CN109449265B - 一种光束成像装置 - Google Patents
一种光束成像装置 Download PDFInfo
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- CN109449265B CN109449265B CN201811587448.2A CN201811587448A CN109449265B CN 109449265 B CN109449265 B CN 109449265B CN 201811587448 A CN201811587448 A CN 201811587448A CN 109449265 B CN109449265 B CN 109449265B
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- 238000003384 imaging method Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000013329 compounding Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 41
- 230000005540 biological transmission Effects 0.000 abstract description 12
- 239000000969 carrier Substances 0.000 description 5
- 238000005036 potential barrier Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
- H01L33/0012—Devices characterised by their operation having p-n or hi-lo junctions p-i-n devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811587448.2A CN109449265B (zh) | 2018-12-24 | 2018-12-24 | 一种光束成像装置 |
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CN201811587448.2A CN109449265B (zh) | 2018-12-24 | 2018-12-24 | 一种光束成像装置 |
Publications (2)
Publication Number | Publication Date |
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CN109449265A CN109449265A (zh) | 2019-03-08 |
CN109449265B true CN109449265B (zh) | 2020-11-27 |
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CN201811587448.2A Active CN109449265B (zh) | 2018-12-24 | 2018-12-24 | 一种光束成像装置 |
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CN (1) | CN109449265B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109975786B (zh) * | 2019-03-25 | 2021-03-02 | 国科光芯(海宁)科技股份有限公司 | 一种光束成像装置以及激光雷达 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1227416A (zh) * | 1996-02-09 | 1999-09-01 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
CN103022891A (zh) * | 2012-12-04 | 2013-04-03 | 北京工业大学 | 一种集成保护二极管的大功率半导体激光芯片 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101335308B (zh) * | 2008-07-30 | 2012-03-21 | 中国科学院上海技术物理研究所 | 一种具有内增益的紫外探测器及制备方法 |
KR101598547B1 (ko) * | 2010-12-03 | 2016-03-02 | 삼성전자주식회사 | 광 이미지 변조기 및 그 제조 방법 |
JP5742345B2 (ja) * | 2011-03-20 | 2015-07-01 | 富士通株式会社 | 受光素子および光受信モジュール |
KR20150086014A (ko) * | 2014-01-17 | 2015-07-27 | 한국전자통신연구원 | 개선된 본딩 패드 구조를 갖는 GaN 트랜지스터 및 그의 제조방법 |
CN108155206B (zh) * | 2016-12-02 | 2021-08-03 | 群创光电股份有限公司 | 有机发光二极管装置 |
CN107479048A (zh) * | 2017-08-28 | 2017-12-15 | 哈尔滨工业大学 | InGaAs材料MSM结构光电混频探测器 |
CN107819071B (zh) * | 2017-10-31 | 2020-05-05 | 山东大学 | 一种平面耿氏毫米波、太赫兹功率放大器及其制备方法 |
CN207529933U (zh) * | 2017-11-23 | 2018-06-22 | 中科天芯科技(北京)有限公司 | 光束成像装置 |
CN108777259A (zh) * | 2018-06-05 | 2018-11-09 | 上海天马有机发光显示技术有限公司 | 一种有机发光显示面板及显示装置 |
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2018
- 2018-12-24 CN CN201811587448.2A patent/CN109449265B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1227416A (zh) * | 1996-02-09 | 1999-09-01 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
CN103022891A (zh) * | 2012-12-04 | 2013-04-03 | 北京工业大学 | 一种集成保护二极管的大功率半导体激光芯片 |
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CN109449265A (zh) | 2019-03-08 |
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Effective date of registration: 20191016 Address after: 314400 building 4, No.17 Caohejing Road, Haining Economic Development Zone, Haining City, Jiaxing City, Zhejiang Province Applicant after: Guoke optical core (Haining) Technology Co.,Ltd. Address before: Room 339, room 62, West Street, Drum Tower, Xicheng District, Beijing, Beijing Applicant before: CHINA SCIENCE SKY CHIP TECHNOLOGY (BEIJING) CO.,LTD. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A beam imaging device Effective date of registration: 20210305 Granted publication date: 20201127 Pledgee: Haining Chengxin Financing Guarantee Co.,Ltd. Pledgor: Guoke optical core (Haining) Technology Co.,Ltd. Registration number: Y2021330000177 |
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Date of cancellation: 20231214 Granted publication date: 20201127 Pledgee: Haining Chengxin Financing Guarantee Co.,Ltd. Pledgor: Guoke optical core (Haining) Technology Co.,Ltd. Registration number: Y2021330000177 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A beam imaging device Effective date of registration: 20231218 Granted publication date: 20201127 Pledgee: Haining Financing Guarantee Co.,Ltd. Pledgor: Guoke optical core (Haining) Technology Co.,Ltd. Registration number: Y2023330003043 |
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