CN109397056A - A kind of cutting method and its scribing machine of chip wafer - Google Patents
A kind of cutting method and its scribing machine of chip wafer Download PDFInfo
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- CN109397056A CN109397056A CN201811568006.3A CN201811568006A CN109397056A CN 109397056 A CN109397056 A CN 109397056A CN 201811568006 A CN201811568006 A CN 201811568006A CN 109397056 A CN109397056 A CN 109397056A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 35
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 51
- 230000008878 coupling Effects 0.000 claims description 18
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 239000000835 fiber Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 229910001651 emery Inorganic materials 0.000 claims description 3
- 238000005188 flotation Methods 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 238000003698 laser cutting Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000009172 bursting Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of cutting method of chip wafer and its scribing machine, which forms the cutting track to lower recess on the chip wafer surface specifically, be irradiated using infrared laser along the cutting preset lines of chip wafer；Grinding wheel is cut along the cutting track, the scribing machine can realize above-mentioned cutting process, the cutting method of chip wafer provided by the invention, have method simple, easily operated, and cut quality is good, it is high in machining efficiency the advantages that.
Description
Technical field
The present invention disclose be related to chip wafer processing technical field more particularly to a kind of chip wafer cutting method and
Its scribing machine.
Background technique
Chip wafer is the basic material for manufacturing semiconductor chip, can be processed on chip wafer and is fabricated to various circuit elements
Part structure, and become the IC product for having specific electrical functionality.
Currently, the cutting mode of chip wafer is broadly divided into two kinds, one is being cut using skive piece, separately
One is using laser cutting.But using skive piece cut when, skive piece protrusion of surface it is sharp, high
Hardness particles of silicon carbide can carry out shovel digging to chip wafer cutting part, which digs formula mechanical force and act directly on chip wafer surface
When, stress damage can be caused to chip wafer inside, lead to that in cutting process surface occurs for chip wafer and the back side is burst apart, deposited
In the low problem of yield rate.It is to irradiate workpiece using the high power density laser beam of line focus due to being cut by laser, makes illuminated
Material melt rapidly, vaporize, ablation or reaching burning point, realization cuts open workpiece, exists although chip wafer effectively can be solved
The problem of bursting apart in cutting process, but heat affected area can be generated when laser cutting, the slag of laser will lead to chip wafer
There is secondary pollution in surface.
Therefore, a kind of novel chip wafer cutting method how is researched and developed, to solve finished product existing for existing cutting method
Rate is low, chip wafer surface is by secondary pollution problems, becomes people's urgent problem to be solved.
Summary of the invention
In consideration of it, the present invention provides a kind of cutting method of chip wafer and its scribing machine, at least to solve using skill
In art, chip wafer cutting is carried out using grinding wheel, is easy to happen and bursts apart, there is a problem of that yield rate is low, and uses laser
Cutting, due to the presence of slag, leads to secondary pollution problems.
One aspect of the present invention provides a kind of cutting method of chip wafer, and this method comprises the following steps:
1) it is irradiated using infrared laser along the cutting preset lines of chip wafer, in chip wafer surface shape
At the cutting track to lower recess；
2) grinding wheel is cut along the cutting track.
It is preferred that the wavelength of the infrared laser is 200~1064 nanometers.
Further preferably, the power of the infrared laser is 6~20w.
Further preferably, spot diameter 40um~50um of the infrared laser irradiation.
Further preferably, the infrared laser vertical irradiation is in the cutting preset lines of the chip wafer.
