CN109219896B - 用于表面声波器件的混合结构 - Google Patents
用于表面声波器件的混合结构 Download PDFInfo
- Publication number
- CN109219896B CN109219896B CN201780034366.2A CN201780034366A CN109219896B CN 109219896 B CN109219896 B CN 109219896B CN 201780034366 A CN201780034366 A CN 201780034366A CN 109219896 B CN109219896 B CN 109219896B
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- CN
- China
- Prior art keywords
- hybrid structure
- acoustic wave
- surface acoustic
- face
- piezoelectric layer
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 33
- 239000007789 gas Substances 0.000 claims description 20
- 238000002513 implantation Methods 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims description 8
- 239000001307 helium Substances 0.000 claims description 7
- 229910052734 helium Inorganic materials 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000010410 layer Substances 0.000 description 106
- 238000004519 manufacturing process Methods 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000001902 propagating effect Effects 0.000 description 5
- 238000003486 chemical etching Methods 0.000 description 4
- 230000010070 molecular adhesion Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 helium ions Chemical class 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
- H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1655030A FR3052298B1 (fr) | 2016-06-02 | 2016-06-02 | Structure hybride pour dispositif a ondes acoustiques de surface |
| FR1655030 | 2016-06-02 | ||
| PCT/FR2017/051339 WO2017207911A1 (fr) | 2016-06-02 | 2017-05-30 | Structure hybride pour dispositif a ondes acoustiques de surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109219896A CN109219896A (zh) | 2019-01-15 |
| CN109219896B true CN109219896B (zh) | 2022-11-22 |
Family
ID=56322239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780034366.2A Active CN109219896B (zh) | 2016-06-02 | 2017-05-30 | 用于表面声波器件的混合结构 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US11800803B2 (fr) |
| EP (1) | EP3465784B1 (fr) |
| JP (1) | JP7057288B2 (fr) |
| KR (1) | KR102410318B1 (fr) |
| CN (1) | CN109219896B (fr) |
| FR (1) | FR3052298B1 (fr) |
| SG (1) | SG11201810733PA (fr) |
| WO (1) | WO2017207911A1 (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020098910A1 (fr) * | 2018-11-13 | 2020-05-22 | Huawei Technologies Co., Ltd. | Dispositif à ondes acoustiques de surface avec cristal phononique |
| DE102018131946A1 (de) | 2018-12-12 | 2020-06-18 | RF360 Europe GmbH | Dünnfilm-SAW-Vorrichtung |
| FR3091032B1 (fr) * | 2018-12-20 | 2020-12-11 | Soitec Silicon On Insulator | Procédé de transfert d’une couche superficielle sur des cavités |
| CN111490748A (zh) * | 2020-02-28 | 2020-08-04 | 武汉大学 | 一种薄膜体声波谐振器 |
| EP3896850A1 (fr) * | 2020-04-14 | 2021-10-20 | IQE plc | Structure en couches avec des régions de contrainte localisées dans les oxydes de terres rares cristallins |
| CN113629182A (zh) * | 2020-05-08 | 2021-11-09 | 济南晶正电子科技有限公司 | 一种tc-saw复合衬底及其制备方法 |
| CN112382559A (zh) * | 2020-11-13 | 2021-02-19 | 中国科学院上海微系统与信息技术研究所 | 一种异质薄膜结构及其制备方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008219720A (ja) * | 2007-03-07 | 2008-09-18 | Matsushita Electric Ind Co Ltd | 弾性表面波デバイス |
| CN102361061A (zh) * | 2010-05-17 | 2012-02-22 | 株式会社村田制作所 | 复合压电基板的制造方法及压电器件 |
| JP2012109399A (ja) * | 2010-11-17 | 2012-06-07 | Ngk Insulators Ltd | 複合基板及びその製法 |
| CN105308860A (zh) * | 2013-04-08 | 2016-02-03 | Soitec公司 | 先进热补偿表面声波器件及其制造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004045181B4 (de) * | 2004-09-17 | 2016-02-04 | Epcos Ag | SAW-Bauelement mit reduziertem Temperaturgang und Verfahren zur Herstellung |
| EP2246978B1 (fr) * | 2008-01-24 | 2018-01-03 | Murata Manufacturing Co. Ltd. | Procédé de fabrication d'un élément d'onde élastique |
| KR100912553B1 (ko) * | 2008-03-07 | 2009-08-19 | 오영주 | 압전기판 및 이를 이용한 ｓａｗ 필터 |
| JP5814774B2 (ja) * | 2010-12-22 | 2015-11-17 | 日本碍子株式会社 | 複合基板及び複合基板の製造方法 |
| CN106209007B (zh) * | 2010-12-24 | 2019-07-05 | 株式会社村田制作所 | 弹性波装置 |
-
2016
- 2016-06-02 FR FR1655030A patent/FR3052298B1/fr active Active
-
2017
- 2017-05-30 EP EP17732512.3A patent/EP3465784B1/fr active Active
- 2017-05-30 WO PCT/FR2017/051339 patent/WO2017207911A1/fr unknown
- 2017-05-30 KR KR1020197000090A patent/KR102410318B1/ko active IP Right Grant
- 2017-05-30 SG SG11201810733PA patent/SG11201810733PA/en unknown
- 2017-05-30 CN CN201780034366.2A patent/CN109219896B/zh active Active
- 2017-05-30 US US16/306,822 patent/US11800803B2/en active Active
- 2017-05-30 JP JP2018563171A patent/JP7057288B2/ja active Active
-
2023
- 2023-10-12 US US18/485,899 patent/US20240040930A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008219720A (ja) * | 2007-03-07 | 2008-09-18 | Matsushita Electric Ind Co Ltd | 弾性表面波デバイス |
| CN102361061A (zh) * | 2010-05-17 | 2012-02-22 | 株式会社村田制作所 | 复合压电基板的制造方法及压电器件 |
| JP2012109399A (ja) * | 2010-11-17 | 2012-06-07 | Ngk Insulators Ltd | 複合基板及びその製法 |
| CN105308860A (zh) * | 2013-04-08 | 2016-02-03 | Soitec公司 | 先进热补偿表面声波器件及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240040930A1 (en) | 2024-02-01 |
| EP3465784B1 (fr) | 2020-04-08 |
| JP7057288B2 (ja) | 2022-04-19 |
| KR20190014072A (ko) | 2019-02-11 |
| EP3465784A1 (fr) | 2019-04-10 |
| US11800803B2 (en) | 2023-10-24 |
| WO2017207911A1 (fr) | 2017-12-07 |
| SG11201810733PA (en) | 2018-12-28 |
| FR3052298A1 (fr) | 2017-12-08 |
| CN109219896A (zh) | 2019-01-15 |
| FR3052298B1 (fr) | 2018-07-13 |
| JP2019520753A (ja) | 2019-07-18 |
| US20190165252A1 (en) | 2019-05-30 |
| KR102410318B1 (ko) | 2022-06-17 |
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| GR01 | Patent grant |