CN109423222B - 有机电子设备封装材料用粘结膜及包括其的有机电子设备用封装材料 - Google Patents
有机电子设备封装材料用粘结膜及包括其的有机电子设备用封装材料 Download PDFInfo
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- CN109423222B CN109423222B CN201810956420.5A CN201810956420A CN109423222B CN 109423222 B CN109423222 B CN 109423222B CN 201810956420 A CN201810956420 A CN 201810956420A CN 109423222 B CN109423222 B CN 109423222B
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- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170106047A KR101962195B1 (ko) | 2017-08-22 | 2017-08-22 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| KR10-2017-0106047 | 2017-08-22 |
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| CN109423222B true CN109423222B (zh) | 2021-10-08 |
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| CN112825347B (zh) * | 2019-11-20 | 2024-04-16 | 利诺士尖端材料有限公司 | 有机电子装置用封装材料及包括其的有机电子装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160095851A (ko) * | 2015-02-04 | 2016-08-12 | 주식회사 엘지화학 | 점착제 조성물, 이의 제조 방법, 이를 포함하는 점착 필름 및 이를 이용한 유기전자장치의 제조방법 |
| CN109207071A (zh) * | 2017-07-06 | 2019-01-15 | 利诺士尖端材料有限公司 | 有机电子装置用粘结膜以及有机电子装置用封装材料 |
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| KR20060030718A (ko) | 2004-10-06 | 2006-04-11 | 에스케이씨 주식회사 | 유기발광 다이오드 표시 소자 및 이의 봉지 방법 |
| US20120128966A1 (en) * | 2009-08-04 | 2012-05-24 | Jingjing Ma | Non-halogenated polyisobutylene-thermoplastic elastomer blend pressure sensitive adhesives |
| JP6609439B2 (ja) * | 2014-08-29 | 2019-11-20 | 積水化学工業株式会社 | 硬化性組成物及び有機エレクトロルミネッセンス表示素子用封止剤 |
| US20170077440A1 (en) * | 2015-02-04 | 2017-03-16 | Lg Chem, Ltd. | Pressure-sensitive adhesive composition |
| KR101693797B1 (ko) | 2015-12-29 | 2017-01-09 | 주식회사 이녹스 | 유기전자장치 봉지재용 점착필름 및 이를 포함하는 봉지재 |
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| KR20160095851A (ko) * | 2015-02-04 | 2016-08-12 | 주식회사 엘지화학 | 점착제 조성물, 이의 제조 방법, 이를 포함하는 점착 필름 및 이를 이용한 유기전자장치의 제조방법 |
| CN109207071A (zh) * | 2017-07-06 | 2019-01-15 | 利诺士尖端材料有限公司 | 有机电子装置用粘结膜以及有机电子装置用封装材料 |
Non-Patent Citations (1)
| Title |
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| LED灌封胶研究进展;王秀彦等;《中国胶粘剂》;20140530;第23卷(第5期);第46-49页 * |
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| Publication number | Publication date |
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| KR101962195B1 (ko) | 2019-03-26 |
| KR20190021006A (ko) | 2019-03-05 |
| CN109423222A (zh) | 2019-03-05 |
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