制备方法为：1mol全氟壬酸与1.2mol苯酚混合，加入0.1mol/L氢氧化钠溶液100mL，机械搅拌在75℃下加热反应2h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到的固体与1mol4-氯-1-丁烯混合，加入0.1mol三氯化铝，60℃反应1.5h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式V所示化合物。
1H NMR(CDCl3,500MHz):δ7.23～7.15(m，H，Ar-H)，6.95～6.85(m，3H，Ar-H)，5.73～5.65(m，H，CH2＝CH)，5.06～4.95(t，2H，CH 2＝CH)，2.63～2.57(t，H，CH2)，2.33～2.28(m，2H，CH2)。
实施例6
本发明提供一种不饱和氟碳化合物，其结构是如式VI所示：
Figure BDA0001867295660000111
式VI所示化合物的制备方法为：1mol全氟十八酸与1.3mol羟基双环戊二烯混合，加入0.1mol/L氢氧化钠溶液100mL，机械搅拌在80℃下加热反应3h，冷却至室温，500mL乙醇洗5遍，分液，减压蒸馏残留乙醇，得到式VI所示化合物。
1H NMR(CDCl3,500MHz):δ5.64～5.58(m，2H，CH＝CH)，3.92～3.86(t，H，CH)，2.28～2.22(t，2H，CH2)，2.12～2.03(m，2H，CH)，1.51～1.40(m，2H，CH2)，1.38～1.32(t，2H，CH2)。
实施例7
本发明提供一种不饱和氟碳化合物，其结构是如式VII所示：
Figure BDA0001867295660000121
式IV所示化合物的制备方法为：1.2mol五氟苯酚与1mol辛醇-7-烯混合，加入浓硫酸20mL，机械搅拌加热至回流反应2.5h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式IV所示化合物。
1H NMR(CDCl3,500MHz):δ5.81～5.75(m，H，CH2＝CH)，5.04～4.95(t，2H，CH 2＝CH)，3.99～3.92(t，2H，CH2)，2.01～1.95(m，2H，CH2)，1.78～1.73(m，2H，CH2)，1.35～1.25(m，6H，CH2)。
实施例8
本发明提供一种不饱和氟碳化合物，其结构是如式VIII所示：
Figure BDA0001867295660000122
式VIII所示化合物的制备方法为：1.2mol五氟苯酚与1mol 6-乙烯基-2萘酚混合，加入浓硫酸20mL，机械搅拌加热至回流反应2h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到的固体与一氯乙烯混合，加入0.1mol三氯化铝，60℃反应1.5h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式VIII所示化合物。
1H NMR(CDCl3,500MHz):δ7.66～7.60(m，H，Ar-H)，7.58～7.52(m，H，Ar-H)，7.42～7.36(m，H，Ar-H)，7.04～6.94(m，2H，Ar-H)，6.69～6.64(m，2H，CH2＝CH)，5.66～5.61(t，2H，CH 2＝CH)，5.21～5.16(t，2H，CH 2＝CH)。
实施例9
本发明提供一种不饱和氟碳化合物，其结构是如式IX所示：
Figure BDA0001867295660000131
式IX所示化合物的制备方法为：1mol五氟苯硫酚与1.2mol苯硫酚混合，加入浓硫酸20mL，机械搅拌在加热回流反应5h，冷却至室温，1000mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到的固体与1mol 6-氯-1-己烯混合，加入0.1mol三氯化铝，60℃反应1.5h，冷却至室温，1000mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式IX所示化合物。
1H NMR(CDCl3,500MHz):δ7.17～7.11(m，2H，Ar-H)，6.95～6.89(m，2H，Ar-H)，5.75～5.67(m，H，CH2＝CH)，5.07～4.95(t，2H，CH 2＝CH)，2.61～2.53(t，2H，CH2)，2.01～1.97(m，2H，CH2)，1.64～1.59(m，2H，CH2)，1.36～1.32(m，2H，CH2)。
实施例10
本发明提供一种不饱和氟碳化合物，其结构是如式X所示：
Figure BDA0001867295660000141
式X所示化合物的制备方法为：1.2mol全氟辛醇与1mol甲基丙烯醇混合，加入浓硫酸20mL，机械搅拌加热至回流反应2.5h，冷却至室温，500mL水洗5遍，分液，加入无水硫酸钠，静置2h，过滤，得到式X所示化合物。
1H NMR(CDCl3,500MHz):δ5.05～4.95(s，2H，CH2＝C)，4.08～4.01(s，2H，CH2)，3.72～3.65(s，2H，CH2)，1.75～1.68(s，3H，CH3)。
在相同引发剂作用下，对实施例1-10制备得到的不饱和氟碳化合物进行自由基聚合，对得到的聚合物的介电常数(Dk)以及介电损耗(Df)进行测试，结果如表1所示，介电常数和介电损耗的测试方法为GB1049-78(10GHz)，。
表1
Dk/C<sup>2</sup>/N·M<sup>2</sup> Df/10<sup>-4</sup> T<sub>m</sub>/℃ Yc/10<sup>-5</sup>·cm<sup>-1</sup>
实施例1 2.6 2.9 220 32