Another aspect of the present invention additionally provides a kind of scribing machine, which is suitable for above-mentioned cutting method, comprising: base
Seat 1, X-axis driving assembly 2, carrying chip operation platform 3, Y-axis driving assembly 4, Z axis driving assembly 5, cutter device 6 and control
Platform；
The pedestal 1 is used for the integrated support of the scribing machine；
The X-axis driving assembly 2 includes: X-axis pedestal 21, X-axis guide rail 22, X-axis driving motor 23, X-axis shaft coupling 24, X
Axial filament thick stick 25 and X-axis slide carriage 26；
The X-axis pedestal 21 is fixedly installed on the pedestal 1；
The X-axis guide rail 22 and X-axis driving motor 23 are fixedly installed on the X-axis pedestal 21；
The power output end of the X-axis driving motor 23 is connected by the X-axis shaft coupling 24 and the X-axis lead screw 25 driving
It connects；
The two sides of the X-axis slide carriage 26 are provided with guide rail slide block 261, and lower surface is provided with silk braid, 26 liang of the X-axis slide carriage
The guide rail slide block 261 of side is engaged with the X-axis guide rail 22 sliding, and the silk braid is set in the outside of the X-axis lead screw 25；
The carrying chip operation platform 3 is fixedly installed on the X-axis slide carriage 26；
The Y-axis driving assembly 4 include: Y-axis pedestal, Y-axis guide rail, Y-axis driving motor, Y-axis shaft coupling, Y-axis lead screw with
And Y-axis slide carriage；
The Y-axis pedestal is fixedly installed on the pedestal 1, and the relatively described X-axis pedestal 21 is vertically arranged；
The Y-axis guide rail and Y-axis driving motor are fixedly installed on the Y-axis pedestal；
The power output end of the Y-axis driving motor is drivingly connected by the Y-axis shaft coupling and the Y-axis lead screw；
The two sides of the Y-axis slide carriage are provided with guide rail slide block, and lower surface is provided with silk braid, and Y-axis slide carriage two sides are led
Rail sliding block is engaged with Y-axis guide rail sliding, and the silk braid is set in the outside of the Y-axis lead screw；
The Z axis driving assembly 5 include: Z axis pedestal, Z axis guide rail, Z axis driving motor, Z axis shaft coupling, Z axis lead screw with
And Z axis slide carriage；
The Z axis pedestal is fixedly installed on the Y-axis slide carriage, and the relatively described Y-axis pedestal is vertically arranged；
The Z axis guide rail and Z axis driving motor are fixedly installed on the Z axis pedestal；
The power output end of the Z axis driving motor is drivingly connected by the Z axis shaft coupling and the Z axis lead screw；
The two sides of the Z axis slide carriage are provided with guide rail slide block, and lower surface is provided with silk braid, and Z axis slide carriage two sides are led
Rail sliding block is engaged with Z axis guide rail sliding, and the silk braid is set in the outside of the Z axis lead screw；
The cutter device 6 includes that sand-wheel cutting apparatus 61 and infrared laser cutter device 62, the sand is arranged in parallel
Wheel cutter device 61 and the infrared laser cutter device 62 all have fixing end and cut end, the sand-wheel cutting apparatus 61
Fixing end and the fixing end of the infrared laser cutter device 62 are fixedly connected with the Z axis slide carriage, the emery wheel cuts dress
It sets 61 cut end and the cut end of the infrared laser cutter device 62 is respectively positioned on the top of the carrying chip operation platform 3,
And the laser spot of the infrared laser cutter device 62 and the point of penetration of the sand-wheel cutting apparatus 61 are point-blank；
The console drives with the X-axis driving motor 23, carrying chip operation platform 2, Y-axis driving motor, Z axis respectively
Motor, abrasive cut-off wheel device 61 and the connection of 62 signal of infrared laser cutter device.
It is preferred that the sand-wheel cutting apparatus 61 includes main shaft frame, main shaft and grinding wheel；
The main shaft is air-flotation type static pressure electric main shaft；
Main shaft frame one end is fixedly connected with the Z axis slide carriage, and the other end is fixedly connected with the main shaft；
The grinding wheel is fixedly connected with the shaft in the main shaft.
Further preferably, the infrared laser cutter device 62 includes: laser fiber head 621, lens barrel 622, beam expanding lens
623, reflecting mirror 624 and focus lamp 625；
The laser fiber head 621 is used for the transmission and transmitting of laser；
The lens barrel 622 is arranged along the Laser emission direction of the laser fiber head 621；
The beam expanding lens 623, reflecting mirror 624 and focus lamp 625 are set gradually along the direction of propagation of laser, and equal position
In in the lens barrel 622；
The reflecting mirror 624 is 45 ° of reflecting mirrors.
Further preferably, the infrared laser cutter device 62 further include: adjust slide unit 626, the adjustings slide unit 626 and
The lens barrel 622 is fixedly connected.
Further preferably, the carrying chip operation platform 2 uses vacuum absorption device.
The cutting method of chip wafer provided by the invention, is put forward for the first time and is combined laser and grinding wheel, and then complete
At the cutting operation of chip wafer.Specifically, being carried out first using infrared laser along the cutting preset lines of chip wafer
Irradiation macroscopically forms the cutting track to lower recess on chip wafer surface, it is microcosmic on, due to the irradiation of infrared laser, make
Crystal phase tissue and stress inside chip wafer irradiated region are changed, so that the region is changed by elastic deformation characteristic
Chip wafer is cut by infrared laser and has carried out performance change at preset lines, then uses grinding wheel again by plastic deformation characteristic
Piece is cut, and not but not generates bursting apart for large area, and edge of a knife width narrows, the feed speed of chip wafer obtains bright
It is aobvious to be promoted.When both having avoided traditional single laser cutting by above-mentioned cutting method, the generation of heat affected area phenomenon is burnt, and solve
When single grinding wheel is cut, to the stress damage that chip wafer generates, the problem of bursting apart is caused.Chip wafer provided by the invention
Cutting method, have method simple, it is easily operated, and cut quality is good, it is high in machining efficiency the advantages that.
Sand-wheel cutting apparatus and infrared laser are organically combined, realize above-mentioned novel crystal by scribing machine provided by the invention
The advantages that cutting method of round core piece, the scribing machine have structure simple, and design is reasonable, easy to use.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example, and be used to explain the principle of the present invention together with specification.
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, for those of ordinary skill in the art
Speech, without creative efforts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram that the present invention discloses a kind of scribing machine that embodiment provides；
Fig. 2 is the structural schematic diagram that the present invention discloses X-axis driving assembly in a kind of scribing machine that embodiment provides；
Fig. 3 is the structural schematic diagram that the present invention discloses a kind of scribing machine mid-infrared laser cutter device that embodiment provides；
Fig. 4 is sectional view of the Fig. 3 along AA.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistented with the present invention.On the contrary, they be only with it is such as appended
The example of device and method being described in detail in claims, some aspects of the invention are consistent.
In view of in the prior art, if individually carry out the cutting of chip wafer using grinding wheel, since grinding wheel is cut
When mechanical force can cause stress damage to the crystal phase tissue inside chip wafer, lead to bursting apart for chip wafer, cause to cut
Yield rate is low；If individually carry out the cutting of chip wafer using laser, due to laser meeting around the irradiation of chip wafer
Heat affected area is generated, slag when laser cutting can be attached to the surface of chip wafer, cause the secondary pollution of chip wafer.For
This, inventor expects and attempts for the first time, and grinding wheel cutting technique is combined with laser cutting technique, forms new chip wafer
Cutting method, realize the mutual supplement with each other's advantages of two cutting techniques, and then improve the cut quality of chip wafer.
Specifically, the cutting method that the present embodiment provides specifically comprises the following steps:
1) be irradiated along the cutting preset lines of chip wafer using infrared laser, chip wafer surface formed to
The cutting track of lower recess；
2) grinding wheel is cut along the cutting track.
Wherein, for the wavelength of the infrared laser used for 200~1064 nanometers, power is 6~20w, and the hot spot of irradiation is straight
Diameter 40um~50um.
In order to improve cutting effect, as the improvement of technical solution, by infrared laser vertical irradiation in chip wafer
It cuts in preset lines.
Above-mentioned cutting method can be adapted for silicon, germanium silicon, any one chip wafer in GaAs, SiC and InP.
In order to realize above-mentioned cutting method, inventor has developed a kind of scribing machine for being exclusively used in above-mentioned cutting method, referring to
Fig. 1, the scribing machine is mainly by pedestal 1, X-axis driving assembly 2, carrying chip operation platform 3, Y-axis driving assembly 4, Z axis driving assembly
5, cutter device 6 and console are constituted, wherein pedestal 1 is used for the integrated support of scribing machine, and X-axis driving assembly 2 can drive and hold
It carries chip operation platform 3 to be moved left and right along pedestal 1, Y-axis driving assembly 4 can drive Z axis driving assembly 5 and cutter device
6 are moved forward and backward along pedestal 1, and Z axis driving assembly 5 can drive 6 opposite base 1 of cutter device to move up and down.
