CN109378704B - Circuit and method for driving laser diode - Google Patents

Circuit and method for driving laser diode Download PDF

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Publication number
CN109378704B
CN109378704B CN201810245696.2A CN201810245696A CN109378704B CN 109378704 B CN109378704 B CN 109378704B CN 201810245696 A CN201810245696 A CN 201810245696A CN 109378704 B CN109378704 B CN 109378704B
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electronic switch
output node
circuit
transistor
laser diode
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CN109378704A (en
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弗兰科·米尼奥利
毛里齐奥·加尔瓦诺
安德烈娅·洛朱代斯
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Infineon Technologies AG
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06209Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes in single-section lasers
    • H01S5/06216Pulse modulation or generation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483Details of pulse systems
    • G01S7/484Transmitters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/0232Lead-frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0233Mounting configuration of laser chips
    • H01S5/02345Wire-bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/026Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0261Non-optical elements, e.g. laser driver components, heaters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0428Electrical excitation ; Circuits therefor for applying pulses to the laser
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/0607Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481Constructional features, e.g. arrangements of optical elements
    • G01S7/4811Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813Housing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/0231Stems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226Modulation at ultra-high frequencies

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Driver circuits and methods for driving laser diodes are described herein. According to a first exemplary embodiment, a driver circuit includes: a first electronic switch connected to an output node, the output node configured to be operably connected to a laser diode. The electrical connection between the first electronic switch and the output node has a first inductance. The driver circuit also includes a bypass circuit coupled to the output node and configured to receive a current provided to the output node via the first electronic switch when activated, thereby magnetizing the first inductor.

Description

Circuit and method for driving laser diode
Technical Field
The present disclosure relates generally to the field of driver circuits for laser diodes, and in particular to driver circuits that allow generation of short laser pulses for laser radar (LIDAR) systems.
Background
Light detection and light ranging (LIDAR) relates to a measurement method for measuring the distance to an object, called target, by illuminating the target with a pulsed laser light, wherein the distance information can be obtained from the time of flight (TOF) of a light pulse travelling from a light source to the target and back to a detector. This time of flight is sometimes also referred to as Round Trip Delay Time (RTDT); the measured distance is essentially the product between the RTDT and the speed of light. For example, LIDAR is used in so-called time-of-flight cameras (TOF cameras), which allow mapping depth information to a single pixel and simultaneously capturing the entire scene within the field of view of the TOF camera. In contrast, scanning LIDAR scans a scene point-by-point by deflecting the laser light with, for example, a mirror such as a micro-scanner (also referred to as a micro-scanning mirror).
The irradiance (power per unit area) of the reflected light pulses reaching the detector decreases with increasing target distance. In order to reach a measuring range of up to tens or hundreds of meters, the radiation power of the emitted laser light (and thus the electrical power of the laser diode) is rather high. However, to ensure that the laser pulse is not harmful to the eye of a person standing nearby, the laser pulse must be relatively short to limit the radiant energy of the laser pulse. For a rectangular pulse (power over time), the pulse energy will be proportional to the product of the pulse width and the power. In a practical example, the peak power of the laser pulse may be as high as 80W or higher with a pulse width in the range of 1ns to 100 ns. To generate such short pulses, the driver electronics for driving the laser diode should be able to switch the load current of the laser diode with very short rise and fall times.
Disclosure of Invention
Driver circuits for driving laser diodes are described herein. According to a first exemplary embodiment, a driver circuit includes: a first electronic switch connected to an output node, the output node configured to be operably connected to a laser diode. The electrical connection between the first electronic switch and the output node has a first inductance. The driver circuit also includes a bypass circuit coupled to the output node and configured to receive a current provided to the output node via the first electronic switch when activated, thereby magnetizing the first inductor.
According to a second exemplary embodiment, the driver circuit includes first and second transistor half bridges forming an H-bridge having first and second output nodes configured to operatively couple a laser diode therebetween. Each transistor half-bridge consists of a high-side transistor and a low-side transistor. The control circuit is configured to turn on the high-side and low-side transistors of the first and second transistor half-bridges in a pre-charge phase to magnetize any inductance coupled in series with the high-side and low-side transistors. The control circuit is configured to turn off the low-side transistor of the first transistor half-bridge and the high-side transistor of the second transistor half-bridge during the ramp-up phase, thereby directing current through the high-side transistor of the first transistor half-bridge and the low-side transistor of the second transistor half-bridge and through an inductor coupled in series with the high-side transistor of the first transistor half-bridge and the low-side transistor of the second transistor half-bridge through the laser diode via the first output node and the second output node.
Further, methods for driving laser diodes are described herein. According to one exemplary embodiment, the method includes directing a first current via a first electronic switch to an output node operatively coupled to a laser diode. Thereby, the effective first inductance between the first electronic switch and the output node is magnetized. The method also includes drawing a first current from the output node by activating the bypass circuit. Thereby, the laser diode is bypassed. Further, the method includes directing the first current to the laser diode via the output node by deactivating the bypass circuit.
