CN109283405A - Sorting machine for testing electronic parts - Google Patents
Sorting machine for testing electronic parts Download PDFInfo
- Publication number
- CN109283405A CN109283405A CN201810587366.1A CN201810587366A CN109283405A CN 109283405 A CN109283405 A CN 109283405A CN 201810587366 A CN201810587366 A CN 201810587366A CN 109283405 A CN109283405 A CN 109283405A
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- China
- Prior art keywords
- loading plate
- temperature
- temperature adjusting
- electronic component
- test
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to the sorting machines for testing electronic parts that one kind can support testing electronic parts at low ambient temperatures.Sorting machine composing environment according to the present invention for testing electronic parts maintains chamber, and environment maintenance chamber is maintained drying regime, to have the structure for capableing of Local cooling.It has the following effects that according to the present invention, the testing reliability to electronic component can be improved, and can be improved cooling efficiency and reduce energy.
Description
Technical field
The present invention relates to one kind can support the electronic components such as semiconductor element that can be tested being used for for device test
The sorting machine of testing electronic parts.
Background technique
The electronic components such as semiconductor element are divided into many processes according to situation and are produced.Even if each process exists
Carried out under the conditions of standardized, but need the electronic component of precise operation, influenced by small variations it is bigger, therefore
It can not accomplish only to produce non-defective unit at present.That is, not can avoid generation substandard products.Therefore, the electronic component of production is surveyed by tester
It is divided into non-defective unit and substandard products after examination and only non-defective unit dispatches from the factory.
The test of electronic component is electrically connected to tester just in electronic component and can be carried out.At this point, by the socket of tester with
Electronic component electrical connection is equipped for sorting machine.
In addition, electronic component can use under the thermal environment of multiplicity.Therefore, it needs constructing in testing electronic parts
It is tested in the state of special temperature environment.Therefore, sorting machine needs maintain electronic component according to desired test condition
Electronic component is simultaneously electrically connected to tester by high temperature, low temperature or normal temperature state.Wherein, the present invention relates to one kind to tie up electronic component
Hold the sorting machine that test is supported in the state of low temperature.
In general, the mode of cooling electronic component includes chamber mode and plate mode.
Chamber mode is a kind of chamber for being configured to form low temperature environment, and by electronic component storing in chamber interior and
The mode of cooling electronic component.This chamber mode has the drawback that make the chamber interior with biggish space
Temperature maintains low temperature and consumes large energy, and needs longer for cooling down the time of electronic component.
Plate mode is to be placed in electronic component by the cooling plate of cooling fluid and cool down electronic component by conduction
Mode.This plate mode is by conducting directly cooling electronic component, therefore cooling time is shorter, but due to being that part is cold
But, therefore have the shortcomings that the influence by the surrounding air of relatively-high temperature and generate moisture condensation or freeze.In particular, if in electronics
In the case where electronic component is pre-chilled in advance before unit test, generates moisture condensation or freeze, then can lead during the test
The electrical contact generation sent a telegraph between subassembly and tester is bad, and then may make to constitute sorting machine due to condense or freezing
Component is damaged.
Of course, it is possible to combine chamber mode and plate mode, but in path for keeping electronic component mobile etc., in fact without
Method blocks chamber interior and outside completely, therefore energy consumption is necessarily big, in particular, as relatively more wet outside air flows into chamber
Room is in fact difficult to the phenomenon that finally preventing to condense or freezing.
Existing technical literature
Patent document
(patent document 0001) Korean Patent Laid 10-2003-0023213
(patent document 0002) Korean Patent Laid 10-2004-0026456
(patent document 0003) Korean Patent Laid 10-2014-0125465
Summary of the invention
Can not be generated in low-temperature test while the object of the present invention is to provide a kind of using plate mode yet moisture condensation or
The technology of icing.
Sorting machine according to the present invention for testing electronic parts, comprising: test support sector supports for electronic component
Test；Stack portion is mounted with client's pallet of electronic component to be tested to the supply of test support sector and recycling is mounted with
Client's pallet of the electronic component of test is completed, the test support sector includes: loader, positioned at for supplying electronic component
The first temperature adjusting use to the feed region of test zone, and the temperature with the electronic component that can adjust loading loads
Plate；Shuttle portion makes the electronic component to be come by the first temperature adjusting with loading plate be moved to test zone, or makes
The electronic component for completing test is moved to recovery zone from test zone, and has the of the temperature for adjusting the electronic component loaded
Loading plate is used in the adjusting of two temperature；At least one first movement device makes to come electronic component to be tested from by the stack portion
Client's pallet of supply position is moved to the first temperature adjusting loading plate, or makes electronic component from first temperature
Adjusting is moved to the second temperature adjusting loading plate with loading plate；Connector will be adjusted by the second temperature with dress
Support plate is electrically connected to tester from the electronic component that the feed region is moved to the test zone, to enable electronic component
Enough tested device test；Recycle plate, be located at the recovery zone, for recycle by the second temperature adjusting loading plate from
The test zone comes the electronic component of the completion test of the unloading position of the recovery zone；At least one second movement
Device makes the electronic component for being moved to recovery zone by second temperature adjusting loading plate be moved to the recycling plate；Environment
Chamber is maintained, for maintaining space existing for the first temperature adjusting loading plate and the second temperature adjusting loading plate
Dry environment, and there is at least one supply orifice, described at least one supply orifice provides the electronics for making to load test in need
Client's pallet of component is moved through the channel come from the stack portion；Humidity measuring transducer measures the environment and remains surging
Internal humidity；Drier maintains chamber interior to supply dry air to the environment；Cooler, supply cooling fluid and it is cold
The first temperature adjusting loading plate and the second temperature adjusting loading plate；Controller is surveyed according to by the humidity
Quantity sensor measurement information and control the drier, to adjust the supply of dry air, wherein first temperature
Adjusting loading plate and the second temperature adjusting can load electronic component with loading plate respectively, adjust loading by conduction
Electronic component temperature, and have and play the cooling of the mobile road function of being passed through by the cooling fluid that the cooler is supplied
Road, wherein the loader further include: primary heater, to the ministry of electronics industry for being loaded into the first temperature adjusting loading plate
Part applies heat；First sensor for measuring temperature, for measuring the temperature of the first temperature adjusting loading plate, wherein described
Shuttle portion further include: secondary heater applies heat to the electronic component for being loaded into the second temperature adjusting loading plate；Second
Sensor for measuring temperature, for measuring the temperature of the second temperature adjusting loading plate, wherein the controller is according to by institute
State the first sensor for measuring temperature and the second temperature measurement sensor measurement information and control the cooler, first plus
Hot device and secondary heater, to adjust the first temperature adjusting loading plate and the second temperature adjusting loading plate
Temperature.
For the cooling fluid cooled down by the cooler to be matched supplied to the cooling road or the cooling recycled
At least one cooling tubing in pipe is dual pipe, by inside tube from the drier to the dual pipe and outboard tube it
Between supply dry air, the cooling fluid supplied and recycled by the cooler is moved to the inside tube of the dual pipe.
