CN109233660A - 一种封装过程中使用的胶带及使用方法 - Google Patents
一种封装过程中使用的胶带及使用方法 Download PDFInfo
- Publication number
- CN109233660A CN109233660A CN201811200756.5A CN201811200756A CN109233660A CN 109233660 A CN109233660 A CN 109233660A CN 201811200756 A CN201811200756 A CN 201811200756A CN 109233660 A CN109233660 A CN 109233660A
- Authority
- CN
- China
- Prior art keywords
- micro
- capsule
- adhesive tape
- adhesive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005538 encapsulation Methods 0.000 title claims abstract description 14
- 239000003094 microcapsule Substances 0.000 claims abstract description 52
- 239000000853 adhesive Substances 0.000 claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000013528 metallic particle Substances 0.000 claims abstract description 15
- 239000012780 transparent material Substances 0.000 claims abstract description 6
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 4
- -1 Polypropylene Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 3
- 229920002472 Starch Polymers 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 3
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 3
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 3
- 235000010265 sodium sulphite Nutrition 0.000 claims description 3
- 235000019698 starch Nutrition 0.000 claims description 3
- 239000008107 starch Substances 0.000 claims description 3
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 3
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000002923 metal particle Substances 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 239000002775 capsule Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000004880 explosion Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J103/00—Adhesives based on starch, amylose or amylopectin or on their derivatives or degradation products
- C09J103/02—Starch; Degradation products thereof, e.g. dextrin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/324—Alkali metal phosphate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811200756.5A CN109233660A (zh) | 2018-10-16 | 2018-10-16 | 一种封装过程中使用的胶带及使用方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811200756.5A CN109233660A (zh) | 2018-10-16 | 2018-10-16 | 一种封装过程中使用的胶带及使用方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109233660A true CN109233660A (zh) | 2019-01-18 |
Family
ID=65053630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811200756.5A Pending CN109233660A (zh) | 2018-10-16 | 2018-10-16 | 一种封装过程中使用的胶带及使用方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109233660A (zh) |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001214148A (ja) * | 2000-01-31 | 2001-08-07 | Mitsubishi Electric Corp | 接合剤 |
CN1711390A (zh) * | 2002-11-22 | 2005-12-21 | 皇家飞利浦电子股份有限公司 | 包含受控物质释放的柔性材料 |
CN101475790A (zh) * | 2008-01-04 | 2009-07-08 | 杨光 | 新型木材胶粘剂及其制备方法 |
CN103008267A (zh) * | 2012-12-27 | 2013-04-03 | 上海师范大学附属第二外国语学校 | 一种滚筒式双面胶带 |
JP2013062911A (ja) * | 2011-09-12 | 2013-04-04 | Toyota Motor Corp | モータ用の絶縁シートとステータコアにコイルを固定する方法 |
WO2013057162A2 (de) * | 2011-10-21 | 2013-04-25 | Andree Gunther | Klebeband |
US20130109565A1 (en) * | 2011-10-28 | 2013-05-02 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
CN104231973A (zh) * | 2014-09-05 | 2014-12-24 | 句容市给力包装制品厂 | 一种瓦楞纸箱用快干胶黏剂及其制备方法 |
CN109010085A (zh) * | 2018-10-29 | 2018-12-18 | 长沙云聚汇科技有限公司 | 一种天然纤维发热面膜及其使用方法 |
CN109083361A (zh) * | 2018-09-20 | 2018-12-25 | 佛山市蓝瑞欧特信息服务有限公司 | 一种便于养护的地板及地板养护方法 |
CN109266276A (zh) * | 2018-09-20 | 2019-01-25 | 佛山市蓝瑞欧特信息服务有限公司 | 建筑材料用的高效快干型硬化胶 |
-
2018
- 2018-10-16 CN CN201811200756.5A patent/CN109233660A/zh active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001214148A (ja) * | 2000-01-31 | 2001-08-07 | Mitsubishi Electric Corp | 接合剤 |
CN1711390A (zh) * | 2002-11-22 | 2005-12-21 | 皇家飞利浦电子股份有限公司 | 包含受控物质释放的柔性材料 |
CN101475790A (zh) * | 2008-01-04 | 2009-07-08 | 杨光 | 新型木材胶粘剂及其制备方法 |
JP2013062911A (ja) * | 2011-09-12 | 2013-04-04 | Toyota Motor Corp | モータ用の絶縁シートとステータコアにコイルを固定する方法 |
WO2013057162A2 (de) * | 2011-10-21 | 2013-04-25 | Andree Gunther | Klebeband |
US20130109565A1 (en) * | 2011-10-28 | 2013-05-02 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
CN103008267A (zh) * | 2012-12-27 | 2013-04-03 | 上海师范大学附属第二外国语学校 | 一种滚筒式双面胶带 |
CN104231973A (zh) * | 2014-09-05 | 2014-12-24 | 句容市给力包装制品厂 | 一种瓦楞纸箱用快干胶黏剂及其制备方法 |
CN109083361A (zh) * | 2018-09-20 | 2018-12-25 | 佛山市蓝瑞欧特信息服务有限公司 | 一种便于养护的地板及地板养护方法 |
CN109266276A (zh) * | 2018-09-20 | 2019-01-25 | 佛山市蓝瑞欧特信息服务有限公司 | 建筑材料用的高效快干型硬化胶 |
CN109010085A (zh) * | 2018-10-29 | 2018-12-18 | 长沙云聚汇科技有限公司 | 一种天然纤维发热面膜及其使用方法 |
Non-Patent Citations (1)
Title |
---|
张兴华,童速玲,丁新平: "微胶囊促进剂在环氧树脂胶带固化中的应用" * |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 223005 No. 3 Meicheng Road, Huai'an Economic Development Zone, Jiangsu Province Applicant after: Jiangsu vocationnal college of electronics and information Address before: 223003 Huai'an Information Vocational and Technical College, No. 3 Meizheng Road, Huai'an University, Jiangsu Province Applicant before: Jiangsu vocationnal college of electronics and information |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 223005 No. 3 Meicheng Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Jiangsu electronic information Vocational College Address before: 223005 No. 3 Meicheng Road, Huai'an Economic Development Zone, Jiangsu Province Applicant before: Jiangsu vocationnal college of electronics and information |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190118 |