Drawings
The invention may be better understood with reference to the following description and accompanying drawings. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. In the drawings:
fig. 1 shows (fig. 1 (a)) a circuit diagram of a laser diode and an electronic switch for switching the laser diode, and (fig. 1 (b)) a schematic diagram of a corresponding chip package.
Fig. 2 shows an electrical equivalent circuit of a laser diode package including a parasitic inductance.
Fig. 3 is a circuit diagram showing a first example of a driver circuit for driving a laser diode.
Fig. 4 includes a timing diagram illustrating the functionality of the circuit of fig. 3.
Fig. 5 is a circuit diagram showing a second example of a driver circuit for driving a laser diode.
Fig. 6 includes a timing diagram illustrating the functionality of the circuit of fig. 5.
Fig. 7 is a circuit diagram showing a third example of a driver circuit for driving a laser diode.
Fig. 8 includes a timing diagram illustrating the function of the circuit of fig. 7.
Fig. 9 is a circuit diagram showing a fourth example of a driver circuit for driving a laser diode.
Fig. 10 is a flow chart illustrating one exemplary method for driving a laser diode.
Detailed Description
Fig. 1 shows a laser diode and a part of a driving circuit for driving the laser diode. FIG. 1 (a) shows a laser diode DLAnd for switching on and off the laser diode DLElectronic switch THSA circuit diagram of (a). Thus, the laser diode DLAnd an electronic switch THSIs coupled between a ground terminal GND and a supply terminal at which a supply voltage V is appliedS. At least one capacitor (in this example capacitor C)1And C2Parallel circuit of) parallel connection to the laser diode DLAnd an electronic switch THSSo as to buffer the supply voltage VSAnd supplies a load current to the laser diode DL. Electronic switch THSWhich may be a MOSFET or any other suitable transistor type (e.g., BJT). In the present example, an electronic switch THSIs marked ON. Usually need to be composed of a capacitor C1And C2A buffer capacitor is provided to enable fast transients in the load current.
Fig. 1 (b) is a schematic diagram of a laser diode module 1, the laser diode module 1 having a chip package 10 including the circuit of fig. 1 (a). Thus, the chip package comprises: comprising an electronic switch THSA first semiconductor die comprising a laser diode DLAnd at least a third semiconductor die providing a buffer capacitance. Corresponding to (a) in fig. 1, a separate capacitor is used in this example. The lead frame 11 is provided with power supply terminals (electricity)Pressure VS) A ground terminal GND and a control terminal ON, wherein the middle terminal is a power supply terminal. Comprising a buffer capacitor C1And C2Is bonded (e.g., soldered) directly (i.e., without the use of bond wires) to the lead frame 11 and provides a buffer capacitance between the pins representing the ground and power terminals. Comprising a MOSFET THSRepresents the drain electrode of the MOSFET and is directly bonded to a pin representing the power supply terminal. MOSFET THSIs connected to a pin representing the control terminal ON via a bonding wire. Similarly, MOSFET THSIs connected to the laser diode D via a bonding wire 12LThe anode electrode on the top surface of the substrate. Laser diode DLIs directly bonded to the lead frame 11.
Fig. 2 shows a simplified electrical equivalent circuit of the laser diode module 1 of fig. 1. In addition, the circuit of fig. 2 includes a gate driver circuit 41 coupled to the MOSFET THSAnd is configured to be dependent on the logic signal SONGenerating MOSFETs T adapted to be switched on and offHSThe drive signal of (1). Removing gate driver 41 except for inductor L1、LCAnd LGExcept that the circuit of FIG. 2 is substantially the same as that of FIG. 1 (a), L1、LCAnd LGRespectively, the parasitic inductances (corresponding to the inductances L) of the bonding wires 121) Capacitor C1And C2And a laser diode DLParasitic inductance (corresponding to inductance L) of the electrical connection therebetweenC) And control terminal ON and MOSFET THSCorresponding to the inductance L, of the parasitic inductance (corresponding to the inductance L) of the electrical connection (e.g. bonding wire) between the actual control electrodesG). Gate driver 41 and electronic switch THSTogether can be considered to be used to drive a laser diode DLThe driver circuit 4 of (1).