It is referring to fig. 2 the concrete structure diagram of X-axis driving assembly 2, which is mainly led by X-axis pedestal 21, X-axis
Rail 22, X-axis driving motor 23, X-axis shaft coupling 24, X-axis lead screw 25 and X-axis slide carriage 26 are constituted, and X-axis pedestal 21 is fixedly installed in
On pedestal 1, X-axis guide rail 22 and X-axis driving motor 23 are fixedly installed on X-axis pedestal 21, the power of X-axis driving motor 23
Output end is drivingly connected by X-axis shaft coupling 24 and X-axis lead screw 25, and the two sides of X-axis slide carriage 26 are provided with guide rail slide block 261, under
Surface is provided with silk braid, and the guide rail slide block 261 of 26 two sides of X-axis slide carriage is engaged with the sliding of X-axis guide rail 22, and silk braid is set in X-axis silk
The outside of thick stick 25 carries chip operation platform 3 and is fixedly installed on X-axis slide carriage 26 referring to Fig. 1.
The specific work process of above-mentioned X-axis driving assembly 2 are as follows: starting X-axis driving motor 23 is rotated, and is joined by X-axis
The connection of joint 24 drives X-axis lead screw 25 to synchronize rotation, since the lower surface silk braid of X-axis slide carriage 26 is set in X-axis lead screw
25 outside, and the guide rail slide block 261 of two sides is engaged with X-axis guide rail 22, therefore when X-axis lead screw 25 is rotated, can drive X
Axis slide carriage 26 moves along a straight line along X-axis guide rail 22, so that carrying chip operation platform 3 be driven to be moved, wherein specific
Moving direction is determined by rotating forward, the reversion of X-axis driving motor.
Composition and working principle for Y-axis driving assembly 4 and Z axis driving assembly 5 is identical as X-axis driving assembly 2, because
This, in the present embodiment, explains and worked with regard to Y-axis driving assembly 4 and Z axis driving assembly 5 are no longer carried out diagram one by one
Journey explanation carries out explanatory note only for structure.It is specific as follows:
Y-axis driving assembly 4 is mainly by Y-axis pedestal, Y-axis guide rail, Y-axis driving motor, Y-axis shaft coupling, Y-axis lead screw and Y
Axis slide carriage is constituted, and Y-axis pedestal is fixedly installed on pedestal 1, and opposite X-axis pedestal 21 is vertically arranged.Y-axis guide rail and Y-axis are driven
Dynamic motor is fixedly installed on Y-axis pedestal, and the power output end of Y-axis driving motor is driven by Y-axis shaft coupling and Y-axis lead screw
Connection, the two sides of Y-axis slide carriage are provided with guide rail slide block, and lower surface is provided with silk braid, the guide rail slide block and Y-axis of Y-axis slide carriage two sides
Guide rail sliding occlusion, silk braid are set in the outside of Y-axis lead screw.
Z axis driving assembly 5 is mainly by Z axis pedestal, Z axis guide rail, Z axis driving motor, Z axis shaft coupling, Z axis lead screw and Z
Axis slide carriage is constituted, and Z axis pedestal is fixedly installed on Y-axis slide carriage, and opposite Y-axis pedestal is vertically arranged, and Z axis guide rail and Z axis drive
Dynamic motor is fixedly installed on Z axis pedestal, and the power output end of Z axis driving motor is driven by Z axis shaft coupling and Z axis lead screw
Connection, the two sides of Z axis slide carriage are provided with guide rail slide block, and lower surface is provided with silk braid, the guide rail slide block and Z axis of Z axis slide carriage two sides
Guide rail sliding occlusion, silk braid are set in the outside of Z axis lead screw.
