CN109115159B - Method for determining aperture of micro-slice - Google Patents
Method for determining aperture of micro-slice Download PDFInfo
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- CN109115159B CN109115159B CN201811002562.4A CN201811002562A CN109115159B CN 109115159 B CN109115159 B CN 109115159B CN 201811002562 A CN201811002562 A CN 201811002562A CN 109115159 B CN109115159 B CN 109115159B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
- G01B21/14—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters internal diameters
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Abstract
The invention provides a method for determining the aperture of a micro-slice, which is characterized by comprising the following steps: s1, grinding for the first time to obtain a grinding surface FN, and grinding for the second time after measuring data to obtain a grinding surface FN; s2, respectively making perpendicular lines AG and Ag, a connection point G and a point G from the hole center A to the grinding surface; respectively drawing vertical lines GI and GM from the point G to the two groups of parallel lines, and drawing vertical lines GI and GM from the point G to the two groups of parallel lines; then, perpendicular lines GK and GL are drawn from the point G to gi and gm, respectively. The invention analyzes key factors of slice making and measurement, and provides a method for obtaining accurate hole deviation data by a mathematical calculation method on the basis of microtomy and evaluating the hole deviation failure risk.
Description
Technical Field
The invention belongs to the technical field of Printed Circuit Board (PCB) processing, and particularly relates to a method for determining the aperture of a micro-slice.
Background
Multilayer Printed Circuit Boards (PCBs) typically employ mechanical vias as connecting bridges for the various layers of circuitry, and the alignment of the vias to their connecting layer patterns plays a critical role in the reliability of the connection. At present, a detection assistant (composed of through holes and patterns with different windowing sizes of each layer) is usually added in the manufacturing process, and the alignment degree is judged by testing the electrical property of open short circuit between the through holes and the inner copper layer, but the method cannot reflect the alignment condition of a single-layer circuit pattern and the holes. The minimum ring width is defined in IPC-6012 as an evaluation standard for the alignment of the through holes with each pattern layer, and is measured by a vertical slicing method. Some well-known IT enterprises in the industry define the problem of the alignment degree of the through hole and each graphic layer as hole deviation, and measure the distance between the hole edge and the graphic edge in a horizontal slicing mode to serve as an evaluation standard.
With the application of the back drilling process in high-frequency and high-speed products in a large quantity, if the back drilling hole is drilled to the inner layer or exposed, the inner layer is scrapped or seriously failed, so that the measurement and control of the alignment (hole deviation) between the back drilling hole and the inner layer wiring becomes an important item, and the vertical slice measurement method is generally adopted in the industry at present for detection.
Measuring hole deviation by adopting a vertical slice, wherein the grinding surface of the slice is required to be at the position of the minimum ring width and pass through the hole center; horizontal slicing is required to solve the problem of alignment between the same hole and two or more layers of patterns, so that the original slicing method is not good in hole deviation measurement operability.
Disclosure of Invention
The invention provides a method for determining the aperture of a micro-slice, which analyzes key factors of slice manufacturing and measurement, and provides a method for obtaining accurate hole deviation data by a mathematical calculation method on the basis of the micro-slice and evaluating the hole deviation failure risk.
In the prior art, the horizontal slice and vertical slice measurement method has the following problems:
horizontal slicing: the distance between the hole edge and the line can be accurately reflected only by the higher parallelism between the grinding surface and the pattern layer. If there are multiple layers of circuits, multiple times of grinding are required, resulting in a large amount of work and an increased chance of over-grinding errors.
Vertical slicing: the requirement for accurately reflecting the hole deviation or the distance between the edge and the line is met: a. the grinding surface is at the position of the minimum ring width and passes through the hole center. b. The inner line is perpendicular to the slice grinding surface. On the basis of the existing microtome manufacturing technology, the two requirements can only be approached. The following conditions apply:
(1) when the vertical slice is made to meet the following requirements:
a. the grinding surface is at the center of the hole; b. the grinding surface of the slice is vertical to the inner layer line.
The slice grinding surface is shown as line AC in FIG. 1, intersecting the hole edge at point B, AC being perpendicular to the inner layer line. The length of the line segment BC indicates the distance from the hole edge to the inner layer line, but the actual slicing cannot achieve the above two points, and thus this is only an ideal state.
(2) When the vertical slice is made to meet the following requirements:
a. the grinding surface is at the center of the hole; b. the slice grinding surface is not perpendicular to the inner layer line.
If the line AC in figure 2 represents the slice grinding surface, the perpendicular line from the hole center A to the inner layer line is crossed at the point D, and the inner layer line and the slice grinding surface form an included angle ACD. The length of a line segment BC on the grinding surface can be measured, AB is the radius of the hole, the value of the wire outlet segment AD can be calculated through trigonometric function operation, and the distance from the edge of the hole to the line can be obtained by subtracting the radius of the hole.
Then, if the included angle ACD formed by the inner layer line and the slice grinding surface is measured in the microtome:
it was found that the hole-to-hole design could be made as a detection panel, and a set of parallel lines (see lines EF// CD in FIG. 3) added, where the grinding face AF intersects the hole edge at point B, and intersects the set parallel lines at point C and point F, respectively, and the perpendicular line from point C to EF and point E are made. Then in the right angle delta CEF, CE is the set parallel line spacing, CF can be measured on the grinding surface, then < CFE ,∠ACD ∠CFE,ADAC sin ACD. The hole edge to line CD spacing is thus determined by subtracting the hole radius AB from AD.
(3) When the vertical slice is made to meet the following requirements:
a. the abrasive surface is not in the center of the hole; b. the slice grinding surface is not perpendicular to the inner layer line.
Line FJ in fig. 4 represents the slice grinding side, intersecting line CD at point C, and intersecting the well edge at points B and J. And drawing a perpendicular line AD from the hole center A to the line DI, and subtracting the hole radius from the value of the line segment AD to obtain the distance from the hole edge to the line. How to obtain the AD value:
the perpendicular line AG can be drawn from the hole center A to the grinding surface GF, and the G point is the midpoint of two intersection points (point B and point J) of the grinding surface and the hole edge, i.e. the value of the line segment BG is half of the distance between the two intersection points BJ. Then, drawing a perpendicular GI from the point G to the CD, and drawing a perpendicular GN from the point G to the AD; then GILine segment AD. The values of the line segments AH and DH are calculated by mathematical operations, respectively.
In the case of a right-angle Δ GCI, the line length GC can be measured on the slice-ground surface, and the method shown in 2.2 above can be used to obtain an angle GCISegment GI。
Two edges AG and AH of the angle GAH are respectively perpendicular to two edges GC and CI of the angle GCI, then the angle GAHAngle GCI. In right-angle Δ GAH, AHAngle GAH. This can be achieved by: AD。
However, in the above analysis, the theoretical value of the hole radius AB (i.e., half the drill diameter) was used. However, the actual finished hole diameter is different from the drill diameter, and therefore the calculation is biased. Then if the actual aperture is available:
the technical scheme of the invention is as follows: a method for determining the pore size of a microtome, comprising the steps of:
s1, grinding for the first time to obtain a grinding surface FN, and grinding for the second time after measuring data to obtain a grinding surface FN;
s2, drawing perpendicular lines AG and Ag, a connection point G and a point G from the hole center A to the grinding surface respectively; respectively drawing vertical lines GI and GM from the point G to the two groups of parallel lines, and drawing vertical lines GI and GM from the point G to the two groups of parallel lines; then, perpendicular lines GK and GL are respectively drawn from the point G to GI and gm, and then GI = GC & ltsin & gt GCI, GI = GC & ltsin & ltgfi & gt GCI, and gK = GI-GI; GM = GN sin GNM, GM = GN sin GNM, then gL = GM-GM;
s5, in delta AGg, two edges AG and Ag of an angle GAg are respectively vertical to two grinding surfaces FN and FN; the included angle between < GAg and the two grinding surfaces is equal or complementary, namely < GAg = < CFE- < CFE, or < GAg = pi- (-CFE- < CFE);
s7, substituting the equations in the steps S3, S4 and S5 into S6 to obtain the hole radiuses AB and Ab.
In particular, the method for determining the aperture of the microtome is suitable for the case where the grinding surface is not at the center of the aperture and the grinding surface of the microtome is not perpendicular to the inner layer line.
The invention also provides a method for determining the aperture of the micro-slice, which is characterized by comprising the following steps:
s1, grinding for the first time to obtain a grinding surface FN, and grinding for the second time after measuring data to obtain a grinding surface FN;
s2, making a perpendicular line from the hole center A to the grinding surface, and respectively crossing the point G and the point G, so that AG = Ag + gG; making a vertical line from the point G to the line Cc, and crossing at a point I; making a vertical line from the point g to the line Cc, and crossing at a point i; making a vertical line from the point G to the point gi, and crossing the vertical line at a point O; GI =;gi=gc*sin(ii) a And is. GO = GI-GI = (GC-GC) ×;
S3 in the right angle delta GgO, the two sides of the angle GgO are respectively perpendicular to∠GgO=,gG=;
s5 AB and AB are pore radii, AB = AB;
In particular, the method for determining the pore size of the microtome is suitable for the case where the two grinding surfaces are parallel.
The invention provides a method for determining the aperture of a novel micro-section by adding two groups of parallel lines as reference datum lines on the basis of an original detection method through a large amount of creative labor and enabling the two groups of parallel lines to be perpendicular to each other.
Drawings
FIG. 1 is a schematic diagram of a determination method of the present invention;
FIG. 2 is a schematic diagram of a determination method of the present invention;
FIG. 3 is a schematic diagram of a determination method of the present invention;
FIG. 4 is a schematic diagram of a determination method of the present invention;
FIG. 5 is a schematic diagram of a determination method of the present invention;
fig. 6 is a schematic diagram of the determination method of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A method for determining the pore size of a microtome, comprising the steps of:
s1, grinding for the first time to obtain a grinding surface FN, and grinding for the second time after measuring data to obtain a grinding surface FN;
s2, drawing perpendicular lines AG and Ag, a connection point G and a point G from the hole center A to the grinding surface respectively; respectively drawing vertical lines GI and GM from the point G to the two groups of parallel lines, and drawing vertical lines GI and GM from the point G to the two groups of parallel lines; then, perpendicular lines GK and GL are respectively drawn from the point G to GI and gm, and then GI = GC & ltsin & gt GCI, GI = GC & ltsin & ltgfi & gt GCI, and gK = GI-GI; GM = GN sin GNM, GM = GN sin GNM, then gL = GM-GM;
s5, in delta AGg, two edges AG and Ag of an angle GAg are respectively vertical to two grinding surfaces FN and FN; the included angle between < GAg and the two grinding surfaces is equal or complementary, namely < GAg = < CFE- < CFE, or < GAg = pi- (-CFE- < CFE);
s7, substituting the equations in the steps S3, S4 and S5 into S6 to obtain the hole radiuses AB and Ab.
In particular, the method for determining the aperture of the microtome is suitable for the case where the grinding surface is not at the center of the aperture and the grinding surface of the microtome is not perpendicular to the inner layer line.
Example 2
A method for determining the pore size of a microtome, comprising the steps of:
s1, grinding for the first time to obtain a grinding surface FN, and grinding for the second time after measuring data to obtain a grinding surface FN;
s2, making a perpendicular line from the hole center A to the grinding surface, and respectively crossing the point G and the point G, so that AG = Ag + gG; making a vertical line from the point G to the line Cc, and crossing at a point I; making a vertical line from the point g to the line Cc, and crossing at a point i; making a vertical line from the point G to the point gi, and crossing the vertical line at a point O; GI =;gi=gc*sin(ii) a And is. GO = GI-GI = (GC-GC) ×;
S3 in the right angle delta GgO, the two sides of the angle GgO are respectively perpendicular to∠GgO=,gG=;
s5 AB and AB are pore radii, AB = AB;
In particular, the method for determining the pore size of the microtome is suitable for the case where the two grinding surfaces are parallel.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (4)
1. A method for determining the pore size of a microtome, comprising the steps of:
s1, grinding for the first time to obtain a grinding surface FN, and grinding for the second time after measuring data to obtain a grinding surface FN;
s2, respectively making perpendicular lines AG and Ag, a connection point G and a point G from the hole center A to the grinding surface FN and the grinding surface FN; determining two groups of parallel lines, including a first group of parallel lines and a second group of parallel lines, wherein the first group of parallel lines and the second group of parallel lines both include two parallel straight lines, the first group of parallel lines and the second group of parallel lines are mutually vertical, and the two groups of parallel lines are arranged outside the aperture and extend along the radial direction; respectively drawing vertical lines GI and GM from the point G to the two groups of parallel lines, and drawing vertical lines GI and GM from the point G to the two groups of parallel lines; then, perpendicular lines GK and GL are respectively drawn from a point G to GI and gm, then GI (GC) is less than GCI, GI (GC) is less than sin (GCI), and gK (GI-GI) is less than gK; GM is GN x sin x GNM, GM is GN x sin x GNM, and gL is GM-GM;
the grinding surface FN intersects a straight line far away from the aperture in the first group of parallel lines at a point F, intersects a straight line close to the aperture in the first group of parallel lines at a point C, intersects a straight line close to the aperture in the second group of parallel lines at a point N, and intersects an excircle of the aperture close to the first group of parallel lines at a point B; the grinding surface fn intersects a straight line far away from the aperture in the first group of parallel lines at a point f, intersects a straight line close to the aperture in the first group of parallel lines at a point c, intersects a straight line close to the aperture in the second group of parallel lines at a point n, and intersects an excircle close to the first group of parallel lines with the aperture at a point b; making a perpendicular line from a C point to a Ff line and crossing the point E, and making a perpendicular line from the C point to the Ff line and crossing the point E;
S4. in the right triangle ABG, AG2=AB2-BG2(ii) a In the right triangle Abg, Ag2=Ab2-bg2;
S5, in delta AGg, two edges AG and Ag of the angle GAg are respectively vertical to two grinding surfaces FN and FN; the included angle between the < GAg and the two grinding surfaces is equal to or complementary, namely < GAg ═ CFE- < CFE, or < GAg ═ pi- (-CFE- < CFE);
S6.gG2=AG2+Ag2-2*AG*Ag*cos∠GAg;
s7, substituting the equations in the steps S3, S4 and S5 into S6 to obtain the hole radiuses AB and Ab.
2. The method of claim 1, wherein the method of determining the aperture of the microtome is applied to a case where the ground plane is not at the center of the hole or the ground plane of the microtome is not perpendicular to the inner layer line.
3. A method for determining the pore size of a microtome, comprising the steps of:
s1, grinding for the first time to obtain a grinding surface FN, and grinding for the second time after measuring data to obtain a grinding surface FN;
s2, making a perpendicular line from the hole center A to the grinding surface FN and the grinding surface FN, and respectively crossing the point G and the point G of the grinding surface FN and the grinding surface FN, so that AG is Ag + gG; determining two groups of parallel lines including a first group of parallel lines and a second group of parallel lines, wherein the first group of parallel lines and the second group of parallel lines both include two parallel straight lines, the first group of parallel lines and the second group of parallel lines are mutually vertical, and the two groups of parallel lines are arranged outside the aperture and extend along the radial direction; making a vertical line from the point G to the line Cc, and crossing at a point I; making a vertical line from the point g to the line Cc, and crossing at a point i; making a vertical line from the point G to the point gi, and crossing the vertical line at a point O; then GI ═ GC × sin ═ GCI; gi ═ gc x sin ═ gci; and < GCI ═ GCI; then GO-Gi-GI (GC-GC) sin GCI; wherein, a line Cc is arranged outside the aperture and in parallel with the radial direction, the grinding surface FN intersects the line Cc at a point C, and intersects an excircle of the aperture close to the line Cc at a point B; the grinding surface fn intersects the line Cc at a point c and intersects the outer circle of the aperture close to the line Cc at a point b;
s3, in the right angle delta GgO, two sides of an angle GgO are respectively perpendicular to two sides of an angle GCI, then the angle GgO is equal to the angle GCI,
s4. in the right-angle Delta ABG, AB2=AG2+BG2(ii) a In the orthogonal Δ Abg, Ab2=Ag2+bg2;
S5, AB and Ab are pore radii, and AB is Ab;
4. The method of claim 3, wherein the method of determining the aperture of the microtome is applied to a case where the two grinding surfaces are parallel.
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CN106338413A (en) * | 2016-08-29 | 2017-01-18 | 广东工业大学 | Making method of PCB half-hole section |
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CN101032193A (en) * | 2004-10-28 | 2007-09-05 | 英特尔公司 | Assessing micro-via formation in a PCB substrate manufacturing process |
CN101726245A (en) * | 2008-10-15 | 2010-06-09 | 维嘉数控科技(苏州)有限公司 | Method for analyzing borehole deviation of PCB drilling machine |
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