In LIDAR systems, the measurement range depends on the radiation power of the laser pulses. However, to limit the pulse energy (to protect the eyes of people in the environment of the LIDAR system), the laser pulse needs to be rather short. Effective parasiticInductor LEFF(LEFF=LC+L1) Voltage drop V acrossLEFFGiven by:
VLEFF=LEFF·ΔiL/trise upAnd VLEFF=LEFF·ΔiL/tDescend
Wherein Δ iLIs the change in load current (e.g. from 0A to 40A or from 40A to 0A), tRise upIs the corresponding rise time and tDescendIs the corresponding fall time. Assume an effective inductance of 5nH and a rise time of 2ns produces a voltage drop of 100V. Thus, the system comprising the capacitor must be designed for voltages in excess of 110V (assuming a voltage drop of 10V across the laser diode and the MOSFET) in order to achieve the desired peak current within the desired rise time. It should be noted that for some applications a 2ns rise time may be too long. With the integration method as shown in fig. 1 (b)), the inductance LEFFCan be significantly reduced (e.g., less than 2nH or even less than 1 nH). The residual inductance is mainly used for connecting the MOSFET THSAnd a laser diode DLIs caused by the bond wire 12. For example, when the load current ramps up to 40A in a rise time of 0.5ns, at the inductor LEFFIn the case of a reduction to 1nH, the voltage drop VLEFFStill 80V.
One understanding from the above analysis is that a relatively high voltage (compared to the forward voltage of the laser diode) is required to produce a fast current transient (steep current ramp within a very short rise time or fall time) of the load current through the laser diode. Higher voltages cause increased complexity and cost of the driver circuit. For example, transistors and buffer capacitors with comparable breakdown voltages are needed; a charge pump may be required to charge the buffer capacitor to the desired voltage. The driver circuit described herein is designed to generate a steep current ramp in order to drive the laser diode at a relatively low supply voltage.
FIG. 3 is a view showing a driving circuit for driving a laser diode DLIs provided in the first example of the driver circuit 4. As in the example of fig. 2And a laser diode DLThe parasitic inductance associated with the generation of the current ramp is shown in fig. 3. The driver circuit thus comprises a transistor half-bridge consisting of a high-side transistor THSAnd a low-side transistor TLSAnd (4) forming. These transistors THSAnd TLSCoupled in series across which a supply voltage V is appliedSAnd is at a reference potential VGNDGround node GND (e.g., 0V). The circuit node forming the center tap of the transistor half-bridge is denoted as OUT. Connecting the circuit node OUT and the transistor THSAnd TLSIs composed of an inductor L1And L2And (4) showing. As discussed above, the mentioned bonding wires or any other wires contacting the transistor electrodes may generate significant inductance. As can be seen in FIG. 3, the laser diode DLConnected between circuit node OUT and ground GND. Furthermore, one or more buffer capacitors, collectively represented by capacitor C, are connected between the power supply node SUP and ground GND. As in the example of fig. 2, an inductor L connected in series with a capacitor CCRepresenting the parasitic inductance created by wires in contact with one or more capacitors. In the present example, the transistor THSAnd TLSIs an n-channel MOSFET. However, any other transistor type (e.g., bipolar junction transistor) may be used in other implementations. When MOSFETs are used, the high-side transistor THSBut may also be implemented as p-channel MOS transistors.
The clamp circuits CL1 and CL2 are coupled to the transistor T respectivelyHSAnd TLS. When the transistor THSWhen turned off, the clamp circuit CL1 is configured to receive a pass through inductor L1Of the inductor current i1. Thus, the transistor THSIs (re) activated for a short period of time (or delays deactivation for a short period of time), thereby allowing the inductor L to be used for a short period of time1"discharge" (demagnetization). Similarly, when the transistor T is turned onLSWhen turned off, the clamp circuit CL2 is configured to receive a pass through inductor L2Of the inductor current i2. Similarly, the transistor TLSIs (re) activated (or delays deactivation for a short time period)Segment) allowing the inductor L to be used2"discharge" (demagnetization). Mentioned transistor T during clampingHSAnd TLSIs controlled by a transistor THSAnd TLSThe drain-source voltage across exceeds the clamping voltage defined by the zener diode included in the clamping circuit. In addition to current commutation, the clamp circuits CL1 and CL2 may limit the voltage across the gate dielectric to protect the transistor T, respectivelyHSAnd TLS(in the case of MOS transistors).
In this example, the clamp circuit CL1 is connected at the transistor THSAnd a supply node SUP and comprises a zener diode DZ1A、DZ1BAnd a normal diode D1The series circuit of (1). At the time of making the inductor current i1When reversing, diode D1Forward biased and zener diode DZ1AAnd DZ1BOperating in zener or avalanche breakdown and thus conducting in reverse. Zener diode DZ1AConnected to a transistor THSTo limit the gate-source voltage and protect the transistor THSThe gate dielectric of (a). Diode D1And a Zener diode DZ1BConnected to a transistor THSAnd a power supply node SUP. The clamp circuit CL2 includes a transistor T coupled toLSBetween the drain and the gate of (2) a zener diode DZ2BAnd a normal diode D2And coupled to the transistor TLSAnother zener diode D between the gate and the source ofZ2A. At the time of making the inductor current i2When reversing, diode D2Forward biased, Zener diode DZ2BOperating in zener or avalanche breakdown and thus conducting in reverse. Connected to a transistor TLSBetween the drain and the gate of diode D2And DZ2BThe transistor T can thus be switchedLSIs pulled up to a high level sufficient to delay the complete turn-off of the transistor for a short time interval, during which the inductor L is pulled up to the above-mentioned clamping voltage of, for example, 40V2Demagnetization is possible. The clamp circuit CL1 is substantially identicalOperate in the manner described above.
It should be noted that the clamp circuits CL1 and CL2 are only suitable for the n-channel MOS transistor THSAnd TLSAn exemplary embodiment of (1). Other implementations of the clamp circuit may be used depending on the application. When the transistor THSAnd TLSWhen turned on, the diode D1And D2Respectively blocking pass transistors THSAnd TLSBetween the gate and the drain of (2) a zener diode DZ1BAnd DZ2BThe current path of (1). As described above, the primary purpose of the clamp circuits CL1 and CL2 is to clamp, i.e., receive, inductor current when the respective transistors are turned off, so as to delay the actual turning off of the respective transistors and allow demagnetization of the respective inductors. It should be noted that the gate driver (see fig. 2, gate driver 41) is omitted in the example of fig. 3 in order to keep the illustration concise. Suitable gate driver circuits are known per se and will therefore not be described in more detail.
The function of the driver circuit of fig. 3 will now be explained with reference to the timing diagram shown in fig. 4. In LIDAR systems, a series of successive current (and light) pulses are typically generated to obtain a sequence of corresponding range measurements. The timing diagram shows that throughout one pulse period (i.e., time t)0To time t4) Of the inductor current i1And i2And through the laser diode DLLoad current iD(diode current). According to the present example, the diode current i is actually switched onDFormerly, inductor i1And i2Are "pre-charged" (i.e., magnetized) with magnetic flux. Fig. 4 (a) shows an inductor current i1An exemplary waveform of (b) in fig. 4 shows an inductor current i2And (c) in fig. 4 shows the diode current iDAn exemplary waveform of (a).
According to the example of fig. 4, the pulse period may be divided into five phases. In the first phase (time t)0Before and at time t3And t4In between), the transistor THSAnd TLSBoth are turned off, andinductor current i1And i2And a diode current iDZero (off phase). The second phase is at time t0(or t in the subsequent pulse period4) A preliminary precharge phase during which the transistor T is activatedHSAnd TLSBoth are conductive (on). Inductor L1And L2(and their intrinsic series resistance) form a voltage divider and are designed such that the voltage V at the center tap OUT of the transistor half-bridge (which is also the center tap of the voltage divider)DNot exceeding the laser diode DLA forward voltage (e.g., 2.2V). Thus, the diode current iDRemains substantially zero during the precharge phase while the inductor current i1And i2(i1=i2,iD0) is ramped up as shown in (a) and (b) of fig. 4. Thereby, the inductor current i1And i2Slope k of1Is k1=(V1+V2)/(L1+L2) In which V is1And V2Respectively shown in the inductor L1And L2The voltage drop across it. At time t1Stored in the inductor L1And L2Energy E in1And E2Are each E1=(L1·i1 2) [ 2 ] and E1=(L2·i2 2)/2. Voltage V across the inductor1+V2Relatively low, e.g., 2V to 5V. It should be noted that the low-side transistor TLSCan be regarded as a bypass circuit configured to receive via the high-side transistor T when activatedHSSupplied inductor current i1(Note that during the precharge phase i1=i2) And during this phase the diode current iDRemains substantially zero.
The third stage is at time t1A ramp-up phase of the start during which the transistor THSRemains on while the transistor TLSAt time t1And (6) turning off. When passing through the transistor TLSWhen the current path of (i) is no longer available, the inductor current i1Is led out via a laser diode, and the diodeCurrent iDRamp up very sharply in a very short rise time, while the inductor current i2Is commutated fairly quickly by the clamp circuit CL 2. During this phase, in the inductor L2Voltage V across2Can drop to about-40V. The fourth phase is called the switch-on phase and is at the time t2At the beginning, at time t2At the inductor current i2Reaches zero and the inductor L2Is completely demagnetized. The switch-on phase continues until the time t2'. The fifth stage is at time t2' initial ramp-down phase during which the transistor TLSRemains off with the transistor THSAt time t2' is also turned off. When passing through the transistor THSWhen the current path of (i) is no longer available, the inductor current i1Commutation takes place relatively quickly by the clamp circuit CL 1. As mentioned above, the Zener diode DZ1AEnsures the transistor THSDoes not become too high, protecting the gate dielectric. At this stage, in the inductor L1Voltage V across1Possibly down to about-40V. At time t3Inductor current i1Down to zero ampere (i.e. inductor L)1Fully demagnetized), the ramp-down phase ends and the mentioned turn-off phase begins until at time t4A new precharge phase is started.
