CN109164329A - A kind of semiconductor memory product high/low temperature ageing testing method - Google Patents
A kind of semiconductor memory product high/low temperature ageing testing method Download PDFInfo
- Publication number
- CN109164329A CN109164329A CN201811236575.8A CN201811236575A CN109164329A CN 109164329 A CN109164329 A CN 109164329A CN 201811236575 A CN201811236575 A CN 201811236575A CN 109164329 A CN109164329 A CN 109164329A
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- Prior art keywords
- test
- low temperature
- semiconductor memory
- testing method
- temperature
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Abstract
The present invention provides a kind of semiconductor memory product high/low temperature ageing testing method, test method includes: that ring measurement equipment, several test machines, timer, precaution device merging are assembled in a weatherometer, ring measurement equipment, test machine, timer and precaution device are controlled by control software and Local network communication with server: by editor control instruction and Local network communication, instruction instruction is issued to ring measurement equipment, test machine, until this test item is completed, and after returning, server issues next instruction again, and carries out the test of next project；By doing logic judgment to test data, judge automatically the result is that PASS or NG.Test process of the present invention has not only reached the requirement of test, and saves the research and development testing time, and the entire testing time is easy to reasonable arrangement, without artificial test on duty, the working efficiency for improving developer, reduces the investment of manpower, and reduces the error that artificial judgment test result is brought.
Description
Technical field
The present invention relates to semiconductor storage class product stability test methods, and in particular to a kind of semiconductor memory product is high
Low temperature aging test method.
Background technique
The reliability temperature test of electronic product includes the test of high/low temperature Alternate hot and humid at present, has become reliability test
The most important thing of work needs to do storage product in the environment of high temperature or low temperature for all semiconductor storage class products
Rigorous readwrite tests (abbreviation burn-in test) simulates in the environment of high temperature or low temperature, is sent instructions by associated control software,
Read-write and contrastive test are done to storage class product, whether confirmation storage product can be with normal operation in harsh external environment.
Currently, product simulation working condition (readwrite tests) is stored when high temperature or low temperature environment are tested, with existing equipment
It can test corresponding project, but need for more test chassis to be located at cooperation beside ring measurement equipment and could complete to store class product and exist
Readwrite tests is done in the environment of different high temperature & low temperature.And need repeatedly setting do high temperature & low temperature switching could complete it is all
Test item.Moreover, the test data of output needs the engineer for giving profession just to can know that test result.It both elongates in this way
The research and development of products period also increases the cost of human input, equipment investment and place investment, and the process of engineer's judgement has
The interference of experience reduces the reliability and working efficiency of test result.
Summary of the invention
In order to solve above-mentioned and other potential technical problems, the embodiment provides a kind of semiconductors to deposit
Product high/low temperature ageing testing method is stored up, the test method includes:
Step 1: ring measurement equipment, several test machines, timer, precaution device merging are assembled in a weatherometer, used
Server controls ring measurement equipment, test machine, timer and precaution device by control software and Local network communication；
Step 2: by editor control instruction and Local network communication, the heating, cooling that ring measurement equipment is timed, constant temperature with
And humid control；
Step 3: by editor control instruction and Local network communication, instruction is issued under different environment temperatures to test machine, is made
Storage product does the instruction read or write, until this test item is completed, and after return, server issues next instruction again, and
Carry out the test of next project；
Step 4: by editing output reporting format, each test item data are backfilled automatically, are sentenced by doing logic to test data
It is disconnected, it judges automatically the result is that PASS or NG.
In one embodiment of the invention, increase power-off protection mechanism, test data timing automatically saves, if occurring abnormal
Power-off, the project that test result can be saved in front of power-off terminate, and for equipment after being once again powered up, server can issue instruction,
It is tested since last time powers off unfinished item, and continues to complete the project that do not test.
In one embodiment of the invention, the test item of test machine sequence are as follows: high temperature writes-and low temperature reading-low temperature writes-
High temperature is read.
In one embodiment of the invention, the high and low-temperature apparatus, test machine, ring measurement equipment, timer, precaution device series connection
Setting.
In one embodiment of the invention, the ring measurement equipment includes temperature sensor and humidity sensor.
In one embodiment of the invention, the runing time of each temperature of high and low-temperature apparatus is set, to realize that high/low temperature is set
Standby automation heating and cooling.
In one embodiment of the invention, the record time of setting data acquisition realizes the automatic every test of record in real time
As a result.
In one embodiment of the invention, the test report be a list automatically generated and graphic file at least within
One of.
It further include a display module, for showing the test report of output in one embodiment of the invention.
In one embodiment of the invention, the temperature range of the high temperature is 35 ~ 85 DEG C, and the temperature of low temperature environment is -30
DEG C ~ 0 DEG C, the humidity is 10%RH ~ 95%RH.
As described above, semiconductor memory product high/low temperature ageing testing method of the invention has the advantages that
High and low-temperature apparatus, several test machines, ring measurement equipment, timer, precaution device are assembled in a burn-in test by the present invention
On in machine, need multiple devices cooperation that could complete storage class product in different high temperature, the environment of low temperature compared to existing
Under do readwrite tests (temperature range of the high temperature be 35 ~ 85 DEG C, and the temperature of low temperature environment is -30 DEG C ~ 0 DEG C, and the humidity is
10%RH~95%RH.), test requires to set up test machine near equipment every time, and repeatedly high temperature is done in setting, and low temperature switching is set
All test items could be completed by setting, and not only reduced the investment of equipment, also simplified test program.Height is arranged in the present invention
The automatic conversion of temperature, the automatic collection of data and test result judge automatically, and server can automatically generate test report
It accuses, entire test process has not only reached the requirement of test, and saves the research and development testing time, and entire testing time depression is closed
Reason arranges, and without artificial test on duty, improves the working efficiency of developer, reduces the investment of manpower, and reduce people
Work judges the error that test result is brought.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is shown as the architecture diagram of test macro of the invention.
Fig. 2 is shown as test flow chart of the invention.
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.It should be noted that in the absence of conflict, following embodiment and implementation
Feature in example can be combined with each other.
Fig. 1 is please referred to Fig. 2.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the invention can be real
The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of present invention can be generated and the purpose that can reach, it should all still fall in disclosed skill
Art content obtains in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right", " centre " and
The term of " one " etc. is merely convenient to being illustrated for narration, rather than to limit the scope of the invention, relativeness
It is altered or modified, under the content of no substantial changes in technology, when being also considered as the enforceable scope of the present invention.
The purpose of the present embodiment is that a kind of semiconductor memory product high/low temperature ageing testing method is provided, for solving
The prior art stores product simulation working condition (readwrite tests) when high temperature or low temperature environment are tested, and needs more test machines
It is erected at cooperation beside ring measurement equipment and could complete to store class product and do readwrite tests in the environment of different high temperature & low temperature.
And repeatedly setting is needed to do the technical issues of switching of high temperature & low temperature could complete all test items, the temperature of the high temperature
Range is 35 ~ 85 DEG C, and the temperature of low temperature environment is -30 DEG C ~ 0 DEG C, and the humidity is 10%RH ~ 95%RH.Test of the present invention
Method includes:
Step 1: ring measurement equipment, several test machines, timer, precaution device are merged in assembling weatherometer, server is used
Ring measurement equipment, test machine, timer and precaution device are controlled by control software and Local network communication；
Step 2: by editor control instruction and Local network communication, the heating, cooling that ring measurement equipment is timed, constant temperature with
And humid control；
Step 3: by editor control instruction and Local network communication, instruction is issued under different environment temperatures to test machine, is made
Storage product does the instruction read or write, until this test item is completed, and after return, server issues next instruction again, and
Carry out the test of next project；
Step 4: by editing output reporting format, each test item data are backfilled automatically, are sentenced by doing logic to test data
It is disconnected, it judges automatically the result is that PASS or NG.
The present invention merges high temperature, Cryo Equipment function and test machine function in a weatherometer.Pass through service
Device control software and Local network communication, are instructed, control ring measurement equipment is in conditions such as different temperatures/humidity by editor control
Under, and control that test computer does rigorous read-write to storage class product and comparison function is tested, return test result to server,
And test result is made certainly.
When the temperature of high and low-temperature apparatus is more than specification temperature range, reliability test does not pass through.Test side of the invention
In method, the interval of high and low-temperature apparatus adjust automatically temperature, high/low temperature adjustment is 5 ~ 10 minutes, and tester detects and remembers automatically
Data are recorded, realize the automation of entire method.
Method and embodiment of the invention described in detail below.
As shown in Fig. 2, equipment issues control instruction information by assist edit software, then by Local network communication, it will be high
Warm oven/test machine/timer/precaution device is cascaded, and by issuing instructions to test under different temperatures environment, and controls
Test machine processed does readwrite tests to storage product, does readwrite tests to simulate the storage product that does under various circumstances, and can be
After the completion of each readwrite tests, test function sends back to communication and ceases to server, and confirm be carry out the next item down test condition and
Test item, finally, server by judgement storage product each test item passback as a result, by logic judgment, produce
Raw intuitive test result.
By a high-temperature service and a Cryo Equipment, two test machines, a ring measurement equipment, a timer, one
Precaution device assembled in series passes through control software and Local network communication to high and low-temperature apparatus, test on one device, with server
Machine, timer and precaution device control；And increasing power-off protection mechanism in a device, test data timing automatically saves, if going out
Existing abnormal power-down, the project that test result can be saved in front of power-off terminate, and after being once again powered up, server can issue equipment
Instruction is tested since last time powers off unfinished item, and continues to complete the project that do not test.
The temperature for setting high-temperature service is 35 DEG C, 65 DEG C, 85 DEG C, and the temperature of Cryo Equipment is -30 DEG C, -10 DEG C and 0 DEG C,
Ring measurement equipment by editor control instruct and Local network communication, the heating, cooling that high and low-temperature apparatus is timed, constant temperature and
Whether humid control reaches setting value by the temperature that the temperature sensor in ring measurement equipment tests high and low-temperature apparatus.
Test machine carries out the test that high temperature is write first, followed by the test that low temperature is read, due at this time also in low temperature environment,
The test that low temperature is write directly is set, then heats up again and carries out the test of high temperature reading.The record of data acquisition is set in test process
Time realizes the automatic every test result of record in real time.Test item is completed, and after return, server issues next finger again
It enables, and carries out the test of next project；
List and graphic file test report output backfill each test item data automatically, lead to by editing output reporting format
It crosses and logic judgment is done to test data, judge automatically the result is that PASS or NG.
In conclusion the embodiment of the present invention merges high temperature, Cryo Equipment function and test machine function in an equipment.
By server control software and Local network communication, instructed by editor control, control ring measurement equipment is in different temperatures/humidity
It Deng under the conditions of, and controls test computer and does rigorous read-write and comparison function test to storage class product, return test result is given
Server, and test report is made certainly, the research and development of products period is shortened, the cost of manpower and equipment investment is reduced.So this
Invention effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, includes that institute is complete without departing from the spirit and technical ideas disclosed in the present invention for usual skill in technical field such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (10)
1. a kind of semiconductor memory product high/low temperature ageing testing method, which is characterized in that the test method includes:
Step 1: ring measurement equipment, several test machines, timer, precaution device merging are assembled in a weatherometer, used
Server controls ring measurement equipment, test machine, timer and precaution device by control software and Local network communication；
Step 2: by editor control instruction and Local network communication, the heating, cooling that ring measurement equipment is timed, constant temperature with
And humid control；
Step 3: by editor control instruction and Local network communication, instruction is issued under different environment temperatures to test machine, is made
Storage product does the instruction read or write, until this test item is completed, and after return, server issues next instruction again, and
Carry out the test of next project；
Step 4: by editing output reporting format, each test item data are backfilled automatically, are sentenced by doing logic to test data
It is disconnected, it judges automatically the result is that PASS or NG.
2. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: increase power-off
Protection mechanism, test data timing automatically saves, if there is abnormal power-down, test result can be saved in a project before power-off
Terminate, for equipment after being once again powered up, server can issue instruction, test since last time powers off unfinished item, and continued
At the project that do not test.
3. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: the test
The test item sequence of machine are as follows: high temperature writes-low temperature reading-low temperature writes-and high temperature reads.
4. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: the height
Warm equipment, test machine, ring measurement equipment, timer, precaution device are arranged in series.
5. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: the ring is surveyed
Equipment includes temperature sensor and humidity sensor.
6. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: setting height
The runing time of the warm each temperature of equipment, to realize the automation heating and cooling of high and low-temperature apparatus.
7. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: setting data
The record time of acquisition realizes the automatic every test result of record in real time.
8. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: the test
Be reported as list that one automatically generates and graphic file at least one.
9. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: further include one
Display module, for showing the test report of output.
10. semiconductor memory product high/low temperature ageing testing method according to claim 1, it is characterised in that: the height
The temperature range of temperature is 35 ~ 85 DEG C, and the temperature of low temperature environment is -30 DEG C ~ 0 DEG C, and the humidity is 10%RH ~ 95%RH.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811236575.8A CN109164329A (en) | 2018-10-23 | 2018-10-23 | A kind of semiconductor memory product high/low temperature ageing testing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811236575.8A CN109164329A (en) | 2018-10-23 | 2018-10-23 | A kind of semiconductor memory product high/low temperature ageing testing method |
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Cited By (3)
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| CN110716126A (en) * | 2019-10-14 | 2020-01-21 | 珠海亿智电子科技有限公司 | Chip aging test system, method and device |
| CN111243656A (en) * | 2020-03-01 | 2020-06-05 | 江苏华存电子科技有限公司 | Multithreading multi-temperature-zone intelligent aging test machine |
| CN113810684A (en) * | 2021-08-06 | 2021-12-17 | 东莞市金锐显数码科技有限公司 | Method and device for starting aging test |
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| CN111243656A (en) * | 2020-03-01 | 2020-06-05 | 江苏华存电子科技有限公司 | Multithreading multi-temperature-zone intelligent aging test machine |
| CN113810684A (en) * | 2021-08-06 | 2021-12-17 | 东莞市金锐显数码科技有限公司 | Method and device for starting aging test |
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Application publication date: 20190108 |