CN109346463A - Display panel and its manufacturing method with electrostatic protection - Google Patents
Display panel and its manufacturing method with electrostatic protection Download PDFInfo
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- CN109346463A CN109346463A CN201811176788.6A CN201811176788A CN109346463A CN 109346463 A CN109346463 A CN 109346463A CN 201811176788 A CN201811176788 A CN 201811176788A CN 109346463 A CN109346463 A CN 109346463A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/136295—Materials; Compositions; Manufacture processes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/22—Antistatic materials or arrangements
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
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Abstract
The present invention provides a kind of display panel and its manufacturing method, the display panel includes: a first substrate, one the second substrate, GOA circuit, one the first metal layer, one first separation layer, one second metal layer, one second separation layer, one via hole, one first transparency electrode and a second transparency electrode, one electrostatic discharge protection circuit is set on first substrate and connects a GOA circuit, one end of electrostatic discharge protection circuit and GOA circuit connection is equipped with a short-circuited conducting sleeve, the first metal layer is arranged on the first substrate, first separation layer is arranged on the first metal layer, second metal layer is arranged on the first separation layer, second separation layer is arranged in second metal layer, via hole is arranged on the first metal layer, first transparency electrode is arranged in via hole, first transparency electrode connects the first metal layer and second metal layer by via hole, second transparency electrode It is arranged in the second substrate, the first area in second transparency electrode is etched removal, and first area is corresponding with first transparency electrode.
Description
Technical field
The present invention is to be related to field of display technology, in particular to a kind of display panel and its system with electrostatic protection
Make method.
Background technique
GOA technology, that is, array substrate row actuation techniques (Gate Driver on Array) is directly by gate driving electricity
Road is incorporated into a kind of technology that the multi-strip scanning line of display panel is driven in array substrate, saves the drive for making external silicon wafer
Dynamic chip, and reduce production process, product cost and panel surrounding area is conducive to manufacture the aobvious of narrow frame or Rimless
Show product, improves the high integration of display panel, panel is enable more to be thinned.
The running of GOA circuit has generally required synchronization signal, clock signal or low-voltage signal etc., transmits the letter of these signals
Number line is distributed at the metal routing around panel, increases static discharge risk, and if these signal wires occur in viewing area
Static discharge causes route to burn, it will and very big influence is constituted to display, causes picture abnormal, a display in the prior art
There is the situation that electrostatic be wound between upper substrate and two transparent electrodes of lower substrate in the display area in panel.Therefore, it is designing
Can further increase in non-display area design one during array substrate prevents static discharge from designing to prevent static discharge
Damage by static electricity.
However, usually will use more harsh electrostatic discharge testing condition to the electrostatic of signal wire in practice examining
Protective performance is tested, and directly beats GOA signal wire with ESD gun to test display panel with the voltage of +/- 10 kilovolt
GOA signal wire electrostatic protection performance.Inventor is by continuous research, for not passing through electrostatic discharge testing after inspection
Display panel is analyzed, and is found in display panel, is because having non-display area (not drawing) prevents electrostatic from putting mostly
It can still occur caused by short circuit between transparent electrode in electricity design and the upper substrate and lower substrate of spacing smaller part.Therefore, i.e.,
Make in the case where being provided with prevents static discharge from designing, still fails to be effectively prevented display panel route burning due to static discharge
It ruins, causes picture abnormal, product is directly scrapped, therefore this is the case where one kind must avoid.
The conventional method of the prior art is the via hole for removing lower substrate, increases upper and lower base plate distance, prevents upper and lower base plate from sending out
Raw short circuit, but the transparent electrode for removing lower substrate via hole protection can be made insufficient and the problems such as corrosion and damage, and by lower substrate
Via hole and transparent electrode remove together needs to change three exposure masks altogether, increases manufacturing cost, since high pixel density, narrow frame etc. are wanted
The factors such as close, semiconductor bed course and grid cutting-edge structure are routed caused by asking, therefore, it is necessary to one kind can overcome the above technology
The modified GOA circuit design of problem.
Summary of the invention
In view of this, the present invention provides a kind of manufacturing method of display panel, to solve the gold of GOA circuit in the prior art
Belong to signal wire the problem of route is burnt due to static discharge at cabling, reduces display panel caused by static discharge
Fraction defective.
To reach foregoing purpose of the invention, one embodiment of the invention provides a kind of display panel, the display panel packet
It includes:
An electrostatic discharge protection circuit is arranged on the first substrate and connects a GOA circuit for one first substrate and a second substrate,
One end of the electrostatic discharge protection circuit and the GOA circuit connection is equipped with a short-circuited conducting sleeve；
One the first metal layer, the first metal layer setting is on the first substrate；
One first separation layer, first separation layer are arranged on the first metal layer；
One second metal layer, the second metal layer are arranged on first separation layer；
One second separation layer, second separation layer are arranged in the second metal layer；
One via hole is arranged on the first metal layer；
One first transparency electrode is arranged in the via hole, and the first transparency electrode passes through described in via hole connection
The first metal layer and the second metal layer；And
One second transparency electrode, on the second substrate, the first area in the second transparency electrode is eclipsed for setting
Removal is carved, the first area is corresponding with the first transparency electrode.
In one embodiment of this invention, one first photic etching material is set in the first transparency electrode, described
One second photic etching material, the first photic etching material and the second photic etching material are set in second transparency electrode
Expect reflexive each other, so that being formed simultaneously the first transparency electrode, and makes saturating with described first in the second transparency electrode
Prescribed electrode corresponding section is etched removal.
In one embodiment of this invention, the electrostatic discharge protection circuit is the non-display area that the display panel is arranged in
In domain, the first area of the second transparency electrode is located at the short-circuited conducting sleeve, and the short-circuited conducting sleeve further includes multiple electricity
Hold, the both ends of the short-circuited conducting sleeve connect the GOA circuit and a public electrode.
In one embodiment of this invention, the short-circuited conducting sleeve has a first capacitor, one second capacitor and third electricity
Hold, the first capacitor is connected with second capacitor, and the third capacitor is parallel to the first capacitor and second electricity
Hold.
Another embodiment of the present invention provides another display panel, the display panel includes:
An electrostatic discharge protection circuit is arranged on the first substrate and connects a GOA circuit for one first substrate and a second substrate,
One end of the electrostatic discharge protection circuit and the GOA circuit connection is equipped with a short-circuited conducting sleeve；
One the first metal layer, the first metal layer setting is on the first substrate；
One first separation layer, first separation layer are arranged on the first metal layer；
One second metal layer, the second metal layer are arranged on first separation layer；
One second separation layer, second separation layer are arranged in the second metal layer；
One via hole is located on the first metal layer；
One first transparency electrode is arranged in the via hole, and the first transparency electrode passes through described in via hole connection
The first metal layer and the second metal layer；
One second transparency electrode, setting is on the second substrate；And
One photoresist spacer, is covered in the first transparency electrode, obstructs the first transparency electrode and described second
Electric connection between transparent electrode.
In one embodiment of this invention, the electrostatic discharge protection circuit is the non-display area that the display panel is arranged in
In domain, the photoresist spacer of the second transparency electrode is located at the short-circuited conducting sleeve, and the short-circuited conducting sleeve further includes multiple
The both ends of capacitor, the short-circuited conducting sleeve connect the GOA circuit and a public electrode.
In one embodiment of this invention, the short-circuited conducting sleeve has a first capacitor, one second capacitor and third electricity
Hold, the first capacitor is connected with second capacitor, and the third capacitor is parallel to the first capacitor and second electricity
Hold.
Another embodiment of the present invention provides the manufacturing method of another display panel, the manufacturing method comprising steps of
A first metal layer, one first separation layer, a second metal layer and one second are successively formed on a first substrate
Separation layer；
First separation layer, the second metal layer and second separation layer are lost using one first exposure mask
It carves, forms a via hole, a first transparency electrode is set on the position for corresponding to the via hole, the first transparency electrode passes through
The via hole connects the first metal layer and the second metal layer；
One the second substrate is provided, and forms a second transparency electrode on the second substrate；And
The second transparency electrode is etched using one second exposure mask, while removing and corresponding to the described first transparent electricity
One first area of the second transparency electrode of the position of pole, to obstruct the first transparency electrode and the described second transparent electricity
Electric connection between pole.
In one embodiment of this invention, it is set in a non-display area of the display panel on the first substrate
It sets an electrostatic discharge protection circuit and connects a GOA circuit, and in an end of the electrostatic discharge protection circuit and the GOA circuit connection
Connect a short-circuited conducting sleeve.
In one embodiment of this invention, the manufacturing method further include: be arranged in the first transparency electrode respectively
One second photic etching material, the first photic erosion is arranged in one first photic etching material in the second transparency electrode
Material and the second photic etching material reflexive each other are carved, so that when being etched using second exposure mask, while shape
At the first transparency electrode a pattern and etch opposite with the pattern of the first transparency electrode described second
The first area of transparent electrode.
Compared with prior art, the present invention provides a kind of manufacturing method of display panel, can improve GOA circuit
The new method of the electrostatic protection performance of signal wire at metal routing, the transparent electrode by removing upper substrate may wound mutually
The region at place, preventing display panel, route is burnt due to static discharge at short-circuited conducting sleeve, improves the electrostatic protection of display panel
Can, the process and cost for using exposure mask are reduced, the competitiveness of product is improved.
For above content of the invention can be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate institute's accompanying drawings, makees
Detailed description are as follows:
Detailed description of the invention
Fig. 1 is the schematic diagram of the position of a short-circuited conducting sleeve of a display panel of the invention.
Fig. 2 is the equivalent circuit diagram of a short-circuited conducting sleeve of a display panel of the invention.
Fig. 3 is the schematic diagram of a display panel of first embodiment of the invention.
Fig. 4 is the schematic diagram of a display panel of second embodiment of the invention.
Fig. 5 is the flow chart of a manufacturing method of a display panel of first embodiment of the invention.
Fig. 6 is the flow chart of a manufacturing method of a display panel of second embodiment of the invention.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention
Example.Furthermore the direction term that the present invention is previously mentioned, for example, above and below, top, bottom, front, rear, left and right, inside and outside, side, surrounding, in
Centre, it is horizontal, laterally, vertically, longitudinally, axial direction, radial direction, top layer or lowest level etc., be only the direction with reference to annexed drawings.Cause
This, the direction term used is to illustrate and understand the present invention, rather than to limit the present invention.
It should be noted that all statements for using " first " and " second " are for differentiation two in the embodiment of the present invention
The non-equal entity of a same names or non-equal parameter, it is seen that " first ", " second " do not answer only for the convenience of statement
It is interpreted as the restriction to the embodiment of the present invention, subsequent embodiment no longer illustrates this one by one
As stated in the background art, the existing solution overwhelming majority is to be that the via hole for removing lower substrate or increase is arranged
Upper and lower base plate distance, to prevent upper and lower base plate from short circuit occurs.But the transparent electrode for removing lower substrate can make via hole protection deficiency
And the problems such as burn into damages occurs, and if lower substrate via hole and transparent electrode to be removed to three exposure masks of needs altogether, need together
It wants multiple working procedure and increases manufacturing cost, and increase upper and lower base plate distance and be then unfavorable for reducing the thickness of existing display panel.
Fig. 1 and Fig. 2 are please referred to, Fig. 1 is the schematic diagram of the position of the short-circuited conducting sleeve 24,25 of display panel 20 of the invention, Fig. 2
It is the equivalent circuit diagram of the short-circuited conducting sleeve 24,25 of display panel 20 of the invention.Display panel 20 of the invention includes viewing area 21
And non-display area 22, a GOA circuit 23, a plurality of GOA signal wire 28,29,30 and a plurality of are equipped in the non-display area 22
Public electrode wire 26,27, a plurality of GOA signal wire 28,29,30 connect the GOA circuit 23 and transmit GOA signal to institute
Grid, the source-drain electrode in viewing area 21 are stated, the public electrode wire connects a public electrode and transmits driving signal to drive
The display panel.An electrostatic discharge protection circuit 31,32, institute are respectively provided in the first end and second end of each GOA signal wire
It states electrostatic discharge protection circuit 31,32 and connects a GOA signal wire and a public electrode wire, to form short-circuited conducting sleeve 24,25.The electrostatic is anti-
Protection circuit 31,32 includes a capacitor, optionally includes at least two capacitors being mutually in parallel.In another embodiment of the present invention
In, the short-circuited conducting sleeve 24,25 can also include an at least capacitor, and the short-circuited conducting sleeve has a first capacitor 33, one second capacitor
34 and a third capacitor 35, the first capacitor 33 connect with second capacitor 34, the third capacitor 35 is parallel to institute
State first capacitor 33 and second capacitor 34.The capacitor 33,34,35 connects the GOA circuit 23 and a public electrode wire
26,27, prevent excessive voltage from wound circuit.
Referring to Fig. 3, Fig. 3 is the schematic diagram of a display panel 200 of first embodiment of the invention.The invention shows faces
One first substrate 210 is provided in plate 200；Successively formed on the first substrate 210 the first metal layer 230, one first every
Absciss layer 240, a second metal layer 250 and one second separation layer 280.
In one embodiment of the present invention, the first metal layer 230 is a signal line layer, first separation layer
240 be an insulating layer, and second separation layer 280 is a protective layer, is contaminated or flows out to avoid the liquid crystal poured into.
Using one first exposure mask to first separation layer 240, the second metal layer 250 and second separation layer
280 are etched, and form a via hole 260, and a first transparency electrode 261, institute is arranged on the position for corresponding to the via hole 260
It states first transparency electrode 261 and the first metal layer 230, the second metal layer 250 is connected by the via hole 260, it is described
One electrostatic discharge protection circuit 31,32 is set on first substrate 210 and connects a GOA circuit, the electrostatic discharge protection circuit and GOA electricity
One end of road connection is equipped with a short-circuited conducting sleeve.
One the second substrate 220 is provided, and forms a second transparency electrode 270 in the second substrate 220.Use one
Two exposure masks are etched the second transparency electrode 270, while removing the position for corresponding to the first transparency electrode 261
One first area 271 of the second transparency electrode 270.
The electrostatic discharge protection circuit may be provided in the non-display area of the display panel 200, the second transparent electricity
The first area 270 of pole 270 is located at the short-circuited conducting sleeve.The first substrate 210 can be array basal plate, described
The second substrate can be a color membrane substrates, and the material of the substrate can be glass.
In one embodiment of the present invention, one end of the signal wire on the first metal layer 230 connects the GOA electricity
One signal wire on road, second that frequency signal line connection the second substrate 220 is formed by the second metal layer 250 are transparent
Electrode 270.In one embodiment of the present invention, the second transparency electrode is a public electrode, is located at the second substrate
220 surface towards first substrate 210, so that when occurring electrostatic on display panel, by the second metal layer 250
By the Electro-static Driven Comb in the viewing area of the display panel 200 to the non-display area, to avoid described in electrostatic entrance
The situation that short circuit occurs between metal layer or transparent electrode is caused inside viewing area, so as to the circuit and component in protection panels.
At the via hole 260, the first metal layer 230 and the top of the second metal layer 250 described first every
Absciss layer 240 and second separation layer 280 can be excavated by a variety of methods, such as: etching etc., the first transparency electrode
261 are formed in the via hole 260 and extend to except the via hole 260, by the metal routing (i.e. described first of different layers
Metal layer 230 and the second metal layer 250) it connects.
In one embodiment of the present invention, the manufacturing method further includes being arranged in the first transparency electrode 261
One second photic etching material is arranged in one first photic etching material in the second transparency electrode 270, and described first is photic
Material and the second photic etching material reflexive each other are etched, so that when being etched using second exposure mask, it is described
First transparency electrode 261 forms the pattern of the first transparency electrode 361, and at the same time to the first transparency electrode is corresponded to
The first area 271 of the second transparency electrode 270 of 261 pattern is etched.
Correspond to described the first of the second transparency electrode 270 of the position of the first transparency electrode 270 in removal
Behind region 271, a liquid crystal layer 290 is provided between the first substrate 210 and the second substrate 220.By first base
Plate 210 stands with 220 groups of the second substrate and is bonded.
The present invention is used only an exposure mask and etches the first transparency electrode 261 and the second transparency electrode simultaneously
270 first area 271 is effectively prevented between the first transparency electrode 261 and the second transparency electrode 270 and sends out
It gives birth to static discharge and burns, effectively reduce the width of the frame of display panel, being conducive to display panel can realize in narrow frame
Complicated GOA layout by static discharge without being burnt.
In another implementation method of the invention, the first photic etching material is the photic etching material of positivity, and
The second photic etching material is the photic etching material of negativity, so that after UV irradiation, in the first transparency electrode 261
The photic etching material of the positivity washed away, remain with the positivity on the part other than the first transparency electrode 261
Photic etching material and be etched, and the first area 271 of the second transparency electrode 270 remains with the negativity
Photic etching material and be etched.Therefore, the first transparency electrode 261 and the etching first transparency electrode are formed simultaneously
The first area 271 of the 261 corresponding second transparency electrodes 270.
In another implementation method of the invention, the first photic etching material is the photic etching material of negativity, and
It is described second it is photic etching material be positivity photic etching material so that UV irradiation after, the first transparency electrode 261 with
The photic etching material that the negativity is remained on outer part is retained and generates etching, and the second transparency electrode 270
The first area 271 on remain with the photic etching material of the positivity and be etched, in the second transparency electrode 270
The photic etching material of the positivity washed away.Therefore, the first transparency electrode 261 and etching described first are formed simultaneously
The first area 271 of the corresponding second transparency electrode 270 of transparent electrode 261.
The photic etching material of the positivity occurs photochemical reaction after UV irradiation and is removed, and the negativity is photic
Etching material crosslinks solidification after UV irradiation and is retained.
From figure 3, it can be seen that unfolded area between the first transparency electrode 261 and the second transparency electrode 270
Domain significantly reduces the first transparency electrode 261 with the second transparency electrode 270 at overlapped region and neighbour
The probability that static discharge occurs near position, makes the short-circuited conducting sleeve in the electrostatic discharge protection circuit that can normally play work under strong electrostatic
With.In addition, the first area 271 for the second transparency electrode 270 for corresponding to the region of the first transparency electrode 261 is gone
Except not needing to increase additional process, it is only necessary to which use exposure mask corresponding with the first transparency electrode 270 is to described second
The first area 271 of transparent electrode 270 performs etching simultaneously, therefore saves multiple working procedure and cost.
The display panel 300 of second embodiment of the invention is similar to the display panel 200 of first embodiment of the invention, and big
Similar elements title is continued to use in cause, but the difference of second embodiment is: the display panel 300 of the second embodiment further increases
If a photoresist spacer 400.The advantages of features described above is: the photoresist spacer 400 prevents mutual at the short-circuited conducting sleeve
Short circuit occurs for the close first transparency electrode 361 and the second transparency electrode 370, and does not need additionally to increase exposure mask
Process can be applicable in a second substrate in the display panel for not needing patterning requirements.Therefore, the second transparency electrode
Exposure mask can not only be shared with the first transparency electrode 361, and multiple working procedure and its cost can be saved, it is further opposite to increase
The yield for adding product overcomes the problems, such as that general technology is short-circuit due to static discharge.
Fig. 4 is the schematic diagram of the display panel 300 of second embodiment of the invention.It is mentioned in a display panel 300 of the invention
For a first substrate 310；A first metal layer 330, one first separation layer 340, one are successively formed on the first substrate 310
Second metal layer 350 and one second separation layer 380.
In one embodiment of the present invention, wherein the first metal layer 330 is a signal line layer, first isolation
Layer 340 is an insulating layer, and second separation layer 380 is a protective layer, is contaminated or flows out to avoid the liquid crystal poured into.
Using one first exposure mask to first separation layer 340, the second metal layer 350 and second separation layer
380 are etched, and form a via hole 360, form a first transparency electrode 361, institute on the position for corresponding to the via hole 360
It states first transparency electrode 361 and is connect by the via hole 360 with the first metal layer 330, the second metal layer 350；Institute
It states and an electrostatic discharge protection circuit one GOA circuit of connection, the electrostatic discharge protection circuit and the GOA circuit is set on first substrate 310
One end of connection is equipped with a short-circuited conducting sleeve.
A photoresist layer is formed on the position for corresponding to the first transparency electrode 361；And it is same using one second exposure mask
When the photoresist layer and the first transparency electrode 361 are etched, to form a photoresist spacer 400, the photoresist
One region of spacer 400 corresponds to a region of the first transparency electrode 361；
After forming the photoresist spacer, a second substrate 320 is provided, and form one in the second substrate 320
Second transparency electrode 370；One liquid crystal layer 390 is provided between the first substrate 310 and the second substrate 320；And it will
The first substrate 310 stands with 320 groups of the second substrate and is bonded.
The electrostatic discharge protection circuit may be provided in a non-display area of the display panel 300, the photoresist interval
Object 400 is located at the short-circuited conducting sleeve.The first substrate 310 can be array basal plate, and the second substrate 320 can be
The material of one color membrane substrates, the substrate can be glass.
In one embodiment of the present invention, one end of the signal wire on the first metal layer 330 connects GOA circuit
Signal wire is formed by the second transparency electrode 370 of frequency signal line connection the second substrate 320 in the second metal layer 350.
Optionally, the second transparency electrode 370 is a public electrode, positioned at the second substrate 320 towards first substrate 310
One surface, so that when occurring electrostatic on display panel, by the second metal layer 330 by the institute of the display panel 300
Electro-static Driven Comb in viewing area is stated to the non-display area, thus avoid electrostatic enter inside the viewing area cause metal layer or
The situation of short circuit occurs between transparent electrode, to protect the circuit and component in display panel.