FIG. 5 is a view showing a driving circuit for driving a laser diode DLIs used for driving the driver circuit 4. In the present example, the driver circuit comprises four transistors connected to a two transistor half bridge and thus forming a transistor H-bridge. Thus, the first half-bridge is formed by the high-side transistor T1And a low-side transistor T11And (4) forming. Circuit node OUT1 is the center tap of the first half bridge. Similarly, the second half-bridge is formed by a high-side transistor T22And a low-side transistor T2And (4) forming. Circuit node OUT2 is the center tap of the second half bridge. Both half-bridges are connected to a supply voltage VSBetween power supply node SUP and ground node GND. Laser diode DLConnected between circuit nodes OUT1 and OUT 2. Circuit node OUT1 and transistor T1And T11The inductances of the wires therebetween are respectively formed by inductors L1And L11And (4) showing. Similarly, circuit node OUT2 and transistor T2And T22The inductances of the wires therebetween are respectively formed by inductors L2And L22And (4) showing. Each transistor T1、T2、T11、T22Respectively by Zener diodes DZ1、DZ2、DZ11、DZ22Respective clamp circuits are shown coupled. It should be noted that the clamp circuit is simplified in this example, and may be more complex in other examples (e.g., as in fig. 3).
The function of the driver circuit of fig. 5 will now be explained with reference to the timing diagram of fig. 6. It should be noted, however, that the principle of operation of this example is similar to that of the previous example shown in fig. 3. Thus, during the pre-charge phase, the inductor L1And L11And L2And L22Is precharged, wherein all transistors T1、T11、T2、T22Conducting (switching on). This phase is shown in the timing diagram of fig. 6 at time t0And t1In the meantime. The first four diagrams in fig. 6 (from the top) show the application to the transistor T1、T11、T2、T22Exemplary waveforms of the gate signal of (1). The bottom diagram of fig. 6 shows the inductor current i1And diode current iDExemplary waveforms of (a). It can be seen that the inductor current i1=i11And at time t0(at which time all transistors are on) and time t1And rises in between. In a symmetrical arrangement, the voltages at circuit nodes OUT1 and OUT2 are the same during the precharge phase, and thus at laser diode DLVoltage V acrossDLIs zero; the inductor currents being the same, i.e. i1=i2=i11=i22. As in the previous example of FIG. 3, the transistor T11(and a transistor T22) Can be viewed as a bypass circuit configured to provide a current path for the inductor current to bypass laser two when activated during the precharge phasePolar tube DL. When deactivated (at the beginning of the subsequent ramp-up phase), the bypass is closed and current is forced through the laser diode.
At time t1By triggering the transistor T11And T22To initiate the ramp-up phase. Thus, the inductor current i1And i2Is laser diode DLReceive, and therefore diode current iDAt a very short rise time tRise up=t2-t1Internal ramp up, and inductor current i11And i22By a Zener diode DZ11And DZ22(the clamp circuits CL11 and CL 22). In addition to the example of fig. 3, a transistor T1And T2At time t2And t2In between (i.e. at time t)2During the' previous on-phase) remains on, triggering the transistor T at the beginning of the ramp-down phase1And T2Is turned off. During the ramp-down phase (time t)2' and t3In between), inductor current i1And i2Zener diode DZ1And DZ2(the clamp circuits CL1 and CL2) receive and the current drops to zero (see FIG. 6, time t)3). The following phase is a shutdown phase that continues until a new precharge phase is triggered.
FIG. 7 is a view showing a driving circuit for driving a laser diode DLIs used for driving the driver circuit 4. The example of fig. 7 is a variation of the previous example of fig. 3, with an additional security feature. As mentioned above, the maximum radiated power of a laser diode is rather high (up to e.g. 40W and more) in order to achieve a significant measurement range in a LIDAR system. However, in order to limit the pulse energy (radiation power multiplied by pulse width) to a value that is not harmful to the human eye (for a given pulse repetition frequency), the duration of the pulse (pulse width) must be sufficiently short. When using a driver circuit as shown in fig. 3, when the high-side switch T is switchedHSWithout turning off the diode current iDA dangerous situation may arise (for whatever reason). In this case, the laser diode will be operated as a laser diode with a radiation power of a few wattsA Continuous Wave (CW) laser (which would correspond to a class 3B or class 4 laser) operates.
