CN109115159A - A kind of determination method in the aperture of micro- slice - Google Patents

A kind of determination method in the aperture of micro- slice Download PDF

Info

Publication number
CN109115159A
CN109115159A CN201811002562.4A CN201811002562A CN109115159A CN 109115159 A CN109115159 A CN 109115159A CN 201811002562 A CN201811002562 A CN 201811002562A CN 109115159 A CN109115159 A CN 109115159A
Authority
CN
China
Prior art keywords
point
slice
abradant surface
vertical line
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811002562.4A
Other languages
Chinese (zh)
Other versions
CN109115159B (en
Inventor
谢世威
王平
黎钦源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guanghe Science And Technology (guangzhou) Co Ltd
Original Assignee
Guanghe Science And Technology (guangzhou) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guanghe Science And Technology (guangzhou) Co Ltd filed Critical Guanghe Science And Technology (guangzhou) Co Ltd
Priority to CN201811002562.4A priority Critical patent/CN109115159B/en
Publication of CN109115159A publication Critical patent/CN109115159A/en
Application granted granted Critical
Publication of CN109115159B publication Critical patent/CN109115159B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/10Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
    • G01B21/14Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters internal diameters

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

The present invention provides a kind of determination method in the aperture of micro- slice, which comprises the following steps: S1. carries out grinding for the first time and obtains abradant surface FN, and second of grinding is carried out after measurement data and obtains abradant surface fn;S2. make vertical line AG, Ag, tie point G and point g respectively to abradant surface from hole heart A;Vertical line GI and GM are made to two groups of parallel lines respectively from point G, make vertical line gi and gm from point g to two groups of parallel lines;Vertical line GK and GL are made to gi and gm respectively from point G again.The present invention is analyzed from microsection manufacture and the key factor of measurement, and propose it is a kind of obtain the inclined data in accurate hole by the method for mathematical computations on the basis of micro- slice, and with this come the method for assessing the inclined failure risk in hole.

Description

A kind of determination method in the aperture of micro- slice
Technical field
The invention belongs to printed wiring board (PCB) processing technique fields, and in particular to a kind of determination in the aperture of micro- slice Method.
Background technique
Multilayer printed wiring board (PCB) generallys use connection bridge of the mechanical through hole as each sandwich circuit, and through-hole connects with it The Aligning degree for connecing layer pattern plays key effect for the reliability of connection.Currently, generalling use plus detecting in the production process Side of section (through-hole and each layer difference window size figure form) is electrically sentenced by the way that opening between test through-hole and internal layer layers of copper is short-circuit Disconnected Aligning degree, but this method cannot feed back the alignment situation of single layer line pattern and hole out.Minimum ring is provided in IPC-6012 Width is the evaluation criterion of through-hole and each graph layer Aligning degree, measures minimum annular ring in terrace cut slice method.Some well-known IT in the industry Through-hole is then that hole is inclined with each graph layer Aligning degree problem definition by enterprise, measures hole edge and graphic edge using dropping cut slice mode Spacing is as evaluation criterion.
With extensive application of the back drill technique in high-frequency high-speed product, if back drill hole is got into interior layer line or is made when making Its is exposed all to cause to scrap or risk of serious failure, therefore, the measurement of the Aligning degree (hole is inclined) between back drill hole and internal layer cabling Become a big event with control hole, generallys use the detection of terrace cut slice measurement method in the industry at present.
It is inclined using terrace cut slice measured hole, it is desirable that with minimum annular ring position and through the via hole heart at slice abradant surface;Horizontal cutting Piece then needs to handle the alignment issues in same hole Yu two or more layers figure, therefore can be grasped partially using original slice method measured hole The property made is bad.
Summary of the invention
In view of this, the present invention provides a kind of determination method in the aperture of micro- slice, the present invention is from microsection manufacture and measures Key factor on analyzed, and propose that a kind of to obtain accurate hole by the method for mathematical computations on the basis of micro- slice inclined Data, and with this come the method for assessing the inclined failure risk in hole.
In the prior art, dropping cut slice has the following problems with terrace cut slice measurement method:
Dropping cut slice: abradant surface will have the higher depth of parallelism just to accurately reflect at a distance from hole edge to line with graph layer.If any multilayer Route then needs repeatedly to grind, lead to larger workload and overgrinding make a mistake probability increase.
Terrace cut slice: accurately to reflect hole partially or the spacing of side to line needs to meet: at a, abradant surface and minimum annular ring Position and through the via hole heart.B, interior layer line and slice abradant surface vertical line.In existing micro- microsection manufacture technical foundation, this two o'clock is wanted Asking can only all accomplish to approach.With following situations:
(1) meet when terrace cut slice makes:
A, abradant surface is at hole center;B, slice abradant surface is vertical with interior layer line.
Line AC indicates slice abradant surface as shown in figure 1, and it is vertical with interior layer line to meet at point B, AC with hole edge.Line segment BC length Indicate that hole edge arrives the distance of interior layer line, but actual slice cannot accomplish above-mentioned two o'clock, thus this it is only ideal in state.
(2) meet when terrace cut slice makes:
A, abradant surface is at hole center;B, slice abradant surface and interior layer line out of plumb.
If Fig. 2 middle line AC indicates slice abradant surface, point D is met at as vertical line by the inside layer line of hole heart A, then interior layer line and slice Abradant surface is at angle ∠ ACD.Line segment BC length can measure on abradant surface, and AB is pore radius, can be with by trigonometric function operation Calculate the value of line segment AD, then subtract hole radius can be obtained hole edge to line distance.
Interior layer line and slice abradant surface so how are measured in micro- slice into angle ∠ ACD:
It has been investigated that first hole to line can be designed and produced into side of detection section, and increase by one group of parallel lines (in such as Fig. 3 Line EF//CD), abradant surface AF and hole edge meet at point B, meet at point C and point F respectively with setting parallel lines, make vertical line from point C to EF With point E.Then in right angle △ CEF, CE is the parallel lines spacing of setting, and CF can be measured on abradant surface, then ∠ CFE ,∠ACD ∠ CFE, ADAC*sin∠ACD.Thus it is hole edge between line CD that AD, which subtracts pore radius AB, Away from.
(3) meet when terrace cut slice makes:
A, abradant surface is not or not hole center;B, slice abradant surface and interior layer line out of plumb.
If Fig. 4 middle line FJ indicates slice abradant surface, point C is met at line CD, meets at point B and point J with hole edge.From hole heart A to Line DI makees vertical line AD, then the value subduction pore radius of line segment AD is distance of the hole edge to line.How the value of AD is obtained:
Vertical line AG first can be made from hole heart A to abradant surface GF, then G point is in abradant surface and two intersection points (point B, point J) of hole edge Point, the i.e. value of line segment BG are the half of two intersection points B J spacing.Make vertical line GI from point G to CD again, point G makees vertical line GN to AD;Then GILine segment AD.The value of line segment AH and DH is calculated separately below by mathematical operation.
In right angle △ GCI, the short GC of line can measure on slice abradant surface, and the method as shown in above-mentioned 2.2 can be obtained ∠ GCI, then line segment GI
In right angle △ ABG, AB is pore radius, and BG can measure on abradant surface, then AG
The GC and CI when AG and AH are respectively perpendicular to two of angle ∠ GCI of two of angle ∠ GAH is vertical, then ∠ GAH∠ GCI.In right angle △ GAH, AH∠GAH.It can be obtained to this: AD
But in above-mentioned analysis, the theoretical value (boring the half of nozzle diameter) of pore radius AB has been applied.But actually accomplish hole Diameter is discrepant with brill nozzle diameter, therefore above-mentioned calculating is that there are deviations.Effective aperture so such as can be obtained:
The technical solution of the present invention is as follows: a kind of determination method in the aperture of micro- slice, which comprises the following steps:
S1. it carries out grinding for the first time and obtains abradant surface FN, second of grinding is carried out after measurement data and obtains abradant surface fn;
S2. make vertical line AG, Ag, tie point G and point g respectively to abradant surface from hole heart A;It is hung down respectively to two groups of parallel lines from point G Line GI and GM make vertical line gi and gm from point g to two groups of parallel lines;Vertical line GK and GL are made to gi and gm respectively from point G again, then GI= GC*sin ∠ GCI, gi=gc*sin ∠ gci, then gK=gi-GI;GM=GN*sin ∠ GNM, gm=gn*sin ∠ gnm, then gL=gm- GM;
S3. in right angle △ gKG, GK=gL, then gG
S4. in right angled triangle ABG,;In right angled triangle Abg,
S5. in △ AGg, the both sides AG and Ag of ∠ GAg is respectively perpendicular to two abradant surface FN and fn;Then ∠ GAg and two abradant surfaces Angle it is equal or complementary, i.e. ∠ GAg=∠ cfe- ∠ CFE or ∠ GAg=π-(∠ cfe- ∠ CFE);
S6.
S7. equation in step S3, S4, S5 is substituted into S6, obtains pore radius AB, Ab.
Particularly, the determination method in the aperture of micro- slice is suitable for abradant surface not at hole center, and slice grinding The case where face and interior layer line out of plumb.
The present invention also provides a kind of determination methods in the aperture of micro- slice, which comprises the following steps:
S1. it carries out grinding for the first time and obtains abradant surface FN, second of grinding is carried out after measurement data and obtains abradant surface fn;
S2. make vertical line from hole heart A to abradant surface, meet at point g and point G respectively, then AG=Ag+gG;Make vertical line from point G to line Cc, Meet at point I;Make vertical line from point g to line Cc, meets at point i;Make vertical line from point G to gi, meets at point O;Then GI=; gi=gc*sin;And.Then GO=gi-GI=(gc-GC) *
S3. in right angle △ GgO, the both sides of ∠ GgO are respectively perpendicular to∠GgO=, gG=
S4. in right angle △ ABG,;In right angle △ Abg,
S5. AB and Ab is pore radius, then AB=Ab;
S6. Ag=;Then pore radius AB=Ab= =
Particularly, the determination method in the aperture of micro- slice is suitable for the parallel situation of two abradant surfaces.
Present inventor by a large amount of creative work, increase on the basis of original detection method two groups it is parallel Line is mutually perpendicular to as reference data line, two groups of parallel lines, obtains the determination method in the aperture of new micro- slice, and the present invention is from cutting Piece production with measure key factor on analyzed, and propose it is a kind of on the basis of micro- slice by the method for mathematical computations come Obtain the inclined data in accurate hole, and with this come the method for assessing the inclined failure risk in hole.
Detailed description of the invention
Fig. 1 is the schematic diagram of determination method of the invention;
Fig. 2 is the schematic diagram of determination method of the invention;
Fig. 3 is the schematic diagram of determination method of the invention;
Fig. 4 is the schematic diagram of determination method of the invention;
Fig. 5 is the schematic diagram of determination method of the invention;
Fig. 6 is the schematic diagram of determination method of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Embodiment 1
A kind of determination method in the aperture of micro- slice, which comprises the following steps:
S1. it carries out grinding for the first time and obtains abradant surface FN, second of grinding is carried out after measurement data and obtains abradant surface fn;
S2. make vertical line AG, Ag, tie point G and point g respectively to abradant surface from hole heart A;It is hung down respectively to two groups of parallel lines from point G Line GI and GM make vertical line gi and gm from point g to two groups of parallel lines;Vertical line GK and GL are made to gi and gm respectively from point G again, then GI= GC*sin ∠ GCI, gi=gc*sin ∠ gci, then gK=gi-GI;GM=GN*sin ∠ GNM, gm=gn*sin ∠ gnm, then gL=gm- GM;
S3. in right angle △ gKG, GK=gL, then gG
S4. in right angled triangle ABG,;In right angled triangle Abg,
S5. in △ AGg, the both sides AG and Ag of ∠ GAg is respectively perpendicular to two abradant surface FN and fn;Then ∠ GAg and two abradant surfaces Angle it is equal or complementary, i.e. ∠ GAg=∠ cfe- ∠ CFE or ∠ GAg=π-(∠ cfe- ∠ CFE);
S6.
S7. equation in step S3, S4, S5 is substituted into S6, obtains pore radius AB, Ab.
Particularly, the determination method in the aperture of micro- slice is suitable for abradant surface not at hole center, and slice grinding The case where face and interior layer line out of plumb.
Embodiment 2
A kind of determination method in the aperture of micro- slice, which comprises the following steps:
S1. it carries out grinding for the first time and obtains abradant surface FN, second of grinding is carried out after measurement data and obtains abradant surface fn;
S2. make vertical line from hole heart A to abradant surface, meet at point g and point G respectively, then AG=Ag+gG;Make vertical line from point G to line Cc, Meet at point I;Make vertical line from point g to line Cc, meets at point i;Make vertical line from point G to gi, meets at point O;Then GI=; gi=gc*sin;And.Then GO=gi-GI=(gc-GC) *
S3. in right angle △ GgO, the both sides of ∠ GgO are respectively perpendicular to∠GgO=, gG=
S4. in right angle △ ABG,;In right angle △ Abg,
S5. AB and Ab is pore radius, then AB=Ab;
S6. Ag=;Then pore radius AB=Ab= =
Particularly, the determination method in the aperture of micro- slice is suitable for the parallel situation of two abradant surfaces.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, it can be by appointing One prior art is realized.

Claims (4)

1. a kind of determination method in the aperture of micro- slice, which comprises the following steps:
S1. it carries out grinding for the first time and obtains abradant surface FN, second of grinding is carried out after measurement data and obtains abradant surface fn;
S2. make vertical line AG, Ag, tie point G and point g respectively to abradant surface from hole heart A;It is hung down respectively to two groups of parallel lines from point G Line GI and GM make vertical line gi and gm from point g to two groups of parallel lines;Vertical line GK and GL are made to gi and gm respectively from point G again, then GI= GC*sin ∠ GCI, gi=gc*sin ∠ gci, then gK=gi-GI;GM=GN*sin ∠ GNM, gm=gn*sin ∠ gnm, then gL =gm-GM;
S3. in right angle △ gKG, GK=gL, then
S4. in right angled triangle ABG, AG2=AB2-BG2;In right angled triangle Abg, Ag2=Ab2-bg2
S5. in △ AGg, the both sides AG and Ag of ∠ GAg is respectively perpendicular to two abradant surface FN and fn;Then ∠ GAg and two abradant surfaces Angle it is equal or complementary, i.e. ∠ GAg=∠ cfe- ∠ CFE or ∠ GAg=π-(∠ cfe- ∠ CFE);
S6.gG2=AG2+Ag2-2*AG*Ag*cos∠GAg;
S7. equation in step S3, S4, S5 is substituted into S6, obtains pore radius AB, Ab.
2. the determination method in the aperture of micro- slice according to claim 1, which is characterized in that the aperture of micro- slice Determine that method is suitable for abradant surface not at hole center, and the case where slice abradant surface and interior layer line out of plumb.
3. a kind of determination method in the aperture of micro- slice, which comprises the following steps:
S1. it carries out grinding for the first time and obtains abradant surface FN, second of grinding is carried out after measurement data and obtains abradant surface fn;
S2. make vertical line from hole heart A to abradant surface, meet at point g and point G respectively, then AG=Ag+gG;Make vertical line from point G to line Cc, Meet at point I;Make vertical line from point g to line Cc, meets at point i;Make vertical line from point G to gi, meets at point O;Then GI=GC*sin ∠ GCI; Gi=gc*sin ∠ gci;And ∠ GCI=∠ gci.Then GO=gi-GI=(gc-GC) * sin ∠ GCI;
S3. in right angle △ GgO, the both sides of ∠ GgO are respectively perpendicular to the both sides of ∠ GCI, then ∠ GgO=∠ GCI,
S4. in right angle △ ABG, AB2=AG2+BG2;In right angle △ Abg, Ab2=Ag2+bg2
S5.AB and Ab is pore radius, then AB=Ab;
S6.Then pore radius
4. the determination method in the aperture of micro- slice according to claim 3, which is characterized in that the aperture of micro- slice Determine that method is suitable for the parallel situation of two abradant surfaces.
CN201811002562.4A 2018-08-30 2018-08-30 Method for determining aperture of micro-slice Active CN109115159B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811002562.4A CN109115159B (en) 2018-08-30 2018-08-30 Method for determining aperture of micro-slice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811002562.4A CN109115159B (en) 2018-08-30 2018-08-30 Method for determining aperture of micro-slice

Publications (2)

Publication Number Publication Date
CN109115159A true CN109115159A (en) 2019-01-01
CN109115159B CN109115159B (en) 2021-02-09

Family

ID=64861432

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811002562.4A Active CN109115159B (en) 2018-08-30 2018-08-30 Method for determining aperture of micro-slice

Country Status (1)

Country Link
CN (1) CN109115159B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101032193A (en) * 2004-10-28 2007-09-05 英特尔公司 Assessing micro-via formation in a PCB substrate manufacturing process
CN101726245A (en) * 2008-10-15 2010-06-09 维嘉数控科技(苏州)有限公司 Method for analyzing borehole deviation of PCB drilling machine
GB2477993A (en) * 2010-02-23 2011-08-24 Geoffrey David Horn Mechanical assembly methods for PCB boards using sets of edge solder pads
CN104020031A (en) * 2014-06-12 2014-09-03 深圳崇达多层线路板有限公司 Manufacturing method of PCB (Printed Circuit Board) section and microsection sample
CN104602463A (en) * 2015-01-05 2015-05-06 深圳崇达多层线路板有限公司 Manufacturing method for mechanical blind hole capable of being embedded with parts
CN104735911A (en) * 2015-01-01 2015-06-24 深圳市兴达线路板有限公司 Circuit board hole position correcting method
CN105043828A (en) * 2015-06-03 2015-11-11 洛阳伟信电子科技有限公司 Method for properly and accurately polishing and grinding metallographic phase slice of PCB
CN106338413A (en) * 2016-08-29 2017-01-18 广东工业大学 Making method of PCB half-hole section

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101032193A (en) * 2004-10-28 2007-09-05 英特尔公司 Assessing micro-via formation in a PCB substrate manufacturing process
CN101726245A (en) * 2008-10-15 2010-06-09 维嘉数控科技(苏州)有限公司 Method for analyzing borehole deviation of PCB drilling machine
GB2477993A (en) * 2010-02-23 2011-08-24 Geoffrey David Horn Mechanical assembly methods for PCB boards using sets of edge solder pads
CN104020031A (en) * 2014-06-12 2014-09-03 深圳崇达多层线路板有限公司 Manufacturing method of PCB (Printed Circuit Board) section and microsection sample
CN104735911A (en) * 2015-01-01 2015-06-24 深圳市兴达线路板有限公司 Circuit board hole position correcting method
CN104602463A (en) * 2015-01-05 2015-05-06 深圳崇达多层线路板有限公司 Manufacturing method for mechanical blind hole capable of being embedded with parts
CN105043828A (en) * 2015-06-03 2015-11-11 洛阳伟信电子科技有限公司 Method for properly and accurately polishing and grinding metallographic phase slice of PCB
CN106338413A (en) * 2016-08-29 2017-01-18 广东工业大学 Making method of PCB half-hole section

Also Published As

Publication number Publication date
CN109115159B (en) 2021-02-09

Similar Documents

Publication Publication Date Title
US20130082997A1 (en) System and method for detection of dimensions of display panel or other patterned device
WO2015096667A1 (en) Drilling method for circuit board
CN105278261B (en) A kind of measuring method of laser direct-writing exposure machine position alignment of inner layer plates precision
CN105612444A (en) Opto-electric hybrid substrate and method for producing same
CN102248288A (en) Method for identifying and positioning flexible printed circuit (FPC) board plug
CN103983498A (en) Microetch liquid used for analyzing metallographic slice and application method thereof
TW201621335A (en) Apparatus for inspecting substrate and method for inspecting substrate
CN110519925A (en) A kind of method of quick reckoning PCB via hole hole copper thickness
CN103884912B (en) A kind of measuring method of square resistance
US10980110B2 (en) Shadow elimination detection method and manufacturing method for a touch substrate, touch substrate and touch device
CN109115159A (en) A kind of determination method in the aperture of micro- slice
CN102967291A (en) Measuring method of coplanarity of surface of circuit board
CN105050326A (en) Back-drilling method
CN105722300A (en) Electroplating quality detection module, printed circuit board motherboard and electroplating quality detection method
CN105043828A (en) Method for properly and accurately polishing and grinding metallographic phase slice of PCB
CN108072343A (en) The appraisal procedure of PCB new material harmomegathus penalty coefficients
CN103308813A (en) Electrode substrate, and circuit pattern inspection device with the same
CN102617030A (en) Cutting method for liquid crystal panel with liquid crystal
CN110375696B (en) Method for rapidly calculating thickness of copper in PCB (printed circuit board) via hole
CN207936890U (en) Irregular hole diameter measuring device
CN109780961A (en) A kind of overall dimensions detection instrument and preparation method thereof
TWI754194B (en) Circuit board
CN115643683B (en) Filling and plating method for special-shaped resin hole and printed circuit board
US10893605B2 (en) Textured test pads for printed circuit board testing
CN207379385U (en) A kind of device for being used to be accurately positioned radio reception mouth position and direction

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Address after: 510000 No. 22, Ying Ying Road, Guangzhou Free Trade Zone, Guangdong

Applicant after: Guangzhou Guanghe Technology Co., Ltd

Address before: 510000 No. 22, Ying Ying Road, Guangzhou Free Trade Zone, Guangdong

Applicant before: DELTON TECHNOLOGY (GUANGZHOU) Inc.

GR01 Patent grant
GR01 Patent grant