Referring to Fig. 1, the cutter device 6 in scribing machine includes that sand-wheel cutting apparatus 61 and infrared laser cutting is arranged in parallel
Device 62, wherein sand-wheel cutting apparatus 61 and infrared laser cutter device 62 all have fixing end and cut end, emery wheel cuts dress
It sets 61 fixing end and the fixing end of infrared laser cutter device 62 is fixedly connected with Z axis slide carriage, sand-wheel cutting apparatus 61
Cut end and the cut end of infrared laser cutter device 62 are respectively positioned on the top of carrying chip operation platform 3, and infrared laser is cut
The laser spot of device 62 and the point of penetration of sand-wheel cutting apparatus 61 point-blank, console respectively with X-axis driving motor
23, chip operation platform 2, Y-axis driving motor, Z axis driving motor, abrasive cut-off wheel device 61 and infrared laser cutter device are carried
The connection of 62 signals.
Any structure can be used in above-mentioned sand-wheel cutting apparatus 61 and infrared laser cutter device 62, as long as its cutting can be realized
Function, the sand-wheel cutting apparatus 61 selected in the present embodiment are mainly made of main shaft frame, main shaft and grinding wheel,
In, main shaft is air-flotation type static pressure electric main shaft, and main shaft frame one end is fixedly connected with Z axis slide carriage, the other end and the fixed company of the main shaft
It connects, grinding wheel is fixedly connected with the shaft in main shaft.
The infrared laser cutter device 62 selected in the present embodiment, referring to fig. 4, mainly by laser fiber head 621, lens barrel
622, beam expanding lens 623, reflecting mirror 624 and focus lamp 625 are constituted, wherein transmission and hair of the laser fiber head 621 for laser
It penetrates, lens barrel 622 is arranged along the Laser emission direction of laser fiber head 621, beam expanding lens 623, reflecting mirror 624 and focus lamp
625 set gradually along the direction of propagation of laser, and are respectively positioned in the lens barrel 622, and reflecting mirror 624 is 45 ° of reflecting mirrors.This is red
The laser of outer laser cutting device is transmitted in lens barrel by optical fiber by optical fiber head, is expanded by beam expanding lens, is rolled over by 45 ° of reflecting mirrors
It penetrates, is focused on by focus lamp and realize cutting on wafer.
For ease of use, it is provided in the infrared laser cutter device as the improvement of technical solution referring to Fig. 3
Slide unit 626 is adjusted, which is fixedly connected with lens barrel 622, is adjusted by adjusting slide unit and realizes that infrared laser is cut
Cut the movement of focus in device 62.
In order to improve carrying chip operation platform 2 stability fixed to chip wafer, the preferably carrying chip operation platform 2 is adopted
Use vacuum absorption device.
The course of work of above-mentioned scribing machine specifically: chip wafer is fixed on carrying chip by vacuum absorption device
On workbench, which drives opposite X-axis guide rail to slide by X-axis driving motor, feeds from nearly motor side to far from motor side
Chip wafer, chip wafer are first irradiated by the laser that infrared laser generates, then by the grinding wheel in sand-wheel cutting apparatus
It is cut, after cutting, carrying chip operation platform is driven by X-axis driving motor, fast to nearly motor side from separate motor side
Speed returns, while Z axis driving motor drives infrared laser and sand-wheel cutting apparatus to be lifted up, and is driven by Y-axis driving motor
Infrared laser and sand-wheel cutting apparatus while a mobile step pitch, then infrared laser and grinding wheel are driven by Z axis driving motor
Cutter device returns to downwards cutting position, at this moment carries chip operation platform and is driven by X-axis driving motor, from nearly motor side to separate
Motor side feeds chip wafer, and entire cutting process repeats above procedure.
In actual experimentation, inventor uses the cutting of the sand-wheel slice cutting machine progress chip wafer of 35 μ thickness first,
The edge of a knife width that cutting is formed is 47 μ, and most fast feeding rate is 20mm/s.
Then inventor uses above-mentioned scribing machine again and cuts, and wherein grinding wheel is equally 35 μ thickness, right after cutting
The edge of a knife measures, and edge of a knife width is 37 μ, therefore, removes the thickness of grinding wheel itself, edge of a knife width is reduced by 12 original μ
To 2 μ, under same cut quality, most fast feeding rate can reach 80mm/s.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to of the invention its
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the invention, these modifications, purposes or
Person's adaptive change follows general principle of the invention and including the undocumented common knowledge in the art of the present invention
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are wanted by right
It asks and points out.
