CN109417116A - Led灯系统 - Google Patents
Led灯系统 Download PDFInfo
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Abstract
一种照明系统包含第一基板和其上具有所述第一基板的第二基板。发光二极管(LED)连接到所述第一基板。封装层覆盖所述LED和至少大部分所述第一基板。
Description
相关申请的交叉引用
本申请作为PCT国际专利申请于2017年7月7日申请,并且要求2016年7月8日申请的美国专利申请第62/360,001号的权益,所述美国专利申请的公开内容以全文引用的方式并入本文中。
背景技术
使用发光二极管(LED)作为光源的照明系统在许多照明应用中越来越流行。基于LED的灯具的一些应用包含必须避免电气和热异常以防爆炸或火灾危险的危险环境。
一些已知的LED灯具设计具有光学室,该光学室包含LED光源、次级光束成形折射光学器件、聚碳酸酯或玻璃盖、垫圈以及用于将光源附接和密封到灯具外壳的密封剂/粘合剂。具有许多不同的层增加了组装过程的复杂性。
发明内容
根据本公开的某些方面,一种照明系统包含第一基板,该第一基板具有连接到第一基板的表面的发光二极管(LED)。封装层直接接触并覆盖LED和第一基板的至少大部分表面。在一些实例中,第一基板是印刷电路板(PCB),其附接到第二基板,例如散热基板。封装层由诸如硅酮的弹性材料形成,并且封装可包含在其中模制的光学特性。
根据本公开的其它方面,一种制造灯具的方法包含在第一基板上设置LED,以及将第一基板附接到第二基板。将封装层包覆成型以覆盖LED和至少大部分第一基板。在一些实例中,封装层被夹持到第一基板,其中垫圈位于封装层和第二基板之间。包覆成型工艺可包含将模具定位在第一和第二基板上,以及将诸如硅酮的弹性材料注入由模具及第一和第二基板形成的空腔中。包覆成型工艺还可以包含在封装中形成光学特性。
附图说明
图1是示出根据本公开的各方面的LED系统的实例的示意性侧视图。
图2是示出根据本公开的各方面的实例LED灯具的侧视图。
图3是图2中所示的LED灯具的顶视图。
图4是图2和图3中所示的LED灯具中使用的实例LED系统的一部分的局部剖视图,包含不可分开模制的共同模制的光学器件和垫圈。
图5是示出用于制造诸如图1中所示的LED系统的过程的实例的流程图。
图6示出了适用于图5中所示的过程的外模。
具体实施方式
在下面的具体实施方式中参考附图,附图形成本发明的一部分,并且在附图中通过图示的方式示出了可以实践本发明的具体实例。应当理解,在不脱离本发明的范围的情况下,可以利用其它实例并且可以进行结构或逻辑上的改变。因此,以下详细描述不应被视为具有限制意义。
一些使用发光二极管(LED)作为光源的已知灯具包含LED光源、用于提供次级光束成形折射光学器件的透镜、聚碳酸酯或玻璃盖以及垫圈和密封剂/粘合剂。具有多个材料层的LED灯具可能是有问题的。例如,光必须折射的多个层——每个具有不同的折射率——可以导致系统中更高的折射损失。此外,这些多个层的制造公差会影响光分布图案并且还使组装变得复杂。更进一步地,在灯具的周边周围具有用于进入保护和限制性呼吸目的的不同材料层可能会增加密封垫圈上的疲劳,从而随着时间的推移,可能会削弱灯具的限制性呼吸性能。
在本文公开的一些实例中,次级光学器件和/或聚碳酸酯/玻璃盖被包含光学特性的弹性封装层代替。在一些实施例中,使用基于硅酮的光学层。将期望的光学图案(例如三维几何图案)模制到封装层中以实现期望的光学分布图案。封装层提供所需的表面接触,以最小化LED表面和封装的内表面之间的气隙。例如,封装层可以包含模制到封装层中的自由形式透镜设计,以产生如北美照明工程学会(IESNA)所定义的预定道路光分布图案。
光学封装层的设置使光学器件免受环境因素(如水和灰尘)的影响,因此不需要单独的玻璃或塑料盖。在一些实例中,使用基于硅酮的粘合剂将包含模制光学器件的封装材料附接到LED基板。封装材料可以是基于硅酮的材料,并且粘合剂满足灯具的限制性呼吸和进入保护要求。这可以显著减少灯具所需的部件数量,从而无需使用边框透镜、固定器、垫圈和相关紧固件等物品。
图1概念性地示出了根据本公开的各方面的LED系统100的各部分。LED系统100包含在基板112上的一个或多个LED 110。在一些实例中,基板112是LED基板,其可以包含印刷电路板(PCB)组件,该印刷电路板组件提供到LED 110和系统10的其它电子部件的必要电连接。基板112通常连接到散热装置。在其它实例中,基板112是散热基板,其具有LED 110和直接安装在其上的其它部件。
封装层120覆盖基板112的至少大部分顶表面,包含LED 110。图1中所示的封装层覆盖基板112的整个顶表面。在一些实例中,封装层120由诸如硅酮的弹性材料或诸如基于聚碳酸酯的变体的高抗冲击聚合物形成。弹性封装材料可以是透明的,或者可以弥漫或着色有着色剂。合适的硅酮物质的实例包含来自Henkel Corporation的Loctite5600Silicone、Loctite Superflex RTV和Loctite E-30CL双组分环氧树脂。在一些实施例中,封装层120包含光学特性,例如全内反射(TIR)光学特性。例如,硅酮封装材料可以模制成光学形状。此外,在一些实施方案中,可以将漫射材料添加到封装材料中,或者可以对封装120进行着色以修改光谱。更进一步地,外光学表面可以进行纹理化以漫射光并减少眩光。在一些实施方案中,通过在模制封装120中包含光学特性而不需要额外的透镜。
因此,不是仅在LED 110上设置光学层,而是封装层120直接接触并覆盖LED 110,以及基板112的未安装有LED的表面。以这种方式,封装层120直接在基板112和LED 110上提供邻接的盖子,保护系统100免受诸如冲击,腐蚀,潮湿等的元件的影响。
图2是侧视图,图3是示出并入有LED系统100的另一实例的实例灯具101的俯视图。所示出的灯具101包含附接到散热组件200的LED系统100,散热组件200具有从其延伸的多个散热片202。驱动器室210容纳驱动器组件,该驱动器组件包含用于灯具101的电源。LED110示出为在基板112上大致成行布置,但是LED可以采用任何图案来实现期望的光输出。
图4是沿图3的线IV-IV截取的特写局部剖视图,其示出了LED系统100的各方面。LED系统100包含在第一基板112上的LED 110的图案。在图4中所示的实施例中,第一基板112是LED基板,其可以包含印刷电路板(PCB)组件,该印刷电路板组件提供到LED 110和系统100的其它电子部件的必要电连接。LED基板112位于第二基板114上,第二基板114在所示实例中是散热基板。散热基板114包含中心毂118,中心毂118为诸如导线124的导体提供路由以从LED基板112延伸到驱动器室210。
封装层120覆盖LED基板112和散热基板114。如上所述,封装层120可以由硅酮形成。垫圈116围绕散热基板114的周边延伸,并且定位在散热基板114和封装层120之间。在图4所示的实例中,封装层120直接定位在LED基板112的表面上,并且完全覆盖LED基板112的表面,以及安装在基板112上的LED 110。因此,即使LED基板112的顶表面的一些部分未安装有LED 120,这些部分也被封装层120覆盖。因此,封装层用作防腐蚀和防潮的保护层,以保护LED系统100的整个上表面。在一些实例中,封装层120在LED 110和封装层120的内表面之间限定气隙122,而在其它实例中,在LED 110和封装层120之间没有气隙。
在图4所示的实例中,封装层还覆盖并密封中心毂118,以及导线124和穿过中心毂118延伸的其它部件。在一些实施例中,这消除了对中心毂118的单独密封的需要。封装层120还覆盖由LED基板112和/或散热基板114支撑的连接器、导线和其它部件。以这种方式,诸如并不容易安装到基板112、114上的那些“松散”部件(天线、传感器、导线等)嵌入到封装层120中以将这些部件固定在适当位置并保护它们免受外部元件的影响。
在一些实施方案中,LED基板112和散热基板114中的一者或两者包含诸如凹槽的特征,以促进诸如硅酮的密封剂的流动,从而帮助将封装层结合到LED基板112和/或散热基板114上。图4中所示的LED系统100包含从封装层120延伸的一个或多个锁定突片130。锁定开口132由第二基板114限定,并接收锁定突片130以将封装层120固定在第一基板112和第二基板114上。在一些实施例中,封装层114,更具体地说,锁定突片130具有与垫圈116的硬度不同的硬度。例如,锁定突片114的硬度可以高于垫圈116的硬度,使得锁定突片130具有将封装层牢固地保持在适当位置所需的强度,而较软的垫圈116可以令人满意地变形以执行其密封功能。在一些实施方案中,锁定突片130的硬度是垫圈116的材料的硬度的1.5至2倍。例如,封装层120的材料具有约60-90的硬度,而垫圈116的材料具有约40-50的硬度。
封装120可以通过不同的工艺制造。例如,在一些实施方案中,封装120通过模制工艺形成,其中包含任何光学特性的封装120以及锁定突片130使用具有闭合模具的注射成型工艺一体地形成。一旦形成封装120和锁定突片130,锁定突片130就被力压入形成在散热基板114和/或LED基板112中的锁定开口132中。在这样的实施例中,具有较低硬度的垫圈116与具有较高硬度的材料共同模制,从而形成封装120和锁定突片130。可以采用诸如夹具140和螺栓142的夹持硬件来确保基板112、114、垫圈116和封装120之间的充分接触。
在下面进一步讨论的一些实施例中,封装层120直接包覆成型在第一基板112上,从而对消除对垫圈116和夹持硬件140、142的需要。在其它实施例中,垫圈116与封装120分开形成,并且在封装被夹持到散热基板114之前定位在散热基板114的周边周围。
在又其它实例中,使用包覆成型工艺形成封装120和锁定突片130。LED基板112和散热基板114进行预组装并用作用于形成封装120、116和锁定突片130的模具的底部。包含任何所需光学特性的模具的上半部分抵靠预组装的部件密封,从而形成空腔,硅酮或其它材料注入到该空腔中以形成弹性部件。LED基板112和/或散热基板114可以包含诸如凹槽或其它开口的特征,以便使封装材料流动并将基板112、114彼此结合。
图5是示出制造LED灯具的方法300的实例的流程图。在图5的框310中,提供第一基板(诸如图1中所示的LED基板112),LED和其它部件及导体附接到所述第一基板。在框312中,将第一基板放置在第二基板(诸如散热基板114)附近。在框320中,模制并定位封装层(诸如封装120)以覆盖LED和至少大部分第一基板。在图4所示的实例中,垫圈116可以与封装层共同模制,并且定位成围绕在第一基板的周边。在封装进行包覆成型的实施例中,封装层直接模制到第一基板上,从而消除了对垫圈的需要,因为可以通过封装材料和基板之间的结合来实现密封。
图6示出了适于形成封装120的外模150的实例。将外模150放置在预组装的第一基板112和第二基板114上,并且将诸如硅酮的封装材料126注入由外模150和基板112、114形成的模具中。外模150可以包含导致所形成的封装120具有光学特征的特征,所述光学特征被配置成通过折射来使来自LED 110的光成形。在一些实施例中,除LED 120之外,外模150被配置成使得封装材料还流过并封装其它部件,例如导线124和延伸穿过中心毂118的其它导体和连接器,从而根据需要实现限制性呼吸。在一些实施例中,这消除了单独密封中心毂118的需要,例如通过另一种灌封化合物。
当封装材料在注射成型过程中流入锁定开口132时,图4中所示的锁定突片130形成。可以加热模具154以实现封装材料的更好的流动性,从而使得LED110和模具之间的98-99%的体积填充有封装材料。在一些实施例中,还提供夹持装置140、142以进一步将封装材料连接到基板112、114。
在图6所示的实例中,外模包含几何和体积特征152,几何和体积特征152控制来自LED 110的发射以折射并形成期望的分布图案。模具150还成形成改变封装层120的厚度以产生所需的次级光学器件。例如,封装层120的直接定位在相应LED 110上方和周围的部分154限定了在基板112上方延伸的不同厚度。如图6所示,模具150形成为使得封装层120的部分154具有在基板112上方延伸第一距离D1的一个厚度,和在基板上方延伸第二距离D2的另一厚度。此外,如果在基板112上没有LED 110,例如图6中所示的区域156,则封装层120在封装基板112的表面的部分的区域中限定第三厚度。形成在封装120的区域156中的封装120的厚度由基板上方的第三距离D3限定,该距离D3小于距离D1和D2。因此,封装120限定了各种厚度,并且在图6所示的实例中,封装120在封装LED 110的区域中具有更大的厚度。通过形成这些不同的几何形状可以改变材料内的光的入射角和路径长度,以实现不同的光分布图案。