The environment maintains chamber to have at least one shutter door inside capable of being opened and closed by operating personnel, the shutter door
Include: first, the first open area can be opened and closed；It second, is set to described first and can be opened and closed less than described
Second open area of one open area.
The connector includes: propeller, by electronic component to the socket side of tester pressurize, and have make from described cold
But the fluid passage that the cooling fluid of device supply is passed through；Heating element is set to the propeller and applies to the propeller
Heat；Temperature-measuring element is set to the propeller and measures the temperature of the propeller；Cooling tube, being used for will be by described cold
But device cooling cooling fluid supply to the propeller or will by the fluid passage and out from the propeller
Cooling fluid is recycled to the cooler, wherein at least one cooling tube in the cooling tube is provided as spiral shape to ensure
The mobility of the propeller, controller temperature according to measured by the temperature-measuring element and control the cooler
And the heating element and adjust the temperature of the propeller.
The loader further include: separation member makes the first temperature adjusting be fixed as separating in advance from basal plane with loading plate
Set a distance；And shielding wall, to adjust with first temperature with loading around the first temperature adjusting loading plate
The mode that the lower end and side of plate mutually separate is equipped with, to minimize the sky around the first temperature adjusting loading plate
Influence of the gas to the electronic component for being loaded into the first temperature adjusting loading plate, by drier supply dry air
The part that mutually separates of the part between the loading plate and the basal plane.
It is formed with spray-hole in the shielding wall, the spray-hole, which makes to adjust to the shielding wall and first temperature, to be used
The dry air of the part supply mutually separated between loading plate is sprayed to surrounding.
The shuttle portion further include: substrate is equipped in a manner of it can move by moving source；Separation member, by described
Two temperature adjustings are fixed in a manner of separating preset space length from the substrate with loading plate；Shielding wall, in second temperature
Degree adjusting with being equipped in a manner of mutually being separated with the lower end of the second temperature adjusting loading plate and side around loading plate,
It adjusts to minimize the air around the second temperature adjusting loading plate to the second temperature is loaded into loading
The influence of the electronic component of plate, wherein the part by drier supply dry air is that the second temperature is adjusted with dress
The part mutually separated between support plate and the substrate.
Be formed with spray-hole in the shielding wall, the spray-hole make to the second temperature adjusting loading plate with it is described
The dry air of the part supply being separated by between substrate is sprayed to surrounding.
The sorting machine for testing electronic parts further include: shutter is opened and closed the supply orifice, wherein the control
Device processed only controls the open supply orifice of the shutter when client's pallet is mobile by the supply orifice.
At least one in the feed region and the test zone is supplied to by the dry air that the drier is supplied
A region to generate draught head between the test zone and the recovery zone, and then prevents from being present in the recycling
The air in region enters the test zone.
The second temperature adjusting loading plate includes: loading station, is loaded electronic component to be tested；Uninstalling portion
Position loads the electronic component for completing test, wherein the shuttle portion further include: cooling unit, for cooling down the loading part
Position；Heating unit, for heating the loading station and debarkation station, wherein the debarkation station according to control and can only be by
Heating.
According to the present invention, it has the effect that
First, prevent infiltration of external air to chamber interior while using plate mode, to prevent in low-temperature test
Only generate moisture condensation or freeze, so as to improve the testing reliability to electronic component, and can anti-locking apparatus it is impaired.
Second, cooling efficiency is improved by the Local cooling of plate and minimizes the outflow of cold air, so as to reduce energy
Amount consumption.
Third can control rapidly the heat for being possible to generate from electronic component during the test, therefore can be further
Improve the testing reliability of electronic component.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the sorting machine for testing electronic parts of an embodiment according to the present invention.
Fig. 2 is the schematic plan view of the sorting machine for testing electronic parts of Fig. 1.
Fig. 3 is the schematic interception perspective view of the preloading device of the sorting machine applied to Fig. 1.
Fig. 4 is the schematic side elevation of the loader of Fig. 3.
Fig. 5 is the schematic interception schematic diagram in the shuttle portion of the sorting machine applied to Fig. 1.
Fig. 6 is another example that can be applied to the preloading device of the sorting machine of Fig. 1.
Fig. 7 is the interception figure of the cooling tubing in the shuttle portion applied to Fig. 5.
Fig. 8 is the schematic interception figure of company's machine of the sorting machine applied to Fig. 2.
Fig. 9 is the schematic interception perspective view of the pusher of the connector applied to Fig. 8.
Figure 10 is the schematic interception schematic diagram of the variation in the shuttle portion applied to Fig. 5.
Symbol description
100: the sorting machine for testing electronic parts
TSP: test support sector SKP: stack portion
110: loading plate is used in the adjusting of 111: the first temperature of loader
112: 113: the first sensor for measuring temperature of primary heater
114: the first separation members 115: shielding wall
115c: spray-hole 120: shuttle portion
121: second temperature, which is adjusted, uses loading plate 122: secondary heater
123: 124: the second separation member of second temperature measurement sensor
125: shielding wall 126: substrate
127: cooling tubing 127a: outer side line
127b: outer side line 130: first movement device
140: connector 142: pusher
TW: fluid passage 143: cooling tube
HD: the TD1: the first temperature-measuring element of heating element
TD2: second temperature measuring cell 150: recycling plate
160: the second shifters 170: environment maintains chamber
171: shutter door 171a: the first
171b: the second SH: supply orifice
SS: 181: the first shutter of humidity measuring transducer
190: drier CA: cooler
MA: controller SP: supply position
RH: recovery holes
Specific embodiment
Preferred embodiment in accordance with the present invention is illustrated referring to attached drawing, in order to illustrate it is succinct, for repeating or real
The identical composition of matter is omitted or is compressed as far as possible.
Fig. 1 is the sorting machine (hereinafter referred to as ' sorting for testing electronic parts of an embodiment according to the present invention
Machine ') 100 perspective view.
As shown in Figure 1, including: test support sector TSP according to the sorting machine 100 of the present embodiment, can support for electronics
The test of component；Stack portion SKP is held in the palm to test support sector TSP supply client's pallet CT or from test support sector TSP recycling client
Disk CT.Here, being loaded with electronic component to be tested from stack portion SKP supplied to client's pallet CT of test support sector TSP,
And the client's pallet CT for being recycled to stack portion SKP from test support sector TSP is loaded with the electronic component for completing test.
With continued reference to Fig. 2 of the schematic plan view as the sorting machine 100 for Fig. 1, carefully illustrate to constitute sorting machine
100 detailed composition.
Testing support sector TSP includes loader 110, shuttle portion (shuttle) 120, first movement device 130, connector
140, plate 150, the second shifter 160, environment are recycled and maintains chamber 170, the first shutter 181, the second shutter 182, humidity
Measurement sensor SS, drier 190, cooler CA and controller MA.