It should be understood that the present invention is not limited to the precise structure already described above and shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.
Claims (10)
1. a kind of cutting method of chip wafer, which comprises the steps of:
1) be irradiated along the cutting preset lines of chip wafer using infrared laser, the chip wafer surface formed to
The cutting track of lower recess；
2) grinding wheel is cut along the cutting track.
2. the cutting method of chip wafer according to claim 1, which is characterized in that the wavelength of the infrared laser is
200~1064 nanometers.
3. the cutting method of chip wafer according to claim 1, which is characterized in that the power of the infrared laser is 6
~20w.
4. the cutting method of chip wafer according to claim 1, which is characterized in that the hot spot of the infrared laser irradiation
Diameter 40um~50um.
5. the cutting method of chip wafer according to claim 1, which is characterized in that the infrared laser vertical irradiation in
In the cutting preset lines of the chip wafer.
6. a kind of scribing machine, suitable for cutting method described in Claims 1 to 4 characterized by comprising pedestal (1), X-axis
Driving assembly (2), carrying chip operation platform (3), Y-axis driving assembly (4), Z axis driving assembly (5), cutter device (6) and control
Platform processed；
The pedestal (1) is used for the integrated support of the scribing machine；
The X-axis driving assembly (2) includes: X-axis pedestal (21), X-axis guide rail (22), X-axis driving motor (23), X-axis shaft coupling
(24), X-axis lead screw (25) and X-axis slide carriage (26)；
The X-axis pedestal (21) is fixedly installed on the pedestal (1)；
The X-axis guide rail (22) and X-axis driving motor (23) are fixedly installed on the X-axis pedestal (21)；
The power output end of the X-axis driving motor (23) is driven by the X-axis shaft coupling (24) and the X-axis lead screw (25)
Connection；
The two sides of the X-axis slide carriage (26) are provided with guide rail slide block (261), and lower surface is provided with silk braid, the X-axis slide carriage (26)
The guide rail slide block (261) of two sides is engaged with the X-axis guide rail (22) sliding, and the silk braid is set in the X-axis lead screw (25)
It is external；
The carrying chip operation platform (3) is fixedly installed on the X-axis slide carriage (26)；
The Y-axis driving assembly (4) includes: Y-axis pedestal, Y-axis guide rail, Y-axis driving motor, Y-axis shaft coupling, Y-axis lead screw and Y
Axis slide carriage；
The Y-axis pedestal is fixedly installed on the pedestal (1), and the relatively described X-axis pedestal (21) is vertically arranged；
The Y-axis guide rail and Y-axis driving motor are fixedly installed on the Y-axis pedestal；
The power output end of the Y-axis driving motor is drivingly connected by the Y-axis shaft coupling and the Y-axis lead screw；
The two sides of the Y-axis slide carriage are provided with guide rail slide block, and lower surface is provided with silk braid, and the guide rail of Y-axis slide carriage two sides is sliding
Block is engaged with Y-axis guide rail sliding, and the silk braid is set in the outside of the Y-axis lead screw；
The Z axis driving assembly (5) includes: Z axis pedestal, Z axis guide rail, Z axis driving motor, Z axis shaft coupling, Z axis lead screw and Z
Axis slide carriage；
The Z axis pedestal is fixedly installed on the Y-axis slide carriage, and the relatively described Y-axis pedestal is vertically arranged；
The Z axis guide rail and Z axis driving motor are fixedly installed on the Z axis pedestal；
The power output end of the Z axis driving motor is drivingly connected by the Z axis shaft coupling and the Z axis lead screw；
The two sides of the Z axis slide carriage are provided with guide rail slide block, and lower surface is provided with silk braid, and the guide rail of Z axis slide carriage two sides is sliding
Block is engaged with Z axis guide rail sliding, and the silk braid is set in the outside of the Z axis lead screw；
The cutter device (6) includes that sand-wheel cutting apparatus (61) and infrared laser cutter device (62) is arranged in parallel, described
Sand-wheel cutting apparatus (61) and the infrared laser cutter device (62) all have fixing end and cut end, the emery wheel cuts dress
The fixing end of the fixing end and the infrared laser cutter device (62) of setting (61) is fixedly connected with the Z axis slide carriage, described
The cut end of sand-wheel cutting apparatus (61) and the cut end of the infrared laser cutter device (62) are respectively positioned on the carrying chip
The top of workbench (3), and the laser spot of the infrared laser cutter device (62) and the sand-wheel cutting apparatus (61)
Point of penetration is point-blank；
The console drives with the X-axis driving motor (23), carrying chip operation platform (2), Y-axis driving motor, Z axis respectively
Motor, abrasive cut-off wheel device (61) and the connection of infrared laser cutter device (62) signal.
