CN102111967B - Method and system for controlling thickness of circuit board insulating layer - Google Patents
Method and system for controlling thickness of circuit board insulating layer Download PDFInfo
- Publication number
- CN102111967B CN102111967B CN200910243565A CN200910243565A CN102111967B CN 102111967 B CN102111967 B CN 102111967B CN 200910243565 A CN200910243565 A CN 200910243565A CN 200910243565 A CN200910243565 A CN 200910243565A CN 102111967 B CN102111967 B CN 102111967B
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- thickness
- insulating layer
- circuit board
- insulating barrier
- boring
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000005553 drilling Methods 0.000 claims abstract description 9
- 230000004888 barrier function Effects 0.000 claims description 54
- 238000005259 measurement Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000011179 visual inspection Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 3
- 230000001066 destructive effect Effects 0.000 abstract description 6
- 238000003475 lamination Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention discloses a method and a system for controlling thickness of a circuit board insulating layer, wherein the method comprises the following steps of: determining a plurality of positions where thickness of the insulating layer is needed to be measured within the area, except a circuit, on the circuit board; drilling holes on the determined positions; determining the thickness of the insulating layer at the position by measuring depth of the drilled hole; and adjusting the thickness of the insulating layer according to the determined thickness and the thickness required by the insulating layer. The method in the present invention selects a plurality of positions within the area, except the circuit, on the circuit board to drill holes, and then measures depth of the drilled hole so as to determine thickness of the insulating layer, so the thickness of the insulating layer on the whole circuit board can be accurately measured on the precondition that no destructive slicing is performed on the circuit board, and thickness of the circuit board insulating layer can be effectively controlled according to the measured thickness.
Description
Technical field
The present invention relates to circuit board and base plate for packaging and make the field, relate in particular to a kind of control method and system of circuit board thickness of insulating layer.
Background technology
In the industry of circuit board and base plate for packaging making at present; In the process of making layer die pressing product; When controlling the thickness of its insulating barrier; The thickness of insulating layer of the product that often need go out lamination detects, and judge whether to be controlled within the customer requirement scope, thereby the common method of inspection that adopts is to do destructive section to measure judgement.
The detection mode of this destructive section; Not only directly have influence on the qualification rate of product; And the effective decision data amount that draws from destructiveness section result is few, is merely able to reflect that actual institute does the thickness of insulating layer situation of break area product, but the situation of the thickness of insulating layer behind other regional lamination of reactor product exactly; Thereby can't reach the purpose of the situation of confirming whole plate insulating layer thickness, also just can't accurately control the thickness of the insulating barrier of whole plate.
Summary of the invention
The embodiment of the invention provides a kind of control method of circuit board thickness of insulating layer, can not be to putting in order the problem that plate insulating layer is accurately controlled to circuit board thickness of insulating layer control method in the prior art in order to solve.
The control method of a kind of circuit board thickness of insulating layer that the embodiment of the invention provides comprises:
Confirm a plurality of positions that need to measure thickness of insulating layer in the zone on circuit board outside the dividing circuit;
The said position boring of determining;
Confirm the thickness of said position insulating barrier through the degree of depth of measuring boring;
According to thickness of determining and the required thickness that reaches of insulating barrier, the thickness of insulating barrier is adjusted.
Further, said definite a plurality of positions that need to measure thickness of insulating layer comprise:
At least select a plurality of positions that need to measure thickness of insulating layer in one of following zone, add target: zone, edges of boards frame zone and cage plate frame region between the cage plate on the circuit board outside the dividing circuit;
Further, the said position boring determining comprises:
CO is carried out in position shown in the target on the circuit board
2Laser drill.
Said a plurality of position that needs to measure thickness of insulating layer evenly distributes.
The pore size of laser drill is in 0.1～0.5mm scope.
Further, after the position boring of determining, also comprise:
Remove residual carbide and resin in the boring.
Further, measure the degree of depth of boring, comprising:
Measure the difference in height of holing with copper face at the bottom of the hole.
Further, before confirming to need the step of measurement thickness of insulating layer position, also comprise:
Insulating barrier to circuit board carries out coarse grinding treatment, makes the said thickness of insulating layer in corase grind back than the required big 5～10um of higher limit that reaches thickness.
Further,, the thickness of insulating barrier is adjusted, being comprised according to thickness of determining and the required thickness that reaches of insulating barrier:
Poor according to the required thickness that reaches of insulating barrier and the thickness determined, through the type or the abrasive parameters of adjustment polish-brush, cutting force when adjustment is ground carries out milled processed to the circuit board insulating barrier.