At the via hole 360, the first metal layer 330 and the top of the second metal layer 350 described first every
Absciss layer 340 and second separation layer 380 can be excavated by the methods of etching, and the first transparency electrode 361 is formed in institute
It states in via hole 360 and extends to except the via hole 360, by metal routing (i.e. described 330 He of the first metal layer of different layers
The second metal layer 350) it connects.
In one embodiment of the present invention, the photoresist spacer 400 not only all covers the entire via hole 360
Lid, while the outwardly extending most long-range place of the first transparency electrode 361 is also covered, to be covered on the first transparency electrode
In 361 whole surface.
In one embodiment of the present invention, the pattern of the photoresist spacer 400 is than described at the via hole 360
The size of one transparent electrode 361 is bigger, therefore the entire first transparency electrode 361 can be completely covered.It is real of the invention one
It applies in mode, the photoresist spacer 400 is insulation, therefore the photoresist spacer 400 can be transparent by described first
Electrode 361 is kept apart with the second transparency electrode 370, prevents them from short circuit, the reduction to GOA panel frame size occurs
Design with narrow frame is very favorable.
As can be seen from Figure 4, there are the photoresists between the first transparency electrode 361 and the second transparency electrode 370
Introns, significantly reduce the first transparency electrode 361 at the overlapped region of the second transparency electrode 370 and
The probability of static discharge occurs for adjacent position, and the short-circuited conducting sleeve in the electrostatic discharge protection circuit is also enable normally to act on.This
Outside, it does not need to increase additional process, it is only necessary to be formed together on the first substrate 310 with the first transparency electrode 361
The photoresist spacer 400, therefore save multiple working procedure and cost.
The material of the first metal layer and second metal layer can be selected from gold, silver, copper, iron, tin, lead, hafnium, tungsten, key,
The metals such as neodymium, titanium, tantalum, aluminium, zinc, above-mentioned alloy or combinations of the above.
The transparent conductive material that the first transparency electrode and the second transparency electrode use can be selected from the oxidation of indium tin
Object, indium-zinc oxide, indium tin zinc oxide, hafnium oxide, zinc oxide, aluminium oxide, aluminium tin-oxide, aluminium zinc oxide, cadmium tin oxygen
Compound, cadmium zinc oxide etc. or combinations of the above.
Fig. 5 is the flow chart of the manufacturing method of the display panel of first embodiment of the invention, the manufacturing method packet
It includes:
Step S101: a first substrate 210 is provided；
Step S102: successively formed on the first substrate 210 the first metal layer 230, one first separation layer 280,
One second metal layer 250 and one second separation layer 280；
Step S103: using one first exposure mask to first separation layer 240, the second metal layer 250 and described
Second gold medal separation layer 280 is etched, and forms a via hole 260, and setting one first is saturating on the position for corresponding to the via hole 260
Prescribed electrode 261, the first transparency electrode 261 connect the first metal layer 230 and second gold medal by the via hole 260
Belong to layer 250；
Step S104: a second substrate 220 is provided, forms a second transparency electrode 270 in the second substrate 220；
And
Step S105: being etched the second transparency electrode 270 using one second exposure mask, while removing and corresponding to institute
A first area 271 of the second transparency electrode 270 of the position of first transparency electrode 261 is stated, to obstruct described first thoroughly
Electric connection between prescribed electrode 261 and the second transparency electrode 270.
In one embodiment of this invention, the manufacturing method further include:
Step S106: an electrostatic discharge protection circuit is set on the first substrate 210 and connects a GOA circuit, the electrostatic is anti-
One end of protection circuit and the GOA circuit connection is equipped with a short-circuited conducting sleeve.
In one embodiment of this invention, the manufacturing method further include:
Step S107: one first photic etching material is set in the first transparency electrode 261 respectively, described second
One second photic etching material, the first photic etching material and the second photic etching material are set in transparent electrode 270
Reflexive each other is expected, so that being formed simultaneously a figure of the first transparency electrode 261 when being etched using second exposure mask
Case and firstth area for etching the second transparency electrode 270 opposite with the pattern of the first transparency electrode
Domain.
Fig. 6 is the flow chart of the manufacturing method of the display panel of second embodiment of the invention, the manufacturing method packet
It includes:
Step S201: a first substrate 310 is provided；
Step S202: successively formed on the first substrate 310 the first metal layer 330, one first separation layer 340,
One second metal layer 350 and one second separation layer 380；
Step S203: using one first exposure mask to first separation layer 340, the second metal layer 350 and described
Second separation layer 380 is etched, and forms a via hole 360, and it is transparent that one first is formed on the position for corresponding to the via hole 360
Electrode 400, the first transparency electrode 400 pass through the via hole 360 and the first metal layer 330 and the second metal layer
350 connections；
Step S204: a photoresist layer 400 is formed on the position for corresponding to the first transparency electrode 361；And
Step S205: the photoresist layer 400 and the first transparency electrode 361 are carried out simultaneously using one second exposure mask
Etching, to form a photoresist spacer 400, the size of the photoresist spacer 400 corresponds to the first transparency electrode 361
Size more effectively avoids display screen to obstruct the electric connection between the first transparency electrode and the second transparency electrode
There is the phenomenon that light leakage, improves the display effect of display screen.
As described above, compared to existing display panel in the case where carrying out +/- 10 kilovolts of voltage it occur frequently that damage by static electricity, and
The disadvantages of leading to picture abnormal, circuit damage, display panel described in multiple embodiments of the invention form one in non-display area
Short-circuited conducting sleeve, and capacitor is set on short-circuited conducting sleeve and connects public electrode and GOA signal wire simultaneously, prevent GOA circuit by static shock
Wound.In addition, the present invention further passes through the first area for removing the second transparency electrode of the second substrate, or
One photoresist spacer of the corresponding position formation of first transparency electrode, effectively avoids the first substrate and second base
Short circuit occurs between plate under strong voltage, thus protect display panel not caused by the electrostatic discharge testing voltage due to occur it is short
Road is even damaged and is directly scrapped, and then improves the yield and stability of display panel, the photoresist interval at dead ring
Object more effectively avoids display screen from the phenomenon that light leakage occur, improves the display effect of display screen.
The present invention is described by above-mentioned related embodiment, however above-described embodiment is only to implement example of the invention.
It must be noted that, it has been disclosed that embodiment be not limiting as the scope of the present invention.On the contrary, being contained in the spirit of claims
And range modification and impartial setting be included in the scope of the present invention.
Claims (10)
1. a kind of display panel, it is characterised in that: the display panel includes:
An electrostatic discharge protection circuit is arranged on the first substrate and connects a GOA circuit for one first substrate and a second substrate, described
One end of electrostatic discharge protection circuit and the GOA circuit connection is equipped with a short-circuited conducting sleeve；
One the first metal layer, the first metal layer setting is on the first substrate；
One first separation layer, first separation layer are arranged on the first metal layer；
One second metal layer, the second metal layer are arranged on first separation layer；
One second separation layer, second separation layer are arranged in the second metal layer；
One via hole is arranged on the first metal layer；
One first transparency electrode is arranged in the via hole, and the first transparency electrode passes through via hole connection described first
Metal layer and the second metal layer；And
One second transparency electrode, on the second substrate, the first area in the second transparency electrode is etched for setting
It removes, the first area is corresponding with the first transparency electrode.
2. display panel as described in claim 1, it is characterised in that: one first photic erosion is arranged in the first transparency electrode
Material is carved, one second photic etching material, the first photic etching material and described are set in the second transparency electrode
Second photic etching material reflexive each other, so that being formed simultaneously the first transparency electrode, and makes the second transparency electrode
In with the first transparency electrode corresponding section be etched removal.
3. display panel as described in claim 1, it is characterised in that: the electrostatic discharge protection circuit is arranged in the display surface
In one non-display area of plate, the first area of the second transparency electrode is located at the short-circuited conducting sleeve, the short circuit
Ring further includes multiple capacitors, and the both ends of the short-circuited conducting sleeve connect the GOA circuit and a public electrode.
4. display panel as claimed in claim 3, it is characterised in that: the short-circuited conducting sleeve has a first capacitor, one second electricity
Hold and a third capacitor, the first capacitor are connected with second capacitor, the third capacitor is parallel to first electricity
Appearance and second capacitor.
5. a kind of display panel, it is characterised in that: the display panel includes:
An electrostatic discharge protection circuit is arranged on the first substrate and connects a GOA circuit for one first substrate and a second substrate, described
One end of electrostatic discharge protection circuit and the GOA circuit connection is equipped with a short-circuited conducting sleeve；
One the first metal layer, the first metal layer setting is on the first substrate；
One first separation layer, first separation layer are arranged on the first metal layer；
One second metal layer, the second metal layer are arranged on first separation layer；
One second separation layer, second separation layer are arranged in the second metal layer；
One via hole is located on the first metal layer；
One first transparency electrode is arranged in the via hole, and the first transparency electrode passes through via hole connection described first
Metal layer and the second metal layer；
One second transparency electrode, setting is on the second substrate；And
One photoresist spacer, is covered in the first transparency electrode, obstructs the first transparency electrode and described second transparent
Electric connection between electrode.
6. display panel as claimed in claim 5, it is characterised in that: the electrostatic discharge protection circuit is arranged in the display surface
In one non-display area of plate, the photoresist spacer of the second transparency electrode is located at the short-circuited conducting sleeve, described short
Road ring further includes multiple capacitors, and the both ends of the short-circuited conducting sleeve connect the GOA circuit and a public electrode.
7. display panel as claimed in claim 6, it is characterised in that: the short-circuited conducting sleeve has a first capacitor, one second electricity
Hold and a third capacitor, the first capacitor are connected with second capacitor, the third capacitor is parallel to first electricity
Appearance and second capacitor.
8. a kind of manufacturing method of display panel, the manufacturing method comprising steps of
A first metal layer, one first separation layer, a second metal layer and one second isolation are successively formed on a first substrate
Layer；
First separation layer, the second metal layer and second separation layer are etched using one first exposure mask,
A via hole is formed, a first transparency electrode is set on the position for corresponding to the via hole, the first transparency electrode passes through institute
It states via hole and connects the first metal layer and the second metal layer；
One the second substrate is provided, and forms a second transparency electrode on the second substrate；And
The second transparency electrode is etched using one second exposure mask, while removing and corresponding to the first transparency electrode
One first area of the second transparency electrode of position, with obstruct the first transparency electrode and the second transparency electrode it
Between electric connection.
9. manufacturing method as claimed in claim 8, it is characterised in that: on the first substrate the one of the display panel
One electrostatic discharge protection circuit is set in non-display area and connects a GOA circuit, and in the electrostatic discharge protection circuit and GOA electricity
One end of road connection connects a short-circuited conducting sleeve.
10. manufacturing method as claimed in claim 8, it is characterised in that: the manufacturing method further include: respectively described first
One first photic etching material is set in transparent electrode, one second photic etching material is set in the second transparency electrode,
The first photic etching material and the second photic etching material reflexive each other, so that when using second exposure mask to carry out
When etching, it is formed simultaneously a pattern of the first transparency electrode and etches the pattern phase with the first transparency electrode
The first area of the anti-second transparency electrode.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811176788.6A CN109346463B (en) | 2018-10-10 | 2018-10-10 | Display panel with electrostatic protection and manufacturing method thereof |
| PCT/CN2019/072523 WO2020073558A1 (en) | 2018-10-10 | 2019-01-21 | Display panel having function of electrostatic protection, and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811176788.6A CN109346463B (en) | 2018-10-10 | 2018-10-10 | Display panel with electrostatic protection and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN109346463A true CN109346463A (en) | 2019-02-15 |
| CN109346463B CN109346463B (en) | 2020-11-03 |
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| WO (1) | WO2020073558A1 (en) |
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| CN110071119A (en) * | 2019-04-09 | 2019-07-30 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and display panel |
| CN110930921A (en) * | 2019-11-25 | 2020-03-27 | 深圳市华星光电半导体显示技术有限公司 | GOA circuit and display panel comprising same |
| CN111129036A (en) * | 2019-12-25 | 2020-05-08 | Tcl华星光电技术有限公司 | Array substrate, preparation method thereof and display panel |
| WO2020206751A1 (en) * | 2019-04-08 | 2020-10-15 | 深圳市华星光电半导体显示技术有限公司 | Display panel, display module, and manufacturing method |
| WO2021012356A1 (en) * | 2019-07-22 | 2021-01-28 | Tcl华星光电技术有限公司 | Liquid crystal display panel and display device thereof |
| WO2021035927A1 (en) * | 2019-08-27 | 2021-03-04 | Tcl华星光电技术有限公司 | Liquid crystal display panel and preparation method |
| WO2022141519A1 (en) * | 2020-12-30 | 2022-07-07 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display panel, fabrication method therefor, and display device |
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| CN112071862B (en) * | 2020-09-03 | 2024-01-19 | Tcl华星光电技术有限公司 | Light-emitting panel, preparation method thereof and display panel |
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Also Published As
| Publication number | Publication date |
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| WO2020073558A1 (en) | 2020-04-16 |
| CN109346463B (en) | 2020-11-03 |
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