The example of fig. 7 is substantially the same as the example of fig. 3, with the circuit node OUT (by transistor T)HSAnd TLSCenter tap of the formed half-bridge) and laser diode DLWith an additional capacitor C interposed0. By a high-side transistor THSParasitic inductance caused by wires between the inductor L and the circuit node OUT1And (4) showing. Composed of a circuit node OUT and a capacitor C0Parasitic inductance caused by the wire therebetween is caused by the inductor L2And (4) showing. Capacitor C0Making the high-side transistor THS(thereby providing a supply voltage VSPower supply node) is decoupled from the laser diode with respect to DC current. Therefore, even a high-side transistor may cause the circuit node OUT and the power supply node (voltage V)S) Short circuit therebetween, laser diode DLIs also operated by the capacitor C0Blocking, capacitor C0Blocking light from the laser diode DLOf the DC current of (1). For safely turning off the laser diode DLThe other low-side switch T can be switchedLS' parallel coupling to laser diode DL. By a laser diode DLAnd a transistor TLSThe parasitic inductance caused by the wire between is caused by the inductance L3Represents, inductance L3Can have a relatively low inductance.
The function of the driver circuit of fig. 7 will now be explained with reference to the timing diagram of fig. 8. Thus, at time t0And t1In the first phase in between (precharge phase), the high-side transistor THSAnd an additional low-side transistor TLS' conductive, low-side transistor TLSAnd (6) turning off. Thus, through the inductor L1、L2And L3And a capacitor C0Of the inductor current i1Ramping up as in the example of fig. 3. Stored in the inductor L1+L2+L3Energy E in123Is E123=((L1+L2+L3)·i1 2)/2. During the second phase (energy transfer phase), the determined energy E in the inductance123Is transferred to the capacitor C0Is caused to pass through a capacitor C0And when the transistor T is in a transient stateLSAt time t1(see second timing diagram in fig. 8) is turned off, the transient current flows through the laser diode DLIs drawn out. A corresponding radiant power output is produced by the laser diode. Capacitor C0May be at time t3Is discharged in the initial third stage, at t3At the moment, two low-side transistors TLSAnd TLS' is turned on. When a new pulse period is triggered, the transistor TLSCan remain on until time t4. In other words, the transistor TLSIs activated at the end of the generated (current and corresponding light) pulse to cause the capacitor C to be charged0Is completely discharged, ensuring the same defined initial conditions (capacitor C)0Discharge) to generate a pulse.
As can be seen in the timing diagrams shown in fig. 4, 6 and 8, the timing of the switching moments of the various transistors determines the pulse width of the radiant power output produced by the laser diode. The example of fig. 9 is the same as the previous example of fig. 3. However, the present example additionally shows a method for separately generating a transistor T for use in a transistorHSAnd TLSGate voltage V ofGHSAnd VGLSThe gate driver circuits 41a and 41 b. The gate drivers 41a and 41b are configured to be ON according to (binary) logic signals, respectivelyHSAnd ONLSTo generate a gate voltage VGHSAnd VGLS. According to the present example, the programmable delay circuits 42a, 42b may be coupled to the inputs of the gate drivers 41a and 41b, respectively. The delay circuits 42a, 42b are configured to turn the logic signal ONHSAnd ONLSThe delay is up to a defined (adjustable) delay time. Using the delay circuits 42a, 42b, the logic signal ON can be fine tunedHSAnd ONLS(further, the gate voltage V can be trimmedGHSAnd VGLS) Timing of (2). In some applications, such trimming may be required, for example, to compensate for variations in parasitic inductance, and may be performed at the end of production during production testing using, for example, automatic test equipment. The delay may be stored in a one-time programmable (O)TP) memory, EPROM, etc. Logic signal ONHSAnd ONLSMay be generated by the controller circuit CTRL and the generation of these signals may be triggered by the input signal IN (logic signal). It will be appreciated that the controller circuit CTRL may be any suitable logic circuit, and may be implemented, for example, using programmable logic circuits, a microcontroller executing software instructions, or the like. It should be understood that in any of the examples described herein, the gate voltages supplied to the high-side and low-side transistors may be generated in a similar manner to the present example of fig. 9.
FIG. 10 is a flow chart illustrating an exemplary method for driving a laser diode. The method may be implemented using any of the driver circuits described herein. First, during the precharge phase, via the first electronic switch (see fig. 3 and 7, the high-side transistor T)HS(ii) a And FIG. 5, transistor T11) The current (see, e.g., fig. 3, 5 and 7, inductor current i)1) To the output node (node OUT or OUT1) coupled to the laser diode (fig. 10, step 81). Thus, the effective first inductance between the first electronic switch and the output node is magnetized. In addition, during the precharge phase, the low-side transistor T is switched on by means of an activated bypass circuit (see fig. 3, 5 and 7, respectivelyLS、T11And TLS') will current i1From the output node (fig. 10, step 82). Thus, the laser diode is bypassed and the diode current is substantially zero, while the inductor is magnetized (pre-charged). In the subsequent ramp-up phase, the low-side transistor T is switched off by deactivating the bypass circuit (see fig. 3, 5 and 7, respectivelyLS、T11And TLS') will current i1To the laser diode via the output node (fig. 10, step 83). Since the effective inductance in the current path has been magnetized, the diode current can ramp up very sharply, resulting in a relatively short rise time.
