CN109156081A - 电子模块及电子模块的制造方法 - Google Patents

电子模块及电子模块的制造方法 Download PDF

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Publication number
CN109156081A
CN109156081A CN201680086061.1A CN201680086061A CN109156081A CN 109156081 A CN109156081 A CN 109156081A CN 201680086061 A CN201680086061 A CN 201680086061A CN 109156081 A CN109156081 A CN 109156081A
Authority
CN
China
Prior art keywords
wiring pattern
radiating fin
substrate
interarea
electronic module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680086061.1A
Other languages
English (en)
Chinese (zh)
Inventor
多田清和
永田雄
永田雄一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN109156081A publication Critical patent/CN109156081A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
CN201680086061.1A 2016-05-30 2016-05-30 电子模块及电子模块的制造方法 Pending CN109156081A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/065925 WO2017208309A1 (ja) 2016-05-30 2016-05-30 電子モジュールおよび電子モジュールの製造方法

Publications (1)

Publication Number Publication Date
CN109156081A true CN109156081A (zh) 2019-01-04

Family

ID=60478131

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680086061.1A Pending CN109156081A (zh) 2016-05-30 2016-05-30 电子模块及电子模块的制造方法

Country Status (3)

Country Link
JP (1) JP6251420B1 (ja)
CN (1) CN109156081A (ja)
WO (1) WO2017208309A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114544697A (zh) * 2022-02-08 2022-05-27 北京卫星环境工程研究所 一种用于真空热试验的散热装置及其强化散热方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020072167A (ja) * 2018-10-31 2020-05-07 Tdk株式会社 実装体

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04255294A (ja) * 1991-02-06 1992-09-10 Fujitsu Ten Ltd 放熱構造および放熱板の実装方法
JPH0613529A (ja) * 1992-06-24 1994-01-21 Toshiba Corp 半導体装置
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6212076B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Enhanced heat-dissipating printed circuit board package
CN101088310A (zh) * 2004-12-21 2007-12-12 皇家飞利浦电子股份有限公司 印刷电路板结构
JP2012004257A (ja) * 2010-06-16 2012-01-05 Joetsu Electronics Ind Co Ltd ヒートシンク
CN104582237A (zh) * 2013-10-18 2015-04-29 深南电路有限公司 一种内层走大电流的电路板及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677281U (ja) * 1993-03-31 1994-10-28 ファナック株式会社 多層プリント基板
JP2003115564A (ja) * 2001-10-03 2003-04-18 Murata Mfg Co Ltd 電子回路装置
JP4730426B2 (ja) * 2008-11-19 2011-07-20 ソニー株式会社 実装基板及び半導体モジュール
JP2012004162A (ja) * 2010-06-14 2012-01-05 Yokogawa Electric Corp 表面実装部品放熱装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04255294A (ja) * 1991-02-06 1992-09-10 Fujitsu Ten Ltd 放熱構造および放熱板の実装方法
JPH0613529A (ja) * 1992-06-24 1994-01-21 Toshiba Corp 半導体装置
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6212076B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Enhanced heat-dissipating printed circuit board package
CN101088310A (zh) * 2004-12-21 2007-12-12 皇家飞利浦电子股份有限公司 印刷电路板结构
JP2012004257A (ja) * 2010-06-16 2012-01-05 Joetsu Electronics Ind Co Ltd ヒートシンク
CN104582237A (zh) * 2013-10-18 2015-04-29 深南电路有限公司 一种内层走大电流的电路板及其制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114544697A (zh) * 2022-02-08 2022-05-27 北京卫星环境工程研究所 一种用于真空热试验的散热装置及其强化散热方法

Also Published As

Publication number Publication date
WO2017208309A1 (ja) 2017-12-07
JPWO2017208309A1 (ja) 2018-06-14
JP6251420B1 (ja) 2017-12-20

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190104

WD01 Invention patent application deemed withdrawn after publication