Loader 110 is located at the feed region SA for electronic component to be supplied to test zone TA, and is passed through cooling
The cooling fluid of device CA supply is cooling, thus by conducting the directly cooling electronic component loaded.That is, according to the present embodiment
Sorting machine 100 have the following structure, pre-cool testing electronic parts can before test
Structure.For this purpose, loader 110 includes the first temperature such as the schematical exploded perspective view of Fig. 3 and the schematic side elevation of Fig. 4
Spend adjusting loading plate 111, primary heater 112, the first sensor for measuring temperature 113, the first separation member 114 and the first shielding
Wall 115.
Surface has the loading chute that can place and load electronic component to first temperature adjusting loading plate 111 on it
LS.Also, it in the inside of the first temperature adjusting loading plate 111, is formed with since former and later two distal portions and in centre
2 cooling road CW that position terminates, and avoid cooling road CW and be formed with heater pocket HS and sensing tank SG.For this purpose, the
One temperature adjusting may include the upper plate 111a and lower plate 111b combined tightly to each other with loading plate 111.
It is preferably configured as by the cooling fluid that cooler CA is supplied, passes through two of the first temperature adjusting loading plate 111
The starting point S of distal portion and flow into cooling road CW, the knot with the intermediate position of loading plate 111 is then adjusted by the first temperature
Beam spot E and from cooling road CW outflow.The reasons why constituting cooling road CW in this way is, true by the research of kinds of experiments
Recognize.In an experimental example, the temperature for injecting subzero 70 degree of the cooling fluid of starting point S rises with close to end point E.
In this case, the intermediate position of the first temperature adjusting loading plate 111 where end point E is confirmed to be because being exposed to week
The temperature in the face of the extraneous gas enclosed is less without being reduced to subzero 65 degree or less.On the contrary, subzero 70 degree of injection of cooling stream
It is confirmed to be around two ends of the first temperature adjusting loading plate 111 where the starting point S of body because being exposed to surrounding
The face of extraneous gas is more and is subzero 65 degree.Obviously, this example is specific experimental example, can have +/- 1 degree or so of temperature
Spend deviation.
Primary heater 112 be embedded in heater pocket HS and by face contact to being loaded into the first temperature adjusting loading plate
111 electronic component applies heat.Precisely, heat the first temperature adjusting loading plate of heating generated by primary heater 112
111, and the electronic component for being loaded into the first temperature adjusting loading plate 111 by conducting heating.This primary heater 112
It can be used when executing high temperature test, and may be accurate temperature control in low-temperature test and used.Also,
Primary heater 112 can generate blocking (jam) after low-temperature test or terminate the fortune of sorting machine 100 for next operation
It is used in the case where row in order to make the first temperature adjusting loading plate 111 return to room temperature or prevent moisture condensation and icing.
First sensor for measuring temperature 113 is set to sensing tank SG and measures the first temperature adjusting loading plate 111
Temperature.Controller MA controls primary heater according to the temperature information measured by this first sensor for measuring temperature 113
112, drier 190 and cooler CA.
First separation member 114 is in order to make the sorting machine 100 of the first temperature adjusting loading plate 111 with setting loader 110
Basal plane (bottom surface) BF and the bottom of the first following shielding walls 115 be separated from each other and be equipped with.It is equipped with this first separation member 114
The reasons why be to minimize the cold air for carrying out the first temperature adjusting loading plate 111 of Local cooling or heating or hot gas passes through biography
It leads and is discharged to basal plane BF.Therefore, the first separation member 114 needs to utilize the low material of thermal conductivity (such as resin material and nonmetallic)
And need with the outfit of least quantity, thickness is preferably also in the degree that can support the first temperature adjusting loading plate 111
Lower minimum.
Also, in sorting machine 100 according to the present invention, to being separated from each other as described above by first separation member 114
The first temperature adjusting it is dry empty by the supply of drier 190 with the part A mutually separated between loading plate 111 and basal plane BF
Gas.Accordingly, drying can intensively be supplied to the position that the presence for needing most supply dry air generates moisture condensation or icing hidden danger
Air, therefore dry efficiency can be improved in corresponding site and reduce the consumption of dry air.Also, dry air can
To play heat-blocking action per supplying when needed.
First shielding wall 115 around the first temperature adjusting loading plate 111 with the first temperature adjusting loading plate
The mode that 111 side is separated by is equipped to the form of substantially quadrilateral frame.Therefore, the first shielding wall 115 can be by the first temperature
Adjusting loading plate 111 and be loaded into this electronic component and surrounding air block predetermined extent, and by above-below direction
The screened film by dry air is formed, surrounding air is minimized and to the first temperature adjusting loading plate 111 and is loaded into this
The influence of electronic component.For this purpose, the upper end of the first shielding wall 115 is preferably more than the first temperature adjusting loading plate 111 and dress
It is loaded in this electronic component, therefore, in the upper-end part of driving of shielding wall 115, being formed with makes the first temperature adjusting loading plate 111
The alternating of upper plate 111a smoothly alternate slot 115a.Obviously, it in shielding wall 115, other than alternate slot 115a, can also be formed
Have to be able to use and be cooled down in by cooling fluid supplied to the cooling road CW of the first temperature adjusting loading plate 111 and from its recycling
Multiple via hole 115b that the cooling tubing of fluid passes through.
Also, the lesser spray-hole 115c of diameter, the spray-hole are formed in the inner wall of the first shielding wall 115 and bottom surface
115c can make supplied to the first temperature adjusting use the dry air of loading plate 111 and the part A of basal plane BF to as first temperature
Spend the inside injection of adjusting 111 side of loading plate.More humid air of surrounding are further blocked to move by this first shielding wall 115
It moves to the first temperature adjusting loading plate 111 or the electronic component for being loaded into this, so as to further prevent condensing or tie
Ice phenomenon.Preferably, spray-hole 115c and the part by spray-hole 115c jet drying air are located at the adjusting of the first temperature and use
The downside in the top face of loading plate 111, need exist to preventing the substandard products electricity for being grasped or being released grasping by first movement device 130
A possibility that subassembly is loaded or is detached from.
Also, know the inner wall at the side position of the first shielding wall 115 and the side of the first temperature adjusting loading plate 111
End is separated from each other, and the bottom surface of the first shielding wall 115 is separated from each other with the first temperature adjusting with the lower end of loading plate 111.This
Kind structure prevents the cold air of the first temperature adjusting loading plate 111 or hot gas to be discharged by the first shielding wall 115, is formed simultaneously
The spray-hole 115c that states and to providing dry air around the first temperature adjusting loading plate 111.
Shuttle portion 120 keeps the electronic component to come by loader mobile to test zone TA or makes to complete test
Electronic component is moved to recovery zone RA from test zone TA.For this purpose, as shown in figure 5, shuttle portion 120 is adjusted with second temperature
With loading plate 121, secondary heater 122, second temperature measurement sensor 123, the second separation member 124, secondary shielding wall 125,
The cooling tubing 127 and moving source 128 of substrate 126, special construction.
