CN109338302A - A kind of preparation method of synthetic graphite adhesion without adhesiver composite material - Google Patents
A kind of preparation method of synthetic graphite adhesion without adhesiver composite material Download PDFInfo
- Publication number
- CN109338302A CN109338302A CN201810968386.3A CN201810968386A CN109338302A CN 109338302 A CN109338302 A CN 109338302A CN 201810968386 A CN201810968386 A CN 201810968386A CN 109338302 A CN109338302 A CN 109338302A
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- Prior art keywords
- synthetic graphite
- metal layer
- preparation
- adhesiver
- composite material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of preparation methods of synthetic graphite adhesion without adhesiver composite material, comprising the following steps: synthetic graphite to be processed is placed in vacuum environment；Surface clean is carried out to synthetic graphite, removes the vapour molecule on synthetic graphite surface；It sputters to form metal layer on synthetic graphite surface with sputtering way；Continue plating on the metal layer in a manner of vapor deposition again and forms thickening metal layer；Heat treatment so that thickening metal layer is in a molten state, thickeies metal layer and the abundant connecting shaping of synthetic graphite after cooling, so that synthetic graphite surface forms metal heat-conducting layer using the transient heating within the time less than 0.1 second of 500 DEG C or more of temperature；Re-plating forms protective layer on metal heat-conducting layer, completes preparation.Binding force of the present invention is stronger, and overall structure is not stratified, and anti-intensity with higher guarantees lightening while promoting quality.
Description
Technical field
The invention belongs to graphite material technical field, specifically a kind of preparation of synthetic graphite adhesion without adhesiver composite material
Method.
Background technique
Graphite is more and more used as heat sink material because of its thermal conductivity with higher.Graphite and highly heat-conductive material
(copper, aluminium) is combined as thermal component.Traditional graphite composite material generallys use graphite, double-sided adhesive, copper foil/aluminium foil group
Conjunction mode, sticking two-faced adhesive tape on graphite, copper foil are pasted on double-sided adhesive again.Moreover, because the thickness of copper foil is generally higher than 5 microns
More than, therefore have stronger rub resistance power and scratch-resistant, intensity higher.But since to be generally higher than 5 micro- for the thickness of copper foil
Meter or more, so that whole thickness is larger, typically larger than 27 microns, it is difficult to which product is made more frivolous.Since centre utilizes
For double-sided adhesive as bond, the heat-resisting quantity of double-sided adhesive itself is poor, cause it is whole be unable to high temperature resistant, once encounter higher temperatures
Degree, has exceeded the resistance to temperature value of double-sided adhesive, double-sided adhesive can melt, so that copper foil and graphite fall off, can not continue to use, and two-sided
The binding force of glue bond is limited.In addition, the thermal conductivity due to double-sided adhesive is poor, but also the thermal conductivity of cylinder foil and graphite is difficult to
It is played to effective, influences whole thermal conductivity.
In addition, generally being adopted there are also one is one layer of layers of copper or aluminium layer is plated by the way of plating directly on synthetic graphite
It is prepared with the mode of sputter.By plating, intermediate gelatine layer is eliminated, whole thickness is reduced, can be made more frivolous.And
And layers of copper and the binding force of synthetic graphite are stronger.But layers of copper is generated on synthetic graphite due to only using a sputter,
The compactness for obtaining layers of copper is poor, and metal structure is sufficiently complete.The mode of plating generally can be only formed one layer of very thin layers of copper, therefore
Intensity is lower, not scratch resistance and not rub resistance.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of preparation method of synthetic graphite adhesion without adhesiver composite material, in conjunction with
Power is stronger, and overall structure is not stratified, and anti-intensity with higher guarantees lightening while promoting quality.
In order to solve the above-mentioned technical problem, the present invention takes following technical scheme:
A kind of preparation method of synthetic graphite adhesion without adhesiver composite material, comprising the following steps:
Synthetic graphite to be processed is placed in vacuum environment；
Surface clean is carried out to synthetic graphite, removes the vapour molecule on synthetic graphite surface；
It sputters to form metal layer on synthetic graphite surface with sputtering way；
Continue plating on the metal layer in a manner of vapor deposition again and forms thickening metal layer；
Heat treatment is in using the transient heating within the time less than 0.1 second of 500 DEG C or more of temperature so that thickening metal layer
Molten condition thickeies metal layer and the abundant connecting shaping of synthetic graphite after cooling, so that synthetic graphite surface forms metal heat-conducting
Layer；
Re-plating forms protective layer on metal heat-conducting layer, completes preparation.
The metal layer with a thickness of 1-2 microns.
It is described thicken metal layer with a thickness of 6-20 microns.
The protective layer is formed using nickel sputter, and the thickness of the protective layer is less than or equal to 1 micron.
The vacuum pressure of the vacuum environment is less than or equal to 10-2Pa。
The cleaning is specifically, emit argon ion bombardment synthetic graphite surface by high-power intermediate frequency power supply, so that synthesis
The vapour molecule of graphite surface is removed.
The metal layer is layers of copper or aluminium layer.
Metal identical with metal layer is used to be electroplated when the vapor deposition for target.
The present invention forms the metal layer of higher caliper in such a way that sputter and vapor deposition be combined with each other, and passes through at heat
Reason, so that metal layer is fully integrated together with synthetic graphite, it is whole not stratified, pull resistance and integral strength are improved, and
Since metal layer thickness is larger, scratch-resistant is strong and rub resistance is good.In addition, there is stronger thermal conductivity due to overall structure
Can, and electric conductivity is also high.
Detailed description of the invention
Attached drawing 1 is the diagrammatic cross-section for the graphite composite material that the present invention is prepared.
Specific embodiment
To further understand the features of the present invention, technological means and specific purposes achieved, function, below with reference to
Present invention is further described in detail with specific embodiment for attached drawing.
Present invention discloses a kind of preparation methods of synthetic graphite adhesion without adhesiver composite material, comprising the following steps:
Synthetic graphite to be processed is placed in vacuum environment, vacuum pressure is preferably smaller than equal to 10-2Pa。
Surface clean is carried out to synthetic graphite, removes the vapour molecule on synthetic graphite surface.Emit argon using intermediate frequency power supply
The surface of ion bombardment synthetic graphite is surface-treated, and the vapour molecule on more thorough removal synthetic graphite surface is capable of.
It is more smooth convenient for subsequent electroplating processes by removing vapour molecule, so that plating metal preferably combines.
It sputters to form the layers of copper that a layer thickness is 1-2 microns on synthetic graphite surface by magnetically controlled DC sputtering copper target material.
Again in a manner of vapor deposition equally continued in layers of copper using copper as target plating formed with a thickness of 6-20 micron add
Thick copper layer so that layers of copper has better scratch-resistant and rub resistance, while improving intensity.
Heat treatment, using the transient heating within the time less than 0.1 second of 500 DEG C or more of temperature, so that thickening at layers of copper
In molten condition, layers of copper and the abundant connecting shaping of synthetic graphite are thickeied after cooling, so that 1 surface of synthetic graphite forms copper heat-conducting layer
2, as shown in Fig. 1.By keeping thickening layers of copper in a molten state, it can be completely combined and be molded on synthetic graphite, so that copper
Whole not stratified structure is formed between heat-conducting layer and synthetic graphite, and there is higher pull resistance.
Re-plating forms protective layer 3 on copper heat-conducting layer 2, completes preparation.Protective layer is formed using nickel sputter, the protective layer
Thickness be less than or equal to 1 micron.By the protective layer, it can prevent copper heat-conducting layer easily by extraneous interference and influence.
The present invention first forms layers of copper in synthetic graphite directly electroplating on surface by sputtering way, is then made in a manner of vapor deposition again
Copper layer thickness increases to 6-20 microns.Then layers of copper is made to melt complete molding structure using high temperature transient heating by heat treatment
On synthetic graphite, there is higher pull resistance, form whole not stratified structure.Have high-termal conductivity and electric conductivity, and
And on an electronic device, the electro-magnetic screen function of layers of copper can be preferably played, is ensureing high performance while accomplishing again
It is lightening, save middle layer.
It should be noted that these are only the preferred embodiment of the present invention, it is not intended to restrict the invention, although ginseng
According to embodiment, invention is explained in detail, for those skilled in the art, still can be to aforementioned reality
Technical solution documented by example is applied to modify or equivalent replacement of some of the technical features, but it is all in this hair
Within bright spirit and principle, any modification, equivalent replacement, improvement and so on should be included in protection scope of the present invention
Within.
Claims (8)
1. a kind of preparation method of synthetic graphite adhesion without adhesiver composite material, comprising the following steps:
Synthetic graphite to be processed is placed in vacuum environment；
Surface clean is carried out to synthetic graphite, removes the vapour molecule on synthetic graphite surface；
It sputters to form metal layer on synthetic graphite surface with sputtering way；
Continue plating on the metal layer in a manner of vapor deposition again and forms thickening metal layer；
Heat treatment is in using the transient heating within the time less than 0.1 second of 500 DEG C or more of temperature so that thickening metal layer
Molten condition thickeies metal layer and the abundant connecting shaping of synthetic graphite after cooling, so that synthetic graphite surface forms metal heat-conducting
Layer；
Re-plating forms protective layer on metal heat-conducting layer, completes preparation.
