JP2008300526A - Mounting line, apparatus and method of inspecting mounting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for inspecting a mounting substrate which can accurately identify a defect cause. <P>SOLUTION: A component E is mounted on a mounting substrate W by coating a solder S and then the solder S is caused to reflow. The apparatus of inspecting such a mounting substrate about its mounted state is provided, which comprises a recognized image data acquisition means for acquiring recognized image data by recognizing on three dimensional shape a joined condition between the component E and the solder S after the component E is mounted and before the solder S is caused to reflow, and a defect cause identification means for identifying a defect cause in the mounting substrate W having a defect in the joined condition between the component E and the solder S on the basis of the recognized image data. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting line, a mounting board inspection apparatus, and an inspection method for inspecting a mounting state with respect to a mounting board to which solder is reflowed after solder is applied and components are mounted.

  A mounting line in which components are mounted by a mounting machine on a board on which solder is printed (applied) by a printing machine is well known.

  As methods for inspecting the mounting state of the mounting substrate in such a mounting line, methods disclosed in Patent Documents 1 and 2 are well known.

In the inspection methods of Patent Documents 1 and 2, after printing the solder, before mounting the component, the printed state of the solder is inspected, and after mounting the component by the mounting machine, the mounting state of the component is inspected. ing.
Japanese Patent No. 3685035 (FIG. 1) Japanese Patent Laying-Open No. 2005-252290 (FIG. 1)

  The conventional mounting board inspection methods shown in Patent Documents 1 and 2 inspect the solder printing position and the component mounting position. From these position data, it is possible to accurately identify the cause of the failure. It was difficult.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a mounting line, a mounting board inspection apparatus, and an inspection method capable of accurately identifying the cause of the failure.

  The present invention provides the following means.

[1] A mounting board inspection apparatus for inspecting a mounting state with respect to a mounting board to which solder is reflowed after solder is applied and a component is mounted.
Recognition image data acquisition means for recognizing the joint state between the component and the solder in a three-dimensional shape and acquiring the recognition image data after mounting the component and before reflowing the solder;
A mounting board inspection apparatus comprising: a failure cause specifying means for specifying a cause of a failure based on recognition image data for a mounting board in which a bonding state between a component and solder is defective.

  [2] A correction value for correcting at least one of a coating condition in a solder coating machine for solder coating and a mounting condition in a mounting machine for mounting components according to the cause of the fault specified by the fault cause specifying means. 2. The mounting board inspection apparatus according to claim 1, further comprising a correction value calculation means for calculating

[3] In a mounting line comprising a solder coater for applying solder to a substrate, a mounting machine for mounting components on the solder-coated substrate, and a reflow furnace for reflowing solder on the substrate on which the components are mounted. There,
An inspection device is installed between the mounting machine and the reflow furnace,
The inspection apparatus recognizes a bonding state between a component and solder in a three-dimensional shape and acquires recognition image data, and recognizes a mounting substrate in which the bonding state between the component and solder is defective. A mounting line comprising: a failure cause specifying means for specifying a cause of failure based on image data.

  [4] The mounting line according to item 3 above, wherein the application condition of the solder coating machine and the mounting condition of the mounting machine are corrected according to the cause of the failure specified by the failure cause specifying means.

[5] A mounting board inspection method for inspecting a mounting state with respect to a mounting board to which solder is reflowed after applying solder and mounting components.
After mounting the part and before reflowing the solder, the joint state between the part and the solder is recognized in a three-dimensional shape, and the recognition image data is acquired.
A mounting board inspection method in which a cause of a failure is specified based on recognition image data for a mounting board in which a bonding state between a component and solder is defective.

  According to the mounting board inspection apparatus according to the invention [1], the bonding state between the component and the solder can be inspected based on the three-dimensional recognition image data before the solder is reflowed. It can be carried out.

  According to the mounting board inspection apparatus of the invention [2], it is possible to effectively prevent the occurrence of defective products.

  According to the mounting line according to the invention [3], the cause of the defect can be accurately identified as described above.

  According to the mounting line according to the invention [4], it is possible to effectively prevent the occurrence of defective products as described above.

  According to the mounting substrate inspection method of the invention [5], the cause of the defect can be accurately identified as described above.

  FIG. 1 is a schematic front view showing a mounting line according to an embodiment of the present invention. As shown in the figure, this mounting line includes, from the upstream side to the downstream side, a substrate carry-in machine 1, a printing machine 2, a plurality of mounting machines 10,..., An inspection device 3, a reflow furnace 4, a substrate unloader 5, and the like. Facilities are arranged side by side.

  The substrate carry-in machine 1 accommodates a large number of unmounted substrates, and sequentially carries the substrates into the printing machine 2.

  The printing machine 2 has a stencil (mask) overlaid on the substrate that has been carried in, and the cream solder supplied on the stencil is expanded with a squeegee, thereby opening the substrate through the opening (pattern hole) formed in the stencil. The cream solder is printed (applied) in a predetermined area.

  The mounting machine 10 has a head capable of picking up a component, picks up an electronic component supplied to the component supply unit by the head, and then moves the head to the loaded substrate position to place the component on the substrate. It is mounted at a predetermined position.

  As will be described in detail later, the inspection device 3 inspects the mounting state of the carried-in board to determine whether it is acceptable or not and to identify the cause of failure.

  The reflow furnace 4 is formed by reflowing cream solder and then curing, and the terminal of the component and the electrode of the substrate are connected by the solder.

  The substrate unloader 5 sequentially stores the mounted substrates unloaded from the reflow furnace 4.

  In this embodiment, each facility constituting the mounting line includes a control device 6 configured by a personal computer or the like as a controller, and the operation of each facility is controlled by each control device 6. .

  Further, the control devices 6 are connected to each other via communication means such as a network line, and signals are transmitted and received between the control devices 6 to perform overall operation as the entire mounting line. Is called.

  In addition, the control devices 6 of the respective facilities are provided with display units 62 such as a liquid crystal display and a CRT display for displaying the operation status. Further, an input unit (not shown) such as a keyboard and a mouse for inputting various information is connected to each control device 6.

  In the mounting line of this embodiment, as shown in FIG. 3A, pads (electrodes) P are formed on the substrate W carried from the substrate carry-in machine 1, that is, the substrate W before the solder is printed. ing.

  When the substrate W is carried into the printing machine 2 and subjected to printing processing, as shown in FIG. 3B, the cream solder S is printed on the pad P in a predetermined shape and a predetermined size (amount). Is done.

  After the solder S is printed, when the substrate W is carried into the mounting machine 10 and the component E is mounted, the terminal T of the component E is pushed into the solder S as shown in FIG. Is placed on the substrate W in contact with or close to the substrate.

  After the component E is mounted, when the substrate W is carried into the reflow furnace 4 and the solder S is reflowed and cured, the solder S moves from the terminal surface of the component E to the pad surface as shown in FIG. Arranged to cover.

  After the solder S is thus cured, the substrate W is carried into the substrate unloader 5. By sequentially repeating such operations, the substrates W on which the component E is mounted are sequentially produced.

  Here, in the mounting line of the present embodiment, a printing failure caused by the printing machine 2, a mounting failure caused by the mounting machine 10, and a reflow failure caused by the reflow furnace 4 will be described.

  As a cause of the failure that causes the printing machine 2 to fail with respect to the normal substrate W shown in FIG. 4A, the amount of solder S is small as shown in FIG. 4 (b-2), a solder position deviation in which the printing position of the solder S is displaced with respect to the pad P, and a solder shape abnormality in which the shape of the solder S is irregular as shown in FIG. 4 (b-3). For example, solder imbalance).

  When there is a defect cause of insufficient solder amount, when the mounting process and the reflow curing process are normally performed by the mounting machine 10 and the reflow furnace 4 as shown in FIG. Insufficient solder wetting failure occurs as shown in FIG.

  When there is a defect cause of the solder misalignment, when the mounting process and the reflow process are normally performed as shown in FIG. 4C-2, the terminal T is lifted and the terminal T and the solder S are not connected. That is, as shown in FIG. 4 (d-2), a terminal floating failure occurs.

  Further, when there is a cause of the defect of the solder shape abnormality, when the mounting process and the reflow process are normally performed as shown in FIG. 4C-2, as shown in FIG. As shown in 3), the terminal floating failure occurs.

  Further, as shown in FIGS. 5A and 5B, when the solder S is normally printed on the normal substrate W, the cause of the failure caused by the mounter 10 to the substrate W is as follows. As shown in FIG. 5 (c-1), when the head transfers the component E onto the substrate W, the amount of descent of the head is insufficient (lowering amount is insufficient, oblique mounting), as shown in FIG. 5 (c-2). When the head transfers the component E onto the substrate W, the head is kept in a lowered state (timer shortage, substrate shortage), mounting pressure shortage, component E as shown in FIG. The mounting position shift etc. which are displaced with respect to the solder S (pad P) is exemplified.

  If there is a cause for the deficiency of the descent amount and the reflow process is performed normally, a deficiency in damp soldering occurs as shown in FIG.

  When there is a cause of a shortage of timers and the reflow process is performed normally, as shown in FIG. 5D-2, a shortage of solder wettability occurs.

  If there is a cause of the mounting position error, if the reflow process is performed normally, a terminal lifting error occurs as shown in FIG.

  Further, as shown in FIGS. 6A to 6C, when the printing process by the printing machine 2 and the mounting process by the mounting machine 10 are normally performed on a normal substrate W, reflow is performed on the substrate W. As the cause of failure that causes the failure due to the furnace 4, as shown in FIG. 6 (d-1), the amount of heat during the reflow process is insufficient, and the reflow temperature varies as shown in FIG. 6 (d-2). Some reflow temperature imbalances are exemplified.

  If there is a defect cause of insufficient heat quantity, after the solder is cured, the above-described insufficient solder wettability occurs, and if there is a cause of the reflow temperature imbalance, the above-described terminal lifting defect occurs.

  As described above, each of the defects found after the solder curing has a cause of the defect. However, the cause of the defect cannot always be identified from the defect state after the solder curing. For example, when the cause of the defect is a printing position shift by the printing press 2 (see FIG. 4 (b-2)), a terminal floating defect occurs after the solder is cured (see FIG. 4 (d-2)). Even if the cause is a mounting position shift by the mounting machine 10 (see FIG. 5 (c-3)) or a reflow temperature imbalance by the reflow furnace 4, the terminal floats up after the solder hardening as described above. A defect occurs (see FIGS. 5 (d-3) and 6 (d-2)).

  Therefore, even if the terminal floating failure is found after the solder is cured, the cause of the failure is due to the printing position deviation of the printing machine 2, the mounting position deviation of the mounting machine 10, or the reflow temperature imbalance of the reflow furnace 4. It was difficult to easily determine whether it was something.

  On the other hand, in the state after the component mounting by the mounting machine 10 and before the reflow by the reflow furnace 4, when the cause of the defect is the printing position shift, as shown in FIG. The fact that S is misaligned can be clearly recognized, and it can be accurately determined that the cause of the defect is a misprinting position.

  Furthermore, regarding printing, it is possible to accurately determine whether the cause of failure is insufficient solder or abnormal solder shape.

  Similarly, when the cause of the defect is a mounting position shift, it is clear that the terminal T of the component E is shifted from the solder S (pad P) as shown in FIG. It can be recognized and it can be accurately determined that the cause of the defect is a mounting position shift.

  Similarly, it can be accurately determined whether the cause of failure is other mounting failure.

  As described above, after mounting the component and before reflowing, it is based on the state of the solder exposed to the outer periphery of the component with respect to the component or the state of the solder with respect to the pad (electrode) of the board to be connected to the terminal of the component. Thus, it is possible to accurately identify the cause of the failure when there is a failure. Therefore, in the present embodiment (the present invention), attention is paid to this point, and the cause of the defect is accurately identified as will be described in detail later.

  On the other hand, in the present embodiment, the inspection apparatus 3 has the external shape of the component, the three-dimensional shape of the solder exposed on the outer periphery of the component, and the outer periphery of the solder with the terminal T of the component E mounted on the solder S. An imaging unit capable of recognizing the pad (electrode) shape of the exposed substrate is provided, and three-dimensional image data recognized by the imaging unit can be acquired.

  As a method for acquiring three-dimensional image data, a conventionally known method can be employed. For example, a method for obtaining three-dimensional image data by performing image processing on a plurality of pieces of imaging data taken from a plurality of locations having different imaging directions, a method for obtaining three-dimensional image data based on a fluoroscopic image by X-rays, a laser or infrared ray A method of acquiring three-dimensional image data based on the reflected beam, a method combining these, and the like can be employed.

  FIG. 2 is a block diagram showing a control system of the inspection apparatus 3. As shown in the figure, the inspection device 3 is provided with the control device 6 as described above, and the control device 6 controls the driving of each drive unit of the inspection device 3 so that the mounting board described later is mounted. Inspection is performed automatically.

  The control device 6 includes an arithmetic processing unit 60, a data storage unit 63, a quality determination unit 64, a failure cause identification unit 65, a correction value calculation unit 66, and an image processing unit 67.

  The arithmetic processing unit 60 comprehensively manages various operations of the inspection device 3.

  The data storage unit 63 temporarily stores and holds various data necessary for the inspection of the inspection device 3.

  The pass / fail judgment unit 64 judges pass / fail of the solder bonding state with respect to the component on the mounting substrate or the solder bonding state with respect to the pads (electrodes) on the substrate.

  The defect cause identifying unit 65 includes a program for identifying the cause of the defect of the defective mounting board, and processes various information according to this program to identify the cause of the defect as described later.

  The correction value calculation unit 66 includes a program for calculating correction values for correcting the printing conditions and the mounting conditions, and calculates various correction values according to this program to calculate correction values as described later.

  The image processing unit 67 processes the image data picked up by the above-described three-dimensional shape imaging means, and a plurality of points P1 (x1, y1, z1) to Pn (xn, yn, zn) and image data suitable for inspection, for example, image data (recognition image data) such as a plurality of cross-sectional images that can be easily compared with reference image data and defective image data described later. In these image data, in addition to the solder portion, the components and the pad portion are added with the pixel brightness being different.

  Further, as described above, the inspection apparatus 7 is connected to a display unit 62 such as a CRT display or a liquid crystal display for displaying various information, and an input unit such as a keyboard or a mouse for inputting various information. (Not shown) is connected.

  The control device 6 of the inspection device 3 is connected to a database 71 in which a large number of sample image data is accumulated.

  In this database 71, the three-dimensional shape of the solder exposed on the outer periphery of the part, which is ideal in the state after being mounted by the mounting machine 10 and before being reflow-cured by the reflow furnace 4, is shown. Sample image data (reference image data) configured as a set of a plurality of solder cross sections is accumulated. Specifically, a plurality of cross-sections obtained by cutting the solder portion of the one shown in FIG. 3C at a plurality of locations are stored as reference image data in a form in which parts and pad portions are added.

  Further, in the database 71, the three-dimensional shape of the solder exposed on the outer periphery of the part, which is regarded as defective in the state after mounting and before reflowing, is shown in a plurality of solder cross-sections (parts and pads). A large number of defective sample image data (defective image data) configured as a set of parts added) is associated with the cause of the defect and accumulated as table data or the like. Specifically, it is obtained by cutting the solder portions shown in the columns of FIGS. 4 (c-1) to (c-3) and the columns of FIGS. 5 (c-1) to (c-3) at a plurality of locations. Image data of a defect in which a plurality of cross sections are added with parts and pad portions is stored as table data in association with the cause of the defect. 4 and 5, only three types of defective image data are shown, but a large number of defective image data is actually stored.

  Therefore, the control device 6 collates the image data (recognition image data) around the solder including the component E and the solder and the component and the pad acquired in the inspection device 3 with the reference image data shown in FIG. Accordingly, it is possible to determine whether or not the image is defective (good or bad) from the actual image position and angle / posture shift amount with respect to the reference image.

  Further, the control device 6 sequentially collates the recognized image data and the defective image data, and when defective image data similar to the recognized image data exists in the defective image data, the defective image The cause of failure associated with the data can be estimated to be the cause of failure of the recognized image data (inspection target component), and the cause of failure of the inspection target component can be identified.

  In addition, defective image data and reference image data are created using image data obtained by imaging the actual mounting state of the board, or image data included in an electronic catalog created by a component manufacturer. Or can be created using artificial image data including numerical data used when creating the mounting program.

  Further, in the database 71, for each type of failure cause, information on which operation of which equipment can be corrected to remove the failure cause, that is, the cause of the failure and the printing machine 2 and the mounting machine related to the cause. Information (related information between the cause of failure and facility operation) associated with 10 operations (facility operation) is held.

  For example, for the cause of the shortage of the solder amount by the printing machine 2, the information that the printing cleaning of the printing machine 2 or the squeegee speed change is performed according to the situation, For information on the correction of the substrate position with respect to the stencil position (fixed) of the printing machine 2 and the cause of the defect of the solder shape abnormality caused by the printing machine 2, change of the plate separating operation and squeegee speed change of the printing machine 2 depending on the situation. Information on performing a descent amount deficiency (diagonal mounting) by the mounting machine 10, information on performing descent speed adjustment and descent amount adjustment of the mounting machine 10, a timer deficient by the mounting machine 10 (board not reached) ) For the cause of failure of the mounting machine 10, information indicating that the amount of descent of the mounting machine 10 is adjusted and the time for adjusting the descent time. Information that adjusts the position is held.

  Therefore, the control device 6 of the inspection device 3 refers to the information related to the cause of the failure and the operation of the equipment to determine which operation to eliminate the cause of the failure based on the failure cause identified as described above. Can be obtained.

  The related information between the cause of failure and the equipment operation can be appropriately acquired based on past production data, experimental data, and the like.

  Next, the inspection operation by the inspection device 3 will be described.

  First, when the substrate W subjected to the printing process by the printing machine 2 and the mounting process by the mounting machine 10 is carried into the inspection apparatus 3, as shown in FIG. ) Is inspected for the solder joint state (YES in step S1).

  That is, the joining state between the part E and the solder S of the part is imaged and recognized three-dimensionally by the imaging means (not shown) in the inspection apparatus 3 (step S2), and the captured image data is acquired by the control apparatus 6. .

  Next, the acquired image data of the joining state of the part E and the solder S is processed by the image processing unit 67 and processed into image data (recognition image data) such as a cross-sectional image suitable for inspection.

  In the present embodiment, the control device 6 of the inspection apparatus 3 that creates recognition image data according to a predetermined program functions as a recognition image data acquisition unit.

  The recognized image data acquired by the control device 6 is compared and collated with reference image data in the joined state between the component E and the solder S held in the database 71 (step S3).

  If the position of each part in the recognition image data, the deviation of the angular orientation, and the like are within a predetermined tolerance range with respect to the reference image data, it is determined to be a non-defective product.

  If it is a non-defective product (not defective) (NO in step S4), the inspection for the part is finished (step S10).

  If the recognized image data is defective (YES in step S4), the recognized image data is sequentially compared and collated with the defective image data in the joining state of the component E and the solder S held in the database 71, and defective. Bad image data similar to the recognized image data is searched from the image data (step S5).

  The method of determining whether the recognized image data is similar or dissimilar to the defective image data is such that the position of each part in the recognized image data, the deviation of the angular orientation, etc. are within a predetermined range with respect to the defective image data to be verified. In this case, it is possible to adopt a method in which it is determined that they are similar and when they deviate from a predetermined range, they are determined to be dissimilar.

  Further, as a method for searching for defective image data similar to the recognized image data from a large number of defective image data, in addition to a method of checking a large number of defective image data one by one in order from the first, the recognized image data. It is also possible to employ a hierarchical search method in which the recognized image data is classified according to the cause of the defect, and the finally classified defective image data is sequentially checked against the recognized image data.

  If there is defective image data similar to the recognized image data as a result of the search (YES in step S6), solder printing or mounting related to the component to be inspected can be performed from the defect cause information associated with the defective image data. The cause of the failure is identified.

  If the specified cause of failure is caused by the printing press 2 (“printing press” in step S7), the printing conditions are corrected as described in detail later (step S8).

  If the specified cause of failure is caused by the mounting machine 10 ("mounting machine" in step S7), the mounting conditions are corrected as described in detail later (step S9).

  When the printing conditions and the mounting conditions are corrected, the inspection for the part is finished (step S10), the next part is checked (NO in step S1), and the same inspection as described above is performed.

  When all the components on the board are inspected and there are no uninspected parts on the board (NO in step S), the operation of the inspecting apparatus for one board is completed, and the inspected board is the next. To the reflow furnace 4.

  In the present embodiment, the control device 6 of the inspection apparatus 3 that specifies the cause of failure according to a predetermined program functions as a failure cause specifying means.

  On the other hand, if the defective image data similar to the recognized image data is not found in the defective image data even when the inspection apparatus 3 is in operation (YES in step S) ( NO in step S6), the cause of the failure cannot be specified, the failure cause cannot be specified error, an error warning is given, and the operation of the inspection apparatus 3 is finished. In addition, as an error warning, the display on the display screen in the display unit 62, a buzzer sound, a warning light, or the like is used.

