CN109203596B - 导热型聚酰亚胺基板 - Google Patents

导热型聚酰亚胺基板 Download PDF

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CN109203596B
CN109203596B CN201810208818.0A CN201810208818A CN109203596B CN 109203596 B CN109203596 B CN 109203596B CN 201810208818 A CN201810208818 A CN 201810208818A CN 109203596 B CN109203596 B CN 109203596B
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thermally conductive
photosensitive resin
heat
polyimide substrate
conducting
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CN109203596A (zh
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黄堂杰
陈伯诚
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Microcosm Technology Co Ltd
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Microcosm Technology Co Ltd
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
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    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
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    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0384—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the main chain of the photopolymer
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B32B2264/1021—Silica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/06—Thermal details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
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Abstract

本发明提供一种导热型聚酰亚胺基板，其包含至少1层绝缘层，且这些绝缘层的单面或两面上有金属层。绝缘层的材料为导热系数介于0.4‑2的导热型感光性树脂，且导热型感光性树脂包括下列成分：(a)感光性聚酰亚胺、(b)无机填充剂以及(c)二氧化硅溶液。感光性聚酰亚胺的含量占导热型感光性树脂的固体成分总重的50‑70％。无机填充剂占导热型感光性树脂固体成分总重的20‑30％，且粒径介于40nm至5μm。二氧化硅溶液包含溶胶凝胶方式聚成的二氧化硅颗粒，颗粒的粒径介于10‑15nm，且含量占该导热型感光性树脂的固体成分总重的5‑30％。

Description

导热型聚酰亚胺基板
技术领域
本发明揭示一种聚酰亚胺基板，特别是关于一种使用导热型感光性聚酰亚胺树脂作为绝缘层的聚酰亚胺基板。
背景技术
一般来说，聚酰亚胺树脂是由芳香族的四羧酸或其衍生物与芳香二胺、芳香二异氰酸酯缩聚而制备，制备所得的聚酰亚胺树脂具有优良的耐热性、耐化学性、机械和电特性，因而被广泛用于如半导体密封剂等绝缘耐热的电子材料。
聚酰亚胺应用于半导体元件的制程中，往往需要利用微影成像技术(MicroLithography)来制作线路图形，如果使用传统的聚酰亚胺，则必须额外加入一层光阻材料(photoresist)以进行蚀刻。因此，感光性聚酰亚胺(Photosensitive polyimide，PSPI)由于同时具有光阻及绝缘保护材料的特性，可以简化制程，使得软板电子材料制程有相当的进步，目前是相当热门的尖端材料。
然而，由于近年电路设计越趋密集，电路中所产生的热能累积，造成产品过热，成为亟欲解决的问题。目前市面上使用热传导系数较低的聚酰亚胺制作的多层基板已无法满足产业需求。
发明内容
本发明目的在于提供一种具有高导热系数同时具有良好感光性的导热型感光性树脂，以及使用其的导热型聚酰亚胺基板。
根据本发明的一个实施例，提供一种导热型聚酰亚胺基板。导热型聚酰亚胺基板包含至少1层绝缘层，且在绝缘层的单面或两面上有金属层。绝缘层的材料为导热系数介于0.4-2的导热型感光性树脂，且导热型感光性树脂包括下列成分：(a)感光性聚酰亚胺、(b)无机填充剂以及(c)二氧化硅溶液。
感光性聚酰亚胺为下式(1)的重复单元所构成的聚合物或共聚合物：
Figure BDA0001596648160000021
其中，m、n各自独立为10至600；X为四价有机基团，其主链部分含脂肪环基团(alicyclic compound group)；Y为二价有机基团，其主链部分含硅氧烷基团(polydimethylsiloxane group)；Z为二价有机基团，其支链部分至少含酚基(phenoilchydroxyl group)或羧基(carboxyl group)。此感光性聚酰亚胺的含量占导热型感光性树脂的固体成分总重的50-70％。
无机填充剂，选自氧化铝、石墨烯、无机粘土、云母粉、氮化硼、氮化铝、二氧化硅、氧化锌、氧化锆、纳米碳管及纳米碳纤维中的至少一种，此无机填充剂的含量占导热型感光性树脂固体成分总重的20-30％，且粒径介于40nm至5μm。
二氧化硅溶液，其包含溶胶凝胶方式聚成的二氧化硅颗粒，二氧化硅颗粒的粒径介于10-15nm，且含量占该导热型感光性树脂的固体成分总重的5-30％。
在一个实施例中，上述导热型感光性树脂的成分还包括含有丙烯酸树脂(acrylicresin)的光交联剂。
在一个实施例中，上述导热型感光性树脂的成分还包括热交联剂。此热交联剂包括酚类化合物、烷氧甲基胺树脂或环氧树脂。
在一个实施例中，无机填充剂为氮化硼或氮化铝。
在一个实施例中，感光性聚酰亚胺式(1)中的X为下列基团其中之一：
Figure BDA0001596648160000031
在一个实施例中，感光性聚酰亚胺式(1)中的Y为下列基团：
Figure BDA0001596648160000032
其中p＝0-20。
在一个实施例中，感光性聚酰亚胺式(1)中的Z为下列基团其中之一：
Figure BDA0001596648160000033
在一个实施例中，二氧化硅溶液中的二氧化硅颗粒占此导热型感光性树脂固体成分总重的7.5-15％，且粒径为10-15nm。
在一个实施例中，导热型聚酰亚胺基板还具有电路元件，其位于绝缘层内并连接至少一个金属层。此电路元件包括电性连接垫、金属柱、金属连结支架或焊线。
在一个实施例中，导热型聚酰亚胺基板还包括保护层，覆盖于最外层的金属层上。保护层的材料包括感光性油墨、热固性油墨、聚对二唑苯纤维(PBO)、聚苯乙烯-苯并环丁烯共聚物(PSBCB)或感光显影覆盖膜(PIC)，或可与绝缘层相同。
在一个实施例中，导热型聚酰亚胺基板为多层结构，包括两层以上的绝缘层，且每一绝缘层的单面或两面上都有金属层。
在一个实施例中，导热型聚酰亚胺基板还包括补强层，其为含浸导热型感光性树脂的碳纤维布。
为使本发明的上述内容与其他方面更能清楚易懂，下文特举实施例，并配合所附图式详细说明。然而需要特别注意的是，实施例的成分、配比、结构仅用于示例之用，并非用以限制本发明。
附图简要说明
图1绘示本发明的导热型聚酰亚胺基板的示意图；
图2A至图2F绘示图1的导热型聚酰亚胺基板的制造方法；
图3A及图3B绘示本发明的导热型聚酰亚胺基板与传统聚酰亚胺基板散热能力的比较结果，其中图3A为操作电压16V的比较结果，图3B为操作电压18V的比较结果。
具体实施方式
本发明提供一种导热型感光性树脂，其主成分为特定分子结构的感光性聚酰亚胺，并加入无机填充剂来改善导热系数，再加入二氧化硅溶液提升光穿透效应，获得具备高导热系数且感光性优良的聚酰亚胺树脂。
本发明的导热型感光性树脂，其中包含：(a)感光性聚酰亚胺；(b)无机填充剂；以及(c)二氧化硅溶液。其中(a)感光性聚酰亚胺具有下式(1)的结构：
Figure BDA0001596648160000041
式(1)中，m、n各自独立为10至600，X为四价有机基团，其主链部分含脂环族基团(alicyclic compound group)，包含(但不限于)以下基团或其组合：
Figure BDA0001596648160000051
Y为二价有机基团，较佳者包含(但不限于)以下基团：
Figure BDA0001596648160000052
p＝0-20
Y的链长以短为佳(p＝0)，最长可到p＝20，过长将破坏感光性聚酰亚胺的性质。
Z为二价有机基团，其支链部分具有酚基(phenolic hydroxyl group)或羧基(carboxyl group)，酚基或羧基的含量约占聚酰亚胺摩尔数的10-30％。调整支链酚基、羧基的含量可以控制显影的时间，当支链酚基或羧基的含量较高，则碱性显影液对感光性聚酰亚胺的溶解性较佳，可提升其显影性。
Z可包括但不限于下列基团：
Figure BDA0001596648160000053
Figure BDA0001596648160000061
(a)感光性聚酰亚胺的含量较佳地占导热型感光性树脂固体成分总重的50-80％。
本发明的导热型感光性树脂还包含(b)无机填充剂，其主要目的为增进聚酰亚胺树脂的导热性。无机填充剂可选自氧化铝、石墨烯、无机黏土、云母粉、氮化硼、二氧化硅、氮化铝、氧化锌、氧化锆、纳米碳管及纳米碳纤维中的一种或多种，且其粒径较佳介于40nm至5μm。无机填充剂的含量较佳占导热型感光性树脂固体成分总重的20-50％。
此外，本发明的导热型感光性树脂中还添加了(c)二氧化硅溶液(silicasolution,colloidal silica)，其包含溶胶凝胶(Sol gel)方式聚成的纳米级二氧化硅颗粒，例如Nissan Chemical的DMAC-ST，二氧化硅颗粒粒径为10-15nm。二氧化硅溶液中的二氧化硅颗粒的含量较佳占导热型感光性树脂的固体成分总重的5-30％。本发明通过添加这两种不同粒径的填充剂，利用小粒径的二氧化硅颗粒将相对大粒径的无机填充剂隔开，使胶体内部于曝光时不至于被大粒径的无机导热填充剂遮盖，可在提升导热能力的同时，维持感光性聚酰亚胺的解析度。
本发明的导热型感光性树脂另可加入结构具有酚类化合物或烷氧甲基胺树脂的热交联剂，使聚烯亚胺分子链上的末端基在曝光烘烤时与热交联剂形成交联结构；也可加入丙烯酸树脂光交联剂，在曝光后产生酸而形成酸催化交联机制。如此产生的交联结构可增加导热型感光性树脂的耐化性及成膜性。
热交联剂其主要目的为在曝后硬烤时经由酸催化及热处理，与PI主链-OH基或末端上-OH基的邻位产生交联，使曝光区域与未曝光区域产生溶解性上的差异，进而快速形成图案。热交联剂含量约占导热型感光性树脂固体成分总重的5-40％，若低于5％，则其交联不足且不耐化学溶剂；若超过40％，则显影性较差。
光交联剂在曝光后会吸收一定波长的光能后产生自由基，引发或催化相应的单体或预聚物的聚合而形成交联。其添加量为导热型感光性树脂固体成分总重的5-40％，若低于5％，则其感光度不足；若超过40％，则显影性较差。
感光性聚酰亚胺的合成步骤为将适量的二胺单体与二酸酐单体溶于N-甲基吡咯烷酮(1-Methyl-2-pyrrolidone；NMP)中，于80℃下反应2小时，加入二甲苯(Xylene)并加热至180℃将其馏出。再加入含有酚基或羧基的二胺单体，于80℃下反应2小时，加入二甲苯并加热至180℃将其馏出，约4小时后将其冷却。导热型感光性树脂的制作方法是取上述制作完成的感光性聚酰亚胺胶体，加入无机填充剂、二氧化硅溶液、光交联剂及热交联剂即可得本发明的导热型感光性树脂(光交联剂及热交联剂可选择性加入)。
实施例1
取配备有机械搅拌器与氮气进入口的500ml三颈圆底烧瓶，加入19.88g(80毫摩尔)的1,3-双(3-氨基丙基)-1,1,3,3-四甲基二硅氧烷(1,3-Bis(3-aminopropyl)tetramethyldisiloxane)、80.7g的N-甲基吡咯烷酮(1-Methyl-2-pyrrolidone；NMP)、39.68g(160毫摩尔)的二环[2,2,2]辛-7-烯-2,3,5,6-四酸二酐(Bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride)，将上述溶液于50-80℃反应2小时后，加入45g的二甲苯后升温至180℃后持续搅拌1.5小时，再加入21.14g(80毫摩尔)的3,5-二氨基苯甲酸2-(2-甲基丙烯酰氧基)乙基酯(2-(Methacryloyloxy)ethyl 3,5-diaminobenzoate)，将上述溶液于50-80℃反应2小时后，加入50g的二甲苯后升温至180℃后持续搅拌4小时。冷却后即可得PIA-1溶液。取PIA-1溶液50g，加入11.38g的甲基丙烯酸缩水甘油酯(Glycidyl methacrylate；GMA)并于70-100℃下搅拌24小时，可得式(1)的感光性聚酰亚胺PSPI-1。
Figure BDA0001596648160000081
式(1)的PSPI-1中，X为
Figure BDA0001596648160000082
Y为
Figure BDA0001596648160000083
p＝0；Z为
Figure BDA0001596648160000084
且m＝n＝120。
取75g PSPI-1加入9.375g填充剂1μm氮化硼(Boron Nitride)，再加入23.43g20％二氧化硅溶液(Nissan Chemical的DMAC-ST，其二氧化硅颗粒粒径为10-15nm)均匀混合，可得导热型感光性树脂PSPI-BN1。利用线棒涂布PSPI-BN1于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
实施例2
将实施例1中的PSPI-1溶液加入12.5g填充剂1μm氮化硼(Boron Nitride)，再加入25g 20％二氧化硅溶液(颗粒粒径为10-15nm)均匀混合，可得导热型感光性树脂PSPI-BN2。利用线棒涂布PSPI-BN2于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
实施例3
将实施例1中的PSPI-1溶液加入16.07g填充剂1μm氮化硼(Boron Nitride)，再加入26.78g 20％二氧化硅溶液(颗粒粒径为10-15nm)均匀混合，可得导热型感光性树脂PSPI-BN3。利用线棒涂布PSPI-BN3于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
实施例4
将实施例1中的PSPI-1溶液加入16.07g填充剂50nm氮化硼(Boron Nitride)，再加入26.78g 20％二氧化硅溶液(颗粒粒径为10-15nm)均匀混合，可得导热型感光性树脂PSPI-BN4。利用线棒涂布PSPI-BN4于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
实施例5
将实施例1中的PSPI-1溶液加入12.5g填充剂5μm氮化铝(Aluminium Nitride)，再加入25g 20％二氧化硅溶液(颗粒粒径为10-15nm)均匀混合，可得导热型感光性树脂PSPI-BN5。利用线棒涂布PSPI-BN2于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
比较例1
将实施例1中的PSPI-1溶液加入9.375g填充剂1μm氮化硼(Boron Nitride)均匀混合，可得导热型感光性树脂PSPI-CT1。利用线棒涂布PSPI-CT1于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
比较例2
将实施例1中的PSPI-1溶液加入12.5g填充剂1μm氮化硼(Boron Nitride)均匀混合，可得导热型感光性树脂PSPI-CT2。利用线棒涂布PSPI-CT2于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
比较例3
将实施例1中的PSPI-1溶液加入16.07g填充剂1μm氮化硼(Boron Nitride)均匀混合，可得导热型感光性树脂PSPI-CT3。利用线棒涂布PSPI-CT3于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
比较例4
将实施例1中的PSPI-1溶液加入16.07g填充剂50nm氮化硼(Boron Nitride)均匀混合，可得导热型感光性树脂PSPI-CT4。利用线棒涂布PSPI-CT4于基材上，经90℃烘箱下，8分钟的预烤程序后，可得膜厚约15μm的薄膜，并以曝光机(功率7kw)投以约400mJ/cm2的能量加以曝光，再以1wt％(重量百分比)碳酸钠(Sodium carbonate)显影剂加以显影，显影时间为1分钟。接着在氮气烘箱200℃下进行2小时的硬烤程序，便可得到耐热性的显影图形。
实施例1-5和比较例1-4的导热型感光性树脂其配方及特性如表一所示：
表一导热型感光性树脂特性测量与比较
Figure BDA0001596648160000111
*解析度表示可达到且可重复的最小图案尺寸，数值越小越佳
*占比皆指占导热型感光树脂的「固体含量」的重量百分比
表一中，填充剂占比是指无机填充剂重量占导热型感光树脂的固体含量的百分比，计算公式如下：
％填充剂＝(W填充剂/Wsolid)×100％
固体含量(％solid)测量方法为，取适当重量胶体，秤重后使用200℃烘烤90分钟，烘烤后再次秤重得固体重量(Wsolid)。得知固体重量后，固体含量可由以下公式计算而得：
％solid＝(Wsolid/Wtotal)×100％
以实施例2的导热型感光树脂PSPI-BN2为例，其为聚酰亚胺PSPI-1 75g(固体含量50％)添加12.5g无机填充剂氮化硼，因此
Figure BDA0001596648160000121
本发明的导热型感光树脂组成物实施例1-4，为相同的感光性聚酰亚胺加入不同重量百分比(wt％)的无机填充剂，且添加相同重量百分比的纳米级二氧化硅颗粒(以二氧化硅溶液方式添加)。相对的，比较例1-4为相同的感光性聚酰亚胺加入不同重量百分比(wt％)的无机填充剂，但未添加二氧化硅溶液。由表一可知，加入二氧化硅溶液，具有不同粒径的填充剂的实施例1-4，比起仅加入单一一种无机填充剂的比较例1-4，其导热系数、热阻(热阻越小越好)与解析度表现(解析度越小越好)都较佳。更甚者，虽然比较例3的主成分也是感光性聚酰亚胺，但由于仅添加一种无机填充剂，且添加比例过高，导致根本无法显影。另外，比较例3虽然使用了粒径较小(50nm)的无机填充剂，但由于添加比例过高，且未添加二氧化硅溶液，仍然无法显影，且导热系数与热阻都较差。实施例5使用另外一种无机填充剂(氮化铝)与二氧化硅溶液混合，同样能够获得高导热、低热阻、解析度优良的效果。本发明通过添加较大粒径的无机填充剂，以及粒径较小的二氧化硅溶液，利用小粒径的二氧化硅颗粒将相对大粒径的无机填充剂隔开，使胶体内部于曝光时不至于被大粒径的无机导热填充剂遮盖，可获得具备高导热系数且感光性优良的导热型感光性树脂。
导热型聚酰亚胺基板
本发明导热型感光性树脂由于兼具导热效果良好以及高感光性的优点，可有多种用途。例如可以作为薄型化基板、载板的介电材料，用以制作多层的叠构基板。
图1为本发明的导热型聚酰亚胺的示意图。导热型聚酰亚胺基板100的结构包括基材10、金属层20,40、电路元件21、绝缘层30以及保护层50。导热型聚酰亚胺基板100可作为半导体元件的载板，通过锡铅凸块60(solder bump)连结半导体IC 70。
以下通过图2A至图2F说明导热型聚酰亚胺基板100的制造方式。首先如图1所示，提供基材10。基材10的材料可包括BT树脂基板、FR-4基板、FR-5基板、ABF树脂基板或FCCL软性铜箔基板等，也可为含浸导热型感光性树脂的碳纤维布，作为加强导热型聚酰亚胺基板强度的补强层。本发明并不对此限制。基材10的上下都具有金属层20，其材质可为铜或其他导电材料。
接着如图2B所示，图案化(patterning)上下金属层20，形成电路设计所需的样式。图案化的方式可为皆知的黄光微影制程，本发明并不限制。
在一个实施例中，如图2C所示，图案化的金属层20上可放置电路元件21，其可为被动元件、主动元件、电性连接垫、金属柱、金属连结支架或焊线等。
接着，如图2D所示，于基材10及金属层20上形成绝缘层30。绝缘层的材料即为前述的导热型感光性树脂，其可直接曝光显影，而不需要额外使用光阻材料来图案化，且具有高导热性，可降低基板的温度。绝缘层30可用印刷、旋涂、辊涂(roller coating)或压贴合(laminating)等方式形成，并使用UV光曝光，再以显影剂去除的方式进行图案化形成通孔31。
然后，如图2E所示，在绝缘层30上形成另外一层图案化金属层40。图案化金属层较佳的制作方法是先对绝缘层30与通孔31进行表面金属化，形成薄金属层使其成为后续制程的金属形成基底，并增加附着力。然后再以电镀的方式于特定地方加厚金属，形成电路设计所需样式的图案化金属层40。
最后，如图2F所示，在最外层的金属层20、40上形成保护层50，图案化使内部的金属层外露，再将金属层外露的部分与半导体IC 70电性连接，便完成图1所示导热型聚酰亚胺基板100。图2F中所示的金属电性连接的方式为覆晶(Flip Chip)与锡铅凸块60(SolderBump)，然而也可采用如打线连结(wire bonding)等的其他方式，本发明并不限制。保护层50的材料可与绝缘层30相同，使用本发明的导热型感光性树脂，也可使用感光性油墨、热固性油墨、聚对二唑苯纤维(PBO)、聚苯乙烯-苯并环丁烯共聚物(PSBCB)或感光显影覆盖膜(PIC)。
图1的导热型聚酰亚胺基板100包括2层金属层20、40，于其他实施例中，可重复图2D至图2F的增层结构制程，便可制作出更多层数的导热型聚酰亚胺基板。
另外，本发明的导热型聚酰亚胺基板并不限定必须依上述制程制造，也可使用其他皆知的半导体制程。只要复数金属层之间的绝缘层使用本发明所述的导热型感光性树脂，都属于本发明的范围。
图3A及图3B比较传统聚酰亚胺基板与本发明导热型聚酰亚胺基板的散热能力。其将相同的发热元件分别设置在传统PSPI基板(单纯使用PSPI作为绝缘层)，以及使用本发明的导热型感光性树脂作为绝缘层的基板中，再用红外线温度扫描仪测量基板的工作温度。图中使用了本发明实施例3、5以及比较例4的导热型感光性树脂，图3A为操作电压16V的测试结果，图3B为操作电压18V的测试结果。由图可知，使用单一填充剂的聚酰亚胺基板(比较例2，导热系数0.19)，其散热效果较一般的PSPI基板(导热系数约0.1-0.2)好，但并没有很明显的差异。而使用本发明的导热型感光性树脂(实施例3、5)的导热型聚酰亚胺基板，其工作温度跟传统聚酰亚胺基板相比较有极大差异，当操作电压较高时，差异更为明显，甚至降低达40％之多(90℃至55℃)。
本发明的导热型聚酰亚胺基板，由于使用了导热型感光性树脂，其工作温度比起传统的PSPI基板(导热系数0.1-0.2)大幅降低，且由于仍保有感光性，图案化制程时不需要额外使用光阻，可简化制程、增加良率。
虽然本发明以实施例说明如上，但这些实施例并非用以限制本发明。本领域的通常知识者在不脱离本发明技艺精神的范畴内，当可对这些实施例进行等效实施或变更，故本发明的保护范围应以其后所附的权利要求范围为准。
【符号说明】
100：导热型聚酰亚胺基板
10：基材
20、40：金属层
21：电路元件
30：绝缘层
31：通孔
50：保护层
60：凸块
70：半导体IC。

Claims (15)

1.一种导热型聚酰亚胺基板，包含：
至少一层绝缘层，且在这些绝缘层的单面或两面上有金属层；
该绝缘层的材料为导热系数介于0.4-2W/m·K的导热型感光性树脂，且该导热型感光性树脂包括下列成分：
(a)感光性聚酰亚胺，其为下式(1)的重复单元所构成的聚合物或共聚合物：
Figure FDA0002526787740000011
其中，m、n各自独立为10至600；X为四价有机基团，其主链部分含脂肪环基团(alicyclic compound group)；Y为二价有机基团，其主链部分含硅氧烷基团(polydimethylsiloxane group)；Z为二价有机基团，其支链部分至少含酚基(phenoilchydroxyl group)或羧基(carboxyl group)，该感光性聚酰亚胺的含量占该导热型感光性树脂的固体成分总重的50-70％；
(b)无机填充剂，选自氧化铝、石墨烯、无机粘土、云母粉、氮化硼、氮化铝、二氧化硅、氧化锌、氧化锆、纳米碳管及纳米碳纤维中的至少一种，该无机填充剂的含量占该导热型感光性树脂固体成分总重的20-30％，且粒径介于40nm至5μm；以及
(c)二氧化硅溶液，其包含溶胶凝胶方式聚成的二氧化硅颗粒，这些二氧化硅颗粒的粒径介于10-15nm，且这些二氧化硅颗粒含量占该导热型感光性树脂的固体成分总重的5-30％。
2.如权利要求1所述的导热型聚酰亚胺基板，其中该导热型感光性树脂的成分还包括含丙烯酸树脂(acrylic resin)的光交联剂。
3.如权利要求1所述的导热型聚酰亚胺基板，其中该导热型感光性树脂的成分还包括热交联剂，该热交联剂包括酚类化合物、烷氧甲基胺树脂或环氧树脂。
4.如权利要求1所述的导热型聚酰亚胺基板，其中该导热型感光性树脂中的该无机填充剂为氮化硼或氮化铝。
5.如权利要求1所述的导热型聚酰亚胺基板，其中该导热型感光性树脂中的X为下列基团其中之一：
Figure FDA0002526787740000021
6.如权利要求1所述的导热型聚酰亚胺基板，其中该导热型感光性树脂中的Y为下列基团：
Figure FDA0002526787740000022
其中p＝0-20。
7.如权利要求1所述的导热型聚酰亚胺基板，其中该导热型感光性树脂中的Z为下列基团其中之一：
Figure FDA0002526787740000023
8.如权利要求1所述的导热型聚酰亚胺基板，其中该导热型感光性树脂内的这些二氧化硅颗粒占该导热型感光性树脂固体成分总重的7.5-15％，且粒径为10-15nm。
9.如权利要求1所述的导热型聚酰亚胺基板，还包括电路元件，其位于绝缘层内并连接至少一个该金属层。
10.如权利要求9所述的导热型聚酰亚胺基板，其中该电路元件包括电性连接垫、金属柱、金属连结支架或焊线。
11.如权利要求1所述的导热型聚酰亚胺基板，还包括保护层，该保护层覆盖于最外层的该金属层上。
12.如权利要求11所述的导热型聚酰亚胺基板，其中该保护层的材料包括感光性油墨、热固性油墨、聚对二唑苯纤维(PBO)、聚苯乙烯-苯并环丁烯共聚物(PSBCB)或感光显影覆盖膜(PIC)。
13.如权利要求11所述的导热型聚酰亚胺基板，其中该保护层的材料与该绝缘层相同。
14.如权利要求1所述的导热型聚酰亚胺基板，其中包括两层以上的绝缘层，且每一绝缘层的单面或两面上都有金属层。
15.如权利要求1所述的导热型聚酰亚胺基板，其还包括补强层，该补强层为含浸该导热型感光性树脂的碳纤维布。
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