CN109287075A - A kind of anti-oxidation technique of pcb board copper face - Google Patents
A kind of anti-oxidation technique of pcb board copper face Download PDFInfo
- Publication number
- CN109287075A CN109287075A CN201811414944.8A CN201811414944A CN109287075A CN 109287075 A CN109287075 A CN 109287075A CN 201811414944 A CN201811414944 A CN 201811414944A CN 109287075 A CN109287075 A CN 109287075A
- Authority
- CN
- China
- Prior art keywords
- making sheet
- pcb
- copper face
- pcb board
- oxidation technique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of anti-oxidation techniques of pcb board copper face, comprising the following steps: carries out a pickling to the PCB making sheet that electro-coppering is completed, removes the oxide layer in PCB making sheet surface and hole；Surface and hole inner wall to PCB making sheet plate one layer of antioxidant, generate one layer of organic oxygen-proof film on surface and hole inner wall；Figure is protected hole wall and table copper using antioxidant method.The anti-oxidation technique application of copper face in this way, it can effectively prevent PCB making sheet in copper palpus residence time internal oxidition, the process residence time is set to extend, reducing the pad pasting that copper face oxidation influences, tightly short-circuit problem is not plated in infiltration, can effectively promote product quality and product yield.
Description
Technical field
The present invention relates to pcb board production technical fields, more particularly to a kind of anti-oxidation technique of pcb board copper face.
Background technique
PCB circuit board is the most crucial electronic device of each electronic equipment, generally is copper electroplating layer in surface, that is, hole.But
It is in current PCB circuit board manufacture craft, copper electroplating layer does not do anti-oxidation processing, and when process stops, plate face is oxidizable, copper
Face oxidation is easy to cause pad pasting not tightly infiltration plating short circuit, seriously affects product quality and product yield；And due to oxidizable, process
Residence time need to reduce very short.Therefore, it is necessary to improve and optimize to the prior art.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of anti-oxidation techniques of pcb board copper face, to make process
Residence time is extended, while reducing the problem that the pad pasting that copper face oxidation influences does not permeate plating short circuit tightly, effective to promote production
Product quality and product yield.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of anti-oxidation technique of pcb board copper face, comprising the following steps:
Pickling is carried out to the PCB making sheet that electro-coppering is completed, removes the oxide layer in PCB making sheet surface and hole；
Surface and hole inner wall to PCB making sheet plate one layer of antioxidant, organic anti-on one layer of surface and hole inner wall generation
Oxidation film；Figure is protected hole wall and table copper using antioxidant method.
Further, organic oxygen-proof film is removed by white picking using preceding.
Further, the layers of copper that the surface of PCB making sheet is ground after a pickling, keeps its surface brighter.
Further, grinding is carried out using needle brush, generates bright copper layers on the surface of PCB making sheet.
Further, organic oxygen-proof film is carried out by coating apparatus.
Further, PCB making sheet is cleaned before white picking, and is dried up.
Further, cleaning PCB making sheet is carried out by water washing device, is then dried up by blow-dry device.
Further, a pickling and white picking are carried out by acid dip pickle.
Of the invention effective to be: the anti-oxidation technique application of copper face in this way can effectively prevent PCB making sheet in copper
Palpus residence time internal oxidition, enables the process residence time to extend, and reducing the pad pasting that copper face oxidation influences, tightly infiltration plating is short
The problem of road, can effectively promote product quality and product yield.
Detailed description of the invention
Fig. 1 is the schematic diagram of pickling of PCB making sheet in embodiment；
Fig. 2 is the schematic diagram of PCB making sheet mechanical lapping in embodiment；
Fig. 3 is the anti-oxidation treatment process schematic diagram of PCB making sheet in embodiment；
Fig. 4 is that schematic diagram is cleaned in PCB making sheet in embodiment；
Fig. 5 is that PCB making sheet dries up schematic diagram in embodiment；
Fig. 6 is the schematic diagram of PCB making sheet white picking removal oxygen-proof film in embodiment.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples.