实施例2 2.5 3.1 211 35
实施例3 2.7 3.2 198 41
实施例4 2.5 3.0 189 38
实施例5 2.5 2.9 203 35
实施例6 2.4 3.0 237 31
实施例7 2.8 3.5 159 52
实施例8 2.8 3.5 172 49
实施例9 3.1 3.9 185 57
实施例10 2.2 2.9 205 32
聚四氟乙烯 2.1 2.8 327 18
实施例1-10制备得到的不饱和氟碳化合物与乙烯基POSS以及C5碳氢树脂按照质量比6:1:3混合，200℃高温成型制成板材，板材厚度20～30mm，对制备得到的板材的玻璃化转变温度、机械性能以及介电性能进行测试，测试结果如表2所示。
板材的玻璃化转变温度采用DSC进行测试，板材的弯曲强度采用GB1042-79标准进行测试，抗压强度采用GB1041-79标准进行测试，抗冲击强度采用GB1043-79进行测试，介电常数和介电损耗的测试方法为GB1049-78(10GHz)。
表2
Figure BDA0001867295660000151
从表1可以看出，实施例1-10制备得到的不饱和氟碳材料自身发生自由基聚合制备得到的材料具有优异的介电性能，介电常数可低至2.2C2/N·M2，介电损耗可低至2.9×10-4，性能与聚四氟乙烯材料相近。本发明的提供氟碳材料介电性能与聚四氟乙烯相近的同时，其熔点在180～220℃之间，而临界表面张力在30～60×10-5N·cm-1之间，其熔点和表面张力均能满足制备多层板的需求。
从表2可以看出，实施例1-9制备得到的不饱和氟碳材料与其他添加剂混合制备得到的板材，其性能要与传统聚四氟乙烯板材相近，更适合应用于5G通信技术领域。
使用环氧树脂胶粘剂以及上述制备得到的单层板制备多层板，板的层数为4，粘结层厚度为100～200μm，对制备得到的4层板的玻璃化转变温度、机械性能以及介电性能进行测试，测试结果如表3所示。
4层板的玻璃化转变温度采用DSC进行测试，板材的弯曲强度采用GB1042-79标准进行测试，抗压强度采用GB1041-79标准进行测试，抗冲击强度采用GB1043-79进行测试，介电常数和介电损耗的测试方法为GB1049-78(10GHz)。
表3
Figure BDA0001867295660000161
使用环氧树脂胶粘剂以及上述制备得到的4层板制备8层板，粘结层厚度为100～200μm，对制备得到的8层板的玻璃化转变温度、机械性能以及介电性能进行测试，测试结果如表4所示。
8层板的玻璃化转变温度采用DSC进行测试，板材的弯曲强度采用GB1042-79标准进行测试，抗压强度采用GB1041-79标准进行测试，抗冲击强度采用GB1043-79进行测试，介电常数和介电损耗的测试方法为GB1049-78(10GHz)。
表4
Figure BDA0001867295660000171
使用环氧树脂胶粘剂以及上述制备得到的8层板制备16层板，粘结层厚度为100～200μm，对制备得到的8层板的玻璃化转变温度、机械性能以及介电性能进行测试，测试结果如表5所示。
16层板的玻璃化转变温度采用DSC进行测试，板材的弯曲强度采用GB1042-79标准进行测试，抗压强度采用GB1041-79标准进行测试，抗冲击强度采用GB1043-79进行测试，介电常数和介电损耗的测试方法为GB1049-78(10GHz)。
表5
Figure BDA0001867295660000181
从表3-5的测试结果可以看出，采用本发明所述氟碳化合物制备得到的单层板而制备得到的多层板，即4、8和16板，均具有优异的介电性能和机械性能，且相比单层板均有较明显的提高。而聚四氟乙烯单层板并不能制备性能稳定的多层板，因此相比聚四氟乙烯板材，本发明提供的氟碳化合物更能满足制备多层板的需求。
申请人声明，本发明通过上述实施例来说明本发明的详细工艺设备和工艺流程，但本发明并不局限于上述详细工艺设备和工艺流程，即不意味着本发明必须依赖上述详细工艺设备和工艺流程才能实施。所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。

Claims (7)

1.一种不饱和氟碳化合物，其特征在于，所述不饱和氟碳化合物选自：
Figure DEST_PATH_IMAGE001
Figure 793392DEST_PATH_IMAGE002
Figure DEST_PATH_IMAGE003
中任意一种。
2.一种权利要求1所述的不饱和氟碳化合物的应用，其特征在于，所述不饱和氟碳化合物用于制备粘结片、覆铜板和线路板。
3.根据权利要求2所述的应用，其特征在于，所述粘结片由树脂组合物制备得到，所述树脂组合物包括所述不饱和氟碳化合物和/或氟碳预聚物以及碳氢树脂，或树脂组合物包括所述不饱和氟碳化合物和/或氟碳预聚物聚合反应得到的氟碳聚合物以及碳氢树脂，其中氟碳预聚物由所述不饱和氟碳化合物通过聚合反应制备得到。
4.根据权利要求3所述的应用，其特征在于，所述覆铜板的制备方法为：所述树脂组合物分散于溶剂中制备得到树脂胶液，所述树脂胶液涂布于基材表面得到预浸板，所述预浸板单侧或两侧贴合金属箔得到覆铜板，或至少两层预浸板叠合得到多层预浸板，与所述多层预浸板单侧或两侧贴合金属箔得到覆铜板。
5.根据权利要求4所述的应用，其特征在于，所述溶剂为丙酮、甲基乙基酮、甲基异丁基酮、甲苯、二甲苯、甲醇、乙醇、乙二醇单甲醚、丙二醇单甲醚、丙二醇甲醚醋酸酯、乙酸乙酯、N,N-二甲基甲酰胺或N,N-二乙基甲酰胺中的一种或者至少两种的混合物。
6.根据权利要求5所述的应用，其特征在于，所述基材为玻璃纤维基材、聚酯基材、聚酰亚胺基材、陶瓷基材或碳纤维基材中的任意一种。
7.根据权利要求6所述的应用，其特征在于，所述线路板由所述覆铜板表面加工线路而成。
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