CN109183031B - 一种装饰色导热膜结构及其制备方法 - Google Patents

一种装饰色导热膜结构及其制备方法 Download PDF

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CN109183031B
CN109183031B CN201811077046.8A CN201811077046A CN109183031B CN 109183031 B CN109183031 B CN 109183031B CN 201811077046 A CN201811077046 A CN 201811077046A CN 109183031 B CN109183031 B CN 109183031B
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林威廷
罗云侠
何石忠
陈招娣
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Kornerstone Materials Technology Co Ltd
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Abstract

本发明涉及一种装饰色导热膜结构及其制备方法，其特征在于：所述导热膜结构自下而上依次由基板、光学膜和导热黑膜构成，所述基板包括玻璃、塑料和膜材中的一种，所述光学膜是由高、低折射率薄膜交互堆叠构成，或由交互堆叠的高、低折射率薄膜和非导电的真空金属共同构成，所述导热薄膜为类金刚石薄膜材料，其制备过程为：先通过真空离子源去除基板表面的微附着物，再基板表面镀制光学膜，然后在光学膜的上方镀制导热黑膜，得到装饰色导热膜结构；本发明可完全有效的帮助手机导热、提升运行效率、降低爆炸风险，并减少多站工艺的设备成本、人工作业与出和入料检测成本，且仍可选择在重点发热元件再贴上石墨片，在机构空间內达到双重快速导热效果。

Description

一种装饰色导热膜结构及其制备方法
技术领域
本发明属于3C产品领域，更具体涉及一种装饰色导热膜结构及其制备方法。
背景技术
智能手机发展至今，除了基本的语音通讯，消费者更要求无线网络、游戏显示适配器分辨率及手机操作流畅度等，手机的CPU 和GPU处理器运行速度越来越快且组件模块设计为紧密排板，处理器在高频运转时的温度约85℃，电池充电时的温度约60℃，原先可从高导热系数的金属背盖进行散热，手机触感温度可控制在40℃以下。而今，为了导入5G通讯及无线充电技术，金属背盖会产生电磁屏蔽效应影响讯号质量，各手机厂开始采用玻璃、陶瓷及塑料等材料做为手机背盖。
玻璃与塑料除了不影响讯号质量，更具有高通透感的特性，可将手机的装饰性外观提升到更高的视觉质量，因此带动了贴膜厂、DECO膜材厂、镀膜厂及相关设备厂的蓬勃发展。然而，玻璃与塑料的热导系数(k)较低，分別为0.75W/（m·k）和0.25W/（m·k），尽管有金属中框接触导热，但导热效率不及铝镁合金属背盖(k=54-100 W/（m·k）)，且手机内的易发热组件与电池过度紧密排板，造成热能集中、手机运行效能降低和有爆炸的危险性。
目前手机背盖的彩色装饰大多采用DECO贴膜，结构如图2所示；因膜材较厚(0.1mm)和材质偏硬，在大曲度的3D玻璃上贴膜良率较低，因此开始有品牌商转往2.5D/3D玻璃直接镀膜，结构如图3所示。
目前无论是贴膜或直接镀膜，背盖的最内侧会贴上人工石墨散热片(k=100-200W/（m·k）)，帮助处理器的热能经由玻璃，快速的将热量传导开来。石墨散热片厚度约0.03~0.1mm且材质偏硬，通常为局部贴片于背盖，导致手机在运行时(1hr)，后盖最高温度点为44℃，后盖表面的冷、热点温差为7℃。如要整面贴片可能造成翘曲，导致背盖装机不平整，表示此方式的散热方式仍需优化。
发明内容
本发明的目的在于提供一种装饰色导热膜结构及其制备方法，该结构具有快速导热效果，其制备方法可简化多站工艺的设备成本、人工作业与出/入料检测成本。
本发明的技术方案在于：一种装饰色导热膜结构，所述导热膜结构自下而上依次由基板、光学膜和导热黑膜构成。
所述基板包括玻璃、复合塑料(PMMA+PC)和塑料膜材(PET)中的一种。
所述光学膜是由高、低折射率薄膜交互堆叠构成，或由交互堆叠的高、低折射率薄膜和非导电的真空金属共同构成，所述高、低折射率薄膜交互堆叠结构依颜色设计通常为4~12层，所述低折射率薄膜为二氧化硅薄膜，所述高折射率薄膜包括氧化铌、氧化铬和氧化铝中一种或几种，所述非导电的真空金属为金属锡或铟-锡合金，所述非导电的真空金属依设计需求的反射光泽度才会加入结构中。
所述导热黑膜为类金刚石薄膜材料。
一种装饰色导热膜结构的制备方法，具体包括以下步骤：
（1）基板表面处理：通过真空离子源去除基板表面的微附着物；
（2）镀制光学膜：通过真空镀膜工艺在步骤（1）的基板表面镀制光学膜；
（3）镀制导热黑膜：通过真空镀膜工艺在步骤（2）中光学膜的上方镀制导热黑膜，得到装饰色导热膜结构。
步骤（2）中真空镀膜工艺为真空蒸镀和磁控溅镀中的一种。
步骤（3）中真空镀膜工艺为化学气相沉积、磁控溅镀、真空电弧沉积和真空滤过阴极真空弧沉积中的一种，优选为真空滤过阴极真空弧沉积。
进一步地，所述光学膜与导热黑膜可在同一腔体内镀制（一站式），也可在不同腔体内镀制（多站式）。
与现有技术相比较，本发明具有以下优点：本发明在光学膜之上镀制整面导热黑膜，代替现有技术中的颜色漆和石墨散热片，且导热黑膜为类金刚石薄膜，其具有高硬度、高耐磨性和高热导率性能，可实现具有装饰颜色及导热功能的镀膜产品，其可快速且均匀的散逸手机在运行时所发的热，使手机后盖表面的冷、热点温差为2~5℃，同时又能提升运行效率、降低爆炸风险，并减少多站工艺的设备成本、人工作业与出和入料检测成本，且仍可选择在重点发热元件再贴上石墨片，在机构空间內达到双重快速导热效果。
附图说明
图1为装饰色导热膜结构示意图；
图2为现有技术中手机背盖贴膜结构示意图；
图3为现有技术中手机背盖镀膜结构示意图；
如图所示：1-导热黑膜、2-光学膜、3-基板。
具体实施方式
为让发明的上述特征和优点能更明显易懂，下文特举实施例，并配合附图，作详细说明如下，但本发明并不限于此。
实施例1
一种装饰色导热膜结构的制备方法，包括以下步骤：
（1）基板表面处理：将玻璃基板放入真空镀膜腔体，然后将镀膜腔体抽真空至1.0×10-5~1.0×10-6Torr，使用真空离子源去除基板表面的微附着物；
（2）采用磁控溅镀方式镀制光学膜：将真空腔体中基板的温度控制在室温~80℃，并通入纯度为99.9%的氩气，10min后开启等离子发生器，同时通入纯度为99.9%的氧气并控制镀膜工作压力为1.0×10-3~5.0×10-3Torr，并选择硅靶材和铌靶材，确定低折射率薄膜为二氧化硅薄膜、高折射率薄膜为氧化鈮薄膜后，开始镀膜，在基板表面形成高、低折射率薄膜交互堆叠结构，总体镀膜厚度控制在50nm~200nm，完成镀膜后取出样品；
（3）采用真空滤过阴极真空弧沉积方式镀制导热黑膜：将步骤（2）中得到的样品送至另一镀膜腔体，抽真空至1.0×10-5~1.0×10-6Torr，基板温度控制在室温~80℃，向真空腔体通入纯度为99.99%的氩气10min后开启磁过滤真空电弧，并控制镀膜工作压力为1.0×10-3~1.0×10-4Torr，并选择纯度为99.99%的石墨靶材，石墨靶材经电弧撞击，并通过100V~1500V的偏压加速，飞溅沉积与基板的光学膜之上，形成类金刚石碳膜，总体膜厚为1~3μm，镀膜完成后得到装饰色导热膜结构。
实施例2
一种装饰色导热膜结构的制备方法，包括以下步骤：
（1）基板表面处理：将玻璃基板放入真空镀膜腔体，然后将镀膜腔体抽真空至1.0×10-5~1.0×10-6Torr，使用真空离子源去除基板表面的微附着物；
（2）采用磁控溅镀方式镀制光学膜：将真空腔体中基板的温度控制在室温~80℃，并通入纯度为99.9%的氩气，10min后开启等离子发生器，同时通入纯度为99.9%的氧气并控制镀膜工作压力为1.0×10-3~5.0×10-3Torr，并选择硅靶材和铌靶材，确定低折射率薄膜为二氧化硅薄膜、高折射率薄膜为氧化鈮薄膜后，开始镀膜，在基板表面形成高、低折射率薄膜交互堆叠结构，总体镀膜厚度控制在50nm~200nm，完成镀膜后取出样品；
（3）采用磁控溅镀方式镀制导热黑膜：将步骤（2）中得到的样品送至另一镀膜腔体，抽真空至1.0×10-5~1.0×10-6Torr，基板温度控制在室温~300℃，向真空腔体通入氩气(Ar)与氢气(H2:10%)混合气体10min后开启等离子，并控制镀膜工作压力为1.0×10-3~1.0×10-4Torr，并选择纯度为99.99%的石墨靶材，石墨靶材经等离子撞击，飞溅沉积与基板的光学膜之上，形成类金刚石碳膜，总体膜厚为1~3μm，镀膜完成后得到装饰色导热膜结构。
实施例3
一种装饰色导热膜结构的制备方法，包括以下步骤：
（1）基板表面处理：将玻璃基板放入真空镀膜腔体，然后将镀膜腔体抽真空至1.0×10-5~1.0×10-6Torr，使用真空离子源去除基板表面的微附着物；
（2）采用磁控溅镀方式镀制光学膜：将真空腔体中基板的温度控制在室温~80℃，并通入纯度为99.9%的氩气，10min后开启等离子发生器，同时通入纯度为99.9%的氧气并控制镀膜工作压力为1.0×10-3~5.0×10-3Torr，并选择硅靶材和铌靶材，确定低折射率薄膜为二氧化硅薄膜、高折射率薄膜为氧化鈮薄膜后，开始镀膜，在基板表面形成高、低折射率薄膜交互堆叠结构，总体镀膜厚度控制在50nm~200nm；
（3）采用真空滤过阴极真空弧沉积方式镀制导热黑膜：直接将步骤（2）中的腔体抽真空至1.0×10-5~1.0×10-6Torr，基板温度控制在室温~80℃，向真空腔体通入纯度为99.99%的氩气10min后开启磁过滤真空电弧，并控制镀膜工作压力为1.0×10-3~1.0×10- 4Torr，并更换纯度为99.99%的石墨靶材，石墨靶材经电弧撞击，并通过100V~1500V的偏压加速，飞溅沉积与基板的光学膜之上，形成类金刚石碳膜，总体膜厚为1~3μm，镀膜完成后得到装饰色导热膜结构。
以上所述仅为本发明的较佳实施例，凡依本发明申请专利范围所做的均等变化与修饰，皆应属本发明的涵盖范围。