  Next, the application condition correction operation (step S8 in FIG. 7) when the printing press 2 has a cause of failure will be described.

  As shown in FIG. 8, the cause of the defect is specified from the defect image data similar to the recognized image data (step S801).

  If the cause of the defect is insufficient solder amount (see FIG. 4C-1) (step S802), it is determined whether or not the amount of solder is totally insufficient (step S803). As this determination method, a method of determining based on the area (volume) and shape of the solder portion in the recognition image data can be used.

  If the solder amount is partially insufficient and the solder amount varies (NO in step S803), information on the cause of the failure is transmitted from the inspection device 3 to the printing press 2. The printer 3 that has received the information executes a cleaning process (step S804). That is, the stencil (mask) is automatically cleaned by the cleaner provided in the printing press 2.

  Cleaning is selected for the cause of the solder amount variation, but this selection is performed between the cause of failure and the equipment operation in which the cause of failure held in the database 71 is associated with the equipment operation as described above. This is done based on related information.

  If the amount of solder is generally insufficient (YES in step S803), the amount of deficiency is calculated, and information regarding the cause of the defect and the deficiency (correction value) is transmitted from the inspection device 3 to the printing press 2. The The printing press 2 that has received the information changes (corrects) the squeegee moving speed, the angle with respect to the substrate (attack angle), the printing pressure load, or the like according to the cause of the failure and the correction value (step). S805).

  The speed change of the squeegee is selected for the cause of the failure of the entire amount of solder, and this selection is made based on the information related to the cause of the failure of the database 71 and the equipment operation, and the speed ( Parameter) is adjusted in accordance with the calculated correction value. In the same manner, the equipment operation is selected and the parameters are adjusted.

  Also, as a method for calculating the solder shortage amount, a method for calculating the solder shortage amount based on an area (volume) difference between the solder portion of the recognized image data and the solder portion of the ideal image data serving as a preset reference. Etc. can be adopted.

  If the cause of the defect is a solder misalignment (see FIG. 4C-2) (step S806), the misalignment amount (correction value) is calculated, and information on the cause of the defect and the correction value is sent to the printing press 2. Sent. The printing machine 2 that has received the information corrects the position of the substrate to be aligned with the stencil (mask) according to the cause of the defect and the correction value (step S807).

  The calculation of the solder misregistration amount (correction value) can be performed by comparing the recognized image data with the reference image data. In the following, when the correction value is calculated, it is calculated by comparing the recognized image data and the reference image data in the same manner as described above.

  When the cause of the defect is a solder shape abnormality (see FIG. 4C-3) (step S808), the defective part is further analyzed in detail (step S809). As a result, when the edge in the solder portion is not formed correctly (edge standing failure: step S810), the degree of failure (correction value) is calculated, and information on the cause of the failure and the correction value is transmitted to the printing press 2. Is done. The printing press 2 that has received the information corrects the substrate detachment operation (plate separation operation) with respect to the stencil in the printing press 2 according to the cause of the defect and the correction value (step S811).

  If the solder does not reach the edge sufficiently at the edge (edge shortage: step S812), the amount of solder shortage (correction value) at the edge is calculated, and information on the cause of the defect and the correction value is transmitted to the printing machine 2. Is done. Then, the printing machine 2 corrects the squeegee speed in the printing machine 2 according to the cause of the defect and the correction value (step S813).

  The degree of defect (correction value) is obtained from the defect cause thus identified, the defect cause and the correction value are fed back to the printing machine 2, and the control parameters of the printing machine 2 are determined according to the defect cause and the correction value. (Printing conditions) is corrected.

  Next, the mounting condition (mounting condition) correcting operation (step S9 in FIG. 7) when the mounting machine 10 has a cause of failure will be described.

  As shown in FIG. 9, the cause of the defect is specified from the defective image data similar to the recognized image data (step S901).

  When the cause of failure is oblique mounting (see FIG. 5C-1) (step S902), the degree of component orientation failure (correction value) is calculated, and information on the cause of failure and the correction value corresponds to the corresponding mounting. Sent to the machine 10. The mounting machine 10 that has received the information adjusts (corrects) the lowering speed and the lowering amount of the head with respect to the board when mounting the components in accordance with the cause of the defect and the correction value (steps S903 and S905).