以上说明内容、实施例和数据提供了本发明的组合物的制造和使用的完整描述。由于可以在不脱离本发明的精神和范围的情况下做出本发明的许多实施例,因此本发明存在于所附的权利要求中。
Claims (15)
1.一种照明系统,包括:
第一基板;
发光二极管(LED),其连接到所述第一基板的表面;和
弹性封装层,其覆盖并直接接触所述LED和所述第一基板的至少大部分表面。
2.根据权利要求1所述的系统,还包括垫圈,所述垫圈围绕所述封装层的周边延伸,并定位在所述第一基板和所述封装层之间。
3.根据权利要求1所述的系统,其中所述第一基板是印刷电路板(PCB)和散热基板中的一个。
4.根据权利要求1所述的系统,还包括:
第二基板,其上具有所述第一基板;
其中所述第二基板是散热基板。
5.根据权利要求1所述的系统,其中所述封装层包含TIR光学器件。
6.根据权利要求1所述的系统,还包括:
从所述封装层延伸的锁定突片;和
锁定开口,其由所述第二基板限定并接收所述锁定突片,其中所述封装层具有第一硬度,并且所述锁定突片具有第二硬度,所述第二硬度比所述第一硬度高至少1.5倍。
7.根据权利要求1所述的系统,其中所述封装层限定所述LED和所述封装层的内表面之间的气隙。
8.根据权利要求1所述的系统,其中在所述LED上没有透镜。
9.根据权利要求2所述的系统,其中所述垫圈与所述封装层一体地形成。
10.根据权利要求1所述的系统,其中所述封装覆盖所述第一基板的整个表面。
11.根据权利要求1所述的系统,其中所述封装在覆盖所述LED的第一区域中具有第一厚度,并且在覆盖所述表面的不具有LED的一部分的第二区域中具有第二厚度,其中所述第一厚度大于所述第二厚度。
12.根据权利要求1所述的系统,其中所述封装在覆盖所述LED的第一区域中具有第一厚度,并且在覆盖所述LED的第二区域中具有第二厚度,其中所述第一厚度大于所述第二厚度。
13.一种制造灯具的方法,包括:
在第一基板上设置LED;
将覆盖所述LED和至少大部分所述第一基板的封装层包覆成型。
14.根据权利要求13所述的方法,还包括:所述第一衬底附接到第二衬底。
15.根据权利要求13所述的方法,其中将所述封装层包覆成型包含:
将模具定位在所述第一基板上;和
将硅酮注入由所述模具和所述第一基板形成的空腔中。
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US20180066815A1 (en) * | 2015-03-13 | 2018-03-08 | Hangzhou Hpwinner Opto Corporation | Light Emitting Diode Lighting Device And Assembly Method Thereof |
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CA3030017A1 (en) | 2018-01-11 |
EP3482422A4 (en) | 2020-04-01 |
CN109417116B (zh) | 2021-11-30 |
MX2018016024A (es) | 2019-05-13 |
EP3482422B1 (en) | 2022-11-16 |
WO2018009792A1 (en) | 2018-01-11 |
US10854796B2 (en) | 2020-12-01 |
US20180013041A1 (en) | 2018-01-11 |
EP3482422A1 (en) | 2019-05-15 |
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