Second temperature adjusting loading plate 121 can load electronic component, such as KR published patent 10-2014-0125465
Number (hereinafter referred to as ' prior art ') can be divided into loading station (being named as ' loading container ' in the prior art) 121a and unloading
Position (being named as ' unloading container ' in the prior art) 121b.Loading station 121a is the portion for loading electronic component to be tested
Position, debarkation station 121b are the positions for loading the electronic component for completing test.Such as the prior art, loading plate is used in second temperature adjusting
121 can move by moving source 128, at this point, loading station 121a is moved between " loaded " position LP and test position TP,
Debarkation station 121b is moved between test position TP and unloading position UP.Obviously, following structure can be fully considered according to implementation
At not distinguishing loading station 121a and debarkation station 121b and only there is a loading station, and make the turnover zone of loading station
Between be extended to " loaded " position LP, test position TP and unloading position.This second temperature adjusting loading plate 121, which is also formed with, to be made
Cooling road, heater pocket and sensing tank, the effect that cooling fluid is passed through adjust the cooling for using loading plate 111 with the first temperature
Road CW, heater pocket HS and sensing tank SG are identical, and and the description is omitted.
Also, secondary heater 122, second temperature measurement sensor 123, the second separation member 124 and secondary shielding wall 125
Function also with the primary heater 112 of the first temperature adjusting loading plate 111,113, first points of the first sensor for measuring temperature
Off member 114 and the first shielding wall 115 are identical, therefore omit detailed description.
Substrate 126 is equipped in a manner of it can move by moving source 128.Also, second temperature, which is adjusted, uses loading plate 121
It is set in a manner of being separated with 126 phase of substrate the second separation member 124, so that second temperature, which is adjusted, uses loading plate 121
Also moved by the movement of moving source 128, and dry air to second temperature adjusting loading plate 121 and substrate 126 it
Between be separated from each other part B supply.
As reference, can also fully consider is equipped with above-mentioned loader 110 can equally move just like shuttle portion 120
The first temperature adjust use loading plate 111.Also, according to implementation, loader 110 is also required to load more electronic components or make
The electronic component of room temperature is quickly cooled down, therefore as shown in fig. 6, can make the cooling road CQ of the first temperature adjusting loading plate 111A
It is formed to have the more quantity on the cooling road than second temperature adjusting loading plate 121, therefore, different from showing for Fig. 3
Example, is configured to, the position of starting point S and end point E is separated in the first temperature adjusting left and right sides of loading plate 111A
Arrangement.
Cooling tubing 127 is supplied to second temperature adjusting loading plate for the cooling fluid that will be supplied from cooler CA
121 or by cooling fluid from second temperature adjusting with loading plate 121 recycle and be equipped with.As shown in fig. 7, this cooling tubing is excellent
Choosing is made of the dual pipe of the interior side line 127a with outer side line 127a and inside outer side line 127a.In inside
The interior side line 172b of the mobile cooling fluid for having low temperature may generate moisture condensation in outer surface or freeze.Also, due to this
Moisture condensation freezes, and when second temperature adjusting loading plate 121 is mobile, curved interior side line 127b may be damaged.Therefore, match
Standby outer side line 127a, and in protecting side line 127b and so that it will not be directly exposed to outside.Here, can more preferably examine
The same be piped by spiral shape of cooling tube for considering the connector 140 for keeping interior side line 127b as be described hereinafter is constituted.And it is possible to preferably
Consider dry air of the space S supply from drier 190 between inside side line 127b and outer side line 127a.Due to this
Kind structure can be minimized the damage of the frequent mobile caused cooling tubing 127 of second temperature adjusting loading plate 121.It is aobvious
So, if the first temperature adjusting of loader 110 is also movably equipped with loading plate 111, it is provided to the cold of loader 110
But piping dual pipe it is also preferred that be made of.
First movement device 130 makes electronic component to be tested from the client's pallet for coming supply position SP by stack portion SKP
CT is moved to the first temperature adjusting loading plate 111, or is moved to electronic component from the first temperature adjusting loading plate 111
Second temperature adjusts the loading station 121a for using loading plate 121.Obviously, according to implementation, multiple first movement devices can be equipped with
130, and be each responsible for by electronic component from client's pallet CT be moved to the first temperature adjusting loading plate 111 function and from
First temperature adjusting loading plate 111 is moved to the function of second temperature adjusting loading plate 121.
The electronic component for the loading station 121a that connector 140 presses absorption to grasp positioned at test position TP by vacuum,
Then so that the electronic component of grasping is electrically connected to the test jack TS of tester, and be moved to the electronic component for completing to test and unload
Carry position 121b.Here, electronic component and test jack TS's is electrically connected by the way that electronic component pressurizes to test jack TS
Mode and implement.For this purpose, connector 140 includes the propulsion of 141,8, head as shown in Fig. 9 of Fig. 8 and interception and local expansion
Device 142, heating element HD, the first temperature-measuring element TD1, second temperature measuring cell TD2, cooling tube 143, vertically move device
144 and move horizontally device 145.
Head 141 is equipped in a manner of it can go up and down by device 144 is vertically moved.This head 141, which has to provide, is directed to 8
The channel design or valve arrangement of the vacuum pressure of a propeller 142.Obviously, it can use individual pipe structure to come to propeller
142 provide vacuum pressure.
8 propellers 142 are equipped with respectively in order to pressurize electronic component.Therefore, 8 electronic components can be disposably electrically connected
It is connected to tester.Obviously, according to the implementation form of equipment, the quantity of propeller 412 can be different.This propeller 142 is cut
Face is ' T ' word shape, and is divided into the binding site 142a of upside and the contact site 142b of downside.
Binding site 142a is incorporated into head 141.Guide hole GH is formed in this binding site 142a, in guide hole GH
It is inserted into the guidance pin (not shown) for accurately guiding the position of propeller 142.
Contact site 142b is the part that width is less than binding site 142a, contact jaw CE and electronics as its lower end surface
Component contact and the electronic component that pressurizes, or pass through the vacuum pressure grasping electronic component from vacuum road VW.
The purpose for forming vacuum road VW is, applies vacuum to electronic component to carry out absorption grasping to electronic component
Pressure.Here, vacuum pressure can be realized in a manner of from outside supply, it can also be in the tune of the outfit generation vacuum pressure of sorting machine 100
Whole device and realized in a manner of being supplied from the adjuster.
Also, the fluid passage TW for passing through the cooling fluid supplied by cooler CA is formed in propeller 142.
Fluid passage TW is formed as, and is moved to and is connect by the cooling fluid that the entrance IH positioned at binding site 142a is flowed into
It is flowed out after the 142b of contact portion position by the outlet positioned at binding site 142a.Therefore, the cold of propeller 142 is reached from cooler CA
But fluid is discharged by fluid passage TW from propeller 142.
Heating element HD is equipped with for following purpose, heat propeller 142 and finally to the electricity to be pressurizeed by propeller 142
Subassembly is heated.As primary heater 112 and secondary heater 122, this heating element HD can be used in order to
The heating of high temperature test, the heating for being restored to room temperature for the electronic component of fine tune temperature being heated or cooled etc..
First temperature-measuring element TD1It is equipped with, second temperature measuring cell TD to measure the temperature of propeller 1422For
The temperature of direct measurement electronic component and be equipped with.Therefore, second temperature measures file TD2It is preferably equipped in contact site 142b
The side contact jaw CE to be contacted with electronic component.
As shown, above-mentioned heating element HD, the first temperature-measuring element TD1And second temperature measuring cell TD2Setting
In propeller 142.
Cooling tube 143 is supplied to propeller 142 for the cooling fluid that will be cooled down by cooler CA, or will be by described
Fluid passage TW and be recycled to cooler CA from the cooling fluid that propeller 142 is discharged and be equipped with.This cooling tube 143 is in order to true
Protect according to their setting position and in the horizontal direction and the mobility of propeller 142 that moves of vertical direction and be provided as spiral
Shape, can have the soft bending because of elastic deformability and restoration.
Vertically moving device 144 makes head 141 go up and down (reference arrow a).Therefore, the head for being provided with propeller 142 can be with
Down or up, when decline, propeller 142 is in the position that can grasp electronic component or by electronic component to test jack
The position of the side TS pressurization.
Moving horizontally device 145 makes head 141 move (reference arrow b) in the horizontal direction.
That is, the head 141 for being provided with propeller 142 by vertically move device 144 and move horizontally device 145 work and
After the loading station 121a of second temperature adjusting loading plate 121 grasping electronic component, the electronic component of grasping is electrically connected
To test jack TS, and the electronic component for completing test can be moved to the uninstalling portion of second temperature adjusting loading plate 121
Position 121b.
Recycling plate 150 is located at the recovery zone RA for recycling the electronic component for completing test, and is equipped with recycling plate 150
Purpose is that the unloading position of recovery zone RA is come in recycling by second temperature adjusting with loading plate 121 from test zone TA
Set the electronic component of the completion test of UP.Therefore, recycling plate 150 is again formed as that the structure of electronic component can be loaded, simply,
Client's pallet CT can replace the effect of recycling plate 150.In the case where client's pallet CT replaces the effect of recycling plate 150, such as
It with above-mentioned second temperature adjusting loading plate 121, is configured to, is moved to recovery position by individual shifter
RP。
Second shifter 160 makes to be come back with the movement of loading plate 121 from test zone TA by second temperature adjusting
The electronic component for receiving the debarkation station 121b of the unloading position UP of region RA is moved to recycling plate 150, or makes to be located at recycling plate
150 electronic component is moved to client's pallet CT in the front positioned at recovery position RP.Obviously, it is held in the palm in recycling plate 150 by client
Disk CT constitutes and uses the structure for the recovery position RP that client's pallet CT can be made to be moved to front by individual shifter
In the case where, so that electronic component is moved to recycling plate from second temperature adjusting loading plate 121 as long as the second shifter 160 has
150 function.
Environment maintains chamber 170 to maintain the first temperature adjusting loading plate 111, second temperature adjusting loading plate
121, the environment of the drying in the space where propeller 142, test jack TS and will accordingly constitute and be isolated with extraneous gas.This reality
It applies in example, maintains the inside of chamber 170 to accommodate the first temperature adjusting loading plate 111, second temperature adjusting loading in environment
Plate 121, first movement device 130, at least head 141 in connector 140 and propeller 142, recycling plate 150, the second shifter
160 and test jack TS.But the environment in the present invention maintain chamber 170 be not intended to cool down its internal space and
It is equipped with, and is equipped with to provide the space of internal drying, there are larger differences with the prior art in this regard.This ring
Border maintains chamber 170 to have shutter door 171, supply orifice SH and recovery holes RH.
Shutter door 171 is equipped with to be opened and closed the inside of environment maintenance chamber 170 by operating personnel, and is provided as dual
Door.
First 171a can be opened and closed biggish first open area.
Second 171b is set near the center of first 171a, and can be opened and closed second less than the first open area
Open area.
That is, due to generating blocking etc. and in the case where environment maintains the inside of chamber 170 to need handwork, operation
Personnel, which can open first 171a or opening according to the degree of corresponding handwork and selectively, can only protrude into operation people
Second 171b of the size of the arm of member.At this point, operating personnel needs with the naked eye in the case where only opening second 171b
Confirm that environment maintains the inside of chamber 170, it is therefore desirable to constitute from the frame of first 171a to the using transparent panels such as glass
Part between two 171b.Also, in the case where open second 171b, chamber 170 is maintained in order to minimize environment
Cold air loss, may be constructed the individual gas curtain for being capable of forming air film, or such as scopiform state and blocked to high-density with filament
Although or constituting other breaking members so that arm is able to enter but farthest blocks the outflow of cold air.
As reference, shutter door 171 is preferably provided as the quantity needed at the desired position.
Supply orifice SH provides the channel that client's pallet CT positioned at stack portion SKP can be made to be moved to supply position SP.
Recovery holes RH provides the channel that client's pallet CT positioned at recovery position RP can be made to be moved to stack portion SKP.
Obviously, according to the capacity of sorting machine 100 or the form of other implementation structures, supply orifice SH or recovery holes RH can be with shapes
At quantity appropriate.
As reference, chamber 170 is maintained to may be equipped with such as the present embodiment in test zone even if being equipped with environment
TA forms the test chamber TC of individual test cabinet.And it is possible to it is preferred that consider to separate supply area by individual barrier film
Domain SA and recovery zone RA.
First shutter 181 is opened and closed supply orifice SH.
Second shutter 182 is opened and closed recovery holes RH.
In the same manner, it other than the first shutter 181 and the second shutter 182, may be equipped with for being supplied open
The unit of individual gas curtain is formed when hole SH and recovery holes RH.
Obviously, the first above-mentioned shutter 181 and the second shutter 182 are with the quantity pair with supply orifice SH and recovery holes RH
The quantity answered is equipped with.
Humidity measuring transducer SS is used to measure the humidity inside environment maintenance chamber 170, anti-especially for measurement request
It only generates the humidity of the feed region SA and test zone TA that condense or freeze and need accurately to adjust aridity degree and is equipped with.
In particular, the humidity in the space where the first temperature adjusting loading plate 111 and second temperature adjusting loading plate 121 is relatively attached most importance to
It wants, therefore humidity measuring transducer SS is preferably equipped with and adjusts in the first temperature adjusting loading plate 111 and second temperature with loading
Near plate 121.Here, the humidity measuring transducer SS for being set to second temperature adjusting loading plate 121 preferably considers with energy
It is enough to be arranged with second temperature adjusting with the mode that loading plate 121 moves together.
Drier 190 is equipped with to maintain supply dry air inside chamber 170 to environment.This drier 190 can
To be configured to the shape of the walking circuit for the inside for making the dry air from external power supply unit be moved to environment maintenance chamber 170
State, such as the present embodiment are configured to sorting machine 100 itself and generate dry air.Here, being supplied to by drier 190
Environment maintains the supply section of the dry air of the inside of chamber 170 to be preferably placed at feed region SA and test zone TA.As above
It is described, the present invention in, it is known that by drier 190 supply dry air by positioned at feed region SA loader 110 with
And it is supplied at least partially always situated in the shuttle portion 120 of test zone TA.Also, sorting machine 100 according to the present invention is logical
A part of C supply for crossing the fixation of individual injection nozzle to the test zone TA most sensitive for test condition is dry empty
Gas constitutes individual test chamber TC for its efficiency.Therefore, test zone TA is compared to adjacent recovery zone RA
As high pressure, thus can farthest be prevented by the draught head in two regions the how wet air of recovery zone RA into
Enter test zone TA.
The reasons why further instruction is for needing to be equipped with drier 190 as described above.In general, dew condensation phenomenon is due to big
The temperature of gas reduces and the saturated steam amount of atmosphere is reduced and generated, in particular, the moisture condensation generated under the conditions of subzero temperature
Freeze and generates icing phenomenon.But for the sorting machine for being able to carry out low-temperature test, need electronic component is sharply cold
But extremely subzero 10 degree or extremely low temperature below, therefore the temperature of other structures object is also maintained at low-down state.Such as
In the state of described in upper, the atmospheric temperature near the works also reduces and causes saturated steam amount very low.For example, often
The saturated steam amount of warm atmosphere is 22.830g/m3, but the saturated steam amount of subzero 10 degree of atmosphere is 2.156/m3.Cause
This, generates the condensation and icing of vapor on the surface of electronic component or works etc., and being likely to become device can not be driven
State, or serious damage is caused to device.Therefore, the present invention is realized by lasting experiment and research.
Cooler CA is to the first temperature adjusting loading plate 111, second temperature adjusting loading plate 121 and propeller 142
Supply cooling fluid.In the same manner, the refrigerating module of cooler CA is provided to sorting machine 100 itself, or can according to implementation and
The system for being individually provided to factory.If refrigerating module and sorting machine 100 are individually equipped with, it is provided to the cooling of sorting machine 100
The concept of device CA can be construed to, and the cooling fluid from external refrigerating module is moved to the cooling of the position of needs and is flowed
Road.
Controller MA controls the composition that the needs in above-mentioned composition control.In particular, controller MA is passed according to by moisture measurement
Sensor SS measurement humidity information and control drier 190, to adjust the supply of dry air, and in order to minimize environment
It maintains the cold air loss inside chamber 170 and controls the first shutter 181 and the second shutter 182 with only logical in client's pallet CT
Keep supply orifice SH or recovery holes RH open when crossing supply orifice SH or recovery holes RH movement.Also, controller MA is based on the first temperature
Adjust the temperature that the loading station 121a, propeller 142 and electronic component that use loading plate 121 are adjusted with loading plate 111, second temperature
It spends information and adjusts cooling degree or degree of heat respectively.
In addition, stack portion SKP includes for the supply stack device PS to supply position SP supply client's pallet CT and returning
Receive the recycling stacker RS of client's pallet CT from recovery position RP.
Continue to be illustrated the sorting machine 100 with above-mentioned composition.
Client's pallet CT positioned at supply stack device PS is successively supplied to supply position SP with one every time.At this point, moving
During dynamic client's pallet CT, the open supply orifice SH of the first shutter 181, and if client's pallet CT enters environment maintenance
Then close supply orifice SH in the inside of chamber 170.
Electronic component is moved to the first temperature from client's pallet CT of supply position SP and adjusted with dress by first movement device 130
Support plate 111.Therefore, the electronic component and the shape cooling in cooled device CA of the first temperature adjusting loading plate 111 are loaded into
The first temperature under state, which is adjusted, to be contacted and is cooled with loading plate 111.
If electronic component is loaded on the first temperature adjusting loading plate 111, first movement device 130 makes the electricity of pre-cooling
Subassembly is moved to the second temperature adjusting loading plate 121 positioned at " loaded " position LP from the first temperature adjusting loading plate 111
Loading station 121a.If electronic component is loaded into loading station 121a, second temperature adjusting with loading plate 121 by means of
Moving source 128 and move to the right, so that the loading station 121a of second temperature adjusting loading plate 121 will be located at test position
TP.Then, connector 140 works and propeller 142 is utilized to grasp electronic component-use vacuum pressure from loading station 121a, then
The electronic component grasped by propeller 142 is set to be electrically connected to survey and vertically moving device 144 and moving horizontally the movement of device 145
Try socket TS.Obviously, loading station 121a and propeller 142 the device CA that is cooled are cooled to the temperature for meeting test condition, therefore
In this moving process, electronic component is without departing from the temperature for meeting test condition.Also, during the test, in electronics
There may be heat for component, but controller MA controls cooler CA and electronic component is made to maintain desired temperature condition.
If the test to electronic component terminates, connector 140 is moved to electronic component positioned at test position TP's
Second temperature adjusts the unloading position 121b for using loading plate 121.At this point, second temperature adjusts the loading station for using loading plate 121
121a is located at " loaded " position LP, therefore will be loaded into loading station 121a in the electronic component of next step test.If completing to survey
The electronic component of examination is loaded on debarkation station 121b, then second temperature adjusting is moved to the right with loading plate 121 and makes to unload
Position 121b is mobile to unloading position UP, and the second shifter 160 makes electronic component be moved to recycling plate from debarkation station 121b
150.Also, it is located at visitor of the electronic component of recycling plate 150 by the second shifter 160 and to the recovery position RP for being located at front
Family pallet CT is mobile.At this point, the electronic component for completing test can be mobile in a manner of by grade distinction according to test result.
Then, if electronic component fills up client's pallet CT positioned at recovery position RP, the second shutter 182 runs and makes recovery holes
RH is open, and client's pallet CT is moved to recycling stacker RS from recovery position RP.
In addition, the process tested while the movement and test for being continued for electronic component as described above
In, humidity sensor SS maintains chamber 170 inside (more specifically feed region with scheduled time interval test constantly environment
Near first temperature adjusting loading plate and near the second temperature adjusting loading plate of test zone) humidity, and controller
MA adjusts the amount of dry air based on corresponding information, and supplies dry air to above-mentioned part.Obviously, environment maintains chamber
170 inside can due to dry air supply and maintain require aridity.
In turn, persistently supplied by drier 190 dry air environment maintain chamber 170 inside compared to outside edge
Constantly maintain high pressure.Therefore, the inner air of environment maintenance chamber 170 passes through supply orifice SH, recovery holes RH or other can not
Realize closed position outflow, this can play the function of blocking inside outside air inflow.
Also, dry air largely injects feed region SA and test zone TA, it is therefore desirable to precisely adjust drying
The feed region SA of degree and the side test zone TA are high pressure compared to the recovery zone side RA.Therefore, in feed region SA and recycling
Region RA is blocked in the case that film mutually blocks, air due to draught head and mainly from feed region SA and test zone TA to
It does not require the recovery zone RA of higher degree of drying accuracy mobile, therefore can prevent the air impact of recovery zone RA from supplying
The air of region SA, and this become can accurately control feed region SA aridity the reason of.
Also, drier 190 is to the outer side line 122a and interior side line 122b of the cooling tubing 122 for being provided as dual pipe
Between supply dry air, to prevent the damage of above-mentioned cooling tubing 122.
In the above-described embodiments, it is configured to, the second temperature adjusting loading plate 121 for being formed in shuttle portion 120 is divided is
Loading station 121a and debarkation station 121b, and by the secondary heater 122 as heating element and as cooling element
Cooling tubing 127 and loading station 121a and debarkation station 121b are all heated or cooled.
But as shown in Figure 10, shuttle portion 120 can deform and be equipped with.
Referring to Fig.1 0, secondary heater 122 is set as all heating loading station 121a and debarkation station 121b, but cold
But piping 127 is laid in a manner of only cooling down loading station 121a.Therefore, loading station 121a can be by secondary heater 122
It is heated or cooled with cooling tubing 127, but debarkation station 121b may be heated only by secondary heater 122.Hereinafter, to realization
The reasons why this variation, is illustrated.
In general, the test approaches of electronic component include high temperature test, room temperature test, low-temperature test.
It in high temperature test, needs to test in the state that electronic component is maintained high temperature, in low-temperature test, need
It to be tested in the state that electronic component is maintained low temperature.Also, in room temperature test, room temperature is maintained in electronic component
It is tested under state.Therefore, other than special status, secondary heater 122 and cooling tubing 127 are only used for high temperature test
Or low-temperature test.
In most cases, the electronic component for completing test carries out unloading operation by pick-up.At this point, in order into
Row does not generate the unloading operation appropriate of damage in pick-up or electronic component, needs the electronic component of high temperature is cooling and heats
The electronic component of low temperature.
Firstly, loading station 121a must be cooled for low-temperature test, and for the control of accurate temperature, load
Position 121a is required to be heated by secondary heater 122.Also, debarkation station 121b can be heated by secondary heater 122,
So as to improve loading electronic component temperature.
If the electronic component for being loaded into debarkation station 121b is not heated near room temperature, generate frost and to
The picking task of the pick-up of the operation of second shifter 160 causes obstacle, or may occur to generate the problems such as picking up trace.
Therefore, it in low-temperature test, needs to cool and heat the two to loading station 121a, but to debarkation station
121b need to only be heated.
In addition, for high temperature test, loading station 121a needs are heated, and for the control of accurate temperature, it is also even
You need cooled.But according to device, the degree of high temperature can be presented as relatively low temperature (100 degree +/- 50 degree), and
And in this case, without cooling down electronic component for unloading operation.
Therefore, in high temperature test, need heating to loading station 121a and both cooling, but according to device without
Need the cooling of debarkation station 121b.
That is, being configured to carry out low-temperature test in device and in the case where high temperature test, loading station 121a need it is cooling and
Both.But according to device, debarkation station 121b only needs to heat without cooling in cooling test, therefore can
Not have the individual cooling element for cooling down debarkation station 121b.In this case, according to the control of test pattern,
Debarkation station 121b can only be heated.
According to the sorting machine of above-described embodiment in order to illustrate it is clear and take succinct composition, but held according to processing
Amount, loader 110, shuttle portion 120, first movement device 130, recycling plate 150, the second shifter 160, supply orifice SH and recovery holes
RH can be equipped with multiple.
Also, in the above-described embodiments, loading station 121a and debarkation station 121b is adjusted in a second temperature with dress
Support plate 121 is arranged in different zones, and moves together, but according to implementation, loading station 121a and debarkation station 121b can also
It is independently moved with being configured to be arranged on individual plate by individual moving source.I.e., it is possible to be configured to, second temperature tune
Saving loading plate is 2, and second temperature adjusting loading plate has loading station 121a, and other second temperatures are adjusted and used
Loading plate has debarkation station 121b.
That is, above-described embodiment is most basic example of the invention, therefore the present invention should not be construed as being limited to
The embodiment stated, and interest field of the invention should be understood claims and its equivalency range.
Claims (11)
1. a kind of sorting machine for testing electronic parts, comprising:
Support sector is tested, supports the test for electronic component；
Stack portion is mounted with client's pallet of electronic component to be tested to the supply of test support sector and recycling is mounted with completion
Client's pallet of the electronic component of test,
The test support sector includes:
Loader positioned at the feed region for electronic component to be supplied to test zone, and has the electricity that can adjust loading
Loading plate is used in the first temperature adjusting of the temperature of subassembly；
Shuttle portion makes the electronic component to be come by the first temperature adjusting with loading plate be moved to test zone, or
So that the electronic component for completing to test is moved to recovery zone from test zone, and there is the temperature for adjusting the electronic component loaded
Loading plate is used in second temperature adjusting；
At least one first movement device makes to hold in the palm electronic component to be tested from the client for coming supply position by the stack portion
Disk is moved to the first temperature adjusting loading plate, or keeps electronic component mobile from the first temperature adjusting loading plate
Loading plate is used to second temperature adjusting；
Connector will be moved to the electricity of the test zone by the second temperature adjusting with loading plate from the feed region
Subassembly is electrically connected to tester, so that electronic component be enable to be tested device test；
Plate is recycled, the recovery zone is located at, for recycling by the second temperature adjusting loading plate from the test section
The electronic component of the completion test of the unloading position of the recovery zone is come in domain；
At least one second shifter moves the electronic component for being moved to recovery zone by second temperature adjusting loading plate
It moves to the recycling plate；
Environment maintains chamber, for maintaining the first temperature adjusting loading plate and the second temperature adjusting to be deposited with loading plate
Space dry environment, and there is at least one supply orifice, the offer of described at least one supply orifice makes to load survey in need
Client's pallet of the electronic component of examination is moved through the channel come from the stack portion；
Humidity measuring transducer measures the humidity inside the environment maintenance advantage；
Drier maintains chamber interior to supply dry air to the environment；
Cooler, supplies cooling fluid and cooling first temperature is adjusted and adjusted with loading plate and the second temperature with loading
Plate；
Controller controls the drier according to the information measured by the humidity measuring transducer, to adjust dry sky
The supply of gas,
Wherein, the first temperature adjusting loading plate and the second temperature adjusting can load the ministry of electronics industry with loading plate respectively
Part is adjusted the temperature of the electronic component of loading by conduction, and has and play the cooling fluid institute supplied by the cooler
The cooling road for the mobile road function of passing through,
Wherein, the loader further include: primary heater, to the ministry of electronics industry for being loaded into the first temperature adjusting loading plate
Part applies heat；First sensor for measuring temperature, for measuring the temperature of the first temperature adjusting loading plate,
Wherein, the shuttle portion further include: secondary heater, to the ministry of electronics industry for being loaded into the second temperature adjusting loading plate
Part applies heat；Second temperature measurement sensor, for measuring the temperature of the second temperature adjusting loading plate,
Wherein, the controller according to by first sensor for measuring temperature and the second temperature measurement sensor measurement
Information and control the cooler, primary heater and secondary heater, to adjust the first temperature adjusting loading plate
With the temperature of the second temperature adjusting loading plate.
2. being used for the sorting machine of testing electronic parts as described in claim 1, wherein
For the cooling fluid cooled down by the cooler to be supplied in the cooling road or the cooling tubing recycled
At least one cooling tubing be dual pipe,
Dry air is supplied between the inside tube and outboard tube of the dual pipe by the drier,
The cooling fluid supplied and recycled by the cooler is moved to the inside tube of the dual pipe.
3. being used for the sorting machine of testing electronic parts as described in claim 1, wherein
The environment maintains chamber to have at least one shutter door inside capable of being opened and closed by operating personnel,
The shutter door includes: first, can be opened and closed the first open area；Second, be set to described first and can
Opening and closing is less than the second open area of first open area.
4. being used for the sorting machine of testing electronic parts as described in claim 1, wherein the connector includes:
Electronic component is pressurizeed to the socket side of tester, and has the cooling fluid for making to supply from the cooler by propeller
The fluid passage of process；
Heating element is set to the propeller and applies heat to the propeller；
Temperature-measuring element is set to the propeller and measures the temperature of the propeller；
Cooling tube, for the fluid will to be supplied or will passed through from the cooling fluid that the cooler cools down to the propeller
Access and from the propeller come out cooling fluid be recycled to the cooler,
Wherein, at least one cooling tube in the cooling tube is provided as spiral shape to ensure the mobility of the propeller,
Controller temperature according to measured by the temperature-measuring element and control the cooler and the heating element
And adjust the temperature of the propeller.
5. being used for the sorting machine of testing electronic parts as described in claim 1, wherein the loader further include:
Separation member makes the first temperature adjusting be fixed as separating preset distance from basal plane with loading plate；And
Shielding wall, with the lower end with the first temperature adjusting loading plate around the first temperature adjusting loading plate
And the mode that side mutually separates is equipped with, so that air of the minimum around the first temperature adjusting loading plate is to loading
In the influence of the electronic component of the first temperature adjusting loading plate,
By the part that mutually separates of the part of drier supply dry air between the loading plate and the basal plane.
6. being used for the sorting machine of testing electronic parts as claimed in claim 5, wherein
It is formed with spray-hole in the shielding wall, the spray-hole makes to adjust to the shielding wall and first temperature with loading
The dry air of the part supply mutually separated between plate is sprayed to surrounding.
7. being used for the sorting machine of testing electronic parts as described in claim 1, wherein the shuttle portion further include:
Substrate is equipped in a manner of it can move by moving source；
The second temperature adjusting is fixed in a manner of separating preset space length from the substrate separation member with loading plate；
Shielding wall, with the lower end with the second temperature adjusting loading plate around the second temperature adjusting loading plate
And the mode that side mutually separates is equipped with, to minimize air around the second temperature adjusting loading plate to being loaded into
The second temperature adjusts the influence of the electronic component with loading plate,
Wherein, by the part of drier supply dry air be the second temperature adjusting loading plate and the substrate it
Between the part mutually separated.
8. being used for the sorting machine of testing electronic parts as claimed in claim 7, wherein
It is formed with spray-hole in the shielding wall, the spray-hole makes to the second temperature adjusting loading plate and the substrate
Between be separated by part supply dry air to surrounding spray.
9. being used for the sorting machine of testing electronic parts as described in claim 1, wherein further include:
Shutter is opened and closed the supply orifice,
Wherein, the controller only controls the open supply of the shutter when client's pallet is mobile by the supply orifice
Hole.
10. being used for the sorting machine of testing electronic parts as described in claim 1, wherein
At least one area in the feed region and the test zone is supplied to by the dry air that the drier is supplied
Domain to generate draught head between the test zone and the recovery zone, and then prevents from being present in the recovery zone
Air enter the test zone.
11. being used for the sorting machine of testing electronic parts as described in claim 1, wherein the second temperature is adjusted with loading
Plate includes:
Loading station is loaded electronic component to be tested；
Debarkation station loads the electronic component for completing test,
Wherein, the shuttle portion further include:
Cooling unit, for cooling down the loading station；
Heating unit, for heating the loading station and debarkation station,
Wherein, the debarkation station can only be heated according to control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110029615.7A CN112649692B (en) | 2017-07-20 | 2018-06-08 | Sorting machine for testing electronic components |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20170092022 | 2017-07-20 | ||
| KR10-2017-0092022 | 2017-07-20 | ||
| KR10-2018-0001467 | 2018-01-05 | ||
| KR1020180001467A KR102440374B1 (en) | 2017-07-20 | 2018-01-05 | Hander for testing electronic components |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110029615.7A Division CN112649692B (en) | 2017-07-20 | 2018-06-08 | Sorting machine for testing electronic components |
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| CN109283405A true CN109283405A (en) | 2019-01-29 |
| CN109283405B CN109283405B (en) | 2021-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN1534754A (en) * | 2003-03-21 | 2004-10-06 | Զ���� | Temperature monitoring system of testing classifying machine |
| CN101623690A (en) * | 2009-07-29 | 2010-01-13 | 深圳市计量质量检测研究院 | Apparatus and method for reliability screening |
| TW201007188A (en) * | 2008-08-14 | 2010-02-16 | King Yuan Electronics Co Ltd | Chip testing and sorting machine capable of simulating a system test |
| CN101975904A (en) * | 2010-10-25 | 2011-02-16 | 温州大学 | System for intelligently detecting high temperature aging of electronic assembly |
| CN103185858A (en) * | 2011-12-27 | 2013-07-03 | 泰克元有限公司 | Test sorting machine |
| CN106483446A (en) * | 2015-08-31 | 2017-03-08 | 精工爱普生株式会社 | Electronic component conveying device and electronic component inspection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1534754A (en) * | 2003-03-21 | 2004-10-06 | Զ���� | Temperature monitoring system of testing classifying machine |
| TW201007188A (en) * | 2008-08-14 | 2010-02-16 | King Yuan Electronics Co Ltd | Chip testing and sorting machine capable of simulating a system test |
| CN101623690A (en) * | 2009-07-29 | 2010-01-13 | 深圳市计量质量检测研究院 | Apparatus and method for reliability screening |
| CN101975904A (en) * | 2010-10-25 | 2011-02-16 | 温州大学 | System for intelligently detecting high temperature aging of electronic assembly |
| CN103185858A (en) * | 2011-12-27 | 2013-07-03 | 泰克元有限公司 | Test sorting machine |
| CN106483446A (en) * | 2015-08-31 | 2017-03-08 | 精工爱普生株式会社 | Electronic component conveying device and electronic component inspection device |
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