Referring to figs. 1 to 6, a kind of anti-oxidation technique of pcb board copper face, comprising the following steps:
Pickling is carried out to the PCB making sheet 10 that electro-coppering is completed, removes the oxygen in 10 surface 11 of PCB making sheet and hole 12
Change layer；Then, the layers of copper on the surface 11 of PCB making sheet 10 is ground, using needle brush 20 to generate on the surface of PCB making sheet 10 11
Bright copper layers keep its surface brighter；One layer of antioxidant is plated on the surface of PCB making sheet 10 11 and 12 inner wall of hole again, from
And on surface 11 and 12 inner wall of hole generate one layer of organic oxygen-proof film 13；By the method for antioxidant by 12 inner wall of hole and
The surface 11 of PCB making sheet 10 protects, and prevents it from aoxidizing in process holding process, when can greatly extend process stop
Between；Organic oxygen-proof film 13 is removed by white picking using preceding.The anti-oxidation technique application of copper face in this way, makes work
The sequence residence time was extended to 72 hours or more by original 24 hours, reduced the pad pasting not tightly infiltration plating short circuit that copper face oxidation influences
The problem of, and bright copper face is more advantageous to subsequent diagram electricity plated with copper, greatly improves Deposit appearance, effectively improves visitor
Reliability of the family to product quality.
Further, organic oxygen-proof film 13 is carried out by coating apparatus 30, so that the setting of oxygen-proof film is rapidly completed.
Further, PCB making sheet 10 is cleaned by water washing device 40 before white picking, and is blown by blow-dry device 50
It is dry, to carry out pickling；Pickling and white picking are carried out by acid dip pickle 60.
The above only better embodiment of the invention, but the present invention is not limited to above-described embodiments, if its with
Any same or similar means reach technical effect of the invention, should all fall under the scope of the present invention.
Claims (7)
1. a kind of anti-oxidation technique of pcb board copper face, it is characterised in that: the following steps are included:
Pickling is carried out to the PCB making sheet (10) that electro-coppering is completed, is removed in PCB making sheet (10) surface (11) and hole (12)
Oxide layer；
Surface (11) and hole (12) inner wall to PCB making sheet (10) plate one layer of antioxidant, in surface (11) and hole (12)
Wall generates one layer of organic oxygen-proof film (13).
Organic oxygen-proof film (13) are removed by white picking using preceding.
2. a kind of anti-oxidation technique of pcb board copper face according to claim 1, it is characterised in that: ground after a pickling
Grind the layers of copper on the surface (11) of PCB making sheet (10).
3. a kind of anti-oxidation technique of pcb board copper face according to claim 2, it is characterised in that: grinding uses needle brush (20)
It carries out, generates bright copper layers on the surface (11) of PCB making sheet (10).
4. a kind of anti-oxidation technique of pcb board copper face according to claim 1, it is characterised in that: organic oxygen-proof film (13)
It is carried out by coating apparatus (30).
5. a kind of anti-oxidation technique of pcb board copper face according to claim 1 to 4, it is characterised in that: before white picking
It cleans PCB making sheet (10), and is dried up.
6. a kind of anti-oxidation technique of pcb board copper face according to claim 5, it is characterised in that: cleaning PCB making sheet (10) is logical
Water washing device (40) progress is crossed, is then dried up by blow-dry device (50).
7. a kind of anti-oxidation technique of pcb board copper face according to claim 1, it is characterised in that: a pickling and quadratic acid
It washes and is carried out by acid dip pickle (60).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811414944.8A CN109287075A (en) | 2018-11-23 | 2018-11-23 | A kind of anti-oxidation technique of pcb board copper face |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811414944.8A CN109287075A (en) | 2018-11-23 | 2018-11-23 | A kind of anti-oxidation technique of pcb board copper face |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109287075A true CN109287075A (en) | 2019-01-29 |
Family
ID=65172677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811414944.8A Pending CN109287075A (en) | 2018-11-23 | 2018-11-23 | A kind of anti-oxidation technique of pcb board copper face |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109287075A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203057687U (en) * | 2013-02-05 | 2013-07-10 | 福清三照电子有限公司 | Anti-oxidation PCB |
| CN103619131A (en) * | 2013-10-31 | 2014-03-05 | 胜宏科技（惠州）股份有限公司 | A circuit board producing method for preventing golden fingers from exposing copper |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
-
2018
- 2018-11-23 CN CN201811414944.8A patent/CN109287075A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203057687U (en) * | 2013-02-05 | 2013-07-10 | 福清三照电子有限公司 | Anti-oxidation PCB |
| CN103619131A (en) * | 2013-10-31 | 2014-03-05 | 胜宏科技（惠州）股份有限公司 | A circuit board producing method for preventing golden fingers from exposing copper |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190129 |