7. scribing machine according to claim 6, which is characterized in that the sand-wheel cutting apparatus (61) includes main shaft frame, main shaft
And grinding wheel；
The main shaft is air-flotation type static pressure electric main shaft；
Main shaft frame one end is fixedly connected with the Z axis slide carriage, and the other end is fixedly connected with the main shaft；
The grinding wheel is fixedly connected with the shaft in the main shaft.
8. scribing machine according to claim 6, which is characterized in that the infrared laser cutter device (62) includes: laser light
Fine head (621), lens barrel (622), beam expanding lens (623), reflecting mirror (624) and focus lamp (625)；
The laser fiber head (621) is used for the transmission and transmitting of laser；
The lens barrel (622) is arranged along the Laser emission direction of the laser fiber head (621)；
The beam expanding lens (623), reflecting mirror (624) and focus lamp (625) are set gradually along the direction of propagation of laser, and
In the lens barrel (622)；
The reflecting mirror (624) is 45 ° of reflecting mirrors.
9. scribing machine according to claim 8, which is characterized in that the infrared laser cutter device (62) further include: adjust
Slide unit (626), the adjusting slide unit (626) are fixedly connected with the lens barrel (622).
10. scribing machine according to claim 6, which is characterized in that the carrying chip operation platform (2) is filled using vacuum suction
It sets.
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| CN201811568006.3A CN109397056A (en) | 2018-12-21 | 2018-12-21 | A kind of cutting method and its scribing machine of chip wafer |
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| CN201811568006.3A CN109397056A (en) | 2018-12-21 | 2018-12-21 | A kind of cutting method and its scribing machine of chip wafer |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110560929A (en) * | 2019-09-06 | 2019-12-13 | 大同新成新材料股份有限公司 | silicon wafer cutting method and cutting device |
| CN110682007A (en) * | 2019-09-11 | 2020-01-14 | 芜湖德锐电子技术有限公司 | Cutting device for chip processing |
| CN112078036A (en) * | 2020-07-08 | 2020-12-15 | 大同新成新材料股份有限公司 | Cutting equipment for processing semiconductor graphite round crystal and cutting method thereof |
| CN112276564A (en) * | 2020-10-12 | 2021-01-29 | 重庆工商大学 | Laser cutting device capable of deburring automobile exhaust elbow |
| CN112318337A (en) * | 2019-12-20 | 2021-02-05 | 沈阳和研科技有限公司 | Method for cutting glass with warping deformation by using grinding wheel scribing machine |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060169680A1 (en) * | 2005-02-03 | 2006-08-03 | Stats Chippac Ltd. | Integrated, integrated circuit singulation system |
| CN2868594Y (en) * | 2005-11-22 | 2007-02-14 | 沈阳仪表科学研究院 | Solar cell substrate cutting machine |
| CN102248309A (en) * | 2010-05-17 | 2011-11-23 | 苏州天弘激光股份有限公司 | Wafer laser dicing method and wafer laser dicing equipment with charge coupled device (CCD) assisting in positioning |
| CN104377280A (en) * | 2014-11-14 | 2015-02-25 | 江苏鑫博电子科技有限公司 | Method for manufacturing groove structure in substrate wafer |