  When the cause of the failure is not reaching the substrate (see FIG. 5C-2) (step S904), the degree of failure (correction value) such as the distance to the substrate (pad P) is calculated, and the cause and correction of the failure are calculated. Information on the value is transmitted to the corresponding mounting machine 10. The mounting machine 10 that has received the information adjusts the head descent amount in accordance with the cause of the defect and the correction value (step S905), and adjusts the time during which the head is maintained in the descent state (descent time) ( Step S906).

  If the cause of the defect is a mounting position shift (see FIG. 5C-3) (step S907), the amount of position shift (correction value) is calculated, and the information on the cause of the defect and the correction value is the corresponding mounting machine 10. Sent to. The mounting machine 10 that has received the information corrects the mounting position by the head in accordance with the cause of the defect and the correction value (step S908).

  As described above, the degree of the defect (correction value) is obtained for the defective part, and information on the cause of the defect and the correction value is fed back to the mounting machine 10, and the mounting machine 2 is determined according to the cause of the defect and the correction value. The control parameters (mounting conditions) are corrected.

  The printing conditions and the mounting conditions may be corrected (corrected) every time a correction value is obtained, or may be corrected collectively every predetermined time or every predetermined number of productions. When correcting collectively, an average value of a plurality of correction values or the like may be used as the correction value.

  In the present embodiment, the control device 6 of the inspection device 3 that calculates correction values such as a positional deviation amount and a solder shortage amount in accordance with a predetermined program functions as a failure cause identifying unit.

  As described above, according to the mounting board inspection apparatus 3 in the present embodiment, after mounting the component by the mounting machine 10 and before reflowing the solder by the reflow furnace 4, the bonding state between the component E and the solder S is changed. Since the three-dimensional shape is recognized and inspected, the solder shape in a state where the component terminal is pressed and deformed can be inspected. In this way, the solder can be inspected in a state related to the part, so that it is possible to judge the quality more clearly than when inspecting only the solder state before mounting the part, etc. The cause can be accurately identified. That is, the inspection accuracy can be further improved.

  In addition, in this embodiment, the solder shape is recognized before reflowing the solder, and the cause of the failure is specified based on the recognition result. Unlike the case where the cause of the failure is specified after the reflow, the soldering is performed by reflow. Therefore, it is possible to reliably prevent a defect such as a problem that it is difficult to identify the cause of the defect and to identify the cause of the defect more accurately.

  Furthermore, in the present embodiment, as described above, since the cause of the failure can be accurately identified, the cause of the failure can be dealt with accurately, the occurrence of the failure can be effectively prevented, and the yield and productivity can be improved. This can be further improved.

  In addition, even if it can discover the defective part of soldering by arrange | positioning an inspection machine in the downstream of the reflow furnace 4 and inspecting the board | substrate which the solder hardening process was complete | finished, the defect which this embodiment is possible The cause is difficult to identify.

  Furthermore, in the present embodiment, by combining with the inspection of the substrate that has been subjected to the solder curing process, the cause of the failure can be reliably identified even when the cause of the failure is in the reflow furnace 4. That is, when the inspection apparatus 3 according to the present embodiment performs an inspection after component mounting and before reflow curing, and determines that the substrate is good, a defect occurs after the good substrate is reflow cured by the reflow furnace 4. Then, it can be determined that the cause of the defect is due to the reflow curing process.

  Specifically, as shown in FIGS. 6A to 6C, when the normal substrate W is normally subjected to the printing process and the mounting process, the substrate W is subjected to reflow curing by the reflow furnace 4, As shown in FIG. 6 (d-1), when the solder deficiency defect occurs, it can be specified that the cause of the defect is a lack of heat in the reflow furnace 4. Further, after the reflow hardening, when a terminal floating failure occurs as shown in FIG. 6D-2, the cause of the failure can be specified as a temperature imbalance caused by the reflow furnace 4.

  Thus, even when the cause of failure is in the reflow furnace 4, the types of failure causes can be narrowed down, countermeasures for failures can be performed reliably, and yield and productivity can be improved more reliably.

