CN109429532B - 发光器件封装和光源设备 - Google Patents

发光器件封装和光源设备 Download PDF

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Publication number
CN109429532B
CN109429532B CN201780039734.2A CN201780039734A CN109429532B CN 109429532 B CN109429532 B CN 109429532B CN 201780039734 A CN201780039734 A CN 201780039734A CN 109429532 B CN109429532 B CN 109429532B
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China
Prior art keywords
light emitting
emitting device
electrode
frame
disposed
Prior art date
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CN201780039734.2A
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English (en)
Chinese (zh)
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CN109429532A (zh
Inventor
李太星
宋俊午
任仓满
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lekin Semiconductor Co Ltd
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Suzhou Liyu Semiconductor Co ltd
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
CN201780039734.2A 2017-06-26 2017-09-29 发光器件封装和光源设备 Active CN109429532B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0080781 2017-06-26
KR1020170080781A KR102473399B1 (ko) 2017-06-26 2017-06-26 발광소자 패키지 및 광원 장치
PCT/KR2017/011082 WO2019004518A1 (ko) 2017-06-26 2017-09-29 발광소자 패키지 및 광원 장치

Publications (2)

Publication Number Publication Date
CN109429532A CN109429532A (zh) 2019-03-05
CN109429532B true CN109429532B (zh) 2023-09-29

Family

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CN201780039734.2A Active CN109429532B (zh) 2017-06-26 2017-09-29 发光器件封装和光源设备

Country Status (6)

Country Link
US (1) US10672959B2 (https=)
EP (1) EP3444856B1 (https=)
JP (1) JP7182782B2 (https=)
KR (1) KR102473399B1 (https=)
CN (1) CN109429532B (https=)
WO (1) WO2019004518A1 (https=)

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KR102432216B1 (ko) * 2017-07-11 2022-08-12 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
US11367820B2 (en) * 2017-09-01 2022-06-21 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device package and light source device
US10672954B2 (en) * 2017-09-01 2020-06-02 Lg Innotek Co., Ltd. Light emitting device package
KR102455086B1 (ko) * 2017-09-12 2022-10-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원장치
KR102392013B1 (ko) * 2017-09-15 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
WO2020003789A1 (ja) * 2018-06-29 2020-01-02 日亜化学工業株式会社 発光装置の製造方法および発光装置
DE102018125138A1 (de) * 2018-10-11 2020-04-16 Osram Opto Semiconductors Gmbh Strahlungsemittierendes bauteil und verfahren zur herstellung eines strahlungsemittierenden bauteils
CN111384228B (zh) 2018-12-28 2024-12-03 日亚化学工业株式会社 发光装置以及发光装置的制造方法
JP7368965B2 (ja) * 2019-07-10 2023-10-25 株式会社ジャパンディスプレイ Ｌｅｄモジュール及びｌｅｄモジュールを含む表示装置
CN110707198A (zh) * 2019-09-20 2020-01-17 深圳市华星光电半导体显示技术有限公司 阵列基板及其制备方法
JP7389363B2 (ja) * 2021-05-26 2023-11-30 日亜化学工業株式会社 発光装置

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KR20120084553A (ko) * 2011-01-20 2012-07-30 삼성엘이디 주식회사 발광소자의 패키지 및 그 제조방법과 리드 프레임
KR20130017464A (ko) * 2011-08-10 2013-02-20 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 시스템
CN105280798A (zh) * 2014-05-28 2016-01-27 Lg伊诺特有限公司 发光器件

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KR101265642B1 (ko) * 2007-07-23 2013-05-22 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
TW201011936A (en) * 2008-09-05 2010-03-16 Advanced Optoelectronic Tech Light emitting device and fabrication thereof
JP2011044593A (ja) 2009-08-21 2011-03-03 Hitachi Chem Co Ltd Ｌｅｄ基板及びｌｅｄパッケージ
KR101056903B1 (ko) * 2009-12-17 2011-08-12 주식회사 두산 발광소자 패키지용 기판 및 이를 이용한 발광소자 패키지
KR20110111173A (ko) * 2010-04-02 2011-10-10 김경동 Ｌｅｄ 조명용 리드 프레임 및 그 제조방법
KR101020963B1 (ko) * 2010-04-23 2011-03-09 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
US8987022B2 (en) 2011-01-17 2015-03-24 Samsung Electronics Co., Ltd. Light-emitting device package and method of manufacturing the same
DE102012215705B4 (de) 2012-09-05 2021-09-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optisches bauelement, baugruppe, verfahren zum herstellen eines gehäuses und verfahren zum herstellen einer baugruppe
US9548261B2 (en) * 2013-03-05 2017-01-17 Nichia Corporation Lead frame and semiconductor device
JP6255747B2 (ja) 2013-07-01 2018-01-10 日亜化学工業株式会社 発光装置
KR101443870B1 (ko) 2014-03-05 2014-09-23 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
KR20160003429A (ko) * 2014-07-01 2016-01-11 현대자동차주식회사 발광 소자 패키지, 발광 소자 패키지 모듈, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
CN105428508B (zh) 2015-12-02 2018-08-24 开发晶照明（厦门）有限公司 封装基板以及led倒装封装结构
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KR20120084553A (ko) * 2011-01-20 2012-07-30 삼성엘이디 주식회사 발광소자의 패키지 및 그 제조방법과 리드 프레임
KR20130017464A (ko) * 2011-08-10 2013-02-20 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 시스템
CN105280798A (zh) * 2014-05-28 2016-01-27 Lg伊诺特有限公司 发光器件

Also Published As

Publication number Publication date
KR20190001188A (ko) 2019-01-04
EP3444856A1 (en) 2019-02-20
US10672959B2 (en) 2020-06-02
JP2020526004A (ja) 2020-08-27
US20190088837A1 (en) 2019-03-21
JP7182782B2 (ja) 2022-12-05
EP3444856A4 (en) 2019-02-20
CN109429532A (zh) 2019-03-05
KR102473399B1 (ko) 2022-12-02
EP3444856B1 (en) 2023-05-10
WO2019004518A1 (ko) 2019-01-03

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Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Applicant after: Suzhou Liyu Semiconductor Co.,Ltd.

Address before: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

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