2. the preparation method of synthetic graphite adhesion without adhesiver composite material according to claim 1, which is characterized in that the metal
Layer with a thickness of 1-2 microns.
3. the preparation method of synthetic graphite adhesion without adhesiver composite material according to claim 2, which is characterized in that the thickening
Metal layer with a thickness of 6-20 microns.
4. the preparation method of synthetic graphite adhesion without adhesiver composite material according to claim 3, which is characterized in that the protection
Layer is formed using nickel sputter, and the thickness of the protective layer is less than or equal to 1 micron.
5. the preparation method of synthetic graphite adhesion without adhesiver composite material according to claim 4, which is characterized in that the vacuum
The vacuum pressure of environment is less than or equal to 10-2Pa。
6. the preparation method of synthetic graphite adhesion without adhesiver composite material according to claim 5, which is characterized in that the cleaning
Specifically, emitting argon ion bombardment synthetic graphite surface by high-power intermediate frequency power supply, so that the steam on synthetic graphite surface point
Son is removed.
7. the preparation method of synthetic graphite adhesion without adhesiver composite material according to claim 6, which is characterized in that the metal
Layer is layers of copper or aluminium layer.
8. the preparation method of synthetic graphite adhesion without adhesiver composite material according to claim 7, which is characterized in that the vapor deposition
Shi Caiyong metal identical with metal layer is that target is electroplated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810968386.3A CN109338302A (en) | 2018-08-23 | 2018-08-23 | A kind of preparation method of synthetic graphite adhesion without adhesiver composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810968386.3A CN109338302A (en) | 2018-08-23 | 2018-08-23 | A kind of preparation method of synthetic graphite adhesion without adhesiver composite material |
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| Publication Number | Publication Date |
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| CN109338302A true CN109338302A (en) | 2019-02-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810968386.3A Pending CN109338302A (en) | 2018-08-23 | 2018-08-23 | A kind of preparation method of synthetic graphite adhesion without adhesiver composite material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110331405A (en) * | 2019-07-18 | 2019-10-15 | 深圳前海量子翼纳米碳科技有限公司 | A kind of liquid metal and graphite composite radiating film and preparation method thereof |
| CN111394709A (en) * | 2020-04-30 | 2020-07-10 | 深圳市汉嵙新材料技术有限公司 | Metal-plated graphite sheet and preparation method thereof |
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| CN105624608A (en) * | 2015-12-29 | 2016-06-01 | 上海交通大学 | Preparation method of metal coating on surface of high-thermal-conductivity graphite film |
| US20170027089A1 (en) * | 2015-07-20 | 2017-01-26 | Jong Geun BAE | Multi-functional sheet for shielding electromagnetic waves and dissipating heat at high performance |
| CN107460483A (en) * | 2017-08-14 | 2017-12-12 | 苏州格优碳素新材料有限公司 | A kind of preparation method of graphite, copper composite heat conducting material |
| CN107611631A (en) * | 2017-09-01 | 2018-01-19 | 张启建 | The copper aluminium connection sheet and its production technology drawn for battery module both positive and negative polarity |
-
2018
- 2018-08-23 CN CN201810968386.3A patent/CN109338302A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458051A (en) * | 2010-10-19 | 2012-05-16 | 台光电子材料股份有限公司 | Manufacture method of substrate and structure used for simplifying preparation technology |
| US20170027089A1 (en) * | 2015-07-20 | 2017-01-26 | Jong Geun BAE | Multi-functional sheet for shielding electromagnetic waves and dissipating heat at high performance |
| CN105624608A (en) * | 2015-12-29 | 2016-06-01 | 上海交通大学 | Preparation method of metal coating on surface of high-thermal-conductivity graphite film |
| CN107460483A (en) * | 2017-08-14 | 2017-12-12 | 苏州格优碳素新材料有限公司 | A kind of preparation method of graphite, copper composite heat conducting material |
| CN107611631A (en) * | 2017-09-01 | 2018-01-19 | 张启建 | The copper aluminium connection sheet and its production technology drawn for battery module both positive and negative polarity |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110331405A (en) * | 2019-07-18 | 2019-10-15 | 深圳前海量子翼纳米碳科技有限公司 | A kind of liquid metal and graphite composite radiating film and preparation method thereof |
| CN110331405B (en) * | 2019-07-18 | 2022-02-25 | 深圳前海量子翼纳米碳科技有限公司 | Liquid metal and graphite composite heat dissipation film and preparation method thereof |
| CN111394709A (en) * | 2020-04-30 | 2020-07-10 | 深圳市汉嵙新材料技术有限公司 | Metal-plated graphite sheet and preparation method thereof |
| CN111394709B (en) * | 2020-04-30 | 2022-04-22 | 深圳市汉嵙新材料技术有限公司 | Metal-plated graphite sheet and preparation method thereof |
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