CN109244020A - A kind of novel pipe PECD graphite boat stuck point - Google Patents
A kind of novel pipe PECD graphite boat stuck point Download PDFInfo
- Publication number
- CN109244020A CN109244020A CN201811313809.4A CN201811313809A CN109244020A CN 109244020 A CN109244020 A CN 109244020A CN 201811313809 A CN201811313809 A CN 201811313809A CN 109244020 A CN109244020 A CN 109244020A
- Authority
- CN
- China
- Prior art keywords
- stuck point
- slot
- stuck
- pedestal
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 16
- 239000010439 graphite Substances 0.000 title claims abstract description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000000465 moulding Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 18
- 229910052710 silicon Inorganic materials 0.000 abstract description 18
- 239000010703 silicon Substances 0.000 abstract description 18
- 238000007747 plating Methods 0.000 abstract description 8
- 239000012528 membrane Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of novel pipe PECD graphite boat stuck points, including stuck point pedestal, stuck point axis and stuck point cap, stuck point pedestal two sides are symmetrically fixed with stuck point axis, the stuck point axis is fixedly connected with stuck point cap far from stuck point pedestal one end, stuck point slot is provided between the stuck point pedestal and stuck point axis, the stuck point slot is opened on stuck point axis；The stuck point cap is set as triangle, and the stuck point slot opens up to be O-shaped, and stuck point slot is opened in three apexes of triangle respectively.O-shaped stuck point slot of the invention is compared with U-shaped card point slot, silicon wafer can be bonded even closer with graphite boat piece, greatly reduce the gap between silicon wafer and stuck point pedestal, to reduce special air-flow around being plated to silicon chip back side, positive film edge stuck point can be reduced thus to print around plating, improved positive film film color, improved the uniformity of color in the piece of positive film, requirement of the further satisfaction market to high standard exterior membrane color, is worthy to be popularized.
Description
Technical field
The present invention relates to the manufacturing technology field of Monocrystalline silicon cell piece surface antireflection film, specially a kind of novel pipe
PECD graphite boat stuck point.
Background technique
In photovoltaic solar industry, the manufacture of monocrystalline solar cells will pass through making herbs into wool, diffusion, and SE is etched, annealed, plating
Film (back passivation, notacoria, positive film), laser, nine procedures of silk-screen printing and sintering.Wherein filming process, the back side deposit one first
Then the aluminium oxide for determining thickness plates silicon nitride film on silicon wafer, purpose is enhancing silicon wafer back surface passivation effect, improves battery
Minority carrier life time and enhance the reflectivity at the back side, to improve UOC/ISC, to promote photoelectric conversion efficiency.
At present in the antireflective coating of Monocrystalline silicon cell piece back surface production, general using with good antireflective and surface
The silicon nitride film of passivation generallys use PECVD (plasma-enhanced chemical gas in manufacture of solar cells technique
Mutually deposit) mode carry out plating silicon nitride film.Tubular type PECVD is to silicon chip film-coated, and silicon wafer is by manually or manipulator form is inserted
Enter in graphite boat, then graphite boat is put in plated film in boiler tube.But existing PECVD back plated film is because of the silicon wafer front surface caused by the plating
There is color difference problem, color difference problem not only influences cell piece qualification rate, does over again and cause a large amount of material wastes, can also reduce cell piece
Efficiency.
The main two kinds of stuck point slots of existing market: V-type with it is U-shaped, the shape of V-type stuck point slot is U-shaped as shown in Figure of description 1
The shape of stuck point slot is as shown in Figure of description 2, and the stuck point cap structure of existing V-type stuck point slot and U-shaped card point slot is as said
Shown in bright book attached drawing 3, in which: the slot inside dimension of V-type stuck point slot is smaller, and silicon wafer easily causes scuffing during inserted sheet, separately because of V-type
Stuck point slot space is tiny easily to be caused to insert because of deposited silicon nitride and takes the chipping of piece process or unfilled corner, and product qualification rate is influenced；U-shaped card point
The groove body position of slot and stuck point cap gradient increase, and relatively reduce scuffing, chipping problem；But groove body is Parallel Design, silicon
Piece placement landing slot is not low high with the boat leaf goodness of fit, then air-flow can be around positive film be plated to, and corresponding positive film edge stuck point will form around plating
Print, influences positive film outward appearance.
Summary of the invention
The purpose of the present invention is to provide a kind of novel pipe PECD graphite boat stuck points, to solve to mention in above-mentioned background technique
Out the problem of.
To achieve the above object, the invention provides the following technical scheme:
A kind of novel pipe PECD graphite boat stuck point, including stuck point pedestal, stuck point axis and stuck point cap, the stuck point pedestal
Two sides are symmetrically fixed with stuck point axis, and the stuck point axis is fixedly connected with stuck point cap, the stuck point pedestal far from stuck point pedestal one end
Stuck point slot is provided between stuck point axis, the stuck point slot is opened on stuck point axis；
The stuck point cap is set as triangle, and the stuck point slot opens up to be O-shaped, and stuck point slot is opened in triangle respectively
Three apexes.
Preferably, the thickness of the stuck point cap is arranged between 0.55-1mm.
Preferably, the width of the stuck point slot is arranged between 0.35-0.5mm.
Preferably, the stuck point pedestal, stuck point axis and stuck point cap are an integral molding structure.
Preferably, the central axis of the stuck point pedestal and stuck point cap is on same reference line.
Compared with prior art, the beneficial effects of the present invention are:
1, O-shaped stuck point slot is provided with to be conducive to slow down silicon wafer and survey from stuck point cap and draws shock to stuck point trench bottom in the present invention
Power reduces chipping, unfilled corner and fragment rate；
2, the radial width that the present invention increases O-shaped stuck point slot can reduce because insert it is not in place caused by scratch；
3, the increase of stuck point cap thickness of the present invention can effectively protect damage caused by the abrasion and unexpected touching of stuck point point,
Increase stuck point service life and reduces producing line repair rate；
4, O-shaped stuck point slot of the invention is compared with U-shaped card point slot, silicon wafer can be bonded with graphite boat piece it is even closer, greatly
The gap reduced between silicon wafer and stuck point pedestal can reduce positive film edge to reduce special air-flow around silicon chip back side is plated to thus
Stuck point is printed around plating, is improved positive film film color, is improved the uniformity of color in the piece of positive film, further satisfaction market is to high standard appearance
The requirement of film color, is worthy to be popularized.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of V-type stuck point slot in the prior art；
Fig. 2 is the structural schematic diagram of U-shaped card point slot in the prior art；
Fig. 3 is the structural schematic diagram of circular stuck point cap in the prior art；
Fig. 4 is the structural schematic diagram of O-shaped stuck point slot of the invention；
Fig. 5 is stuck point cap structure schematic diagram of the invention.
In figure: 1 stuck point pedestal, 2 stuck point axis, 3 stuck point caps, 4 stuck point slots.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-5 is please referred to, the present invention provides a kind of technical solution:
A kind of novel pipe PECD graphite boat stuck point, including stuck point pedestal 1, stuck point axis 2 and stuck point cap 3, stuck point pedestal 1
Two sides are symmetrically fixed with stuck point axis 2, and stuck point axis 2 is fixedly connected with stuck point cap 3, stuck point pedestal 1 and card far from 1 one end of stuck point pedestal
It is provided with stuck point slot 4 between point axis 2, stuck point slot 4 is opened on stuck point axis 2.
As shown in Figure of description 5, stuck point cap 3 is set as triangle, and the thickness of stuck point cap 3 is set as 0.75mm, stuck point
Slot 4 opens up to be O-shaped, and the width of stuck point slot 4 is set as 0.45mm, i.e., the radius of O-shaped stuck point slot 4 is 0.45mm, and stuck point slot 4 divides
It is not opened in three apexes of triangle, allows a stuck point by the stuck point slot 4 by two vertex to two panels silicon
Piece carries out stuck point and fixes, and stuck point pedestal 1, stuck point axis 2 and stuck point cap 3 are an integral molding structure, so that overall structure is more steady
Fixed, the central axis of stuck point pedestal 1 and stuck point cap 3 is on same reference line, so that position error will not occur when use.
As shown in Figure of description 4, silicon wafer can be fallen in O-shaped stuck point slot 4 after placing vertically along circular arc, and be fitted in
The pedestal of stuck point slot 4, this gap reduced between silicon wafer and stuck point pedestal 1 are to reduce special air-flow around silicon chip back side is plated to
This can reduce positive film edge stuck point and print around plating, improve positive film film color, improve the uniformity of color in the piece of positive film, this improves around plating
It is highly effective
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of novel pipe PECD graphite boat stuck point, including stuck point pedestal (1), stuck point axis (2) and stuck point cap (3), described
Stuck point pedestal (1) two sides are symmetrically fixed with stuck point axis (2), and the stuck point axis (2) is fixedly connected with far from stuck point pedestal (1) one end
Stuck point cap (3) is provided with stuck point slot (4) between the stuck point pedestal (1) and stuck point axis (2), and the stuck point slot (4) is opened in card
On point axis (2), it is characterised in that:
The stuck point cap (3) is set as triangle, and the stuck point slot (4) opens up to be O-shaped, and stuck point slot (4) is opened in three respectively
Three angular apexes.
2. a kind of novel pipe PECD graphite boat stuck point according to claim 1, it is characterised in that: the stuck point cap (3)
Thickness be arranged between 0.55-1mm.
3. a kind of novel pipe PECD graphite boat stuck point according to claim 1, it is characterised in that: the stuck point slot (4)
Width be arranged between 0.35-0.5mm.
4. a kind of novel pipe PECD graphite boat stuck point according to claim 1, it is characterised in that: the stuck point pedestal
(1), stuck point axis (2) and stuck point cap (3) are an integral molding structure.
5. a kind of novel pipe PECD graphite boat stuck point according to claim 1, it is characterised in that: the stuck point pedestal
(1) it is on same reference line with the central axis of stuck point cap (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313809.4A CN109244020A (en) | 2018-11-06 | 2018-11-06 | A kind of novel pipe PECD graphite boat stuck point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313809.4A CN109244020A (en) | 2018-11-06 | 2018-11-06 | A kind of novel pipe PECD graphite boat stuck point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109244020A true CN109244020A (en) | 2019-01-18 |
Family
ID=65077113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811313809.4A Pending CN109244020A (en) | 2018-11-06 | 2018-11-06 | A kind of novel pipe PECD graphite boat stuck point |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109244020A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211906A (en) * | 2019-04-22 | 2019-09-06 | 江苏润阳悦达光伏科技有限公司 | Graphite boat fixture |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004168388A (en) * | 2002-11-21 | 2004-06-17 | Toppan Printing Co Ltd | Color filter transferring box |
| CN202839560U (en) * | 2012-08-10 | 2013-03-27 | 晶澳太阳能有限公司 | Easily processable graphite boat snapping point |
| CN203683662U (en) * | 2014-02-14 | 2014-07-02 | 上海东洋炭素有限公司 | Novel graphite boat bearing pin |
| CN204857687U (en) * | 2015-07-28 | 2015-12-09 | 张家港国龙光伏科技有限公司 | Silicon chip is graphite boat for coating film |
| CN205452326U (en) * | 2016-03-28 | 2016-08-10 | 盐城阭特斯协鑫阳光电力科技有限公司 | A novel stuck point for tubular PECVD |
| CN205508793U (en) * | 2016-03-15 | 2016-08-24 | 上海弘竣实业有限公司 | Triangle -shaped stuck point |
| CN206505900U (en) * | 2017-02-22 | 2017-09-19 | 广东爱康太阳能科技有限公司 | A kind of graphite boat of stuck point position optimization |
| CN206742218U (en) * | 2017-06-02 | 2017-12-12 | 福建鑫隆光伏科技有限公司 | A kind of monocrystalline silicon cuts silicon chip collector |
| CN206902232U (en) * | 2017-05-18 | 2018-01-19 | 广东爱旭科技股份有限公司 | Tubular PECVD device |
| CN206921800U (en) * | 2017-07-15 | 2018-01-23 | 青岛环球石墨制品有限公司 | A kind of graphite carrying plate |
| CN207183244U (en) * | 2017-09-11 | 2018-04-03 | 上海亿横精密机械有限公司 | Stuck point, graphite boat piece and graphite boat |
| CN208753284U (en) * | 2018-11-06 | 2019-04-16 | 通威太阳能（安徽）有限公司 | A kind of novel pipe PECD graphite boat stuck point |
-
2018
- 2018-11-06 CN CN201811313809.4A patent/CN109244020A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004168388A (en) * | 2002-11-21 | 2004-06-17 | Toppan Printing Co Ltd | Color filter transferring box |
| CN202839560U (en) * | 2012-08-10 | 2013-03-27 | 晶澳太阳能有限公司 | Easily processable graphite boat snapping point |
| CN203683662U (en) * | 2014-02-14 | 2014-07-02 | 上海东洋炭素有限公司 | Novel graphite boat bearing pin |
| CN204857687U (en) * | 2015-07-28 | 2015-12-09 | 张家港国龙光伏科技有限公司 | Silicon chip is graphite boat for coating film |
| CN205508793U (en) * | 2016-03-15 | 2016-08-24 | 上海弘竣实业有限公司 | Triangle -shaped stuck point |
| CN205452326U (en) * | 2016-03-28 | 2016-08-10 | 盐城阭特斯协鑫阳光电力科技有限公司 | A novel stuck point for tubular PECVD |
| CN206505900U (en) * | 2017-02-22 | 2017-09-19 | 广东爱康太阳能科技有限公司 | A kind of graphite boat of stuck point position optimization |
| CN206902232U (en) * | 2017-05-18 | 2018-01-19 | 广东爱旭科技股份有限公司 | Tubular PECVD device |
| CN206742218U (en) * | 2017-06-02 | 2017-12-12 | 福建鑫隆光伏科技有限公司 | A kind of monocrystalline silicon cuts silicon chip collector |
| CN206921800U (en) * | 2017-07-15 | 2018-01-23 | 青岛环球石墨制品有限公司 | A kind of graphite carrying plate |
| CN207183244U (en) * | 2017-09-11 | 2018-04-03 | 上海亿横精密机械有限公司 | Stuck point, graphite boat piece and graphite boat |
| CN208753284U (en) * | 2018-11-06 | 2019-04-16 | 通威太阳能（安徽）有限公司 | A kind of novel pipe PECD graphite boat stuck point |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211906A (en) * | 2019-04-22 | 2019-09-06 | 江苏润阳悦达光伏科技有限公司 | Graphite boat fixture |
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Application publication date: 20190118 |