CN109360791B - 一种无需刻蚀的amb直接成型方法 - Google Patents
一种无需刻蚀的amb直接成型方法 Download PDFInfo
- Publication number
- CN109360791B CN109360791B CN201811004442.8A CN201811004442A CN109360791B CN 109360791 B CN109360791 B CN 109360791B CN 201811004442 A CN201811004442 A CN 201811004442A CN 109360791 B CN109360791 B CN 109360791B
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- China
- Prior art keywords
- copper sheet
- engraving
- etching
- groove
- amb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 86
- 239000010949 copper Substances 0.000 claims abstract description 86
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 83
- 238000005530 etching Methods 0.000 claims abstract description 30
- 238000005219 brazing Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 238000005245 sintering Methods 0.000 claims abstract description 10
- 230000035515 penetration Effects 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims abstract description 5
- 238000007650 screen-printing Methods 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 239000007888 film coating Substances 0.000 claims abstract description 4
- 238000009501 film coating Methods 0.000 claims abstract description 4
- 238000013519 translation Methods 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 8
- 230000009471 action Effects 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 6
- 230000000295 complement effect Effects 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 21
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Substances OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 1
- BCKPSZOVMCRZEE-UHFFFAOYSA-N azanium hydrogen peroxide fluoride Chemical compound OO.[F-].[NH4+] BCKPSZOVMCRZEE-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002920 hazardous waste Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811004442.8A CN109360791B (zh) | 2018-08-30 | 2018-08-30 | 一种无需刻蚀的amb直接成型方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811004442.8A CN109360791B (zh) | 2018-08-30 | 2018-08-30 | 一种无需刻蚀的amb直接成型方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109360791A CN109360791A (zh) | 2019-02-19 |
CN109360791B true CN109360791B (zh) | 2020-08-07 |
Family
ID=65350314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201811004442.8A Active CN109360791B (zh) | 2018-08-30 | 2018-08-30 | 一种无需刻蚀的amb直接成型方法 |
Country Status (1)
Country | Link |
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CN (1) | CN109360791B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1416182A (zh) * | 2002-10-24 | 2003-05-07 | 上海利浦电子陶瓷厂 | 敷铜型陶瓷散热基片的制造工艺 |
CN103687337A (zh) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | 封装基板通孔的激光加工方法 |
CN107962297A (zh) * | 2017-11-01 | 2018-04-27 | 厦门盈趣科技股份有限公司 | 激光雕刻机多电机负载均衡分配系统及方法 |
CN108257876A (zh) * | 2018-01-11 | 2018-07-06 | 苏州久奥新材料有限公司 | 一种活性金属钎焊氮化物陶瓷基板及其图形化方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04206893A (ja) * | 1990-11-30 | 1992-07-28 | Ibiden Co Ltd | セラミックス基板の製造方法 |
JP5303980B2 (ja) * | 2008-03-24 | 2013-10-02 | 日立金属株式会社 | 回路基板の製造方法および回路基板 |
-
2018
- 2018-08-30 CN CN201811004442.8A patent/CN109360791B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1416182A (zh) * | 2002-10-24 | 2003-05-07 | 上海利浦电子陶瓷厂 | 敷铜型陶瓷散热基片的制造工艺 |
CN103687337A (zh) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | 封装基板通孔的激光加工方法 |
CN107962297A (zh) * | 2017-11-01 | 2018-04-27 | 厦门盈趣科技股份有限公司 | 激光雕刻机多电机负载均衡分配系统及方法 |
CN108257876A (zh) * | 2018-01-11 | 2018-07-06 | 苏州久奥新材料有限公司 | 一种活性金属钎焊氮化物陶瓷基板及其图形化方法 |
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Publication number | Publication date |
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CN109360791A (zh) | 2019-02-19 |
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PB01 | Publication | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20201028 Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Patentee before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: Jiangsu fulehua Semiconductor Technology Co.,Ltd. Address before: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |