CN109152326A - Electronic component mounting system and electronic component attaching method - Google Patents
Electronic component mounting system and electronic component attaching method Download PDFInfo
- Publication number
- CN109152326A CN109152326A CN201810132785.6A CN201810132785A CN109152326A CN 109152326 A CN109152326 A CN 109152326A CN 201810132785 A CN201810132785 A CN 201810132785A CN 109152326 A CN109152326 A CN 109152326A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- substrate
- electrode
- convex block
- electro part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000010992 reflux Methods 0.000 claims abstract description 14
- 238000005259 measurement Methods 0.000 claims abstract description 9
- 238000007689 inspection Methods 0.000 claims description 14
- 238000012937 correction Methods 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 4
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 238000012109 statistical procedure Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000002045 lasting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
The present invention provides a kind of electronic component mounting system and electronic component attaching method.According to an aspect of the present invention, electronic component mounting system includes: electro part carrying device, so that the convex block for being formed in electronic component is overlapped onto the electronic component engagement electrode for being formed in substrate, to carry the electronic component；Reflux unit heats the substrate after the carrying electronic component and the convex block is made to be joined to the electrode；Control unit controls the electro part carrying device；And x-ray check device, it is set between the electro part carrying device and the reflux unit, the position of the electrode on substrate after the measurement carrying electronic component and the position of the convex block, wherein, described control unit carries out feedback control to the electro part carrying device, reduces so that the position of the two of the position acquisition of the position and convex block of the electrode as measured by the x-ray check device is deviateed.
Description
Technical field
The present invention relates to it is a kind of by electronic component attachment to substrate and manufacture mounted substrate electronic component mounting system and
Electronic component attaching method.
Background technique
In general, electronic component mounting system (electronic component attaching method) includes: electro part carrying device (electronic component
Carry process), in the electronic component engagement for being formed in substrate with carrying electronic component on electrode；And reflux unit (reflux work
Sequence), by the substrate heating after carrying electronic component and by the electrode of electronic component engagement to substrate, and in electro part carrying
Check device (inspection operation) is set between device (electro part carrying process) and reflux unit (reflow process), to check
Whether electronic component is correctly equipped on substrate before reflux, and above-mentioned composition is well-known.
However, previous inspection is all the simple inspection to appearance, it, can be from electronic component during the visual examination
Back side shooting electronic component loading position (front), therefore, to convex block be formed in positive electronic component (hereinafter, and also
Referred to as " tab feature "), the shade at the back side of the position formation tab feature of the position or convex block of electrode leads to not directly
Check these positions.That is, can not accurately check carrying quality to existing tab feature, and it is difficult to fill the inspection result
Use the maintenance or improvement of product having mounted thereon matter with dividing.
A kind of inspection for executing and being directed to component mounted substrate is disclosed in Korean Patent Laid the 2005-0080442nd
The technology looked into.
Summary of the invention
According to an aspect of the present invention, major subjects are that convex block (bump) component can accurately be detected by providing one kind
Carrying quality, and can be realized maintenance or improved electronic component mounting system and the electronic component attachment side of the carrying quality
Method.
A kind of electronic component mounting system is provided according to an aspect of the present invention, wherein includes: electro part carrying dress
It sets, so that the convex block for being formed in electronic component is overlapped onto the electronic component engagement electrode for being formed in substrate, to carry the electricity
Subassembly；Reflux unit heats the substrate after the carrying electronic component and the convex block is made to be joined to the electrode；
Control unit controls the electro part carrying device；And x-ray check device, it is set to the electro part carrying device
Between the reflux unit, measurement carry the electrode on the substrate after the electronic component position and the convex block
Position, described control unit carry out feedback control to the electro part carrying device as follows: will be checked by the x-ray
The position of the two of the position acquisition of the position of the electrode and the convex block measured by device, which is deviateed, is reduced.
Wherein, the electro part carrying device may include: mouthpiece part, pick up from the supply department of the electronic component
The electronic component and the electrode for being carried to the substrate；Boarded head is rotatably mounted with the nozzle section in axis
Part；XY mobile mechanism moves the boarded head along the direction XY in the horizontal plane, and described control unit is in order to reduce the position
Deviate and calculate the position correction amount on the direction XY of boarded head when carrying the electronic component, and with described in the carrying
The mode that the position correction amount is able to reflect when electronic component carries out feedback control to the electro part carrying device.
Wherein, described control unit can be in the viewpoint of each region for the substrate and for the mouthpiece part
Each rotation angle viewpoint at least one viewpoint calculate the position correction amount.
Also, according to another aspect of the present invention, provide a kind of electronic component attaching method, wherein comprise the following steps:
Electro part carrying process makes the convex block for being formed in electronic component overlap onto the electronic component engagement electrode for being formed in substrate,
To carry the electronic component；Reflow process heats the substrate after the carrying electronic component and makes the convex block
It is joined to the electrode；X-ray inspection operation, between the electro part carrying process and the reflow process, by x-ray inspection
The position of the electrode on substrate after the device measurement carrying electronic component and the position of the convex block；And control work
Sequence carries out feedback control to the electro part carrying process as follows: will be by measuring in the x-ray inspection operation
The position of the two of the position acquisition of the position of the electrode and the convex block, which is deviateed, is reduced.
Wherein, electro part carrying device, the electro part carrying device are used in the electro part carrying process
Can have: mouthpiece part picks up the electronic component from the supply department of the electronic component and is carried to the electricity of the substrate
Pole；Boarded head is rotatably mounted with the mouthpiece part in axis；XY mobile mechanism makes the boarded head in level
The face direction Nei YanXY is mobile, and in the control process, in order to reduce, the position is deviateed and is calculated and is carried the electronic component
When the boarded head the direction XY on position correction amount, and to be able to reflect the position when carrying the electronic component
The mode of correcting value carries out feedback control to the electro part carrying device.
It wherein, can be in the viewpoint of each region for the substrate and for the suction in the control process
At least one viewpoint in the viewpoint of each rotation angle of nozzle component calculates the position correction amount.
According to electronic component mounting system and electronic component attaching method based on an aspect of of the present present invention, by applying X
Ray examination and the position of measuring electrode and the position of convex block, and in order to the position both reduced is deviateed and to electro part carrying
Device (electro part carrying process) carries out feedback control, therefore can accurately check the carrying quality of tab feature, and energy
Enough realize the maintenance or improvement of the carrying quality.
Detailed description of the invention
Fig. 1 is the system pie graph for showing the electronic component mounting system of an implementation form according to the present invention.
Fig. 2 is the schematic diagram for showing the composition of the electro part carrying device in the electronic component mounting system of Fig. 1.
Fig. 3 is the schematic diagram for showing the function of the x-ray check device in the electronic component mounting system of Fig. 1.
Fig. 4 is the calculating for showing each rotation angle amount of being corrected for mouthpiece part, and according to the correcting value and
The schematic diagram of the method for feedback control is carried out to electro part carrying device.
Fig. 5 is the calculating for showing each region amount of being corrected for substrate, and according to the correcting value and to the ministry of electronics industry
Part loading device carries out the schematic diagram of the method for feedback control.
Symbol description
1: electro part carrying device 2:X ray detection device
3: reflux unit 4: appearance inspection device
5: communication network 6: management computer (control unit)
10: substrate 10a: electrode
11: tab feature 11a: convex block
Specific embodiment
Hereinafter, being described in detail referring to attached drawing to according to the present invention of preferred embodiment.Also, this specification with
And in attached drawing, identical reference numeral is used for the constituent element of substantial composition having the same, and omit duplicate theory
It is bright.
Fig. 1 is the system pie graph for showing the electronic component mounting system of an implementation form according to the present invention.Referring to figure
1, electronic component mounting system is by filling electro part carrying device 1, x-ray check device 2, reflux unit 3 and visual examination
It sets 4 these each device connections and is formed, and each device is connected to each other by communication network 5, and electronic component pastes
Dress system integrally has the composition controlled by the management computer 6 as control unit.
Hereinafter, will be by illustrating the composition and function of each device, and to the electronic component mounting system based on Fig. 1
Electronic component attaching method is illustrated.
Electro part carrying device 1 executes electro part carrying process.That is, electro part carrying device 1 will be formed in it is convex
The positive convex block of block part overlaps the electronic component engagement electrode for being formed in substrate, to carry tab feature.
As schematically shown in Fig. 2, in this embodiment, electro part carrying device 1 has boarded head 1a and use
In the XY mobile mechanism for moving the boarded head along the direction XY.
Also, in Fig. 2, although it is not shown, still rotatable in the axis for riding over a 1a in boarded head 1a
Ground is equipped with single line or multi-thread mouthpiece part, and picks up tab feature from the supply department of tab feature by the mouthpiece part
And it is carried to the electrode of substrate.Also, the usual mouthpiece part includes the main shaft (spindle) for being rotatably mounted in boarded head
They are referred to as mouthpiece part in the present invention with the suction nozzle main body for the front end for being removably mountable to the main shaft.
X-ray check device 2 executes x-ray inspection operation, and x-ray check device 2 is set to electro part carrying device 1 and reflux
Between device 3, and measure carry electronic component after substrate on electrode position and convex block position.
It is as follows if being illustrated referring to function of the Fig. 3 to the x-ray check device 2 of this implementation form.
As shown in (a) of Fig. 3, x-ray check device 2 from the back side exposure of the tab feature 11 for being equipped on substrate 10,
To which measurement is formed in the position of the position of the electrode 10a of substrate 10 and the convex block 11a of tab feature 11.
In (b) of Fig. 3, it is schematically shown the measurement result of the position of electrode 10a；In (b) of Fig. 3, schematically
Ground shows the measurement result of convex block 11a；In (d) of Fig. 3, it is schematically shown the measurement knot for being overlapped (b) and (c) of Fig. 3
Fruit.As described above, according to x-ray check device 2, can for the substrate 10 equipped with tab feature 11 and (b) such as Fig. 3 and
(c) position of electrode 10a and the position of convex block 11a are separately measured shown in, and can also be such as (d) institute of Fig. 3
It by the position of electrode 10a and the position of convex block 11a while measuring with showing.Here, the reference numeral 11b in (a) of Fig. 3 is to include
The grafting material of solder, scaling powder for engaging electrode 10a and convex block 11a etc., and be in advance in electro part carrying
The grafting material that convex block 11a is attached at by deep processing etc. in a upper process for device 1 and is formed.
It manages computer 6 and executes the control process for carrying out feedback control to electro part carrying device 1, to reduce by x-ray
Deviate (hereinafter, claiming the position between the two that the position of electrode 10a and the position of convex block 11a measured by check device 2 obtain
Be " position deviation ").
Specifically, in this embodiment, managing the feedback-control electronic part carrying device as follows of computer 6
1: the position school in the direction XY for calculating boarded head 1a when carrying electronic component (referring to Fig. 2) to reduce the position deviation
Positive quantity (hereinafter, being referred to as " correcting value "), and reflect the correcting value when carrying electronic component.
More specifically, management computer 6 can be directed to each region of substrate and be rotatably mounted in boarded head
The correcting value is calculated in the viewpoints such as each rotation angle of the mouthpiece part of 1a.Above-mentioned correcting value can be by " substrate
Each region ", " each rotation angle of mouthpiece part " viewpoint on to scheduled quantity (for example, for adjacent side
100 pieces of substrates) x-ray check device 2 measured by the runout information (data) carry out statistical procedures and obtain.
Fig. 4 schematically shows the calculating of each rotation angle amount of being corrected for mouthpiece part, and according to the school
Positive quantity and to electro part carrying device 1 carry out feedback control method.
That is, in the case where mouthpiece part is multiple, if by the rotation angle of the mouthpiece part (for example, 0,90,180,
270) it is associated with " position deviation " and carries out statistical procedures, then as shown in figure 4, there is the rotation angles of each mouthpiece part
The tendency of corresponding " position deviation " situation different from each other (Fig. 4 is shown for a mouthpiece part).
For example, mouthpiece part is with rotation and on a left side if the axis of mouthpiece part deviates from vertical direction and tilts
It is shaken in right direction, therefore there is its positions to deviate according to each rotation angle without same situation.In the case, it manages
Computer 6 for mouthpiece part each rotation angle calculation correcting value (in this embodiment, the correcting value be carry electronics
The position correction amount of the boarded head on the direction XY when component), and feedback-control electronic part carrying device 1, with can be
It is reflected to the correcting value in each rotation angle of mouthpiece part.By above-mentioned method,
" the position deviation " of each rotation angle of mouthpiece part can be reduced.
Fig. 5 schematically shows the calculating of each region amount of being corrected for substrate, and right according to the correcting value
The method of the progress feedback control of electro part carrying device 1.
That is, if substrate to be virtually divided into multiple regions 1,2,3,4, and be multiple situations in mouthpiece part
Under, it is mouthpiece part is respectively associated with " the position deviation " in opposing substrate region and carry out statistical procedures, then such as Fig. 5 institute
Show, there is the different situations of the tendency of " the position deviation " in each region of substrate.
For example, X-direction crossbeam (beam) 1b of electro part carrying device as shown in Figure 2 if there is deformation or it is curved
Song, then depositing the respectively different situation of the tendency of " position deviation " corresponding to each region of substrate, (Fig. 5 is for a suction
Nozzle component is shown).In the case, management computer 6 is directed to the mouthpiece part, calculates in each region of substrate
Correcting value, and the feedback-control electronic in a manner of making the correcting value be able to reflect each region of substrate when carrying electronic component
Part carrying device 1.Accordingly, the whole region of substrate can be reduced " position deviation ", and closer to 0.
Also, pass through the correcting value of " for each rotation angle of mouthpiece part " that will be shown in FIG. 4 and in Fig. 5
The correcting value of " for each region of substrate " for showing combines, so that the deviation of " for each rotation angle of mouthpiece part "
The deviation of " for each region of substrate " is all reduced, and the absolute value that the position of each mouthpiece part can be made to deviate connects
Nearly 0.Also, as described above, Fig. 4 and Fig. 5 indicates that tendency is deviateed in the position for a mouthpiece part, and it is in mouthpiece part
In the case where multiple, position as shown in Figure 4 and Figure 5 is obtained for each mouthpiece part and deviates tendency, and in this situation
Under, each correcting value is calculated for each mouthpiece part and carries out feedback control.
Here, management computer 6 monitors the lasting variation that position is deviateed, and it can deviate in position and increase with lasting
It is sounded an alarm in the case where the tendency added, or police can also be issued in the case where it is more than scheduled management value that position, which is deviateed,
Report.
Fig. 1 is returned to, the substrate after 3 pairs of reflux unit carrying electronic components heats, thus by electronic component (convex block portion
Part) convex block be joined to the electrode of substrate.And appearance inspection device 4 checks the electronic component on the substrate after being engaged
The mounted state of (tab feature).Mounted substrate is manufactured by method as described above.
It can be learnt from the explanation of above implementation form, according to the present invention, by applying x-ray inspection measuring electrode
Position and convex block position, and by reduce both position deviate in a manner of to electro part carrying device, (electronic component is taken
Carry process) feedback control is carried out, so as to accurately check the carrying quality of tab feature, and it can be realized the carrying quality
Holding or improvement.
Also, in above implementation form, describe from " for each region of substrate ", " for each of mouthpiece part
The example of the correcting value using feedback control is calculated in the viewpoint of a rotation angle ", still, for example, being multiple in boarded head
In the case of, correcting value can also be calculated in another viewpoint of " being directed to each boarded head ".
Embodiment of an aspect of of the present present invention referenced in schematic in attached drawing and be illustrated, but this is only exemplary
, as long as the people with basic knowledge is then it is understood that multiplicity can be realized by these embodiments in this technical field
Deformation and equivalent other embodiments.Therefore, real protection scope of the invention should be according to the appended claims
Range determines.
Industrial availability
According to an aspect of the present invention, the present invention is applicable to production electronic component mounting system or applying electronic portion
In the industry of part attaching method.
Claims (6)
1. a kind of electronic component mounting system, wherein include:
Electro part carrying device makes the convex block for being formed in electronic component overlap onto the electronic component engagement electricity consumption for being formed in substrate
Pole, to carry the electronic component；
Reflux unit heats the substrate after the carrying electronic component and the convex block is made to be joined to the electrode；
Control unit controls the electro part carrying device；And
X-ray check device is set between the electro part carrying device and the reflux unit, and the electronics is carried in measurement
The position of the electrode on substrate after component and the position of the convex block,
Described control unit carries out feedback control to the electro part carrying device, so as to be surveyed by the x-ray check device
The position of the two of the position acquisition of the position and convex block of the electrode of amount, which is deviateed, is reduced.
2. electronic component mounting system as described in claim 1, wherein
The electro part carrying device includes:
Mouthpiece part picks up the electronic component from the supply department of the electronic component and is carried to the electrode of the substrate；
Boarded head is rotatably mounted with the mouthpiece part in axis；
XY mobile mechanism moves the boarded head along the direction XY in the horizontal plane,
Described control unit calculates the XY of boarded head when carrying the electronic component in order to reduce the position deviation
Position correction amount on direction, and to described in a manner of being able to reflect the position correction amount when carrying the electronic component
Electro part carrying device carries out feedback control.
3. electronic component mounting system as claimed in claim 2, wherein
Described control unit based on for the substrate each region viewpoint and for each rotation of the mouthpiece part
At least one viewpoint in the viewpoint of angle calculates the position correction amount.
4. a kind of electronic component attaching method, wherein comprise the following steps:
Electro part carrying process makes the convex block for being formed in electronic component overlap onto the electronic component engagement electricity consumption for being formed in substrate
Pole, to carry the electronic component；
Reflow process heats the substrate after the carrying electronic component and the convex block is made to be joined to the electrode；
X-ray inspection operation is taken between the electro part carrying process and the reflow process by x-ray check device measurement
The position of the electrode on substrate after carrying the electronic component and the position of the convex block；And
Process is controlled, feedback control is carried out to the electro part carrying process, so that by measuring in the x-ray inspection operation
The electrode position and the convex block position acquisition the two position deviate reduce.
5. electronic component attaching method as claimed in claim 4, wherein
Electro part carrying device is used in the electro part carrying process, the electro part carrying device includes suction nozzle
Component picks up the electronic component from the supply department of the electronic component and is carried to the electrode of the substrate；Boarded head, in axis
The mouthpiece part is rotatably mounted with around line；XY mobile mechanism moves the boarded head along the direction XY in the horizontal plane
It is dynamic,
In the control process, in order to reduce, the position is deviateed and calculates boarded head when carrying the electronic component
The direction XY on position correction amount, and in a manner of being able to reflect the position correction amount when carrying the electronic component pair
The electro part carrying device carries out feedback control.
6. electronic component attaching method as claimed in claim 5, wherein
In the control process, based on for the substrate each region viewpoint and for each of the mouthpiece part
At least one viewpoint rotated in the viewpoint of angle calculates the position correction amount.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016224372A JP6915981B2 (en) | 2016-11-17 | 2016-11-17 | Electronic component mounting system and electronic component mounting method |
| KR10-2017-0075811 | 2017-06-15 | ||
| KR1020170075811A KR102350923B1 (en) | 2016-11-17 | 2017-06-15 | An electronic device mounting system and method for mounting electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109152326A true CN109152326A (en) | 2019-01-04 |
| CN109152326B CN109152326B (en) | 2022-01-28 |
Family
ID=62197852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810132785.6A Active CN109152326B (en) | 2016-11-17 | 2018-02-09 | Electronic component mounting system and electronic component mounting method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6915981B2 (en) |
| KR (1) | KR102350923B1 (en) |
| CN (1) | CN109152326B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6547136B2 (en) * | 2017-01-12 | 2019-07-24 | パナソニックＩｐマネジメント株式会社 | Component mounting system, component mounting method, and correction value calculation device |
| JP6547137B2 (en) * | 2017-01-12 | 2019-07-24 | パナソニックＩｐマネジメント株式会社 | Component mounting system, component mounting method, and correction value calculation device |
| US10893639B2 (en) * | 2017-01-12 | 2021-01-12 | Panasonic Intellectual Property Management Co., Ltd. | Component mounting using feedback correction |
| JP6706768B2 (en) * | 2019-06-10 | 2020-06-10 | パナソニックＩｐマネジメント株式会社 | Component mounting system, component mounting method, and correction value calculation device |
| JP6706769B2 (en) * | 2019-06-10 | 2020-06-10 | パナソニックＩｐマネジメント株式会社 | Component mounting system, component mounting method, and correction value calculation device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204934A (en) * | 1998-01-13 | 1999-07-30 | Fuji Photo Film Co Ltd | Mounting method of electronic component |
| JP2006319378A (en) * | 2006-09-05 | 2006-11-24 | Matsushita Electric Ind Co Ltd | Electronic component mounting system and method therefor |
| JP2008300526A (en) * | 2007-05-30 | 2008-12-11 | Yamaha Motor Co Ltd | Mounting line, apparatus and method of inspecting mounting substrate |
| CN101868126A (en) * | 2009-04-17 | 2010-10-20 | 松下电器产业株式会社 | Electronic component mounting method |
| JP2013105806A (en) * | 2011-11-11 | 2013-05-30 | Panasonic Corp | Electronic component packaging system and electronic component packaging method |
| CN103548430A (en) * | 2011-06-02 | 2014-01-29 | 松下电器产业株式会社 | Electronic component mounting method, electronic component loading device and electronic component mounting system |
| CN104837298A (en) * | 2014-02-06 | 2015-08-12 | Ekra自动化系统有限公司 | Method and device for printing on substrates |
| CN104996005A (en) * | 2012-11-19 | 2015-10-21 | 松下知识产权经营株式会社 | Electronic-component-mounting system and electronic-component mounting method |
| CN105917217A (en) * | 2014-02-06 | 2016-08-31 | 欧姆龙株式会社 | Quality management system |
| CN105940354A (en) * | 2014-02-10 | 2016-09-14 | 欧姆龙株式会社 | Quality management device and method for controlling same |
| CN106031328A (en) * | 2014-01-29 | 2016-10-12 | 欧姆龙株式会社 | Quality management device and method for controlling quality management device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153995A (en) * | 1994-11-28 | 1996-06-11 | Oki Electric Ind Co Ltd | Method for aligning semiconductor device |
| JP2003110288A (en) * | 2001-07-23 | 2003-04-11 | Fuji Mach Mfg Co Ltd | Circuit board operation system and electronic circuit manufacturing method |
| JP2006080197A (en) * | 2004-09-08 | 2006-03-23 | Juki Corp | Method for correcting place of attraction nozzle in electronic-part mounting device |
| JP2008205424A (en) * | 2007-01-26 | 2008-09-04 | Juki Corp | Method and apparatus for packaging component |
| JP2010141209A (en) * | 2008-12-12 | 2010-06-24 | Sony Corp | Substrate inspection device and substrate inspection method |
| CN103340029B (en) * | 2011-12-22 | 2016-02-24 | 松下知识产权经营株式会社 | Electronic component hookup wire and electronic component mounting method |
| JP6035937B2 (en) * | 2012-07-20 | 2016-11-30 | 日本電気株式会社 | Component mounting apparatus and component mounting method |
| WO2014118982A1 (en) * | 2013-02-03 | 2014-08-07 | 株式会社Ｄｊｔｅｃｈ | Inspection method for substrate with mounted parts and substrate manufacturing system employing same inspection method |
| JP6320108B2 (en) * | 2014-03-27 | 2018-05-09 | 株式会社Ｆｕｊｉ | Device that assists workers who perform visual inspection of defective products |
| JP2016174110A (en) * | 2015-03-17 | 2016-09-29 | 東レエンジニアリング株式会社 | Mounting position correction method and mounting position correction device |
-
2016
- 2016-11-17 JP JP2016224372A patent/JP6915981B2/en active Active
-
2017
- 2017-06-15 KR KR1020170075811A patent/KR102350923B1/en active IP Right Grant
-
2018
- 2018-02-09 CN CN201810132785.6A patent/CN109152326B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204934A (en) * | 1998-01-13 | 1999-07-30 | Fuji Photo Film Co Ltd | Mounting method of electronic component |