| CN204748023U (en) * | 2015-06-25 | 2015-11-11 | 马维虎 | Metal tool bit mixes sculpture cutting machine with laser tool bit |
| JP2016164908A (en) * | 2015-03-06 | 2016-09-08 | 株式会社ディスコ | Method of manufacturing optical device chip |
| CN106469679A (en) * | 2015-08-18 | 2017-03-01 | 株式会社迪思科 | The processing method of chip |
| CN106799613A (en) * | 2016-12-29 | 2017-06-06 | 大族激光科技产业集团股份有限公司 | A kind of processing method of laser composite manufacture device and complex parts |
| CN107538136A (en) * | 2017-07-31 | 2018-01-05 | 山东浪潮华光光电子股份有限公司 | It is a kind of to utilize the method for being cut by laser sapphire substrate LED chip |
| CN108044355A (en) * | 2017-12-22 | 2018-05-18 | 沈阳芯嘉科技有限公司 | A kind of laser sand-wheel slice cutting machine and composite material cutting method |
-
2018
- 2018-12-21 CN CN201811568006.3A patent/CN109397056A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060169680A1 (en) * | 2005-02-03 | 2006-08-03 | Stats Chippac Ltd. | Integrated, integrated circuit singulation system |
| CN2868594Y (en) * | 2005-11-22 | 2007-02-14 | 沈阳仪表科学研究院 | Solar cell substrate cutting machine |
| CN102248309A (en) * | 2010-05-17 | 2011-11-23 | 苏州天弘激光股份有限公司 | Wafer laser dicing method and wafer laser dicing equipment with charge coupled device (CCD) assisting in positioning |
| CN104377280A (en) * | 2014-11-14 | 2015-02-25 | 江苏鑫博电子科技有限公司 | Method for manufacturing groove structure in substrate wafer |
| JP2016164908A (en) * | 2015-03-06 | 2016-09-08 | 株式会社ディスコ | Method of manufacturing optical device chip |
| CN204748023U (en) * | 2015-06-25 | 2015-11-11 | 马维虎 | Metal tool bit mixes sculpture cutting machine with laser tool bit |
| CN106469679A (en) * | 2015-08-18 | 2017-03-01 | 株式会社迪思科 | The processing method of chip |
| CN106799613A (en) * | 2016-12-29 | 2017-06-06 | 大族激光科技产业集团股份有限公司 | A kind of processing method of laser composite manufacture device and complex parts |
| CN107538136A (en) * | 2017-07-31 | 2018-01-05 | 山东浪潮华光光电子股份有限公司 | It is a kind of to utilize the method for being cut by laser sapphire substrate LED chip |
| CN108044355A (en) * | 2017-12-22 | 2018-05-18 | 沈阳芯嘉科技有限公司 | A kind of laser sand-wheel slice cutting machine and composite material cutting method |
Non-Patent Citations (2)
| Title |
|---|
| 李燕玲;高爱梅;张雅丽;: "硅晶圆复合划片工艺研究", 电子工业专用设备, no. 01, pages 25 - 28 * |
| 郭琛;肖娜;: "LED用蓝宝石晶体衬底激光划片工艺", 中国照明电器, no. 03, pages 26 - 29 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110560929A (en) * | 2019-09-06 | 2019-12-13 | 大同新成新材料股份有限公司 | silicon wafer cutting method and cutting device |
| CN110682007A (en) * | 2019-09-11 | 2020-01-14 | 芜湖德锐电子技术有限公司 | Cutting device for chip processing |
| CN110682007B (en) * | 2019-09-11 | 2021-12-17 | 前海晶方云(深圳)测试设备有限公司 | Cutting device for chip processing |
| CN112318337A (en) * | 2019-12-20 | 2021-02-05 | 沈阳和研科技有限公司 | Method for cutting glass with warping deformation by using grinding wheel scribing machine |
| CN112078036A (en) * | 2020-07-08 | 2020-12-15 | 大同新成新材料股份有限公司 | Cutting equipment for processing semiconductor graphite round crystal and cutting method thereof |
| CN112276564A (en) * | 2020-10-12 | 2021-01-29 | 重庆工商大学 | Laser cutting device capable of deburring automobile exhaust elbow |
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