The embodiment of the invention also provides a kind of control system of circuit board thickness of insulating layer, comprising:
The equipment that is used for the position of the definite a plurality of needs measurement thickness of insulating layer in zone outside dividing circuit on the circuit board;
Be used for the equipment of on the said position of determining, holing;
The degree of depth that is used to measure boring is confirmed the equipment of the thickness of said position insulating barrier;
Be used for according to thickness and the required thickness that reaches of insulating barrier determined the equipment that the thickness of insulating barrier is adjusted.
Further, the said equipment that is used on the said position of determining, holing is CO
2Laser drilling machine;
The said degree of depth that is used to measure boring confirms that the equipment of the thickness of said position insulating barrier is 3D microscope or 3D automatic visual inspection appearance.
The beneficial effect of the embodiment of the invention comprises:
The control method and the system of the circuit board thickness of insulating layer that the embodiment of the invention provides; Confirm a plurality of positions that need to measure thickness of insulating layer in the zone on circuit board outside the dividing circuit; On the position of determining, hole, confirm the thickness of each position insulating barrier through measuring the degree of depth of holing, according to the thickness and the required thickness of insulating barrier of the insulating barrier of determining; Thickness to insulating barrier is adjusted, and makes the thickness of insulating layer of circuit board finally reach required thickness.
Select a plurality of positions to hole in the zone of the embodiment of the invention outside dividing circuit plate dividing circuit; Measure drilling depth and then definite thickness of insulating layer; Can not be implemented in circuit board is carried out under the prerequisite of destructive section; Thickness to the whole plate insulating layer of circuit board is accurately measured, and according to the measured thickness value, the thickness of insulating layer of circuit board is controlled effectively.
Further; The control method and the system of the circuit board thickness of insulating layer that the embodiment of the invention provides, the insulating barrier to circuit board before boring carries out coarse grinding treatment, and the thickness of insulating layer after the feasible corase grind is than the big 5～10um of higher limit of the thickness that need reach; After boring and the definite thickness of insulating layer; Can circuit board be ground to reach the purpose of desired thickness once more according to the difference between circuit board insulating barrier actual (real) thickness and the desired thickness, through above-mentioned by the process that controls to accurate control roughly; Make that the circuit board thickness of insulating layer can be further precisely controlled, improved the yield of product.
Description of drawings
The flow chart of the control method of the circuit board thickness of insulating layer that Fig. 1 provides for the embodiment of the invention;
The profile of boring back circuit board in the control method of the circuit board thickness of insulating layer that Fig. 2 provides for the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing, the control method of a kind of circuit board thickness of insulating layer provided by the invention and the embodiment of system are carried out detailed explanation.
The control method of a kind of circuit board thickness of insulating layer that the embodiment of the invention provides; Under the situation that need not carry out destructive section to circuit board; Realize drawing exactly the thickness of insulating layer of circuit board whole plate behind lamination; And confirm that its thickness whether within the required scope that reaches, specifically, comprises the steps:
S101, the insulating barrier of circuit board is carried out coarse grinding treatment;
This step is an optional step, for the thickness of control circuit plate insulating layer more accurately reaches client's needs, can roughly grind the insulating barrier of circuit board in advance, and in subsequent step, further add mill according to the result who measures.
In this step S101, during corase grind, the requirement of insulating barrier and the cutting force situation of the used polish-brush of abrasive parameters to be roughly ground according to the client, the thickness of insulating layer of corase grind back product is advisable than the big 5～10um of higher limit of the required thickness that reaches.
S102, outside the circuitous pattern zone of customer requirement on the circuit board, confirm a plurality of positions of need measuring thickness of insulating layer.
In this step S102, outside the circuitous pattern zone of customer requirement on the circuit board, select to detect the position of thickness of insulating layer as required, add corresponding target.
In circuit board; More than one of the position of target institute mark; Preferably; For under the prerequisite of the product percent of pass that does not influence circuit board, as far as possible all sidedly the thickness of insulating layer of the whole plate each several part of circuit board is measured and is controlled, the position at target place can be outside the circuitous pattern zone of non-customer requirement for example between the circuit board cage plate, zones such as edges of boards frame or edges of boards frame distribute equably.
When implementing; At first on board design software; Between the circuit board cage plate, the selected position detected of needing, zones such as edges of boards frame or edges of boards frame, add corresponding target figure, in the process of circuit board manufacturing; To at the target graph copying that is provided with on the software to the circuit board of reality, form target.
S103, carry out laser drill in the position that step S102 determines.
In this step S102, CO is used in the position at target place on circuit board
2Laser drilling machine carries out CO
2Laser drill, the pore size of boring is controlled in 0.1～0.5mm scope.
The section of the circuit board after the laser drill is as shown in Figure 2,201 signs be insulating barrier, 202 signs be boring, 203 signs be copper layer at the bottom of the hole.
Residual in order to make at the bottom of the hole of boring that copper face does not have resin with other foreign material, avoid influencing the accuracy of follow-up measuring process measurement result, in embodiments of the present invention, after above-mentioned steps S103, also comprise the steps S104.
S104, use de-smear line or plasma cleaning equipment are removed residual carbide and resin in the boring.
S105, confirm the thickness of the insulating barrier of position shown in the target through the degree of depth of measuring boring.
In this step S105, (Automatic OpticalInspection AOI) measures the difference in height of boring and copper face at the bottom of the hole, and the degree of depth that obtains holing has also promptly obtained the thickness of this target placement place insulating barrier to use 3D microscope or 3D automatic visual inspection appearance.
Under the bigger situation of detection limit, can preferably use scanning devices such as 3D automatic visual inspection appearance to measure, can improve the efficient of measurement.
Thickness and the required thickness that reaches of insulating barrier that S106, basis are determined are adjusted the thickness of insulating barrier.
Under prerequisite through step S101 corase grind step; In step S106, can be according to the required thickness that reaches of insulating barrier and the thickness of determining poor, through the type or the abrasive parameters of adjustment polish-brush; Cutting force when adjustment is ground carries out milled processed once more to the circuit board insulating barrier.Make the circuit board thickness of insulating layer after grinding reach required thickness.
The control method of the circuit board thickness of insulating layer that provides in the embodiment of the invention in the specific implementation; Execute after the above-mentioned steps S106; Whether all right repeated execution of steps S105 reaches required thickness according to the thickness of insulating layer of the results verification of measuring once more after grinding to drilling depth, and according to the result who measures once more; Thickness of insulating layer is adjusted; For example insulating barrier is added mill or other are handled, reach the required thickness that reaches until the thickness of the insulating barrier of finishing dealing with, and then carry out the operation of other operations.
The embodiment of the invention also provides a kind of control system of circuit board thickness of insulating layer, comprising:
The equipment that is used for the position of the definite a plurality of needs measurement thickness of insulating layer in zone outside dividing circuit on the circuit board;
The equipment of holing in a plurality of positions that are used to determine;
Be used to measure the difference in height of copper face at the bottom of boring surface and the hole, confirm the equipment of the thickness of said position insulating barrier;
Be used for according to thickness and the required thickness that reaches of insulating barrier determined the equipment that the thickness of insulating barrier is adjusted.
Further, in the control system of the foregoing circuit plate insulating layer thickness that the embodiment of the invention provides:
The equipment that is used on the said position of determining, holing is CO
2Laser drilling machine.
The degree of depth that is used to measure boring confirms that the equipment of the thickness of said position insulating barrier is 3D microscope or 3D automatic visual inspection appearance.
The control method and the system of the circuit board thickness of insulating layer that the embodiment of the invention provides; Confirm a plurality of positions that need to measure thickness of insulating layer in the zone on circuit board outside the dividing circuit; On the position of determining, hole, confirm the thickness of each position insulating barrier through measuring the degree of depth of holing, according to the thickness and the required thickness of insulating barrier of the insulating barrier of determining; Thickness to insulating barrier is adjusted, and makes the thickness of insulating layer of circuit board finally reach required thickness.Select a plurality of positions to hole in the zone of the embodiment of the invention outside dividing circuit plate dividing circuit; Measure drilling depth and then definite thickness of insulating layer; Can not be implemented in circuit board is carried out under the prerequisite of destructive section; Thickness to the whole plate insulating layer of circuit board is accurately measured, and according to the measured thickness value, the thickness of insulating layer of circuit board is controlled effectively.
Further; The control method and the system of the circuit board thickness of insulating layer that the embodiment of the invention provides, the insulating barrier to circuit board before boring carries out coarse grinding treatment, and the thickness of insulating layer after the feasible corase grind is than the big 5～10um of higher limit of the thickness that need reach; After boring and the definite thickness of insulating layer; Can circuit board be ground to reach the purpose of desired thickness once more according to the difference between circuit board insulating barrier actual (real) thickness and the desired thickness, through above-mentioned by the process that controls to accurate control roughly; Make that the circuit board thickness of insulating layer can be further precisely controlled, improved the yield of product.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, belong within the scope of claim of the present invention and equivalent technologies thereof if of the present invention these are revised with modification, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. the control method of a circuit board thickness of insulating layer is characterized in that, comprising:
Confirm a plurality of positions that need to measure thickness of insulating layer in the zone on circuit board outside the dividing circuit; The said position boring of determining;
Confirm the thickness of said position insulating barrier through the degree of depth of measuring boring;
According to thickness of determining and the required thickness that reaches of insulating barrier, the thickness of insulating barrier is adjusted.
2. the method for claim 1 is characterized in that, said definite a plurality of positions that need to measure thickness of insulating layer comprise:
At least select a plurality of positions that need to measure thickness of insulating layer in one of following zone, add target: zone, edges of boards frame zone and cage plate frame region between the cage plate on the circuit board outside the dividing circuit;
Said position boring determining comprises:
CO is carried out in position shown in the target on the circuit board
2Laser drill.
3. method as claimed in claim 2 is characterized in that, said a plurality of positions that need to measure thickness of insulating layer evenly distribute.
4. method as claimed in claim 2 is characterized in that the pore size of laser drill is in 0.1 ~ 0.5mm scope.
5. the method for claim 1 is characterized in that, after the position boring of determining, also comprises: remove residual carbide and resin in the boring.
6. like each described method of claim 1-5, it is characterized in that, measure the degree of depth of boring, comprising: the difference in height of copper face at the bottom of measurement drilling orifice plane and the hole.
7. the method for claim 1 is characterized in that, before confirming to need the step of measurement thickness of insulating layer position, also comprises:
Insulating barrier to circuit board carries out coarse grinding treatment, makes the said thickness of insulating layer in corase grind back than the required big 5 ~ 10um of higher limit that reaches thickness.
8. the method for claim 1 is characterized in that, according to thickness of determining and the required thickness that reaches of insulating barrier, the thickness of insulating barrier is adjusted, and comprising:
Poor according to the required thickness that reaches of insulating barrier and the thickness determined, through the type or the abrasive parameters of adjustment polish-brush, cutting force when adjustment is ground carries out milled processed to the circuit board insulating barrier.
9. the control system of a circuit board thickness of insulating layer is characterized in that, comprising:
The equipment that is used for the position of the definite a plurality of needs measurement thickness of insulating layer in zone outside dividing circuit on the circuit board;
Be used for the equipment of on the said position of determining, holing;
The degree of depth that is used to measure boring is confirmed the equipment of the thickness of said position insulating barrier;
Be used for according to thickness and the required thickness that reaches of insulating barrier determined the equipment that the thickness of insulating barrier is adjusted.
10. control system as claimed in claim 9 is characterized in that, the said equipment that is used on the said position of determining, holing is CO
2Laser drilling machine;
The said degree of depth that is used to measure boring confirms that the equipment of the thickness of said position insulating barrier is 3D microscope or 3D automatic visual inspection appearance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910243565A CN102111967B (en) | 2009-12-28 | 2009-12-28 | Method and system for controlling thickness of circuit board insulating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910243565A CN102111967B (en) | 2009-12-28 | 2009-12-28 | Method and system for controlling thickness of circuit board insulating layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102111967A CN102111967A (en) | 2011-06-29 |
| CN102111967B true CN102111967B (en) | 2012-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910243565A Expired - Fee Related CN102111967B (en) | 2009-12-28 | 2009-12-28 | Method and system for controlling thickness of circuit board insulating layer |
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| Country | Link |
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| CN (1) | CN102111967B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104202926A (en) * | 2014-08-21 | 2014-12-10 | 广州杰赛科技股份有限公司 | Printed circuit board manufacturing method |
| CN106323204A (en) * | 2016-08-16 | 2017-01-11 | 深圳天珑无线科技有限公司 | PCB medium thickness monitoring method and device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6337463B1 (en) * | 1998-03-18 | 2002-01-08 | Mitsubishi Gas Chemical Company, Inc. | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| CN101365291A (en) * | 2007-03-23 | 2009-02-11 | 华为技术有限公司 | Printed circuit board, design method thereof and terminal product main board |
-
2009
- 2009-12-28 CN CN200910243565A patent/CN102111967B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6337463B1 (en) * | 1998-03-18 | 2002-01-08 | Mitsubishi Gas Chemical Company, Inc. | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| CN101365291A (en) * | 2007-03-23 | 2009-02-11 | 华为技术有限公司 | Printed circuit board, design method thereof and terminal product main board |
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| Publication number | Publication date |
|---|---|
| CN102111967A (en) | 2011-06-29 |
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Effective date of registration: 20220921 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. |
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Granted publication date: 20121003 |
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