  In the above-described embodiment, correction values such as misregistration amounts and solder shortage amounts are calculated by the control device 6 of the inspection device 3. However, the present invention is not limited to this, and in this embodiment, the correction value is calculated. The calculation may be performed by a computer such as a control device other than the inspection device. For example, the correction value related to printing may be calculated by the control device (computer) of the printing press, or the correction value related to mounting may be calculated by the printing device (computer) of the mounting press. Further, when a host computer that supervises a control device (computer) for each facility on the mounting line is provided, the correction value may be calculated by the host computer.

  Further, in the above-described embodiment, the inspection device determines whether or not the bonding state between the component and the solder on the mounting substrate is good, but the present invention is not limited thereto, and the inspection device of the present invention does not make a good / bad determination. Alternatively, only the cause of the defect may be specified. For example, the inspection apparatus of the present invention may be arranged in parallel to the mounting line, and the cause of the defect may be specified by the inspection apparatus separately from the board production. In this case, it is preferable that a device for determining pass / fail is disposed on the mounting line, and only the substrate determined to be defective by the device is transferred to the inspection device.

  In the above embodiment, the mounting machine is disposed adjacent to the downstream side of the printing machine. However, the present invention is not limited to this, and in the present invention, the solder state is two-dimensionally arranged between the printing machine and the mounting machine. Or you may make it arrange | position the inspection apparatus which test | inspects in three dimensions. In this case, since the solder state before mounting can also be detected, the inspection accuracy can be further improved.

It is a schematic front view which shows the mounting line concerning one Embodiment of this invention. It is a block diagram which shows the control system of the test | inspection apparatus employ | adopted for the mounting line of embodiment. It is a cross-sectional view which shows the board | substrate ideally produced by the mounting line of embodiment in the state for every process. It is a cross-sectional view which shows the board | substrate produced by a mounting line when the cause of defect suits a printing machine in embodiment in the state for every process. It is a cross-sectional view which shows the board | substrate produced by a mounting line when the cause of a defect suits a mounting machine in embodiment in the state for every process. It is a cross-sectional view which shows the board | substrate produced by a mounting line when the cause of a defect suits the reflow furnace in embodiment in the state for every process. It is a flowchart for demonstrating the test | inspection operation | movement in the test | inspection apparatus of embodiment. It is a flowchart for demonstrating the correction | amendment operation | movement of the printing conditions in the inspection apparatus of embodiment. It is a flowchart for demonstrating the correction | amendment operation | movement of the mounting conditions in the test | inspection apparatus of embodiment.

Explanation of symbols

2 Printing machine 3 Inspection device 4 Reflow furnace 10 Mounting machine E Parts S Solder W Substrate

Claims (5)

A mounting board inspection device that inspects the mounting state of a mounting board on which solder is applied and components are mounted and solder is reflowed.
Recognition image data acquisition means for recognizing the joining state of the component and the solder with a three-dimensional shape after mounting the component and before reflowing the solder;
A mounting board inspection apparatus comprising: a failure cause specifying means for specifying a cause of a failure based on recognition image data for a mounting board in which a bonding state between a component and solder is defective.   A correction value for correcting at least one of a coating condition in a solder coating machine for solder coating or a mounting condition in a mounting machine for component mounting is calculated according to the cause of the fault specified by the fault cause specifying means. The mounting board inspection apparatus according to claim 1, further comprising a correction value calculation unit. A mounting line comprising: a solder application machine that applies solder to a substrate; a mounting machine that mounts components on the substrate on which solder is applied; and a reflow furnace that reflows solder on the substrate on which the components are mounted.
An inspection device is installed between the mounting machine and the reflow furnace,
The inspection apparatus recognizes a bonding state between a component and solder in a three-dimensional shape and acquires recognition image data, and recognizes a mounting substrate in which the bonding state between the component and solder is defective. A mounting line comprising: a failure cause specifying means for specifying a cause of failure based on image data.   The mounting line according to claim 3, wherein the coating condition of the solder coating machine and the mounting condition of the mounting machine are corrected according to the cause of the fault specified by the fault cause specifying means. A mounting board inspection method for inspecting a mounting state with respect to a mounting board to which solder is reflowed after applying solder and mounting components,
After mounting the part and before reflowing the solder, the joint state between the part and the solder is recognized in a three-dimensional shape, and the recognition image data is acquired.
A mounting board inspection method in which a cause of a failure is specified based on recognition image data for a mounting board in which a bonding state between a component and solder is defective.

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