Claims (2)

1.一种装饰色导热膜结构，其特征在于：所述导热膜结构自下而上依次由基板、光学膜和导热黑膜构成；所述光学膜是由高、低折射率薄膜交互堆叠构成，或由交互堆叠的高、低折射率薄膜和非导电的真空金属共同构成，所述低折射率薄膜为二氧化硅薄膜，所述高折射率薄膜包括氧化铌、氧化铬和氧化铝中一种或几种，所述非导电的真空金属为金属锡或铟-锡合金；所述导热黑膜为类金刚石薄膜材料；
所述装饰色导热膜结构的制备方法包括以下步骤：
（1）基板表面处理：通过真空离子源去除基板表面的微附着物；
（2）镀制光学膜：通过真空镀膜工艺在步骤（1）的基板表面镀制光学膜；
（3）镀制导热黑膜：通过真空滤过阴极真空弧沉积在步骤（2）中光学膜的上方镀制导热黑膜，得到装饰色导热膜结构，具体为：将镀制光学膜后的基板置于真空腔体中，抽真空至1.0×10-5~1.0×10-6Torr，镀制光学膜后的基板温度控制在室温~80℃，向真空腔体通入纯度为99.99%的氩气10min后开启磁过滤真空电弧，并控制镀膜工作压力为1.0×10-3~1.0×10-4Torr，并更换纯度为99.99%的石墨靶材，石墨靶材经电弧撞击，并通过100V~1500V的偏压加速，飞溅沉积与基板的光学膜之上，形成类金刚石碳膜，总体膜厚为1~3μm，镀膜完成后得到装饰色导热膜结构；
所述装饰色导热膜结构用于手机后盖；所述基板包括玻璃、复合塑料和塑料膜材中的一种。
2.根据权利要求书1所述的一种装饰色导热膜结构，其特征在于：所述步骤（2）中真空镀膜工艺为真空蒸镀或磁控溅镀。
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