Although the invention has been illustrated and described with respect to one or more implementations, alterations and/or modifications may be made to the illustrated examples without departing from the spirit and scope of the appended claims. In particular regard to the various functions performed by the above described components or structures (units, assemblies, devices, circuits, systems, etc.), the terms (including a reference to a "means") used to describe such components are intended to correspond, unless otherwise indicated, to any component or structure which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the invention. .
In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application. Furthermore, to the extent that the terms "includes," including, "" includes, "" having, "" has, "" with, "or variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term" comprising.
In summary, in embodiments according to the present invention, the present invention provides the following examples.
Example 1a driver circuit for driving a laser diode, comprising:
a first electronic switch connected to an output node, the output node configured to be operably connected to the laser diode; the electrical connection between the first electronic switch and the output node has a first inductance;
a bypass circuit coupled to the output node and configured to receive a current provided to the output node via the first electronic switch when activated, thereby magnetizing the first inductor.
Example 2. according to the driver circuit of example 1,
wherein an electrical connection between the output node and the bypass circuit has a second inductance that is also magnetized when the bypass circuit is activated.
Example 3. the driver circuit of examples 1 or 2, further comprising:
a clamping circuit coupled to the first electronic switch, the clamping circuit configured to limit a voltage drop across the first electronic switch according to a clamping voltage.
Example 4. the driver circuit of any of examples 1 to 3, further comprising:
a clamp circuit coupled to the first electronic switch, the clamp circuit configured to delay the turn-off during the turn-off of the first electronic switch to demagnetize the first inductor.
Example 5. the driver circuit of any of examples 1 to 4, further comprising:
a first driver coupled to a control electrode of the first electronic switch, the first driver configured to generate a drive signal to turn the first electronic switch on or off in accordance with a first control signal.
Example 6. the driver circuit of example 5, further comprising:
a first delay circuit coupled to the first driver and configured to delay the first control signal by an adjustable delay time.
Example 7. the driver circuit according to any one of examples 1 to 6,
wherein the bypass circuit comprises a second electronic switch connected to the output node, the electrical connection between the second electronic switch and the output node having a second inductance.
Example 8, according to the driver circuit of example 7,
wherein the bypass circuit further comprises a clamp circuit coupled to the second electronic switch, the clamp circuit configured to receive current through the second inductor when the second electronic switch is turned off.
Example 9. the driver circuit of examples 7 or 8, further comprising:
a second driver coupled to a control electrode of the second electronic switch, the second driver configured to generate a drive signal to turn the second electronic switch on or off in accordance with a second control signal.
Example 10. the driver circuit of example 9, further comprising:
a second delay circuit coupled to the second driver and configured to delay the second control signal by an adjustable delay time.
Example 11 the driver circuit of any of examples 1 to 10, further comprising:
a capacitor coupled between the first electronic switch and the output node to block DC current flowing from the first electronic switch to the output node.
Example 12. the driver circuit of example 11, further comprising:
a third electronic switch operably connected in parallel with the laser diode.
Example 13. the driver circuit of any of examples 1 to 12, further comprising:
a half bridge including a third electronic switch and a fourth electronic switch, the half bridge coupled between a power supply node and a ground node, a center tap of the half bridge forming another output node configured to be operably coupled to the laser diode such that the laser diode is coupled between the output node and the another output node.
Example 14, according to the driver circuit of example 13,
wherein the electrical connection between the third electronic switch and the further output node has a third inductance; and
wherein an electrical connection between the fourth electronic switch and the further output node has a fourth inductance.
Example 15. the driver circuit of example 14, further comprising:
a clamp circuit coupled to the third electronic switch, the clamp circuit configured to receive current through the third inductor when the third electronic switch is turned off; and
another clamp circuit coupled to the fourth electronic switch, the other clamp circuit configured to receive current through the fourth inductor when the fourth electronic switch is turned off.
Example 16. a driver circuit for driving a laser diode, comprising:
first and second transistor half bridges forming an H-bridge having first and second output nodes configured to operably couple a laser diode therebetween; each transistor half-bridge consists of a high-side transistor and a low-side transistor; and
a control circuit configured to:
during a pre-charge phase, turning on high-side and low-side transistors of the first and second transistor half-bridges to magnetize any inductors coupled in series with the high-side and low-side transistors; and
during a ramp-up phase, the low-side transistor of the first transistor half-bridge and the high-side transistor of the second transistor half-bridge are turned off, thereby directing current through the high-side transistor of the first transistor half-bridge and the low-side transistor of the second transistor half-bridge and through an inductor coupled in series to the high-side transistor of the first transistor half-bridge and the low-side transistor of the second transistor half-bridge through the laser diode via the first output node and the second output node.
Example 17 a method for driving a laser diode, comprising:
directing a first current through a first electronic switch to an output node operatively coupled to the laser diode, thereby magnetizing an effective first inductance between the first electronic switch and the output node;
bypassing the laser diode by activating a bypass circuit to draw the first current from the output node;
directing the first current to the laser diode via the output node by deactivating the bypass circuit.

Claims (17)

1. A driver circuit for driving a laser diode, comprising:
a first electronic switch connected to an output node, the output node configured to be operably connected to the laser diode; the electrical connection between the first electronic switch and the output node has a first inductance;
a bypass circuit coupled to the output node and configured to receive a current provided to the output node via the first electronic switch when activated, thereby magnetizing the first inductor.
2. The driver circuit as set forth in claim 1,
wherein an electrical connection between the output node and the bypass circuit has a second inductance that is also magnetized when the bypass circuit is activated.
3. The driver circuit according to claim 1 or 2, further comprising:
a clamping circuit coupled to the first electronic switch, the clamping circuit configured to limit a voltage drop across the first electronic switch according to a clamping voltage.
4. The driver circuit according to claim 1 or 2, further comprising:
a clamp circuit coupled to the first electronic switch, the clamp circuit configured to delay the turn-off during the turn-off of the first electronic switch to demagnetize the first inductor.
5. The driver circuit according to claim 1 or 2, further comprising:
a first driver coupled to a control electrode of the first electronic switch, the first driver configured to generate a drive signal to turn the first electronic switch on or off in accordance with a first control signal.
6. The driver circuit of claim 5, further comprising:
a first delay circuit coupled to the first driver and configured to delay the first control signal by an adjustable delay time.
7. The driver circuit as set forth in claim 1,
wherein the bypass circuit comprises a second electronic switch connected to the output node, the electrical connection between the second electronic switch and the output node having a second inductance.
8. The driver circuit as set forth in claim 7,
wherein the bypass circuit further comprises a clamp circuit coupled to the second electronic switch, the clamp circuit configured to receive current through the second inductor when the second electronic switch is turned off.
9. The driver circuit according to claim 7 or 8, further comprising:
a second driver coupled to a control electrode of the second electronic switch, the second driver configured to generate a drive signal to turn the second electronic switch on or off in accordance with a second control signal.
10. The driver circuit of claim 9, further comprising:
a second delay circuit coupled to the second driver and configured to delay the second control signal by an adjustable delay time.
11. The driver circuit according to claim 1 or 2, further comprising:
a capacitor coupled between the first electronic switch and the output node to block DC current flowing from the first electronic switch to the output node.
12. The driver circuit of claim 11, further comprising:
a third electronic switch operably connected in parallel with the laser diode.
13. The driver circuit according to claim 1 or 2, further comprising:
a half bridge including a third electronic switch and a fourth electronic switch, the half bridge coupled between a power supply node and a ground node, a center tap of the half bridge forming another output node configured to be operably coupled to the laser diode such that the laser diode is coupled between the output node and the another output node.
14. The driver circuit as set forth in claim 13,
wherein the electrical connection between the third electronic switch and the further output node has a third inductance; and
wherein an electrical connection between the fourth electronic switch and the further output node has a fourth inductance.
15. The driver circuit of claim 14, further comprising:
a clamp circuit coupled to the third electronic switch, the clamp circuit configured to receive current through the third inductor when the third electronic switch is turned off; and
another clamp circuit coupled to the fourth electronic switch, the other clamp circuit configured to receive current through the fourth inductor when the fourth electronic switch is turned off.
16. A driver circuit for driving a laser diode, comprising:
first and second transistor half bridges forming an H-bridge having first and second output nodes configured to operably couple a laser diode therebetween; each transistor half-bridge consists of a high-side transistor and a low-side transistor; and
a control circuit configured to:
during a pre-charge phase, turning on high-side and low-side transistors of the first and second transistor half-bridges to magnetize any inductors coupled in series with the high-side and low-side transistors of the first and second transistor half-bridges; and
during a ramp-up phase, the low-side transistor of the first transistor half-bridge and the high-side transistor of the second transistor half-bridge are turned off, thereby directing current through the high-side transistor of the first transistor half-bridge and the low-side transistor of the second transistor half-bridge and through an inductor coupled in series to the high-side transistor of the first transistor half-bridge and the low-side transistor of the second transistor half-bridge through the laser diode via the first output node and the second output node.
17. A method for driving a laser diode, comprising:
directing a first current through a first electronic switch to an output node operatively coupled to the laser diode, thereby magnetizing an effective first inductance between the first electronic switch and the output node;
bypassing the laser diode by activating a bypass circuit to draw the first current from the output node;
directing the first current to the laser diode via the output node by deactivating the bypass circuit.
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