| JP2006319378A (en) * | 2006-09-05 | 2006-11-24 | Matsushita Electric Ind Co Ltd | Electronic component mounting system and method therefor |
| JP2008300526A (en) * | 2007-05-30 | 2008-12-11 | Yamaha Motor Co Ltd | Mounting line, apparatus and method of inspecting mounting substrate |
| CN101868126A (en) * | 2009-04-17 | 2010-10-20 | 松下电器产业株式会社 | Electronic component mounting method |
| CN103548430A (en) * | 2011-06-02 | 2014-01-29 | 松下电器产业株式会社 | Electronic component mounting method, electronic component loading device and electronic component mounting system |
| JP2013105806A (en) * | 2011-11-11 | 2013-05-30 | Panasonic Corp | Electronic component packaging system and electronic component packaging method |
| CN104996005A (en) * | 2012-11-19 | 2015-10-21 | 松下知识产权经营株式会社 | Electronic-component-mounting system and electronic-component mounting method |
| CN106031328A (en) * | 2014-01-29 | 2016-10-12 | 欧姆龙株式会社 | Quality management device and method for controlling quality management device |
| CN104837298A (en) * | 2014-02-06 | 2015-08-12 | Ekra自动化系统有限公司 | Method and device for printing on substrates |
| CN105917217A (en) * | 2014-02-06 | 2016-08-31 | 欧姆龙株式会社 | Quality management system |
| CN105940354A (en) * | 2014-02-10 | 2016-09-14 | 欧姆龙株式会社 | Quality management device and method for controlling same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180055674A (en) | 2018-05-25 |
| JP2018082096A (en) | 2018-05-24 |
| CN109152326B (en) | 2022-01-28 |
| KR102350923B1 (en) | 2022-01-13 |
| JP6915981B2 (en) | 2021-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109152326A (en) | Electronic component mounting system and electronic component attaching method | |
| CN106031328B (en) | The control method of quality management device and quality management device | |
| CN107734955B (en) | Inspection device for surface mounting line, quality management system, and recording medium | |
| CN103376263B (en) | Scolding tin soaks shaping inspection technique, automatic shape inspection apparatus and base plate inspection system | |
| CN103299177B (en) | Soldering inspection method and base plate inspection system and soldering inspection machine | |
| JP6262378B1 (en) | Substrate inspection apparatus, substrate inspection method, and substrate manufacturing method | |
| CN103328959B (en) | The display packing of the confirmation picture of base board checking device, base plate inspection system and inspecting substrate result | |
| CN104802173B (en) | The data generating device of vision sensor and detection analog systems | |
| CN106493042A (en) | Dispensing method and dispenser system | |
| WO2015115426A1 (en) | Quality control device and quality control method | |
| US8328074B2 (en) | Component-mounted board production apparatus and position control method for electronic components in component-mounted board production apparatus | |
| CN104718808B (en) | Electronic component mounting system | |
| CN102974964A (en) | Method for fixing printed circuit board (PCB) with mark point location function | |
| CN104798456B (en) | Electronic component mounting system and electronic component mounting method | |
| CN109551856A (en) | A kind of contraposition applying method | |
| CN105917755A (en) | Quality control apparatus, quality control method, and program | |
| CN108307616A (en) | Component installation system and component mounting method and amendment value calculation apparatus | |
| CN105917217B (en) | Quality control system | |
| CN110466158A (en) | Article applying method, device and computer readable storage medium based on mark point | |
| CN103722869B (en) | The resolver and analytic method of silk-screen printing device, silk-screen printing poor prognostic cause | |
| CN104360548A (en) | Liquid crystal ink jet coating equipment as well as parameter adjusting method and liquid crystal coating and checking system | |
| CN104050384B (en) | The four-wheel aligner spacer thickness computational methods and system of vehicle | |
| CN104458754B (en) | A kind of AOI detects the acquisition methods of the scolding tin detection threshold value of 0603 packaging made in Great Britain | |
| CN108253908B (en) | The image detecting method of contact point radius of curvature in a kind of potato compression test | |
| KR102402523B1 (en) | An electronic device mounting system and method for mounting electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: HANWHA TECHWIN Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190409 Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: HANWHA AEROSPACE Co.,Ltd. |
|
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |